XC6120C252HR-G [TOREX]
IC SUPERVISOR 2.5V 3-USP;型号: | XC6120C252HR-G |
厂家: | Torex Semiconductor |
描述: | IC SUPERVISOR 2.5V 3-USP |
文件: | 总15页 (文件大小:535K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
XC6120 Series
ETR0209-011
Highly Accurate, Ultra Small, Low Power Consumption Voltage Detector
■GENERAL DESCRIPTION
The XC6120 series are highly precise, low power consumption voltage detectors, manufactured using CMOS and laser
trimming technologies. With low power consumption and high accuracy, the series is suitable for precision mobile equipment.
The XC6120 in ultra small packages are ideally suited for high-density mounting. The XC6120 is available in both CMOS and
N-channel open drain output configurations.
■FEATURES
■APPLICATIONS
●Microprocessor reset circuitry
●Memory battery back-up circuits
●Power-on reset circuits
Highly Accurate
:± 2% (VDF≧1.5V)
: ± 30mV (VDF<1.5V)
Low Power Consumption: 0.6μA [VDF=2.7V, VIN=2.97V]
Detect Voltage Range : 1.0V ~ 5.0V (0.1V increments)
Operating Voltage Range: 0.7V ~ 6.0V
Detect Voltage Temperature Characteristics
:±100ppm/℃ (TYP.)
●Power failure detection
●System battery life and charge voltage monitors
Output Configuration
: CMOS (XC6120C)
: N-channel open drain (XC6120N)
Operating
Temperature Range
Packages
: -40℃~+85℃
: USP-3, SSOT-24, SOT-25
Environmentally Friendly : EU RoHS Compliant, Pb Free
■ TYPICAL PERFORMANCE
■
CHARACTERISTICS
●Supply Current vs. Input Voltage
XC6120x272xx
Vpull-up
3.5
V
IN
Ta= 85℃
25℃
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Rpull-up
(Unused for the CMOS
output products)
-40℃
VIN
VOUT
VOUT
VSS
0
1
2
3
4
5
6
Input Voltage: VIN (V)
1/15
XC6120 Series
■BLOCK DIAGRAMS
(1) XC6120C
V
IN
M2
R
R
1
Comparator
VOUT
Vref.
2
M1
VSS
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
(2) XC6120N
V
IN
R
R
1
Comparator
V
V
OUT
Vref.
2
M
1
SS
* Diodes inside the circuits are ESD protection diodes and parasitic diodes.
2/15
XC6120
Series
■PRODUCT CLASSIFICATION
1) Ordering Information
(*1)
XC6120①②③④⑤⑥-⑦
DESIGNATOR
ITEM
SYMBOL
DESCRIPTION
C
N
CMOS output
①
②③
④
Output Configuration
N-ch open drain output
Detect Voltage (VDF
Detect Accuracy
)
10~50
For example 1.0V → ②1, ③0
±2%(1.5V≦VDF≦5.0V)
±30mV(1.0V≦VDF≦1.5V)
USP-3 (3,000pcs/Reel)
2
HR
HR-G
NR
USP-3 (3,000pcs/Reel)
SSOT-24 (3,000pcs/Reel)
Packages
(*1)
⑤⑥-⑦
(Order Unit)
NR-G
SR-G
SL-G
SSOT-24 (3,000pcs/Reel)
SOT-25 (3,000pcs/Reel) Standard feed(*2)
SOT-25 (3,000pcs/Reel) Reverse feed(*2)
(*1)
(*2)
The “-G” suffix indicates that the products are Halogen and Antimony free as well as being fully EU RoHS compliant.
SOT-25 uses Cu wires.
2) Taping Specifications
・SR-G
・SL-G
direction of feed
direction of feed
■PIN CONFIGURATION
NC
5
NC
4
VIN
VOUT
VSS
1
2
3
VSS
SSOT-24
(TOP VIEW)
NC
VOUT
USP-3
VIN
VO UT
VIN
VSS
SOT-25
(TOP VIEW)
(BOTTOM VIEW)
■PIN ASSIGNMENT
PIN NUMBER
PIN NAME
FUNCTION
USP-3
SSOT-24
SOT-25
1
3
2
-
4
2
3
1
2
3
1
VIN
VSS
VOUT
NC
Power Input
Ground
Output (Detect ”Low” )
No Connection
4,5
3/15
XC6120 Series
■ABSOLUTE MAXIMUM RATINGS
Ta=25℃
UNITS
PARAMETER
Input Voltage
Output Current
SYMBOL
RATING
VSS-0.3~7.0
10
VIN
V
IOUT
mA
CMOS Output
VSS-0.3~VIN+0.3
Output Voltage
VOUT
V
N-ch Open Drain Output
VSS-0.3~7.0
120
USP-3
1000 (40mm x 40mm Standard board )(*1)
150
SSOT-24
SOT-25
Power Dissipation
Pd
mW
500 (40mm x 40mm Standard board )(*1)
250
600 (40mm x 40mm Standard board )(*1)
-40~+85
Operating Temperature Range
Storage Temperature Range
Topr
Tstg
℃
℃
-55~+125
(*1) The power dissipation figure shown is PCB mounted and is for reference only.
The mounting condition is please refer to PACKAGING INFORMATION.
4/15
XC6120
Series
■ELECTRICAL CHARACTERISTICS
XC6120 Series
Ta=25℃
PARAMETER
SYMBOL
VIN
CONDITION
MIN.
0.7
TYP.
-
MAX.
6.0
UNITS CIRCUIT
Operating Voltage
VDF(T)=1.0~5.0V (*1)
V
V
-
Detect Voltage
VDF
VDF(T)=1.0V~5.0V
VDF(T)=1.0V~5.0V
E-1
①
VDF
×
VDF
×
VDF
×
Hysteresis Width
VHYS
V
①
0.03
0.05
0.07
Supply Current 1
Supply Current 2
ISS1
ISS2
VIN=VDF(T)×1.1
VIN= VDF(T)×0.9
E-2
E-3
μA
μA
②
②
VOUT=0.5V
0.09
0.08
0.05
0.46
1.15
1.44
1.61
-
0.57
0.56
0.30
0.71
1.41
1.77
1.96
-0.95
-
VIN=0.7V
VOUT=0.3V
-
VOUT=0.1V
-
IOUTN
VIN=1.0V
VIN=2.0V
VIN=3.0V
VIN=4.0V
VIN=6.0V
VOUT=0.1V, VDF(T)>1.0V
VOUT=0.1V, VDF(T)>2.0V
VOUT=0.1V, VDF(T)>3.0V
VOUT=0.1V, VDF(T)>4.0V
VOUT=5.5V
-
mA
③
Output Current
-
-
-
(*2)
IOUTP
-0.60
mA
③
③
CMOS
VIN=VDF×0.9, VOUT=0V
-
-
-0.001
0.001
-
Output(Pch)
N-ch Open
Drain
Leakage
Current
ILEAK
μA
VIN=6.0V, VOUT=6.0V
0.10
ΔVDF
(ΔTopr・
/
Temperature
-40 oC≦Topr≦85 oC
-
±100
-
ppm/oC
①
Characteristics
Detect Delay Time (*3)
Release Delay Time (*5)
VDF
tDF
)
VIN=6.0V→0.7V
VIN=VDF to VOUT=0.5V
VIN=0.7V→6.0V
-
-
30
20
100
100
μs
μs
④
④
tDR
(*4)
VIN=VDR to VOUT=VDR
(*1): VDF (T): Nominal detect voltage
(*2): For XC6120C only.
(*3): A time taking from the time at VIN = VDF to the time at VOUT=0.5V when VIN falls from 6.0V to 0.7V.
(*4): VDR: Release voltage (VDR = VDF + VHYS
)
(*5): A time taking from the time at VIN = VDR to the time at VOUT = VDR when VIN rise from 0.7V to 6.0V.
●XC6120N recommended pull-up resistance
Input Voltage Range
Pull-up Resistance
0.7V~6.0V
0.8V~6.0V
1.0V~6.0V
≧ 220kΩ
≧ 100kΩ
≧
33kΩ
5/15
XC6120 Series
■ELECTRICAL CHARACTERISTICS (Continued)
● DETECT VOLTAGE ACCURACY AND SUPPLY CURRENT SPECIFICATIONS
SYMBOL
E-1
E-2
E-3
PARAMETER
DETECT VOLTAGE
VDF (V)
SUPPLY CURRENT 1
SUPPLY CURRENT 2
XC6120xxx2 Series
ISS1 (μA)
ISS2 (μA)
NOMINAL DETECT
VOLTAGE
VDF(T)
1.0
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
4.5
4.6
4.7
4.8
4.9
5.0
MIN.
0.970
1.070
1.170
1.270
1.370
1.470
1.568
1.666
1.764
1.862
1.960
2.058
2.156
2.254
2.352
2.450
2.548
2.646
2.744
2.842
2.940
3.038
3.136
3.234
3.332
3.430
3.528
3.626
3.724
3.822
3.920
4.018
4.116
4.214
4.312
4.410
4.508
4.606
4.704
4.802
4.900
MAX.
1.030
1.130
1.230
1.330
1.430
1.530
1.632
1.734
1.836
1.938
2.040
2.142
2.244
2.346
2.448
2.550
2.652
2.754
2.856
2.958
3.060
3.162
3.264
3.366
3.468
3.570
3.672
3.774
3.876
3.978
4.080
4.182
4.284
4.386
4.488
4.590
4.692
4.794
4.896
4.998
5.100
TYP.
MAX.
TYP.
MAX.
0.5
1.4
0.4
1.35
0.6
1.7
0.5
1.60
0.7
1.9
0.6
1.80
(*6)When detect voltage is 1.0V≦VDF(T)<1.5V, detect accuracy is ±30mV.
When detect voltage is 1.5V≦VDF(T)≦5.0V, detect accuracy is ±2%.
6/15
XC6120
Series
■TEST CIRCUITS
Circuit ①
RPULL=100kΩ
VIN
(Unused for the CMOS output products)
VIN
V
VOUT
V
VSS
Circuit ②
Circuit ③
Circuit ④
RPULL=100kΩ
V
IN
(Unused for the CMOS output products)
VOUT
Measurement of waveform
V
SS
7/15
XC6120 Series
■OPERATIONAL EXPLANATION
●Typical Application Circuit
RPULL
V
IN
(Unused for the CMOS output products)
VIN
V
OUT
VOUT
VSS
●Timing Charge
Release Voltage (VDR
)
⑥
⑤
Detect Voltage (VDF
)
Input Voltage
(VIN)
Minimum Operating Voltage (VMIN
)
Ground Voltage (VSS
)
①
②
④
③
Output
Voltage
(VOUT
)
Ground Voltage (VSS
)
Note: For explaining in a simplified case, an operation time of the circuit is not counted.
The following explains the operation of the typical application circuit along number symbols shown in the timing chart.
①
When input voltage (VIN) is higher than detect voltage (VDF), output voltage (VOUT) will be equal to input voltage (VIN).
(A condition of high impedance exists with N-ch open drain output configurations.)
②
③
When input voltage (VIN) falls below detect voltage (VDF), output voltage (VOUT) will be equal to the ground voltage
(VSS) level.
When input voltage (VIN) falls to a level below that of the minimum operating voltage (VMIN), output will become
unstable. If In this condition, VIN will equal the pulled-up output (should output be pulled-up.) (Input voltage, VIN, in the
typical application circuit.)
④
⑤
When input voltage (VIN) rises above the minimum operating voltage (VMIN) level until it achieves a release voltage
(VDR), output keeps the ground voltage level (VSS).
When the input voltage (VIN) rises above the release voltage (VDR), output voltage (VOUT will be equal to input voltage
(VIN). (A condition of high impedance exists with N-ch open drain output configurations.)
⑥
The difference between VDR and VDF represents the hysteresis width.
8/15
XC6120
Series
■NOTE ON USE
1. Please use this IC within the stated maximum ratings. For temporary, transitional voltage drop or voltage rising
phenomenon, the IC is liable to malfunction should the ratings be exceeded.
2. In order to stabilize the IC's operations, please ensure that VIN pin's input frequency's rise and fall times are more than
several μs / V.
3. With a resistor connected between the VIN pin and the power supply VDD some errors may be observed from the input
voltage at the detect and release voltage. Those errors are not constant because of the fluctuation of the supply current.
4. When a resistor is connected between the VIN pin and the power supply VDD, oscillation may occur as a result of through
current and voltage drop at the RIN at the time of voltage release. (refer to the Oscillation Description (1) below ) Especially
in the CMOS output configurations, oscillation may occur regardless of detect/release operation if load current (IOUT) exists.
(refer to the Oscillation Description (2) below)
5. Please use N-ch open drains configuration, when a resistor RIN is connected between the VIN pin and the power supply VDD
power source. In such cases, please ensure that RIN is less than 10kΩ and that C is more than 0.1μF.
6. Torex places an importance on improving our products and its reliability.
However, by any possibility, we would request user fail-safe design and post-aging treatment on system or equipment.
RIN
V
PULL
V
IN
RPULL
XC6120N
V
DD
C
V
OUT
VOUT
V
SS
[Figure 1: Circuit connected with the input resistor]
●
Oscillation Description
(1) Oscillation as a result of through current
Since the XC6120 series are CMOS ICs, transient through current will flow when the IC's internal circuit switching operates
regardless of output configuration. Consequently, oscillation is liable to occur as a result of the similar operations as in (1) above.
This oscillation does not occur during the detect operation.
(2) Output current oscillation with the CMOS output configuration
As shown in figure 2, when the voltage applied at the power supply (VDD) rises from below detect voltage to above release voltage,
the IC commence release operations and the internal P-ch driver transistor will be on. The output current (IOUT) flows the input
resistor (RIN) via the P-ch driver transistor. Because of the input resistor (RIN) and the output current (IOUT), an input pin voltage
drops RIN x IOUT. If the voltage drop level is larger than the IC’s hysteresis width (VHYS), the input pin voltage will falls below the
VDF and detect operations will commerce so that the internal P-ch driver transistor will be off. The voltage drop will stop because
the output current (IOUT) which was flowing the P-ch driver transistor will run down. The input pin voltage will become the same
voltage level as the input voltage (VIN). For this, the input pin voltage will rise above the release voltage (VDR), therefore, the
release operations will begin over again. Oscillation may occur with this repetition. Further, this condition will also appear via
means of a similar mechanism during detect operations.
RIN
Voltage Drop
(RIN×IOUT
V
IN
)
IOUT
XC6120C
V
DD(≧VDR)
V
OUT
V
SS
R
L
[Figure 2: Oscillation caused by the input resistor of the CMOS output product and the output current]
9/15
XC6120 Series
■TYPICAL PERFORMANCE CHARACTERISTICS
(1) Supply Current vs. Input Voltage
XC6120x102xx
XC6120x502xx
3.5
3.5
Ta= 85℃
25℃
-40℃
3.0
2.5
2.0
1.5
1.0
0.5
0.0
Ta= 85℃
25℃
-40℃
3.0
2.5
2.0
1.5
1.0
0.5
0.0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(2) Output Voltage vs. Input Voltage
XC6120C202xx
XC6120N202xx
Ta= 25℃
Vpull-up=6V Rpull-up=100kΩ
6
5
4
3
2
1
0
7
6
5
4
3
2
1
0
Ta= 85℃
25℃
-50℃
0
1
2
3
4
5
6
0.0
0.5
1.0
1.5
2.0
2.5
3.0
Input Voltage: VIN (V)
Input Voltage: VIN (V)
(3) Detect Voltage, Release Voltage vs. Ambient Temperature
XC6120x202xx
XC6120x102xx
2.4
2.4
2.3
2.2
2.1
2.0
1.9
1.8
1.20
1.15
1.10
1.05
1.00
0.95
0.90
1.20
1.15
1.10
1.05
1.00
0.95
0.90
2.3
2.2
2.1
2.0
1.9
1.8
V
DR
V
V
DR
V
DF
DF
-50
-25
0
25
50
75
100
-50 -25
0
25
50
75
100
Ambient Temperature: Ta (℃)
Ambient Temperature: Ta (℃)
10/15
XC6120
Series
■TYPICAL PERFORMANCE CHARACTERISTICS (Continued)
(4) Output Current (Nch Driver) vs. Input Voltage
XC6120x502xx
XC6120x502xx
V
OUT=0.3V
V
OUT=0.5V
10
8
10
8
Ta= -40℃
Ta= -40℃
25℃
85℃
25℃
85℃
6
6
4
4
2
2
0
0
0
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN [V]
Input Voltage: VIN (V)
(5) Output Current (Pch Driver) vs. Input Voltage
XC6120x502xx
XC6120C102xx
V
OUT=0.1V
V
OUT=VIN-0.5V
6
0.00
-0.25
-0.50
-0.75
-1.00
-1.25
-1.50
Ta= 85℃
25℃
-40℃
5
4
3
2
1
0
Ta= -40℃
25℃
85℃
1
2
3
4
5
6
0
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
XC6120C102xx
XC6120C102xx
V
OUT=VIN-0.1V
V
OUT=VIN-0.3V
0.00
-0.05
-0.10
-0.15
-0.20
-0.25
-0.30
0.00
-0.20
-0.40
-0.60
-0.80
-1.00
Ta= 85℃
25℃
-40℃
Ta= 85℃
25℃
-40℃
1
2
3
4
5
6
1
2
3
4
5
6
Input Voltage: VIN (V)
Input Voltage: VIN (V)
11/15
XC6120 Series
■PACKAGING INFORMATION
For the latest package information go to, www.torexsemi.com/technical-support/packages
PACKAGE
SOT-25
OUTLINE / LAND PATTERN
SOT-25 PKG
THERMAL CHARACTERISTICS
SOT-25 Power Dissipation
Standard Board
Standard Board
Standard Board
SSOT-24
USP-3
SSOT-24 PKG
SSOT-24 Power Dissipation
USP-3 Power Dissipation
USP-3 PKG
12/15
XC6120
Series
■ MARKING RULE
●SSOT-24
4
3
① represents output configuration and detect voltage Range
MARK
OUTPUT CONFIGURATION OUTPUT VOLTAGE
PRODUCT SERIES
K
L
1.0V~2.9V
CMOS
XC6120C
XC6120N
3.0V~5.0V
M
N
1.0V~2.9V
Nch open drain
3.0V~5.0V
1
2
SSOT-24
(TOP VIEW)
② represents detect voltage
MARK
DETECT VOLTAGE (V)
MARK
DETECT VOLTAGE (V)
0
1
2
3
4
5
6
7
8
9
A
B
C
D
E
-
3.0
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
4.0
4.1
4.2
4.3
4.4
F
H
K
L
1.5
1.6
1.7
1.8
1.9
2.0
2.1
2.2
2.3
2.4
2.5
2.6
2.7
2.8
2.9
4.5
-
4.6
-
-
4.7
4.8
-
M
N
P
R
S
T
4.9
-
5.0
-
-
-
-
-
-
-
-
-
-
-
-
-
1.0
1.1
1.2
1.3
1.4
U
V
X
Y
Z
③,④ represents production lot number
01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.
(G, I, J, O, Q, W excluded. Reversed character is not used.)
13/15
XC6120 Series
■ MARKING RULE (Continued)
●USP-3
① represents product series
3
MARK
0
PRODUCT SERIES
XC6120******
1
2
3
USP-3
② standard:represents output configuration and integer number of detect voltage
●CMOS Output (XC6120C Series)
●Nch open drain (XC6120N Series)
(TOP VIEW)
MARK DETECT VOLTAGE (V)
MARK DETECT VOLTAGE (V)
●SOT-25
A
B
C
D
E
1.X
2.X
3.X
4.X
5.X
F
H
K
L
1.X
2.X
3.X
4.X
5.X
5
4
M
①
②
③
④
⑤
1
2
3
③ standard:represents decimal point of detect voltage
SOT-25
(TOP VIEW)
MARK
DETECT VOLTAGE (V)
PRODUCT SERIES
XC6120**3***
3
0
X.3
X.0
XC6120**0***
④,⑤ represents production lot number
01 to 09, 10, 11, …, 99, 0A, …, 0Z, 1A, …repeated.
(G, I, J, O, Q, W excluded.)
14/15
XC6120
Series
1. The product and product specifications contained herein are subject to change without notice to
improve performance characteristics. Consult us, or our representatives before use, to confirm that
the information in this datasheet is up to date.
2. The information in this datasheet is intended to illustrate the operation and characteristics of our
products. We neither make warranties or representations with respect to the accuracy or
completeness of the information contained in this datasheet nor grant any license to any intellectual
property rights of ours or any third party concerning with the information in this datasheet.
3. Applicable export control laws and regulations should be complied and the procedures required by
such laws and regulations should also be followed, when the product or any information contained in
this datasheet is exported.
4. The product is neither intended nor warranted for use in equipment of systems which require
extremely high levels of quality and/or reliability and/or a malfunction or failure which may cause loss
of human life, bodily injury, serious property damage including but not limited to devices or equipment
used in 1) nuclear facilities, 2) aerospace industry, 3) medical facilities, 4) automobile industry and
other transportation industry and 5) safety devices and safety equipment to control combustions and
explosions. Do not use the product for the above use unless agreed by us in writing in advance.
5. Although we make continuous efforts to improve the quality and reliability of our products;
nevertheless Semiconductors are likely to fail with a certain probability. So in order to prevent personal
injury and/or property damage resulting from such failure, customers are required to incorporate
adequate safety measures in their designs, such as system fail safes, redundancy and fire prevention
features.
6. Our products are not designed to be Radiation-resistant.
7. Please use the product listed in this datasheet within the specified ranges.
8. We assume no responsibility for damage or loss due to abnormal use.
9. All rights reserved. No part of this datasheet may be copied or reproduced unless agreed by Torex
Semiconductor Ltd in writing in advance.
TOREX SEMICONDUCTOR LTD.
15/15
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