XC9224081AR [TOREX]
Switching Regulator/Controller;型号: | XC9224081AR |
厂家: | Torex Semiconductor |
描述: | Switching Regulator/Controller |
文件: | 总21页 (文件大小:427K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
☆GO-Compatible
◆Step-Down DC/DC Converters
◆Built-in P-channel MOSFET : 0.21Ω
Built-in Synchronous
■APPLICATIONS
●HDD
●Notebook computers
●CD-R / RW, DVD
●PDAs, Portable communication modems
●Digital cameras, Video recorders
N-channel MOSFET
: 0.23Ω
(No Schottky Barrier Diode Required)
◆Output Current
◆High Efficiency
: Up to 1A
: 95%
(VIN=5.0V, VOUT=3.3V)
●Various general-purpose power supplies
◆Oscillation Frequency :1.0MHz, 2.0MHz
(Small Inductor for High Frequency Selectable)
◆Synchronized with an External Clock Signal
◆Ceramic Capacitor Compatible
◆MSOP-10, USP-10B (Preliminary) Packages
■GENERAL DESCRIPTION
■FEATURES
The XC9223/9224 series are synchronous step-down
DC/DC converters with a 0.21Ω (TYP.) P-channel driver
transistor and a synchronous 0.23Ω (TYP.) N-channel
switching transistor built-in. A highly efficient and stable
current can be supplied up to 1.0A by reducing ON
resistance of the built-in transistor.
Input Voltage Range
Output Voltage Range
: 2.5V ~ 6.0V
: 0.9V ~ VIN
(Can be set freely with 0.8V [+2%] of
reference voltage by the external
resistors.)
Oscillation Frequency
Output Current
: 1MHz, 2MHz (+15% accuracy)
: 1.0A
With a high switching frequency of 1.0MHz or 2.0MHz, a
small inductor is selectable; therefore, the XC9223/9224
series are ideally suited to applications with height limitation
such as HDD or space-saving applications. Current limit
value can be chosen either 1.5A (MIN.) when the LIM pin is
high level, or 0.5A (MIN.) when the LIM pin is low level for
using the power supply which current limit value differs such
as USB or AC adapter. With the MODE/SYNC pin, the
XC9223/9224 series provide mode selection of the fixed
PWM control or automatically switching current limit
PFM/PWM control. As for preventing unwanted switching
noise, the XC9223/9224 series can be synchronized with an
external clock signal within the range of ± 25% toward an
Maximum Current Limit : 0.6A (MIN.) ~ 0.9A (MAX)
with LIM pin=’L’
: 1.2A (MIN.) ~ 2.0A (MAX.)
with LIM pin=’H’
Controls
: PWM/PFM externally switching
: Synchronized with
an external clock signal
: Thermal shutdown
Protection Circuits
: Integral latch method
(Over current limit)
: Short-circuit protection
: 1ms (TYP.) internally set
: 0.712V detect,
Soft-Start Time
internal clock signal via the MODE/SYNC pin.
For
Voltage Detector
protection against heat damage of the ICs, the
XC9223/9224 series build in three protection functions:
integral latch protection, thermal shutdown, and short-circuit
protection. With the built-in U.V.L.O. (Under Voltage Lock
Out) function, the internal P-channel driver transistor is
forced OFF when input voltage becomes 1.8V or lower.
The series’ detector function monitors the discretional
voltage by external resistors.
N-ch open-drain output
■TYPICAL PERFORMANCE
CHARACTERISTICS
●Efficiency vs. Output Current
XC9223B081Ax
VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C),
CIN=10uF(ceramic), CL=10uF(ceramic)
100
■TYPICAL APPLICATION CIRCUIT
90
80
70
CIN
VOUT=3.3V
60
VIN
50
PGND
LX
1
2
3
4
5
VIN
10
9
L
VOUT
CL
VOUT=1.5V
VDIN
40
VDIN
AGND
CE
30
CFB
CE
8
MODE/SYNC
LIM
VDOUT
MODE/
20
10
0
PWM/PFM
PWM
VDOUT
FB
7
(ceramic)
RFB1
SYNC
LIM
6
1
10
100
1000
RFB2
Output Current: IOUT (mA)
1
XC9223_9224 ETR0509_003.doc
XC9223/9224 Series
■PIN CONFIGURATION
FB 5
VDOUT 4
AGND 3
VDIN 2
6 LIM
VIN 1
VDIN 2
AGND 3
VDOUT 4
FB 5
10 PGND
9 LX
7 MODE/SYNC
8 CE
8 CE
7 MODE/SYNC
9 LX
6 LIM
VIN 1
10 PGND
USP-10B
(BOTTOM VIEW)
(Preliminary)
MSOP-10
(TOP VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
Input
Voltage Detector Input
Analog Ground
MSOP-10
USP-10B
1
2
3
4
5
6
7
8
VIN
VDIN
AGND
VDOUT
FB
VD Output
Output Voltage Monitor
Over Current Limit Setting
Mode Switch / External Clock Input
Chip Enable
LIM
MODE/SYNC
CE
9
10
Lx
PGND
Switch
Power Ground
■FUNCTION CHART
●CE Pin Function
CE PIN
OPERATIONAL STATE
H
ON
L
OFF *1
*1: Except for a voltage detector block in the XC9224 series.
●MODE Pin Function
MODE PIN
FUNCTION
PWM Control
H
L
PWM/PFM Automatic Control
●LIM Pin Function
LIM PIN
FUNCTION
H
L
Maximum Output Current: 1.0A
Maximum Output Current: 0.4A
2
XC9223/9224
Series
■PACKAGE INFORMATION
●MSOP-10
●USP-10B (Preliminary)
1
0.15+0.08
2.9+0.15
AAA
AAAA
1
3.00+0.10
0.2+0.05
0.45+0.05
0.45+0.05
0.2+0.05
0.2+0.05
0.125
0.15
0.2
0.325 0.3 0.3
+0.1
(0.5)
1 0.20
-0.05
0.65
0.65
2.5+0.1
0.5
0.5
0.1+0.03
0.1+0.03
■PRODUCT CLASSIFICATION
●Ordering Information
XC9223B①②③④⑤ <The CE pin is commonly used in the DC/DC block and the voltage detector block.>
XC9224B①②③④⑤ <No CE pin in the voltage detector block. (The voltage detector block is constantly operated) >
DESIGNATOR
DESCRIPTION
SYMBOL
DESCRIPTION
: Fixed voltage
①=0, ②=8
0
①②
Reference Voltage
8
1
2
: 1.0MHz
: 2.0MHz
: MSOP-10
③
④
⑤
DC/DC Oscillation Frequency
Package
A
D
R
L
: USP-10B (Preliminary)
: Embossed tape, standard feed
: Embossed tape, reverse feed
Device Orientation
3
XC9223/9224 Series
■MARKING RULE
●MSOP-10
①Represents products series
10 9
8
7
6
MARK
0
PRODUCT SERIES
XC9223xxxxAx
A
XC9224xxxxAx
① ② ③
④ ⑤ ⑥ ⑦
②Represents type of DC/DC converters
MARK
B
PRODUCT SERIES
XC9223/9224BxxxAx
③④Represents reference voltage
MARK
PRODUCT SERIES
XC9223/9224x08xAx
③
④
1
2
3
4
5
0
8
MSOP-10
(TOP VIEW)
⑤Represents oscillation frequency
MARK
OSCILLATION FREQUENCY
PRODUCT SERIES
XC9223/9224xxx1Ax
XC9223/9224xxx2Ax
1
2
1.0MHz
2.0MHz
⑥Represents production lot number
01 to 09, 0A to 0Z, 10 to 19, 1A~ in order. (G, I, J, O, Q, W excepted)
Note: No character inversion used.
4
XC9223/9224
Series
■BLOCK DIAGRAM
VIN
LIM
Current Limit
PFM
Error Amp.
Comparator
PWM
FB
Buffer
Driver
Logic
Current
Feedback
LX
Vref with
Soft-Start,
CE
CE
PGND
AGND
Ramp Wave
Thermal
MODE/
SYNC
PMW/PFM
Generator,
OSC
Shutdown
VD
VDOUT
VDIN
■ABSOLUTE MAXIMUM RATINGS
Ta=25OC
PARAMETER
VIN Pin Voltage
VDIN Pin Voltage
VDOUT Pin Voltage
VDOUT Pin Current
FB Pin Voltage
SYMBOL
VIN
VDIN
VDOUT
IDOUT
VFB
VLIM
VMODE/SYNC
VCE
RATINGS
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ 6.5
10
UNITS
V
V
V
mA
V
V
V
V
V
mA
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ 6.5
- 0.3 ~ VDD + 0.3
2000
LIM Pin Voltage
MODE/SYNC Pin Voltage
CE Pin Voltage
Lx Pin Voltage
Lx Pin Current
VLx
ILx
MSOP-10
USP-10B (*2)
350 (*1)
150
Power Dissipation
Pd
mW
Operating Temperature Range
Topr
Tstg
- 40 ~ + 85
- 55 ~ +125
℃
℃
Storage Temperature Range
*1: When implemented on a PCB.
*2: Preliminary
5
XC9223/9224 Series
■ELECTRICAL CHARACTERISTICS
XC9223/9224 Series
Topr=25℃
PARAMETER
SYMBOL
CONDITIONS
MIN.
TYP.
MAX.
UNIT CIRCUIT
Input Voltage
FB Voltage
Output Voltage Setting Range
VIN
VFB
VOUTSET
2.5
0.784
0.9
-
0.800
-
6.0
0.816
VIN
V
V
V
-
1
3
Maximum Output Current 1 (*1)
Maximum Output Current 2 (*1)
IOUTMAX1
IOUTMAX2
0.4
1.0
-
-
-
-
A
A
3
3
FB=VFB x 0.9, VIN Voltage which Lx pin
voltage holding ‘L’ level (*8)
FB=VFB x 0.9, MODE/SYNC=0V
U.V.L.O. Voltage
Supply Current 1
Supply Current 2
Stand-by Current
Oscillation Frequency
VUVLO
1.55
1.80
2.00
V
1
2
2
2
3
IDD1
D1-1 (*2)
D1-2 (*2)
D1-6 (*2)
D1-3 (*2)
µA
FB=VFB x 1.1 (Oscillation stops),
IDD2
µA
MODE/SYNC=0V
ISTB
CE=0V
µA
Connected to external components,
FOSC
MHz
IOUT=10mA
Connected to external components,
IOUT=10mA, apply an external clock signal
to the MODE/SYNC
External Clock Signal
SYNCOSC
D1-4 (*2)
MHz
4
Synchronized Frequency
External Clock Signal Duty
Maximum Duty Ratio
Minimum Duty Ratio
SYNCDTY
MAXDTY
MINDTY
25
100
-
-
-
-
75
-
0
%
%
%
4
1
1
FB=VFB x 0.9
FB=VFB x 1.1
Connected to external components,
PFM Switch Current
IPFM
-
200
250
mA
3
MODE/SYNC=0V, IOUT=10mA
Connected to external components,
VIN=5.0V, VOUT=3.3V, IOUT=200mA
Efficiency (*3)
EFFI
RLxH
-
-
95
-
%
3
1
Lx SW ‘H’ On Resistance (*4)
FB=VFB x 0.9, ILx=VIN-0.05V
0.21
0.3 (*7)
Ω
Lx SW ‘L’ On Resistance
Current Limit 1
RLxL
ILIM1
ILIM2
-
0.23
-
-
0.3 (*7)
0.9
2.0
Ω
A
A
-
1
1
0.6
1.2
Current Limit 2
Integral Latch Time (*5)
Short Detect Voltage
TLAT
FB=VFB x 0.9, Short Lx by 1Ω resistance
D1-5 (*2)
0.4
ms
V
1
1
VSHORT
FB Voltage which Lx becomes ‘L’ (*8)
0.3
0.5
0.5
2.0
Connected to external components,
Soft-Start Time
TSS
1.0
ms
1
CE=0V→VIN, IOUT=1mA
O
Thermal Shutdown Temperature
Hysteresis Range
TTSD
THYS
-
-
150
20
-
-
C
-
-
O
C
FB=VFB x 0.9, Voltage which Lx becomes
‘H’ after CE voltage changed from 0.4V to
1.2V (*8)
CE ‘H’ Voltage
CE ‘L’ Voltage
VCEH
VCEL
1.2
-
-
-
-
V
V
1
1
FB=VFB x 0.9, Voltage which Lx becomes
‘L’ after CE voltage changed from 1.2V to
0.4V (*8)
0.4
MODE/SYNC ‘H’ Voltage
MODE/SYNC ‘L’ Voltage
LIM ‘H’ Voltage
VMODE/SYNCH
VMODE/SYNCL
VLIMH
1.2
-
-
-
-
-
0.4
-
V
V
V
3
3
1
1.2
IOUT=ILIM1 x 1.1, Check LIM voltage which
Lx oscillated after CE voltage changed
from 1.2V to 0.4V
LIM ‘L’ Voltage
VLIML
-
-
0.4
V
1
CE ‘H’ Current
CE ‘L’ Current
ICEH
ICEL
VIN=CE-6.0V
-
- 0.1
-
-
-
-
-
-
-
-
-
-
-
0.1
-
µA
µA
µA
µA
µA
µA
µA
µA
µA
µA
5
5
5
5
5
5
5
5
6
6
VIN=6.0V, CE=0V
VIN=6.0V
MODE/SYNC ‘H’ Current
MODE/SYNC ‘L’ Current
LIM ‘H’ Current
IMODE/SYNCH
IMODE/SYNCL
ILIMH
0.1
-
VIN=6.0V, MODE/SYNC=0V
VIN=LIM=6.0V
- 0.1
-
0.1
-
LIM ‘L’ Current
ILIML
VIN=6.0V, LIM=0V
VIN=FB=6.0V
- 0.1
-
FB ‘H’ Current
IFBH
0.1
-
FB ‘L’ Current
IFBL
VIN=6.0V, FB=0V
VIN=Lx=6.0V, CE=0V
VIN=6.0V, Lx=CE=0V
- 0.1
-
Lx SW ‘H’ Leak Current
Lx SW ‘L’ Leak Current (*6)
ILeakH
1.0
-
ILeakL
- 3.0
6
XC9223/9224
Series
■ELECTRICAL CHARACTERISTICS (Continued)
XC9223/9224 Series (Continued), Voltage Detector Block
Topr=25℃
PARAMETER
Detect Voltage
Release Voltage
SYMBOL
CONDITIONS
MIN.
0.676
0.716
TYP.
0.712
0.752
MAX.
UNIT CIRCUIT
VDIN Voltage which VDOUT becomes
‘H’ to ‘L’, Pull-up resistor 200kΩ
VDIN Voltage which VDOUT becomes
‘L’ to ‘H’, Pull-up resistor 200kΩ
VDF
0.744
0.784
V
V
7
7
VDR
Hysteresis Range
Output Current
VHYS
IDOUT
VHYS=(VDR-VDF) / VDF x 100
-
5
-
-
%
-
VDIN=VDF x 0.9, apply 0.25V to VDOUT
2.5
4.0
mA
7
Time until VDOUT becomes ‘L’ to ‘H’ after
Delay Time
TDLY
0.5
2.0
8.0
ms
7
VDIN changed from 0V to 1.0V
VDIN ‘H’ Current
VDIN ‘L’ Current
VDOUT ‘H’ Current
VDOUT ‘L’ Current
IVDINH
IVDINL
VIN=VDIN=6.0V
-
-
-
-
-
0.1
-
µA
µA
µA
µA
5
5
5
5
VIN=6.0V, VDIN=0V
- 0.1
-
IVDOUTH
IVDOUTL
VIN=VDIN=VDOUT=6.0V
VIN=VDIN=6.0V, VDOUT=0V
1.0
-
- 1.0
Test Condition: Unless otherwise stated, VIN=3.6V, CE=VIN, MODE/SYNC=VIN
NOTE:
*1: When the difference between the input and the output is small, some cycles may be skipped completely before current maximizes.
If current is further pulled from this state, output voltage will decrease because of P-ch driver ON resistance.
*2: Refer to the chart below.
*2: EFFI = { ( output voltage x output current ) / ( input voltage x input current) } x 100
*4: On resistance (Ω)= (VIN- Lx pin measurement voltage) / 100mA
*5: Time until it short-circuits Lx with GND through 1Ω of resistance from a state of operation and is set to Lx=Low from current limit pulse
generating.
*6: When temperature is high, a current of approximately 100µA may leak.
*7: Designed value.
*8: Whether the Lx pin is high level or low level is judged at the condition of “H”>VIN-0.1V and “L”<0.05V.
●Electrical Characteristics Standard Values
1MHz
TYP.
380
30
1.00
2MHz
TYP.
440
45
No.
PARAMETER
SYMBOL
MIN.
-
-
MAX.
700
60
MIN.
-
-
MAX.
800
80
D1-1
D1-2
D1-3
Supply Current 1
Supply Current 2
Oscillation Frequency
IDD1
IDD2
FOSC
0.85
1.15
1.7
2.0
2.3
External Clock
Synchronous Oscillation
Integral Latch Time
D1-4
D1-5
SYNCOSC
TLAT
0.75
-
-
1.25
15
1.5
-
-
2.5
15
6.0
3.0
XC9223 SERIES
XC9224 SERIES
No.
PARAMETER
SYMBOL
ISTB
MIN.
TYP.
0.1
MAX.
MIN.
TYP.
7.0
MAX.
D1-6
Stand-by Current
-
2.0
-
15
7
XC9223/9224 Series
■TYPICAL APPLICATION CIRCUITS
CIN
VIN
PGND
LX
1
2
3
4
5
VIN
10
9
L
VOUT
CL
VDIN
VDIN
AGND
CE
CFB
CE
8
MODE/SYNC
LIM
VDOUT
MODE/
VDOUT
FB
7
(ceramic)
RFB1
SYNC
6
LIM
RFB2
<Output Voltage Setting>
Output voltage can be set by adding external split resistors. Output voltage is determined by the following equation,
based on the values of RFB1 and RFB2. The sum of RFB1 and RFB2 should normally be 1MΩ or less.
VOUT = 0.8 x (RFB1 + RFB2) / RFB2
The value of CFB, speed-up capacitor for phase compensation, should be fzfb = 1 / (2 x π CFB1 x RFB1) which is equal to
20kHz. Adjustments are required from 1kHz to 50kHz depending on the application, value of inductance (L), and value of
load capacity (CL).
[Example of calculation]
When RFB1=470kΩ, RFB2=150kΩ,
VOUT1 = 0.8 x (470k + 150k) / 150k =3.3V
[Typical example]
VOUT (V)
1.0
CFB (pF)
110
51
VOUT (V)
2.5
CFB (pF)
15
RFB1 (kΩ)
75
RFB2 (kΩ)
300
RFB1 (kΩ)
510
RFB2 (kΩ)
240
1.2
150
300
3.0
330
120
24
1.5
1.8
130
300
150
240
62
27
3.3
5.0
470
430
150
82
18
18
* When fzfb = 20kHz
[External components]
1MHz:
L: 4.7uH (CDRH4D28C, SUMIDA)
CL: 10uF (ceramic)
CIN: 10uF (ceramic)
2MHz:
L: 2.2uH (CDRH4D28, SUMIDA)
2.2uH (VLCF4020T-2R2N1R7, TDK)
CL: 10uF (ceramic)
CIN: 10uF (ceramic)
* As for CIN and CL, use output capacitors of 10μF or more. (Ceramic capacitor compatible)
* High ESR (Equivalent Series Resistance) that comes by using a tantalum or an electrolytic capacitor causes high ripple voltage.
Furthermore, it can cause an unstable operation. Use the IC after you fully confirm with an actual device.
8
XC9223/9224
Series
■OPERATIONAL EXPLANATION
Each unit of the XC9223/9224 series consists of a reference voltage source, a ramp wave circuit, error amplifier, PWM
comparator, phase compensation circuit, output voltage adjustment resistors, P-channel MOS driver transistor, N-channel
MOS synchronous rectification switching transistor, current limiter circuit, U.V.L.O. circuit and others. The series
compares, using the error amplifier, the internal reference voltage to the VOUT pin with the voltage fedback via resistors RFB1
and RFB2. Phase compensation is performed on the resulting error amplifier output, to input a signal to the PWM
comparator to determine the turn-on time during PWM operation. The PWM comparator compares, in terms of voltage
level, the signal from the error amplifier with the ramp wave from the ramp wave circuit, and delivers the resulting output to
the buffer driver circuit to cause the Lx pin to output a switching duty cycle. This process is continuously performed to
ensure stable output voltage. The current feedback circuit monitors the P-channel MOS driver transistor current for each
switching operation, and modulates the error amplifier output signal to provide multiple feedback signals. This enables a
stable feedback loop even when a low ESR capacitor, such as a ceramic capacitor, is used, ensuring stable output voltage.
<Reference Voltage Source>
The reference voltage source provides the reference voltage to ensure stable output voltage of the DC/DC converter.
<Ramp Wave Circuit>
The ramp wave circuit determines switching frequency. The frequency is fixed internally and can be selected from 1.0MHz
and 2.0MHz. Clock pulses generated in this circuit are used to produce ramp waveforms needed for PWM operation, and
to synchronize all the internal circuits.
<Error Amplifier>
The error amplifier is designed to monitor output voltage. The amplifier compares the reference voltage with the feedback
voltage divided by the internal resistors (RFB1 and RFB2). When a voltage lower than the reference voltage is fed back, the
output voltage of the error amplifier increases. The gain and frequency characteristics of the error amplifier output are
fixed internally to deliver an optimized signal to the mixer.
<Current Limit>
The current limiter circuit of the XC9223/9224 series monitors the current flowing through the P-channel MOS driver
transistor connected to the Lx pin, and features a combination of the constant-current type current limit mode and the
operation suspension mode. For the current limit values, please select the values either from 1.2A (MIN.) when the LIM
pin is high level or 0.6A (MIN.) when the LIM pin is low level.
1When the driver current is greater than a specific level, the constant-current type current limit function operates to turn
off the pulses from the Lx pin at any given time.
2When the driver transistor is turned off, the limiter circuit is then released from the current limit detection state.
3At the next pulse, the driver transistor is turned on. However, the transistor is immediately turned off in the case of an
over current state.
4 When the over current state is eliminated, the IC resumes its normal operation.
The IC waits for the over current state to end by repeating the steps 1 through 3. If an over current state continues for
several msec and the above three steps are repeatedly performed, the IC performs the function of latching the OFF state of
the driver transistor, and goes into operation suspension mode. After being put into suspension mode, the IC can resume
operation by turning itself off once and then starting it up using the CE pin, or by restoring power to the VIN pin. Integral
latch time may be released from a current limit detection state because of the noise. Depending on the state of a substrate,
it may result in the case where the latch time may become longer or the operation may not be latched. Please locate an
input capacitor as close as possible.
Limit < # mS
Limit > # mS
Current Limit LEVEL
0mA
IOUT
VOUT
LX
VSS
CE
Restart
VIN
9
XC9223/9224 Series
■
<Thermal Shutdown>
For protection against heat damage of the ICs, thermal shutdown function monitors chip temperature. The thermal
shutdown circuit starts operating and the driver transistor will be turned off when the chip’s temperature reaches 150OC.
When the temperature drops to 130OC or less after shutting of the current flow, the IC performs the soft start function to
initiate output startup operation.
<Short-Circuit Protection>
The short-circuit protection circuit monitors FB voltage. In case where output is accidentally shorted to the Ground and
when the FB voltage decreases less than half of the FB voltage, the short-circuit protection operates to turn off and to
latch the driver transistor. In latch mode, the operation can be resumed by either turning the IC off and on via the CE pin,
or by restoring power supply to the VIN pin.
<Voltage Detector>
The detector block of the XC9223/9224 series detects a signal inputted from the VDIN pin by the VDOUT pin (N-ch
open-drain).
<U.V.L.O. Circuit>
When the VIN pin voltage becomes 1.8V (TYP.) or lower, the driver transistor is forced OFF to prevent false pulse output
caused by unstable operation of the internal circuitry. When the VIN pin voltage becomes 2.0V (TYP.) or higher, switching
operation takes place. By releasing the U.V.L.O. function, the IC performs the soft-start function to initiate output startup
operation. The U.V.L.O. function operates even when the VIN pin voltage falls below the U.V.L.O. operating voltage for
tens of ns.
<MODE/SYNC>
A MODE/SYNC pin has two functions, a MODE switch and an input of external clock signal. The MODE/SYNC pin
operates as the PWM mode when applying high level of direct current and the PFM/PWM automatic switching mode by
applying low level of direct current, which is the same function as the normal MODE pin. By applying the external clock
signal (±25% of the internal clock signal, ON duty 25% to 75%), the MODE/SYNC pin switches to the internal clock signal.
Also the circuit will synchronize with the falling edge of external clock signal. While synchronizing with the external clock
signal, the MODE/SYNC pin becomes the PWM mode automatically. If the MODE/SYNC pin holds high or low level of the
external clock signal for several µS, the MODE/SYNC pin stops synchronizing with the external clock and switches to the
internal clock operation. (Refer to the chart below.)
・External Clock Synchronization Function
VOUT
50mV/div
Synchronous with the
external clock
Operates by the
internal clock
1.2MHz
1MHz
Lx
2V/div
External Clock Signal
1.2MHz Duty50%
MODE/SYNC
2V/div
Delay time to the external clock synchronization
1.0μs/div
* When an input of MODE/SYNC is changed from “L” voltage into a clock signal of 1.2MHz and 50% duty.
10
XC9223/9224
Series
■NOTES ON USE
1. The XC9223/9224 series is designed for use with ceramic output capacitors. If, however, the potential difference between
dropout voltage, a ceramic capacitor may fail to absorb the resulting high switching energy and oscillation could occur on
the output. In this case, use a larger capacitor etc. to compensate for insufficient capacitance.
2. Spike noise and ripple voltage arise in a switching regulator as with a DC/DC converter. These are greatly influenced by
external component selection, such as the coil inductance, capacitance values, and board layout of external components.
Once the design has been completed, verification with actual components should be done.
3. In PWM control, very narrow pulses will be outputted, and there is the possibility that some cycles may be skipped
completely. This may happens while synchronizing with an external clock.
4. When the difference between VIN and VOUT is small, and the load current is heavy, very wide pulses will be outputted and
there is the possibility that some cycles may be skipped completely.
5. With the IC, the peak current of the coil is controlled by the current limit circuit. Since the peak current increases when
dropout voltage or load current is high, current limit starts operating, and this can lead to instability. When peak current
becomes high, please adjust the coil inductance value and fully check the circuit operation. In addition, please calculate
the peak current according to the following formula:
Ipk = (VIN - VOUT) x OnDuty / (2 x L x FOSC) + IDOUT
L: Coil Inductance Value
FOSC: Oscillation Frequency
6. When the peak current, which exceeds limit current, flows within the specified time, the built-in P-ch driver transistor is
turned off (an integral latch circuit). During the time until it detects limit current and before the built-in transistor can be
turned off, the current for limit current flows; therefore, care must be taken when selecting the rating for the coil.
7. The voltage drops because of ON resistance of a driver transistor or in-series resistance of a coil. For this, the current
limit may not be attained to the limit current value, when input voltage is low.
8. Malfunction may occur in the U.V.L.O. circuit because of the noise when pulling current at the minimum operation voltage.
9. This IC and the external components should be used within the stated absolute maximum ratings in order to prevent
damage to the device.
10. Depending on the state of the PC Board, latch time may become longer and latch operation may not work. The board
should be laid out so that capacitors are placed as close to the chip as possible.
11. In heavy load, the noise of DC/DC may influence and the delay time of the voltage detector may be prolonged.
12. Output voltage may become unstable when synchronizing high internal frequency with the external clock.
In such a case, please use a larger output capacitor etc. to compensate for insufficient capacitance.
13. When a voltage lower than minimum operating voltage is applied, the output voltage may fall before reaching the over
current limit.
14. When the IC is used in high temperature, output voltage may increase up to input voltage level at light load (less than
100uA) because of the leak current of the driver transistor.
15. The current limit is set to LIM=H: 2000mA (MAX.). However, the current of 2000mA or more may flow. In case that the
current limit functions while the VOUT pin is shorted to the GND pin, when P-ch MOSFET is ON, the potential difference
for input voltage will occur at both ends of a coil. For this, the time rate of coil current becomes large. By contrast,
when N-ch MOSFET is ON, there is almost no potential difference at both ends of the coil since the VOUT pin is shorted to
the GND pin. Consequently, the time rate of coil current becomes quite small. According to the repetition of this
operation, and the delay time of the circuit, coil current will be converged on a certain current value, exceeding the
amount of current, which is supposed to be limited originally. The short protection does not operate during the soft-start
time. The short protection starts to operate and the circuit will be disabled after the soft-start time. Current larger than
over current limit may flow because of a delay time of the IC when step-down ratio is large. A coil should be used within
the stated absolute maximum rating in order to prevent damage to the device.
①Current flows into P-ch MOSFET to reach the current limit (ILIM).
②The current of ILIM (2000mA, MAX.) or more flows since the delay time of the circuit occurs during from the detection of
the current limit to OFF of P-ch MOSFET.
③Because of no potential difference at both ends of the coil, the time rate of coil current becomes quite small.
④Lx oscillates very narrow pulses by the current limit for several msec.
⑤The short protection operates, stopping its operation.
②
③
①
④ #ms
⑤
Delay
VLX
Overcurrent
Limit Value
ILX
(Coil Current)
11
XC9223/9224 Series
■TEST CIRCUITS
Circuit 2
Circuit 1
Waveform Measurement Point
A
VIN
CE
LX
FB
ILx
LX
A
VIN
CE
MODE/
SYNC
ILIM
1uF
MODE/
FB
1uF
SYNC
ILIM
V
VDIN
VDOUT
AGND
VDIN
PGND
VDOUT
AGND
PGND
Circuit 3
Waveform Measurement Point
L
IOUT
LX
VIN
CE
A
A
RFB1
RFB2
V
CFB
V
MODE/
SYNC
ILIM
FB
CIN
CL
VDOUT
AGND
VDIN
V
PGND
* External Components
L (1MHz) : 4.7μH (CDRH4D28C, SUMIDA)
L (2MHz) : 2.2μH (VLCF4020T-2R2N1R7, TDK)
ꢀꢀCIN : 10μF (ceramic)
ꢀꢀCL : 10μF (ceramic)
ꢀꢀRFB1 : 130kΩ
ꢀꢀRFB2 : 150kΩ
ꢀꢀCFB : 62pF (ceramic)
Circuit 4
Waveform Measurement Point
L
IOUT
VIN
CE
LX
RFB1
RFB2
CFB
MODE/
SYNC
ILIM
FB
CL
~
CIN
VDIN
VDOUT
AGND
PULSE
PGND
* External Components
L (1MHz) : 4.7μH (CDRH4D28C, SUMIDA)
L (2MHz) : 2.2μH (VLCF4020T-2R2N1R7, TDK)
ꢀꢀCIN : 10μF (ceramic)
ꢀꢀCL : 10μF (ceramic)
ꢀꢀRFB1 : 130kΩ
ꢀꢀRFB2 : 150kΩ
ꢀꢀCFB : 62pF (ceramic)
12
XC9223/9224
Series
■TEST CIRCUITS (Continued)
Circuit 5
LX
FB
VIN
CE
MODE/
SYNC
ILIM
A
A
A
A
A
1μF
A
A
VDOUT
AGND
VDIN
PGND
Circuit 6
LX
FB
VIN
CE
MODE/
SYNC
ILIM
A
1μF
VDOUT
VDIN
AGND
PGND
Circuit 7
LX
FB
VIN
CE
MODE/
SYNC
ILIM
1μF
200kΩ
A
VDIN
VDOUT
PGND
AGND
Waveform Measurement Point
13
XC9223/9224 Series
■INSTRUCTION ON LAYOUT
1. In order to stabilize VIN’s voltage level, we recommend that a by-pass capacitor (CIN) be connected as close as
possible to the VIN & VSS pins.
2. Please mount each external component, especially CIN, as close to the IC as possible.
3. Wire external components as close to the IC as possible and use thick, short connecting traces to reduce the circuit
impedance.
4. Make sure that the PCB GND traces are as thick as possible, as variations in ground potential caused by high
ground currents at the time of switching may result in instability of the IC.
・TOP VIEW
VIN
VDIN
VOUT
VDOUT
R
C
RFB1
CFB
R
Inductor
L
RFB2
LO
ILIM
HI
IC
0
0
R
C
Jumper Chip
Resistor
Lx
L
MODE/
SYN
Ceramic Capaticor
VSS
TOREX
・BOTTOM VIEW
XC9223/24
Rev.2.0
MSOP10
14
XC9223/9224
Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Efficiency vs. Output Current
XC9223B082Ax
XC9223B081Ax
VIN=5V, FOSC=2MHz, L=2.2uH(CDRH4D28),
VIN=5V, FOSC=1MHz, L=4.7uH(CDRH4D28C),
CIN=10uF(ceramic), CL=10uF(ceramic)
CIN=10uF(ceramic), CL=10uF(ceramic)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VOUT=3.3V
VOUT=1.5V
VOUT=3.3V
VOUT=1.5V
PWM/PFM
PWM
PWM/PFM
PWM
1
10
100
1000
1
10
100
1000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
XC9223B081Ax
XC9223B082Ax
VIN=3.3V, FOSC=2MHz, L=2.2uH(CDRH4D28),
CIN=10uF(ceramic), CL=10uF(ceramic)
100
90
80
70
60
50
40
30
20
10
0
100
90
80
70
60
50
40
30
20
10
0
VOUT=2.5V
VOUT=1.5V
VOUT=2.5V
VOUT=1.5V
PWM/PFM
PWM
PWM/PFM
PWM
1
10
100
1000
1
10
100
1000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
(2) Output Voltage vs. Output Current
XC9223B081Ax
XC9223B082Ax
VIN=5.0V, Topr=25oC, L:4.7uH(CDRH4D28C),
CIN=10uF(ceramic),CL=10uF(ceramic)
VIN=5.0V,Topr=25oC, L:4.7uH(CDRH4D28C),
CIN=10uF(ceramic),CL=10uF(ceramic)
1.6
1.55
1.5
3.6
3.5
3.4
3.3
3.2
3.1
3
PWM Control
PWM Control
1.45
1.4
PWM/PFM Automatic Switching Control
PWM/PFM Automatic Switching Control
1
10
100
1000
1
10
100
1000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
15
XC9223/9224 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(2) Output Voltage vs. Output Current (Continued)
XC9223B082Ax
XC9223B081Ax
VIN=3.3V,Topr=25oC, L:4.7uH(CDRH4D28C),
CIN=10uF(ceramic), CL=10uF(ceramic)
VIN=3.3V,Topr=25oC, L:4.7uH(CDRH4D28C),
CIN=10uF(ceramic),CL=10uF(ceramic)
2.8
2.7
2.6
2.5
2.4
2.3
2.2
1.6
1.55
1.5
PWM Control
PWM Control
PWM/PFM Automatic Switching Control
1.45
1.4
PWM/PFM Automatic Switching Control
1
10
100
1000
1
10
100
1000
Output Current: IOUT (mA)
Output Current: IOUT (mA)
(3) Oscillation Frequency vs. Ambient Temperature
(4) U.V.L.O. Voltage vs. Ambient Temperature
XC9223/24 Series
XC9223/24 Series
1.40
2.8
2.8
2.6
UVLO2
1MHz
1.20
2.4
2
2.4
2.2
2.0
1.8
1.00
2MHz
0.80
1.6
1.2
1.6
1.4
UVLO
-25
0.60
-50
-25
0
25
50
75
100
-50
0
25
50
75
100
Ambient Temperature : Ta (oC)
Ambient Temperature : Ta (oC)
(5) Supply Current 2 vs. Input Voltage
XC9223/9424 Series (1MHz)
XC9223/24 Series (2MHz)
CE=FB=VIN, MODE=0V
CE=FB=VIN, MODE=0V
100
80
60
40
20
0
100
80
60
40
20
0
2
3
4
5
6
7
2
3
4
5
6
7
Input Voltage: VIN (V)
Input Voltage: VIN (V)
16
XC9223/9224
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(6) Soft Start Time
XC9223/24 Series
ꢀ
XC9223/24 Series
VIN=5.0V,VOUT=3.3V,CE=0 5V
→
VIN=5.0V,VOUT=1.5V,CE=0 5V
→
IOUT=1mA,MODE=VIN
IOUT=1mA,MODE=0V
CE : 5V/div
VOUT : 1V/div
500usec/div
500usec/div
(7) FB Voltage vs. Supply Voltage
XC9223/9424 Series
IOUT=0.1mA,Topr=25oC
0.816
0.808
0.800
0.792
0.784
2.0
3.0
4.0
5.0
6.0
7.0
Input Voltage: VIN (V)
17
XC9223/9224 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response
XC9223B081Ax <1MHz>
VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control)
L=4.7uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
500usec/div
VOUT:200mV/div
VOUT:200mV/div
IOUT=800mA
IOUT=800mA
IOUT=200mA
IOUT=200mA
50usec/div
500usec/div
VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control)
L=4.7uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
500usec/div
18
XC9223/9224
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (Continued)
XC9223B081Ax <1MHz> (Continued)
VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control)
L=4.7uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
200usec/div
VOUT:200mV/div
VOUT:200mV/div
IOUT=800mA
IOUT=800mA
IOUT=200mA
IOUT=200mA
50usec/div
200usec/div
VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control)
L=4.7uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
200usec/div
19
XC9223/9224 Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (Continued)
XC9223B082Ax <2MHz>
VIN=5.0V, VOUT=3.3V, MODE/SYNC=VIN (PWM control)
L=2.2uH (CDRH4D28), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
500usec/div
VOUT:200mV/div
VOUT:200mV/div
IOUT=800mA
IOUT=800mA
IOUT=200mA
IOUT=200mA
500usec/div
50usec/div
VIN=5.0V, VOUT=3.3V, MODE/SYNC=0V (PWM/PFM automatic switching control)
L=2.2uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
500usec/div
20
XC9223/9224
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(8) Load Transient Response (Continued)
XC9223B082Ax <2MHz> (Continued)
VIN=5.0V, VOUT=1.5V, MODE/SYNC=VIN (PWM control)
L=2.2uH (CDRH4D28), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
50usec/div
200usec/div
VOUT:200mV/div
VOUT:200mV/div
IOUT=800mA
IOUT=800mA
IOUT=200mA
IOUT=200mA
50usec/div
200usec/div
VIN=5.0V, VOUT=1.5V, MODE/SYNC=0V (PWM/PFM automatic switching control)
L=2.2uH (CDRH4D28C), CIN=10uF (ceramic), CL=10uF (ceramic), Topr=25OC
VOUT:200mV/div
VOUT:200mV/div
IOUT=200mA
IOUT=200mA
IOUT=1mA
IOUT=1mA
200usec/div
50usec/div
21
相关型号:
XC9224B082DR-G
Switching Regulator, Voltage-mode, 2A, 2000kHz Switching Freq-Max, PDSO10, ANTIMONY AND HALOGEN FREE, ROHS COMPLIANT, USP-10
TOREX
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