XC6120C202HR-G [TOREX]

IC SUPERVISOR 2.0V 3-USP;


型号：	XC6120C202HR-G
厂家：	Torex Semiconductor
描述：	IC SUPERVISOR 2.0V 3-USP
文件：	总15页 (文件大小：535K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC6120 Series

ETR0209-011

Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector

■GENERAL DESCRIPTION

The XC6120 series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser

trimming technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment.

The XC6120 in ultra small packages are ideally suited for high-density mounting. The XC6120 is available in both CMOS and

N-channel open drain output configurations.

■FEATURES

■APPLICATIONS

●Microprocessor reset circuitry

●Memory battery back-up circuits

●Power-on reset circuits

Highly Accurate

:± 2% (V_DF≧1.5V)

: ± 30mV (V_DF<1.5V)

Low Power Consumption: 0.6μA [V_DF=2.7V, V_IN=2.97V]

Detect Voltage Range : 1.0V ~ 5.0V (0.1V increments)

Operating Voltage Range: 0.7V ~ 6.0V

Detect Voltage Temperature Characteristics

:±100ppm/℃ (TYP.)

●Power failure detection

●System battery life and charge voltage monitors

Output Configuration

: CMOS (XC6120C)

: N-channel open drain (XC6120N)

Operating

Temperature Range

Packages

: -40℃~+85℃

: USP-3, SSOT-24, SOT-25

Environmentally Friendly : EU RoHS Compliant, Pb Free

■ TYPICAL PERFORMANCE

■

TYPICAL APPLICATION CIRCUIT

CHARACTERISTICS

●Supply Current vs. Input Voltage

XC6120x272xx

Vpull-up

3.5

Ta= 85℃

25℃

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Rpull-up

(Unused for the CMOS

output products)

-40℃

VIN

VOUT

VSS

Input Voltage: VIN (V)

1/15

XC6120 Series

■BLOCK DIAGRAMS

(1) XC6120C

Comparator

VOUT

Vref.

VSS

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

(2) XC6120N

Comparator

OUT

Vref.

* Diodes inside the circuits are ESD protection diodes and parasitic diodes.

2/15

XC6120

Series

■PRODUCT CLASSIFICATION

1) Ordering Information

(*1)

XC6120①②③④⑤⑥-⑦

DESIGNATOR

ITEM

SYMBOL

DESCRIPTION

CMOS output

①

②③

④

Output Configuration

N-ch open drain output

Detect Voltage (V_DF

Detect Accuracy

)

10~50

For example 1.0V → ②1, ③0

±2%(1.5V≦VDF≦5.0V)

±30mV(1.0V≦VDF≦1.5V)

USP-3 (3,000pcs/Reel)

HR-G

USP-3 (3,000pcs/Reel)

SSOT-24 (3,000pcs/Reel)

Packages

(*1)

⑤⑥-⑦

(Order Unit)

NR-G

SR-G

SL-G

SSOT-24 (3,000pcs/Reel)

SOT-25 (3,000pcs/Reel) Standard feed^(*2)

SOT-25 (3,000pcs/Reel) Reverse feed^(*2)

(*1)

(*2)

The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.

SOT-25 uses Cu wires.

2) Taping Specifications

・SR-G

・SL-G

direction of feed

■PIN CONFIGURATION

V_IN

V_OUT

V_SS

SSOT-24

(TOP VIEW)

V_OUT

USP-3

V_IN

V_{O UT}

V_IN

V_SS

SOT-25

(TOP VIEW)

(BOTTOM VIEW)

■PIN ASSIGNMENT

PIN NUMBER

PIN NAME

FUNCTION

USP-3

SSOT-24

SOT-25

V_IN

V_SS

V_OUT

Power Input

Ground

Output (Detect ”Low” )

No Connection

4,5

3/15

XC6120 Series

■ABSOLUTE MAXIMUM RATINGS

Ta=25℃

UNITS

PARAMETER

Input Voltage

Output Current

SYMBOL

RATING

V_SS-0.3~7.0

V_IN

I_OUT

CMOS Output

V_SS-0.3~V_IN+0.3

Output Voltage

V_OUT

N-ch Open Drain Output

V_SS-0.3~7.0

120

USP-3

1000 (40mm x 40mm Standard board )^(*1)

150

SSOT-24

SOT-25

Power Dissipation

500 (40mm x 40mm Standard board )^(*1)

250

600 (40mm x 40mm Standard board )^(*1)

-40~+85

Operating Temperature Range

Storage Temperature Range

Topr

Tstg

℃

-55~+125

^(*1)The power dissipation figure shown is PCB mounted and is for reference only.

The mounting condition is please refer to PACKAGING INFORMATION.

4/15

XC6120

Series

■ELECTRICAL CHARACTERISTICS

XC6120 Series

Ta=25℃

PARAMETER

SYMBOL

V_IN

CONDITION

MIN.

0.7

TYP.

MAX.

6.0

UNITS CIRCUIT

Operating Voltage

V_DF(T)=1.0～5.0V ^(*1)

Detect Voltage

V_DF

V_DF(T)=1.0V～5.0V

E-1

①

V_DF

Hysteresis Width

V_HYS

①

0.03

0.05

0.07

Supply Current 1

Supply Current 2

I_SS1

I_SS2

V_IN=V_DF(T)×1.1

V_IN= V_DF(T)×0.9

E-2

E-3

μA

②

V_OUT=0.5V

0.09

0.08

0.05

0.46

1.15

1.44

1.61

0.57

0.56

0.30

0.71

1.41

1.77

1.96

-0.95

V_IN=0.7V

V_OUT=0.3V

V_OUT=0.1V

I_OUTN

V_IN=1.0V

V_IN=2.0V

V_IN=3.0V

V_IN=4.0V

V_IN=6.0V

V_OUT=0.1V, V_DF(T)＞1.0V

V_OUT=0.1V, V_DF(T)＞2.0V

V_OUT=0.1V, V_DF(T)＞3.0V

V_OUT=0.1V, V_DF(T)＞4.0V

V_OUT=5.5V

③

Output Current

(*2)

I_OUTP

-0.60

③

CMOS

V_IN=V_DF×0.9, V_OUT=0V

-0.001

0.001

Output(Pch)

N-ch Open

Drain

Leakage

Current

I_LEAK

μA

V_IN=6.0V, V_OUT=6.0V

0.10

ΔV_DF

(ΔTopr・

Temperature

-40 ^oC≦Topr≦85 ^oC

±100

ppm/^oC

①

Characteristics

Detect Delay Time ^(*3)

Release Delay Time ^(*5)

V_DF

t_DF

)

V_IN=6.0V→0.7V

V_IN=V_DFto V_OUT=0.5V

V_IN=0.7V→6.0V

100

μs

④

t_DR

(*4)

V_IN=V_DRto V_OUT=V_DR

^(*1): VDF (T): Nominal detect voltage

^(*2): For XC6120C only.

^(*3): A time taking from the time at V_IN= V_DFto the time at V_OUT=0.5V when V_INfalls from 6.0V to 0.7V.

^(*4): V_DR: Release voltage (V_DR= V_DF+ V_HYS

)

^(*5): A time taking from the time at V_IN= V_DRto the time at V_OUT= V_DRwhen V_INrise from 0.7V to 6.0V.

●XC6120N recommended pull-up resistance

Input Voltage Range

Pull-up Resistance

0.7V~6.0V

0.8V~6.0V

1.0V~6.0V

≧ 220kΩ

≧ 100kΩ

≧

33kΩ

5/15

XC6120 Series

■ELECTRICAL CHARACTERISTICS (Continued)

● DETECT VOLTAGE ACCURACY AND SUPPLY CURRENT SPECIFICATIONS

SYMBOL

E-1

E-2

E-3

PARAMETER

DETECT VOLTAGE

V_DF(V)

SUPPLY CURRENT 1

SUPPLY CURRENT 2

XC6120xxx2 Series

I_SS1(μA)

I_SS2(μA)

NOMINAL DETECT

VOLTAGE

V_DF(T)

1.0

1.1

1.2

1.3

1.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.4

4.5

4.6

4.7

4.8

4.9

5.0

MIN.

0.970

1.070

1.170

1.270

1.370

1.470

1.568

1.666

1.764

1.862

1.960

2.058

2.156

2.254

2.352

2.450

2.548

2.646

2.744

2.842

2.940

3.038

3.136

3.234

3.332

3.430

3.528

3.626

3.724

3.822

3.920

4.018

4.116

4.214

4.312

4.410

4.508

4.606

4.704

4.802

4.900

MAX.

1.030

1.130

1.230

1.330

1.430

1.530

1.632

1.734

1.836

1.938

2.040

2.142

2.244

2.346

2.448

2.550

2.652

2.754

2.856

2.958

3.060

3.162

3.264

3.366

3.468

3.570

3.672

3.774

3.876

3.978

4.080

4.182

4.284

4.386

4.488

4.590

4.692

4.794

4.896

4.998

5.100

TYP.

MAX.

TYP.

MAX.

0.5

1.4

0.4

1.35

0.6

1.7

0.5

1.60

0.7

1.9

0.6

1.80

^(*6)When detect voltage is 1.0V≦V_DF(T)＜1.5V, detect accuracy is ±30mV.

When detect voltage is 1.5V≦V_DF(T)≦5.0V, detect accuracy is ±2%.

6/15

XC6120

Series

■TEST CIRCUITS

Circuit ①

R_PULL=100kΩ

VIN

(Unused for the CMOS output products)

VIN

VOUT

VSS

Circuit ②

Circuit ③

Circuit ④

R_PULL=100kΩ

(Unused for the CMOS output products)

VOUT

Measurement of waveform

7/15

XC6120 Series

■OPERATIONAL EXPLANATION

●Typical Application Circuit

R_PULL

(Unused for the CMOS output products)

VIN

OUT

VOUT

VSS

●Timing Charge

Release Voltage (V_DR

)

⑥

⑤

Detect Voltage (V_DF

)

Input Voltage

(V_IN)

Minimum Operating Voltage (V_MIN

)

Ground Voltage (V_SS

)

①

②

④

③

Output

Voltage

(V_OUT

)

Ground Voltage (V_SS

)

Note: For explaining in a simplified case, an operation time of the circuit is not counted.

The following explains the operation of the typical application circuit along number symbols shown in the timing chart.

①

When input voltage (V_IN) is higher than detect voltage (V_DF), output voltage (V_OUT) will be equal to input voltage (V_IN).

(A condition of high impedance exists with N-ch open drain output configurations.)

②

③

When input voltage (V_IN) falls below detect voltage (V_DF), output voltage (V_OUT) will be equal to the ground voltage

(V_SS) level.

When input voltage (V_IN) falls to a level below that of the minimum operating voltage (V_MIN), output will become

unstable. If In this condition, V_INwill equal the pulled-up output (should output be pulled-up.) (Input voltage, V_IN, in the

typical application circuit.)

④

⑤

When input voltage (V_IN) rises above the minimum operating voltage (V_MIN) level until it achieves a release voltage

(V_DR), output keeps the ground voltage level (V_SS).

When the input voltage (V_IN) rises above the release voltage (V_DR), output voltage (V_OUTwill be equal to input voltage

(V_IN). (A condition of high impedance exists with N-ch open drain output configurations.)

⑥

The difference between V_DRand V_DFrepresents the hysteresis width.

8/15

XC6120

Series

■NOTE ON USE

1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising

phenomenon, the IC is liable to malfunction should the ratings be exceeded.

2. In order to stabilize the IC's operations, please ensure that V_INpin's input frequency's rise and fall times are more than

several μs / V.

3. With a resistor connected between the V_INpin and the power supply V_DDsome errors may be observed from the input

voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current.

4. When a resistor is connected between the V_INpin and the power supply V_DD, oscillation may occur as a result of through

current and voltage drop at the R_INat the time of voltage release. (refer to the Oscillation Description (1) below ) Especially

in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (I_OUT) exists.

(refer to the Oscillation Description (2) below)

5. Please use N-ch open drains configuration, when a resistor R_INis connected between the V_INpin and the power supply V_DD

power source. In such cases, please ensure that R_INis less than 10kΩ and that C is more than 0.1μF.

6. Torex places an importance on improving our products and its reliability.

However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.

RIN

VP_PU_UL_LL_L-UP

R_PULL

PULL-UP

XC6120N

OUT

VOUT

[Figure 1: Circuit connected with the input resistor]

●

Oscillation Description

(1) Oscillation as a result of through current

Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates

regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above.

This oscillation does not occur during the detect operation.

(2) Output current oscillation with the CMOS output configuration

As shown in figure 2, when the voltage applied at the power supply (V_DD) rises from below detect voltage to above release voltage,

the IC commence release operations and the internal P-ch driver transistor will be on. The output current (I_OUT) flows the input

resistor (R_IN) via the P-ch driver transistor. Because of the input resistor (R_IN) and the output current (I_OUT), an input pin voltage

drops R_INx I_OUT. If the voltage drop level is larger than the IC’s hysteresis width (V_HYS), the input pin voltage will falls below the

V_DFand detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because

the output current (I_OUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same

voltage level as the input voltage (V_IN). For this, the input pin voltage will rise above the release voltage (V_DR), therefore, the

release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via

means of a similar mechanism during detect operations.

RIN

Voltage Drop

(RIN×IOUT

)

IOUT

XC6120C

DD(≧VDR)

OUT

[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]

9/15

XC6120 Series

■TYPICAL PERFORMANCE CHARACTERISTICS

(1) Supply Current vs. Input Voltage

XC6120x102xx

XC6120x502xx

3.5

Ta= 85℃

25℃

-40℃

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Ta= 85℃

25℃

-40℃

3.0

2.5

2.0

1.5

1.0

0.5

0.0

Input Voltage: VIN (V)

(2) Output Voltage vs. Input Voltage

XC6120C202xx

XC6120N202xx

Ta= 25℃

Vpull-up=6V Rpull-up=100kΩ

Ta= 85℃

25℃

-50℃

0.0

0.5

1.0

1.5

2.0

2.5

3.0

Input Voltage: VIN (V)

(3) Detect Voltage, Release Voltage vs. Ambient Temperature

XC6120x202xx

XC6120x102xx

2.4

2.3

2.2

2.1

2.0

1.9

1.8

1.20

1.15

1.10

1.05

1.00

0.95

0.90

1.20

1.15

1.10

1.05

1.00

0.95

0.90

2.3

2.2

2.1

2.0

1.9

1.8

-50

-25

100

-50 -25

100

Ambient Temperature: Ta (℃)

10/15

XC6120

Series

■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)

(4) Output Current (Nch Driver) vs. Input Voltage

XC6120x502xx

^OUT=0.3V

OUT=0.5V

Ta= -40℃

25℃

85℃

25℃

85℃

Input Voltage: VIN [V]

Input Voltage: VIN (V)

(5) Output Current (Pch Driver) vs. Input Voltage

XC6120x502xx

XC6120C102xx

OUT=0.1V

^OUT=V^IN-0.5V

0.00

-0.25

-0.50

-0.75

-1.00

-1.25

-1.50

Ta= 85℃

25℃

-40℃

Ta= -40℃

25℃

85℃

Input Voltage: VIN (V)

XC6120C102xx

^OUT=VIN-0.1V

OUT=VIN-0.3V

0.00

-0.05

-0.10

-0.15

-0.20

-0.25

-0.30

0.00

-0.20

-0.40

-0.60

-0.80

-1.00

Ta= 85℃

25℃

-40℃

Ta= 85℃

25℃

-40℃

Input Voltage: VIN (V)

11/15

XC6120 Series

■PACKAGING INFORMATION

For the latest package information go to, www.torexsemi.com/technical-support/packages

PACKAGE

SOT-25

OUTLINE / LAND PATTERN

SOT-25 PKG

THERMAL CHARACTERISTICS

SOT-25 Power Dissipation

Standard Board

SSOT-24

USP-3

SSOT-24 PKG

SSOT-24 Power Dissipation

USP-3 Power Dissipation

USP-3 PKG

12/15

XC6120

Series

■ MARKING RULE

●SSOT-24

① represents output configuration and detect voltage Range

MARK

OUTPUT CONFIGURATION OUTPUT VOLTAGE

PRODUCT SERIES

1.0V～2.9V

CMOS

XC6120C

XC6120N

3.0V～5.0V

1.0V～2.9V

Nch open drain

3.0V～5.0V

SSOT-24

(TOP VIEW)

② represents detect voltage

MARK

DETECT VOLTAGE (V)

MARK

DETECT VOLTAGE (V)

3.0

3.1

3.2

3.3

3.4

3.5

3.6

3.7

3.8

3.9

4.0

4.1

4.2

4.3

4.4

1.5

1.6

1.7

1.8

1.9

2.0

2.1

2.2

2.3

2.4

2.5

2.6

2.7

2.8

2.9

4.5

4.6

4.7

4.8

4.9

5.0

1.0

1.1

1.2

1.3

1.4

③,④ represents production lot number

01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.

(G, I, J, O, Q, W excluded. Reversed character is not used.)

13/15

XC6120 Series

■ MARKING RULE (Continued)

●USP-3

① represents product series

MARK

PRODUCT SERIES

XC6120******

USP-3

② standard：represents output configuration and integer number of detect voltage

●CMOS Output (XC6120C Series)

●Nch open drain (XC6120N Series)

(TOP VIEW)

MARK DETECT VOLTAGE (V)

●SOT-25

1.X

2.X

3.X

4.X

5.X

1.X

2.X

3.X

4.X

5.X

①

②

③

④

⑤

③ standard：represents decimal point of detect voltage

SOT-25

(TOP VIEW)

MARK

DETECT VOLTAGE (V)

PRODUCT SERIES

XC6120**3***

X.3

X.0

XC6120**0***

④,⑤ represents production lot number

01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.

(G, I, J, O, Q, W excluded.)

14/15

XC6120

Series

1. The product and product specifications contained herein are subject to change without notice to

improve performance characteristics. Consult us, or our representatives before use, to confirm that

the information in this datasheet is up to date.

2. The information in this datasheet is intended to illustrate the operation and characteristics of our

products. We neither make warranties or representations with respect to the accuracy or

completeness of the information contained in this datasheet nor grant any license to any intellectual

property rights of ours or any third party concerning with the information in this datasheet.

3. Applicable export control laws and regulations should be complied and the procedures required by

such laws and regulations should also be followed, when the product or any information contained in

this datasheet is exported.

4. The product is neither intended nor warranted for use in equipment of systems which require

extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss

of human life, bodily injury, serious property damage including but not limited to devices or equipment

used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and

other transportation industry and 5) safety devices and safety equipment to control combustions and

explosions. Do not use the product for the above use unless agreed by us in writing in advance.

5. Although we make continuous efforts to improve the quality and reliability of our products;

nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal

injury and/or property damage resulting from such failure, customers are required to incorporate

adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention

features.

6. Our products are not designed to be Radiation-resistant.

7. Please use the product listed in this datasheet within the specified ranges.

8. We assume no responsibility for damage or loss due to abnormal use.

Semiconductor Ltd in writing in advance.

TOREX SEMICONDUCTOR LTD.

15/15

XC6120C202HR-G [TOREX]

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