XC25BS6128MR [TOREX]

Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit; 除法器信号输出时钟发生器IC，内置晶振电路


型号：	XC25BS6128MR
厂家：	Torex Semiconductor
描述：	Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit 除法器信号输出时钟发生器IC，内置晶振电路时钟发生器
文件：	总5页 (文件大小：182K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

XC25BS6Series

ETR1503_001

Divider Signal Output Clock Generator ICs with Built-In Crystal Oscillator Circuit

■GENERAL DESCRIPTION

The XC25BS6 is a low operating voltage, low current consumption series of CMOS ICs with built-in crystal oscillator and

divider circuits designed for clock generators. Oscillation capacitors Cg and Cd are externally set up. Output is selectable

from any one of the following values for f0:f0/1024, f0/512, f0/256, and f0/128. With oscillation feedback resistors built-in, it is

possible to configure a stable fundamental oscillator using about 10pF of external oscillation capacitor and an external crystal.

The series has a stand-by function. The oscillation completely stops in the stand-by state and output will be one of

high-impedance.

■APPLICATIONS

●Crystal oscillation modules

●Clocks for micro-computers, DSPs, etc.

●Communication equipment

●Various system clocks

■FEATURES

Oscillation Frequency : 2MHz~36MHz (fundamental)

-Oscillation feedback resistor built-in

-External oscillation capacitor

Divider Ratio

Output

Operating Supply Voltage Range

: f0/1024, f0/512, f0/256, f0/128

: 3-State

●Clock time-base

: 2.3~4.0V

Supply Current

Chip Form

: 0.5μA (MAX.) when stand-by mode

: Chip size 1.3×0.8mm

CMOS Low Power Consumption

Low Operating Supply Voltage

: 2.3V (MIN.)

Output Frequency

Package

: 32.768kHz

: SOT-26

■PIN ASSIGNMENT

■PIN CONFIGURATION

FUNCTIONS

NUMBER NAME

Crystal Oscillator

Connection (Output)

Ground

Clock Output

Stand-by Control *

Power Supply

/XT

VSS

VDD

Crystal Oscillator

Connection (Input)

*The stand-by control pin (pin #4) has a pull-down resistor built-in.

SOT-26

(TOP VIEW)

■PAD LAYOUT FOR CHIP FORM

■PAD LOCATIONS

(Unit:μm)

(1300,800)

PAD DIMENSIONS

FUNCTIONS

NUMBER

NAME

(NC)

VSS

VDD

VSS

/XT

Note)

Crystal Oscillator

Connection (Output)

Ground

No Connection

Ground

/XT

128.0

610.0

There are two V^SS

pads and two V^DD

pads. Please connect

both V^SSpads to

GND, and connect both

V^DDpads to a power

supply.

VDD

VSS

(NC)

VSS

VDD

328.0

741.0

952.0

1172.0

672.0

430.0

189.0

(0,0)

Clock Output

Chip Size

Chip Thickness :280±20μm

Chip Back

:1300×800μm

Power Supply

Stand-by Control *

Crystal Oscillator

Connection (Input)

Power Supply

:VDD level

Pad Aperture

:88×88μm

128.0

187.0

399.0

VDD

■BLOCK DIAGRAM

*The stand-by control pin (pin #4) has a pull-down resistor built-in.

VDD

■CE, Q0 PIN FUNCTION

/XT

Counter

‘H’

Clock Output

High Impedance

‘L’ or Open

VSS

1/5

XC25BS6 Series

■ABSOLUTE MAXIMUM RATINGS

Ta = 25℃

PARAMETER

SYMBOL

RATINGS

VSS -0.3 ~ VSS +7.0

VSS -0.3 ~ VDD +0.3

±50

UNITS

Supply Voltage

VDD

CE Pin Voltage

VCE

Q0 Pin Voltage

VQ0

Q0 Output Current

Power Dissipation

Operating Temperature Range

IQ0

℃

150 **

Topr

-40 ~ +85

-65 ~ +150 (Chip Form)

-55 ~ +125 (SOT-26)

Tstg

℃

Storage Temperature Range

** SOT-26 package, when implemented on a glass epoxy PCB.

■PRODUCT CLASSIFICATION

●Ordering Information

XC25BS6 ①②③④⑤

DESIGNATOR

DESCRIPTION

Divider Ratio

SYMBOL

DESCRIPTION

128

256

512

A24

: 128 divider

: 256 divider

: 512 divider

: 1024 divider

: Chip form

: Wafer form

: SOT-26

①②③

④

⑤

Package

: Embossed tape, standard feed

: Embossed tape, reverse feed

: Chip Tray

Device Orientation:

: Wafer

■WIRE BONDING CONNECTION

* There are two VSS pads and VDD pads.

Please connect both V^SSpads to GND, and connect both VDD pads to a power supply.

■TYPICAL APPLICATION CIRCUIT

* Please use oscillation capacitors Cg, Cd =10pF externally

* The same power supply can be used for VDD and CE.

2/5

XC25BS6

Series

■NOTES ON USE

(1) The oscillation circuit of this IC does not have internal oscillation capacitors.

Please make the oscillation circuitry using an external crystal transducer and oscillation capacitors Cg and Cd.

*) A higher harmonic wave oscillation may occur without Cg and Cd.

*) Cg and Cd can be connected either to GND or VDD.

(Cg and Cd in the above circuit example are connected to GND.)

*) It is recommended to use around for 10pF of Cg and Cd.

For trimmer capacitors, 10pF as a standard value is appropriate.

*) The crystal oscillation frequency should be measured at the output of the Q0 pin.

When a probe is directly connected to the XT pin or the /XT pin, oscillation frequency will change and a precise value can

not be taken.

(2) Please insert a by-pass capacitor of 0.1μF between VDD and GND.

(3) The use of a matching resistor Rq0 of 50Ω connected in series to the Q0 pin is recommended in order to counter

unwanted radiations.

(4) Please place a by-pass capacitor and the matching resistor as close to the IC as possible. If the by-pass capacitor is

placed away from the IC, it may cause abnormal oscillation. If the matching resistor is placed away from the IC, it may

cause unwanted radiations in the pattern between the Q0 pin and the resistor.

(5) When the CE pin is not controlled by external signals, please connect the CE pin to VDD power supply.

*) When the CE pin is not connected, the IC goes into stand-by mode due to the internal pull-down resistor.

(6) As for the supply voltage, it is recommended to apply a low noise power supply, such as a series regulator. Using a

power supply like a switching regulator might lead to an unstable oscillation jitter, which in turn may lead the oscillation

frequency to fluctuate due to the ripple of the switching regulator.

■DC ELECTRICAL CHARACTERISTICS

XC25BS6xxxxx

3.0V Operation (unless otherwise stated, VDD=3.0V, FOSC=16MHz, No load, Ta=25℃)

STANDARD VALUE

PARAMETER

SYMBOL

FUNCTIONS

UNIT

MIN.

TYP.

MAX.

4.0

Operating Supply Voltage

Crystal Oscillation Frequency

H Level Output Voltage

VDD

FOSC

VOH

VOL

(2.3)

3.0

MHz

Cg=Cd=10pF (External)

VDD=2.7V, IOH= - 4mA

VDD=2.7V, IOL=4mA

2.3

L Level Output Voltage

0.4

(0.8)

(1.0)

(1.6)

(1.8)

0.5

fOSC=4MHz, XC25BS6128

fOSC=8MHz, XC25BS6256

fOSC=16MHz, XC25BS6512

fOSC=36MHz, XC25BS6A24

CE=0V

(0.4)

(0.5)

(0.8)

(1.0)

Supply Current 1

IDD1

CE=3.0V

Supply Current 2

CE H Level Voltage

IDD2

VCEH

VCEL

Rp1

Rp2

μA

2.4

CE L Level Voltage

0.6

3.0

CE Pull-Down Resistance 1

CE Pull-Down Resistance 2

Internal Oscillation Feedback Resistance

Output Disable Leakage Current

CE=3.0V

CE=0.3V

0.5

0.2

1.6

0.5

MΩ

KΩ

MΩ

μA

XT Pin, CE=/XT=3.0V

Q0 Pin, V^DD=4.0V, CE=0V

1.0

0.5

IOZ

*External oscillation capacitor

■AC ELECTRICAL CHARACTERISTICS

XC25BS6xxxxx

3.0V Operation (unless otherwise stated, V^DD=3.0V, FOSC=16MHz, CL=15pF, Ta=25℃)

STANDARD VALUE

PARAMETER

SYMBOL

FUNCTIONS

UNIT

MIN.

TYP.

MAX.

Output Rise Time

Output Fall Time

Duty Cycle

VDD=3.0V (10% to 90%) *1

DUTY

Ton

Output Start Time

3.0

*1 R&D guarantee

3/5

XC25BS6 Series

■

AC ELECTRICAL CHARACTERISTICS MEASUREMENT WAVE FORMS

(1) Output Rise Time, Output Fall Time

0.9VDD

0.1VDD

(2) Duty Cycle

DUTY Measurement Level

0.5VDD

DUTY = (TW/T) x 100 [%]

■PACKAGING INFORMATION

●SOT-26

■MARKING RULE

①Represents product series

●SOT-26

MARK

PRODUCT SERIES

XC25BS6

②Represents product series

①

②

③

④

MARK

PRODUCT SERIES

XC25BS6

③Represents divider ratio

SOT-26

(TOP VIEW)

MARK

DIVIDER RATIO

f0/128

MARK

DIVIDER RATIO

f0/256

f0/512

f0/1024

④Represents assembly lot number.

(Based on internal standards)

4/5

XC25BS6

Series

1. The products and product specifications contained herein are subject to change without

notice to improve performance characteristics. Consult us, or our representatives

before use, to confirm that the information in this catalog is up to date.

2. We assume no responsibility for any infringement of patents, patent rights, or other

rights arising from the use of any information and circuitry in this catalog.

3. Please ensure suitable shipping controls (including fail-safe designs and aging

protection) are in force for equipment employing products listed in this catalog.

4. The products in this catalog are not developed, designed, or approved for use with such

equipment whose failure of malfunction can be reasonably expected to directly

endanger the life of, or cause significant injury to, the user.

(e.g. Atomic energy; aerospace; transport; combustion and associated safety

equipment thereof.)

5. Please use the products listed in this catalog within the specified ranges.

Should you wish to use the products under conditions exceeding the specifications,

please consult us or our representatives.

6. We assume no responsibility for damage or loss due to abnormal use.

prior permission of Torex Semiconductor Ltd.

5/5

XC25BS6128MR [TOREX]

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