XC25BS6128CT [TOREX]
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit; 除法器信号输出时钟发生器IC，内置晶振电路
| 型号： | XC25BS6128CT |
| 厂家： | 
Torex Semiconductor |
| 描述： | Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit |
| 文件： | 总4页 (文件大小：58K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
September 17, 2003 V1
Preliminary
CMOS
Low Power Consumption
2.3V (MIN.)
APPLICATIONS
Low Operating Supply Voltage
Output Frequency
Oscillation Frequency
Built-In Divider Circuit
z
z
z
z
z
Crystal Oscillation Modules
32.768kHz
Clocks for Micro-computers, DSPs, etc.
Communication Equipment
Various System Clocks
2MHz ~ 36MHz (fundamental)
Selectable from divisions of
1024, 512, 256, 128
3-State
Clock Time-Base
Output
Ultra Small Package
Chip Form
SOT-26
GENERAL DESCRIPTION
FEATURES
The XC25BS6 is a low operating voltage, low current consumption
series of CMOS ICs with built-in crystal oscillator and divider circuits
designed for clock generators. Oscillation capacitors Cg and Cd are
externally set up.
Output is selectable from any one of the following values for f0:f0/1024,
f0/512, f0/256, and f0/128.
With oscillation feedback resistors built-in, it is possible to configure a
stable fundamental oscillator using about 10pF of external oscillation
capacitor and an external crystal.
The series has a stand-by function. The oscillation completely stops in
the stand-by state and output will be one of high-impedance.
Oscillation Frequency
2MHz ~ 36MHz (fundamental)
- Oscillation feedback resistor built-in
- External oscillation capacitor
f0/1024, f0/ 512, f0/256, f0/128
3-State
Divider Ratio
Output
Operating Supply
Voltage Range
Supply Current
Chip Form
2.3 ~ 4.0V
0.5µA (MAX.) when stand-by mode
Chip size 1.3 x 0.8mm
Package
SOT-26 mini mold
PIN CONFIGURATION
PIN ASSIGNMENT
PIN
PIN NUMBER
NAME
FUNCTIONS
Crystal Oscillator
Connection (Output)
1
/ XT
XT
6
/XT
1
2
3
4
5
VSS
Q0
Ground
Clock Output
5 VDD
VSS 2
Q0
CE
Stand-by Control *
Power Supply
VDD
4
3
CE
Crystal Oscillator
Connection (Input)
6
XT
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
PAD LAYOUT FOR CHIP FORM
PAD LOCATIONS
(Unit:µm)
PIN
PIN NUMBER
NAME
PAD DIMENSIONS
FUNCTIONS
(1300,800)
X
Y
Crystal Oscillator
Connection (Output)
Ground
No Connection
Ground
Clock Output
Power Supply
Stand-by Control *
Crystal Oscillator
1
/ XT
128.0
610.0
(NC)
VSS
Q0
VSS
/XT
2
3
4
5
6
7
VSS
(NC)
VSS
Q0
VDD
CE
328.0
741.0
952.0
1172.0 672.0
1172.0 430.0
1172.0 189.0
672.0
672.0
672.0
Note)
There are two VSS
VDD
CE
VDD
XT
pads and two VDD
pads. Please connect
both VSS pads to
GND, and connect
both VDD pads to a
power supply.
(0,0)
Chip Size
Chip Thickness
Chip Back
: 1300 x 800µm
: 280±20µm
: VDD level
8
9
XT
128.0
128.0
187.0
399.0
Connection (Input)
Power Supply
VDD
Pad Aperture
: 88 x 88 µm
* The stand-by control pin (pin #4) has a pull-down resistor built-in.
BLOCK DIAGRAM
CE, Q0 PIN FUNCTION
CE
'H'
Q0
VDD
/XT
Clock Output
High Impedance
Q0
Counter
'L' or Open
CE
XT
VSS
Semiconductor Ltd.
Data Sheet
1
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
ABSOLUTE MAXIMUM RATINGS
Ta=25OC
UNITS
PARAMETER
Supply Voltage
SYMBOL
RATINGS
VDD
VCE
VQ0
IQ0
VSS -0.3 ~ VSS +7.0
VSS -0.3 ~ VDD +0.3
VSS -0.3 ~ VDD +0.3
± 50
V
V
CE Pin Voltage
Q0 Pin Voltage
V
Q0 Output Current
mA
mW
OC
Continuous Power Dissipation
Operating Temperature Range
Pd
150 **
Topr
- 40 ~ + 85
- 65 ~ + 150 (Chip Form)
- 55 ~ + 125 (SOT-26)
Storage Temperature Range
Tstg
OC
** SOT-26 package, When implemented on a glass epoxy PCB.
PRODUCT CLASSIFICATION
Ordering Information
XC25BS6 12345
DESIGNATOR
DESCRIPTION
DESIGNATOR
DESCRIPTION
Divider Ratio:
128 = 128 divider
Package:
C : Chip Form
4
256 = 256 divider
512 = 512 divider
A24 = 1024 divider
W : Wafer Form
M : SOT-26
123
Device Orientation:
R : Embossed Tape : Standard Feed
L : Embossed Tape : Reverse Feed
T : Chip Tray
5
W : Wafer
MARKING RULE
1 Represents XC25BS6 Series
MARK
Product Name
6
5
4
B
XC25BS6
2 Represents XC25BS6 Series
1 2 3 4
MARK
Product Name
6
XC25BS6
1
2
3
3 Represents divider ratio
MARK
Divider Ratio
f0/128
MARK
Divider Ratio
f0/256
1
5
2
f0/512
A
f0/1024
4 Represents the assembly lot no.
(Based on internal standards)
PACKAGING INFORMATION
SOT-26
Semiconductor Ltd.
Data Sheet
2
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
WIRE BONDING CONNECTION
VSS
VSS
/XT
VDD
XT
Q0
VDD
CE
(NC)
* There are two VSS pads and VDD pads.
Please connect both VSS pads to GND, and connect both VDD pads to a power supply.
TYPICAL APPLICATION CIRCUIT
Rq0
fQ0 measurement
VDD
/XT
Q0
CE
XT
VSS
Cd
Cg
0.1uF
* Please use oscillation capacitors Cg, Cd =10pF externally
* The same power supply can be used for VDD and CE.
NOTES ON USE
(1) The oscillation circuit of this IC does not have internal oscillation capacitors.
Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd.
*) A higher harmonic wave oscillation may occur without Cg and Cd.
*) Cg and Cd can be connected either to GND or VDD. (Cg and Cd in the above circuit example are connected to GND.)
*) It is recommended to use around for 10pF of Cg and Cd. For trimmer capacitors, 10pF as a standard value is appropriate.
*) The crystal oscillation frequency should be measured at the output of the Q0 pin.
When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can not be taken.
(2) Please insert a by-pass capacitor of 0.1µF between VDD and GND.
(3) The use of a matching resistor Rq0 of 50Ω connected in series to the Q0 pin is recommended in order to counter unwanted radiations.
(4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is placed away from the IC, it
may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may cause unwanted radiations in the pattern between the
Q0 pin and the resistor.
(5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply.
*) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor.
(6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a power supply like a switching
regulator might lead to an unstable oscillation jitter which in turn may lead the oscillation frequency to fluctuate due to the ripple of the switching
regulator.
Semiconductor Ltd.
Data Sheet
3
XC25BS6 Series
Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit
Preliminary
DC ELECTRICAL CHARACTERISTICS
XC25BS6xxxxx
3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, No load, Ta=25OC)
STANDARD VALUE
SYMBOL
PARAMETER
FUNCTIONS
UNIT
MIN
TYP
MAX
4.0
36
Operating Supply Voltage
Crystal Oscillation Frequency
H Level Output Voltage
VDD
fOSC
VOH
VOL
(2.3)
3.0
V
MHz
V
Cf=Cd=10pF (External)
VDD=2.7V, IOH= - 4mA
VDD=2.7V, IOL=4mA
2
-
2.3
-
-
-
L Level Output Voltage
-
0.4
(0.8)
(1.0)
(1.6)
(1.8)
0.5
-
V
fOSC=4MHz, XC25BS6128
fOSC=8MHz, XC25BS6256
fOSC=16MHz, XC25BS6512
fOSC=36MHz, XC25BS6A24
CE=0V
-
(0.4)
(0.5)
(0.8)
(1.0)
-
-
Supply Current 1
IDD1
CE=3.0V
mA
-
-
µA
Supply Current 2
CE H Level Voltage
IDD2
VCEH
VCEL
Rp1
-
2.4
-
V
CE L Level Voltage
-
0.6
3.0
90
V
MΩ
KΩ
MΩ
µA
CE Pull-Down Resistance 1
CE Pull-Down Resistance 2
Internal Oscillation Feedback Resistance
Output Disable Leakage Current
CE=3.0V
CE=0.3V
0.5
22
0.2
-
1.6
55
0.5
-
Rp2
Rf
XT Pin, CE=/XT=3.0V
1.0
0.5
IOZ
Q0 Pin, VDD=4.0V, CE=0V
* External oscillation capacitor
AC ELECTRICAL CHARACTERISTICS
XC25BS6xxxxx
3.0V Operation (unless otherwise stated, VDD=3.0V, fOSC=16MHz, CL=15pF, Ta=25OC)
STANDARD VALUE
SYMBOL
PARAMETER
FUNCTIONS
UNIT
MIN
TYP
10
10
50
-
MAX
15
Output Rise Time
Output Fall Time
Duty Cycle
Tr
Tf
VDD=3.0V (10% to 90%) *1
VDD=3.0V (10% to 90%) *1
-
-
ns
ns
%
15
DUTY
Ton
45
-
55
Output Start Time
*1
3.0
ms
*1 R&D guarantee
AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS
(1) Output Rise Time , Output Fall Time
0.9VDD
0.1VDD
0.9VDD
0.1VDD
tr
tf
(2) Duty Cycle
DUTY Measurement Level
0.5VDD
TW
T
DUTY = (TW/T) x 100 [%]
Semiconductor Ltd.
Data Sheet
4
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