ULN2004ADRG3 [TI]
SMALL SIGNAL TRANSISTOR;
| 型号： | ULN2004ADRG3 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | SMALL SIGNAL TRANSISTOR |
| 文件： | 总29页 (文件大小：1229K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
HIGH-VOLTAGE, HIGH-CURRENT DARLINGTON TRANSISTOR ARRAYS
Check for Samples: ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A
1
FEATURES
ULN2002A . . . N PACKAGE
ULN2003A . . . D, N, NS, OR PW PACKAGE
ULN2004A . . . D, N, OR NS PACKAGE
ULQ2003A, ULQ2004A . . . D OR N PACKAGE
(TOP VIEW)
•
500-mA-Rated Collector Current (Single
Output)
•
•
•
High-Voltage Outputs: 50 V
Output Clamp Diodes
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
1B
2B
3B
4B
5B
6B
7B
E
1C
Inputs Compatible With Various Types of
Logic
2C
3C
•
Relay-Driver Applications
4C
5C
6C
7C
COM
DESCRIPTION
The ULN2002A, ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, and ULQ2004A are high-voltage high-current
Darlington transistor arrays. Each consists of seven npn Darlington pairs that feature high-voltage outputs with
common-cathode clamp diodes for switching inductive loads. The collector-current rating of a single Darlington
pair is 500 mA. The Darlington pairs can be paralleled for higher current capability. Applications include relay
drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line drivers, and logic buffers.
For 100-V (otherwise interchangeable) versions of the ULN2003A and ULN2004A, see the SN75468 and
SN75469, respectively.
The ULN2002A is designed specifically for use with 14-V to 25-V PMOS devices. Each input of this device has a
Zener diode and resistor in series to control the input current to a safe limit. The ULN2003A and ULQ2003A have
a 2.7-kΩ series base resistor for each Darlington pair for operation directly with TTL or 5-V CMOS devices. The
ULN2004A and ULQ2004A have a 10.5-kΩ series base resistor to allow operation directly from CMOS devices
that use supply voltages of 6 V to 15 V. The required input current of the ULN/ULQ2004A is below that of the
ULN/ULQ2003A, and the required voltage is less than that required by the ULN2002A.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1976–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
www.ti.com
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
ULN2002AN
ULN2002AN
ULN2003AN
ULN2004AN
PDIP – N
SOIC – D
Tube of 25
ULN2003AN
ULN2004AN
Tube of 40
ULN2003AD
Reel of 2500
Reel of 2500
Tube of 40
ULN2003ADR
ULN2003ADRG3
ULN2004AD
ULN2003A
–20°C to 70°C
ULN2004A
Reel of 2500
ULN2004ADRG3
ULN2003ANSR
ULN2004ANSR
ULN2003APW
ULN2003APWR
ULQ2003AN
ULN2003A
ULN2004A
SOP – NS
TSSOP – PW
PDIP – N
Reel of 2000
Tube of 90
UN2003A
Reel of 2000
ULQ2003A
Tube of 25
ULQ2004AN
ULQ2004AN
Tube of 40
ULQ2003AD
–40°C to 85°C
ULQ2003A
ULQ2004A
Reel of 2500
Tube of 40
ULQ2003ADR
ULQ2004AD
SOIC – D
Reel of 2500
Reel of 2000
Tube of 425
Tube of 40
ULQ2004ADR
ULN2003AINSR
ULN2003AIN
ULN2003AID
ULN2003AIDR
ULN2003AIPWR
SOP – NS
PDIP – N
ULN2003AI
ULN2003AIN
–40°C to 105°C
SOIC – D
ULN2003AI
UN2003AI
Reel of 2500
Reel of 2500
TSSOP – PW
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
LOGIC DIAGRAM
9
COM
1
2
3
4
5
6
7
16
15
14
13
12
11
10
1B
2B
3B
4B
5B
6B
7B
1C
2C
3C
4C
5C
6C
7C
2
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Copyright © 1976–2013, Texas Instruments Incorporated
Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
SCHEMATICS (EACH DARLINGTON PAIR)
10.5 kW
7.2 kW
3 kW
ULN2002A
R
B
ULN/ULQ2003A: R = 2.7 kW
B
ULN2003AI: R = 2.7 kW
7.2 kW
3 kW
B
ULN/ULQ2004A: R = 10.5 kW
B
ULN2003A, ULN2003AI, ULN2004A, ULQ2003A, ULQ2004A
All resistor values shown are nominal.
The collector-emitter diode is a parasitic structure and should not be used to conduct current. If the collector(s) go
below ground an external Schottky diode should be added to clamp negative undershoots.
Copyright © 1976–2013, Texas Instruments Incorporated
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ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
www.ti.com
ABSOLUTE MAXIMUM RATINGS(1)
at 25°C free-air temperature (unless otherwise noted)
MIN
MAX
50
UNIT
VCC
Collector-emitter voltage
Clamp diode reverse voltage(2)
Input voltage(2)
V
V
V
50
VI
30
See Figure 14 and
Figure 15
Peak collector current
500
mA
IOK
Output clamp current
500
–2.5
70
mA
A
Total emitter-terminal current
ULN200xA
ULN200xAI
ULQ200xA
ULQ200xAT
D package
N package
NS package
PW package
D package
N package
–20
–40
–40
–40
105
85
TA
Operating free-air temperature range
°C
105
73
67
θJA
Package thermal impedance(3) (4)
Package thermal impedance(5) (6)
64
°C/W
108
36
θJC
54
TJ
Operating virtual junction temperature
150
260
150
°C
°C
°C
Lead temperature for 1.6 mm (1/16 inch) from case for 10 seconds
Storage temperature range
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
(5) Maximum power dissipation is a function of TJ(max), θJC, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJC. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with MIL-STD-883.
ELECTRICAL CHARACTERISTICS
TA = 25°C
ULN2002A
TEST
FIGURE
PARAMETER
On-state input voltage
TEST CONDITIONS
UNIT
MIN
TYP
MAX
13
VI(on)
VCE(sat)
VF
Figure 6
Figure 4
VCE = 2 V,
IC = 300 mA
IC = 100 mA
IC = 200 mA
IC = 350 mA
V
II = 250 μA,
II = 350 μA,
II = 500 μA,
IF = 350 mA
VCE = 50 V,
0.9
1
1.1
1.3
1.6
2
Collector-emitter saturation voltage
Clamp forward voltage
V
V
1.2
1.7
Figure 7
Figure 1
II = 0
50
ICEX
Collector cutoff current
VCE = 50 V,
TA = 70°C
II = 0
100
500
μA
Figure 2
VI = 6 V
IC = 500 μA
II(off)
II
Off-state input current
Input current
Figure 2
Figure 3
VCE = 50 V,
VI = 17 V
50
65
μA
0.82
1.25 mA
TA = 70°C
f = 1 MHz
100
μA
50
IR
Ci
Clamp reverse current
Input capacitance
Figure 6
VR = 50 V
VI = 0,
25
pF
4
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
ELECTRICAL CHARACTERISTICS
TA = 25°C
ULN2003A
ULN2004A
TEST
PARAMETER
TEST CONDITIONS
UNIT
FIGURE
MIN
TYP MAX
MIN
TYP MAX
IC = 125 mA
IC = 200 mA
IC = 250 mA
5
6
2.4
2.7
VI(on)
On-state input voltage
Figure 6
VCE = 2 V
V
IC = 275 mA
IC = 300 mA
IC = 350 mA
IC = 100 mA
IC = 200 mA
IC = 350 mA
II = 0
7
3
8
1.1
1.3
1.6
50
II = 250 μA,
II = 350 μA,
II = 500 μA,
VCE = 50 V,
0.9
1
1.1
1.3
1.6
50
0.9
1
Collector-emitter
saturation voltage
VCE(sat)
Figure 5
V
1.2
1.2
Figure 1
Figure 2
ICEX
Collector cutoff current
VCE = 50 V,
TA = 70°C
II = 0
100
100
500
2
μA
VI = 6 V
VF
Clamp forward voltage
Off-state input current
Figure 8
Figure 3
IF = 350 mA
1.7
65
2
1.7
65
V
VCE = 50 V,
TA = 70°C,
IC = 500 μA
II(off)
50
50
μA
VI = 3.85 V
VI = 5 V
0.93
1.35
II
Input current
Figure 4
Figure 7
0.35
1
0.5 mA
1.45
VI = 12 V
50
100
25
50
100
25
IR
Ci
Clamp reverse current
Input capacitance
VR = 50 V
VI = 0,
μA
TA = 70°C
f = 1 MHz
15
15
pF
ELECTRICAL CHARACTERISTICS
TA = 25°C
ULN2003AI
TEST
CONDITIONS
PARAMETER
TEST FIGURE
UNIT
MIN
TYP
MAX
2.4
2.7
3
IC = 200 mA
IC = 250 mA
IC = 300 mA
IC = 100 mA
IC = 200 mA
IC = 350 mA
II = 0
VI(on)
On-state input voltage
Figure 6
Figure 5
VCE = 2 V
V
II = 250 μA,
II = 350 μA,
II = 500 μA,
VCE = 50 V,
IF = 350 mA
VCE = 50 V,
VI = 3.85 V
VR = 50 V
VI = 0,
0.9
1
1.1
1.3
1.6
50
VCE(sat)
Collector-emitter saturation voltage
V
1.2
ICEX
VF
II(off)
II
Collector cutoff current
Clamp forward voltage
Off-state input current
Input current
Figure 1
Figure 8
Figure 3
Figure 4
Figure 7
μA
V
1.7
65
2
IC = 500 μA
50
μA
mA
μA
pF
0.93
1.35
50
IR
Clamp reverse current
Input capacitance
Ci
f = 1 MHz
15
25
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ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
TA = –40°C to 105°C
ULN2003AI
PARAMETER
TEST FIGURE
TEST CONDITIONS
UNIT
MIN
TYP
MAX
IC = 200 mA
2.7
2.9
3
VI(on)
On-state input voltage
Figure 6
Figure 5
VCE = 2 V
IC = 250 mA
IC = 300 mA
IC = 100 mA
IC = 200 mA
IC = 350 mA
II = 0
V
V
II = 250 μA,
II = 350 μA,
II = 500 μA,
VCE = 50 V,
IF = 350 mA
VCE = 50 V,
VI = 3.85 V
VR = 50 V
VI = 0,
0.9
1
1.2
1.4
1.7
100
2.2
VCE(sat)
Collector-emitter saturation voltage
1.2
ICEX
VF
II(off)
II
Collector cutoff current
Clamp forward voltage
Off-state input current
Input current
Figure 1
Figure 8
Figure 3
Figure 4
Figure 7
μA
V
1.7
65
IC = 500 μA
30
μA
mA
μA
pF
0.93
1.35
100
25
IR
Clamp reverse current
Input capacitance
Ci
f = 1 MHz
15
ELECTRICAL CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
ULQ2003A
ULQ2004A
TEST
FIGURE
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP MAX
MIN
TYP MAX
IC = 125 mA
IC = 200 mA
IC = 250 mA
IC = 275 mA
IC = 300 mA
IC = 350 mA
IC = 100 mA
IC = 200 mA
IC = 350 mA
II = 0
5
6
2.7
2.9
VI(on)
On-state input voltage
Figure 6
VCE = 2 V
V
7
3
8
II = 250 μA,
II = 350 μA,
II = 500 μA,
VCE = 50 V,
0.9
1
1.2
1.4
1.7
100
0.9
1
1.1
1.3
1.6
50
Collector-emitter
saturation voltage
VCE(sat)
Figure 5
V
1.2
1.2
Figure 1
Figure 2
ICEX
Collector cutoff current
VCE = 50 V,
TA = 70°C
II = 0
100
500
2
μA
VI = 6 V
VF
Clamp forward voltage
Off-state input current
Figure 8
Figure 3
IF = 350 mA
1.7
65
2.3
1.7
65
V
VCE = 50 V,
TA = 70°C,
II(off)
IC = 500 μA
50
μA
VI = 3.85 V
VI = 5 V
0.93
1.35
II
Input current
Figure 4
Figure 7
0.35
1
0.5 mA
1.45
VI = 12 V
TA = 25°C
f = 1 MHz
100
100
25
50
100
25
IR
Ci
Clamp reverse current
Input capacitance
VR = 50 V
VI = 0,
μA
15
15
pF
6
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
SWITCHING CHARACTERISTICS
TA = 25°C
ULN2002A, ULN2003A,
ULN2004A
PARAMETER
TEST CONDITIONS
See Figure 9
UNIT
MIN
TYP
0.25
0.25
MAX
tPLH
tPHL
VOH
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
High-level output voltage after switching
1
1
μs
μs
See Figure 9
VS = 50 V, IO = 300 mA, See Figure 10
VS – 20
mV
SWITCHING CHARACTERISTICS
TA = 25°C
ULN2003AI
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
0.25
0.25
MAX
tPLH
tPHL
VOH
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
High-level output voltage after switching
See Figure 9
1
1
μs
μs
See Figure 9
VS = 50 V, IO ≈ 300 mA, See Figure 10
VS – 20
mV
SWITCHING CHARACTERISTICS
TA = –40°C to 105°C
ULN2003AI
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
1
MAX
10
tPLH
tPHL
VOH
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
High-level output voltage after switching
See Figure 9
μs
μs
See Figure 9
1
10
VS = 50 V, IO ≈ 300 mA, See Figure 10
VS – 50
mV
SWITCHING CHARACTERISTICS
over recommended operating conditions (unless otherwise noted)
ULQ2003A, ULQ2004A
PARAMETER
TEST CONDITIONS
UNIT
MIN
TYP
1
MAX
10
tPLH
tPHL
VOH
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
High-level output voltage after switching
See Figure 9
μs
μs
See Figure 9
1
10
VS = 50 V, IO = 300 mA, See Figure 10
VS – 20
mV
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ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
www.ti.com
PARAMETER MEASUREMENT INFORMATION
Open
Open
V
V
CE
CE
I
I
CEX
CEX
Open
V
I
Figure 1. ICEX Test Circuit
Figure 2. ICEX Test Circuit
Open
Open
V
CE
I
I
I
I(off)
I(on)
C
V
Open
I
Figure 3. II(off) Test Circuit
Figure 4. II Test Circuit
A. II is fixed for measuring VCE(sat), variable for measuring hFE
.
Open
Open
I
C
h
=
FE
I
I
V
V
V
CE
CE
I(on)
I
I
I
C
I
C
Figure 5. hFE, VCE(sat) Test Circuit
Figure 6. VI(on) Test Circuit
V
R
I
R
V
F
I
F
Open
Open
Figure 7. IR Test Circuit
Figure 8. VF Test Circuit
8
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
PARAMETER MEASUREMENT INFORMATION (continued)
Figure 9. Propagation Delay-Time Waveforms
200 W
≤5 ns
≤10 ns
V
IH
(see Note C)
90%
1.5 V
90%
1.5 V
Input
10%
10%
0 V
40 µs
V
OH
Output
V
OL
VOLTAGE WAVEFORMS
A. The pulse generator has the following characteristics: PRR = 12.5 kHz, ZO = 50 Ω.
B. CL includes probe and jig capacitance.
C. For testing the ULN2003A, ULN2003AI, and ULQ2003A, VIH = 3 V; for the ULN2002A, VIH = 13 V; for the ULN2004A
and the ULQ2004A, VIH = 8 V.
Figure 10. Latch-Up Test Circuit and Voltage Waveforms
Copyright © 1976–2013, Texas Instruments Incorporated
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
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TYPICAL CHARACTERISTICS
COLLECTOR-EMITTER SATURATION VOLTAGE
COLLECTOR-EMITTER SATURATION VOLTAGE
vs
vs
TOTAL COLLECTOR CURRENT (TWO DARLINGTONS IN
COLLECTOR CURRENT (ONE DARLINGTON)
PARALLEL)
2.5
2
2.5
T
A
= 25°C
T
A
= 25°C
I = 250 µA
I
2
1.5
1
I = 350 µA
I
I = 250 µA
I
I = 350 µA
I
I = 500 µA
1.5
1
I
I = 500 µA
I
0.5
0
0.5
0
0
100 200 300 400 500 600 700 800
0
100 200 300 400 500 600 700 800
I
- Total Collector Current - mA
I
- Collector Current - mA
C(tot)
C
Figure 11.
Figure 12.
D PACKAGE
COLLECTOR CURRENT
vs
MAXIMUM COLLECTOR CURRENT
vs
INPUT CURRENT
DUTY CYCLE
600
500
400
500
450
400
350
300
250
200
150
100
50
R
= 10 Ω
L
T
= 25°C
A
V
S
= 10 V
N = 1
N = 4
V
= 8 V
S
N = 3
300
200
100
0
N = 2
N = 6
N = 7
N = 5
T
A
= 70°C
N = Number of Outputs
Conducting Simultaneously
0
0
25
50
75
100 125 150 175 200
0
10 20 30 40 50 60 70 80 90 100
I - Input Current - µA
I
Duty Cycle - %
Figure 13.
Figure 14.
10
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
TYPICAL CHARACTERISTICS (continued)
N PACKAGE
MAXIMUM COLLECTOR CURRENT
vs
MAXIMUM AND TYPICAL INPUT CURRENT
vs
DUTY CYCLE
INPUT VOLTAGE
2000
1800
1600
1400
1200
1000
800
600
500
400
300
200
100
0
TJ = -40°C to 105°C
N = 1
N = 2
N = 3
N = 4
Maximum
N = 5
N = 6
N = 7
600
400
Typical
T
A
= 85°C
200
N = Number of Outputs
Conducting Simultaneously
0
2
2.5
3 3.5
Input Voltage – V
4
4.5
5
0
10 20 30 40 50 60 70 80 90 100
Duty Cycle - %
Figure 15.
Figure 16.
MAXIMUM AND TYPICAL SATURATED VCE
MINIMUM OUTPUT CURRENT
vs
vs
OUTPUT CURRENT
INPUT CURRENT
2.1
1.9
1.7
1.5
1.3
1.1
0.9
500
450
400
350
300
250
200
150
100
VCE = 2 V
TJ = -40°C to 105°C
TJ = -40°C to 105°C
Maximum
Minimum
Typical
250
350
450
550
650
100
200
300
400
500
Output Current – mA
Input Current – µA
Figure 17.
Figure 18.
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Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
www.ti.com
APPLICATION INFORMATION
ULN2002A
V
SS
V
ULQ2003A
V
CC
V
1
2
16
15
14
13
12
11
10
9
1
2
16
15
14
13
12
11
10
9
3
4
3
4
5
5
6
7
8
6
7
8
P-MOS
Output
Lam
Test
TTL
Output
Figure 19. P-MOS to Load
Figure 20. TTL to Load
ULN2004A
ULQ2004A
V
DD
V
V
V
ULQ2003A
CC
1
1
16
15
14
16
15
14
2
2
3
3
4
R
P
13
12
11
10
9
4
5
13
12
11
10
9
5
6
7
8
6
7
8
CMOS
Output
TTL
Output
Figure 21. Buffer for Higher Current Loads
Figure 22. Use of Pullup Resistors to Increase
Drive Current
12
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Copyright © 1976–2013, Texas Instruments Incorporated
Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
ULN2002A, ULN2003A, ULN2003AI, ULN2004A
ULQ2003A, ULQ2004A
www.ti.com
SLRS027M –DECEMBER 1976–REVISED FEBRUARY 2013
REVISION HISTORY
Changes from Revision K (August 2011) to Revision L
Page
•
Removed reference to obsolete ULN2001 part .................................................................................................................... 1
Changes from Revision L (March 2012) to Revision M
Page
•
Updated temperature rating for ULN2003AI in the ORDERING INFORMATION table. ...................................................... 2
Copyright © 1976–2013, Texas Instruments Incorporated
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13
Product Folder Links: ULN2002A ULN2003A ULN2003AI ULN2004A ULQ2003A ULQ2004A
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2014
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ULN2001AD
ULN2001ADR
ULN2001AN
ULN2002AD
ULN2002AN
OBSOLETE
OBSOLETE
OBSOLETE
OBSOLETE
ACTIVE
SOIC
SOIC
PDIP
SOIC
PDIP
D
D
N
D
N
16
16
16
16
16
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
ULN2002AN
ULN2002ANE4
ULN2003AD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
N
D
D
D
D
D
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
ULN2002AN
ULN2003A
ULN2003A
ULN2003A
ULN2003A
ULN2003A
ULN2003A
ULN2003A
ULN2003AI
ULN2003AI
ULN2003AI
ULN2003AI
ULN2003AI
ULN2003AI
40
Green (RoHS
& no Sb/Br)
ULN2003ADE4
ULN2003ADG4
ULN2003ADR
40
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
2500
2500
2500
2500
40
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
ULN2003ADRE4
ULN2003ADRG3
ULN2003ADRG4
ULN2003AID
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU SN
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Green (RoHS
& no Sb/Br)
ULN2003AIDE4
ULN2003AIDG4
ULN2003AIDR
ULN2003AIDRE4
ULN2003AIDRG4
40
Green (RoHS
& no Sb/Br)
40
Green (RoHS
& no Sb/Br)
2500
2500
2500
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU NIPDAU
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
-40 to 105
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ULN2003AIN
ULN2003AINE4
ULN2003AINSR
ULN2003AIPW
ACTIVE
PDIP
PDIP
N
16
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
N / A for Pkg Type
ULN2003AIN
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
N
25
2000
90
Pb-Free
(RoHS)
N / A for Pkg Type
ULN2003AIN
ULN2003AI
UN2003AI
UN2003AI
UN2003AI
UN2003AI
UN2003AI
UN2003AI
SO
NS
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
ULN2003AIPWE4
ULN2003AIPWG4
ULN2003AIPWR
ULN2003AIPWRE4
ULN2003AIPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CU NIPDAU
Green (RoHS
& no Sb/Br)
CU NIPDAU
ULN2003AJ
ULN2003AN
OBSOLETE
ACTIVE
CDIP
PDIP
J
16
16
TBD
Call TI
Call TI
-55 to 125
-20 to 70
N
25
Pb-Free
(RoHS)
CU NIPDAU | CU SN
N / A for Pkg Type
ULN2003AN
ULN2003ANE3
ULN2003ANE4
PREVIEW
ACTIVE
PDIP
PDIP
N
N
16
16
25
25
TBD
Call TI
Call TI
-20 to 70
-20 to 70
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
ULN2003AN
ULN2003A
ULN2003A
ULN2003A
UN2003A
UN2003A
UN2003A
ULN2003ANSR
ULN2003ANSRE4
ULN2003ANSRG4
ULN2003APW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
SO
NS
NS
NS
PW
PW
PW
16
16
16
16
16
16
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
ULN2003APWE4
ULN2003APWG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-20 to 70
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ULN2003APWR
ULN2003APWRE4
ULN2003APWRG4
ULN2004AD
ACTIVE
TSSOP
TSSOP
TSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
PDIP
PDIP
SO
PW
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2000
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
UN2003A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
D
2000
2000
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
UN2003A
Green (RoHS
& no Sb/Br)
UN2003A
Green (RoHS
& no Sb/Br)
ULN2004A
ULN2004A
ULN2004A
ULN2004A
ULN2004A
ULN2004A
ULN2004AN
ULN2004AN
ULN2004A
ULN2004A
ULQ2003A
ULQ2003A
ULQ2003A
ULQ2003A
ULQ2003A
ULN2004ADE4
ULN2004ADG4
ULN2004ADR
D
40
Green (RoHS
& no Sb/Br)
D
40
Green (RoHS
& no Sb/Br)
D
2500
2500
2500
25
Green (RoHS CU NIPDAU | CU SN
& no Sb/Br)
ULN2004ADRE4
ULN2004ADRG4
ULN2004AN
D
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
D
Green (RoHS
& no Sb/Br)
N
Pb-Free
(RoHS)
ULN2004ANE4
ULN2004ANSR
ULN2004ANSRG4
ULQ2003AD
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
NS
NS
D
2000
2000
40
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
SO
Green (RoHS
& no Sb/Br)
SOIC
SOIC
SOIC
SOIC
PDIP
Green (RoHS
& no Sb/Br)
ULQ2003ADG4
ULQ2003ADR
ULQ2003ADRG4
ULQ2003AN
D
40
Green (RoHS
& no Sb/Br)
D
2500
2500
25
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
D
Green (RoHS
& no Sb/Br)
N
Pb-Free
(RoHS)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ULQ2004AD
ULQ2004ADG4
ULQ2004ADR
ULQ2004ADRG4
ULQ2004AN
ACTIVE
SOIC
SOIC
SOIC
SOIC
PDIP
D
16
16
16
16
16
40
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
-40 to 85
ULQ2004A
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
D
N
40
2500
2500
25
Green (RoHS
& no Sb/Br)
ULQ2004A
ULQ2004A
ULQ2004A
ULQ2004AN
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
Green (RoHS
& no Sb/Br)
Pb-Free
(RoHS)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
13-Apr-2014
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF ULQ2003A, ULQ2004A :
Automotive: ULQ2003A-Q1, ULQ2004A-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 5
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2014
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ULN2003ADR
ULN2003ADR
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2500
2500
2500
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.8
16.4
16.8
16.4
16.4
16.8
16.4
12.4
12.4
12.4
12.4
12.4
12.4
16.4
16.4
16.8
16.4
16.4
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.9
7.0
6.9
7.0
6.9
6.9
6.5
6.5
6.5
6.5
6.5
10.3
10.3
10.3
10.3
10.3
10.3
10.3
5.6
2.1
2.1
2.1
2.1
2.1
2.1
2.1
1.6
1.6
1.6
1.6
1.6
1.6
2.1
2.1
2.1
2.1
2.1
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
16.0
16.0
16.0
16.0
16.0
16.0
16.0
12.0
12.0
12.0
12.0
12.0
12.0
16.0
16.0
16.0
16.0
16.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
ULN2003ADRG3
ULN2003ADRG4
ULN2003AIDR
SOIC
D
SOIC
D
SOIC
D
ULN2003AIDR
SOIC
D
ULN2003AIDRG4
ULN2003AIPWR
ULN2003AIPWR
ULN2003AIPWRG4
ULN2003APWR
ULN2003APWR
ULN2003APWRG4
ULN2004ADR
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
PW
PW
D
5.6
5.6
5.6
5.6
5.6
10.3
10.3
10.3
10.3
10.3
ULN2004ADR
SOIC
D
ULN2004ADR
SOIC
D
ULN2004ADRG4
ULN2004ADRG4
SOIC
D
SOIC
D
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2014
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
ULQ2003ADR
SOIC
SOIC
D
D
16
16
2500
2500
330.0
330.0
16.4
16.4
6.5
6.5
10.3
10.3
2.1
2.1
8.0
8.0
16.0
16.0
Q1
Q1
ULQ2003ADRG4
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
ULN2003ADR
ULN2003ADR
SOIC
SOIC
D
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2000
2000
2500
2500
364.0
333.2
364.0
333.2
333.2
364.0
333.2
367.0
364.0
367.0
364.0
367.0
367.0
367.0
333.2
364.0
345.9
364.0
345.9
345.9
364.0
345.9
367.0
364.0
367.0
364.0
367.0
367.0
367.0
345.9
27.0
28.6
27.0
28.6
28.6
27.0
28.6
35.0
27.0
35.0
27.0
35.0
35.0
38.0
28.6
ULN2003ADRG3
ULN2003ADRG4
ULN2003AIDR
SOIC
D
SOIC
D
SOIC
D
ULN2003AIDR
SOIC
D
ULN2003AIDRG4
ULN2003AIPWR
ULN2003AIPWR
ULN2003AIPWRG4
ULN2003APWR
ULN2003APWR
ULN2003APWRG4
ULN2004ADR
SOIC
D
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SOIC
PW
PW
PW
PW
PW
PW
D
ULN2004ADR
SOIC
D
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
31-Jan-2014
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
ULN2004ADR
ULN2004ADRG4
ULN2004ADRG4
ULQ2003ADR
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
16
16
16
16
16
2500
2500
2500
2500
2500
364.0
333.2
367.0
333.2
367.0
364.0
345.9
367.0
345.9
367.0
27.0
28.6
38.0
28.6
38.0
ULQ2003ADRG4
Pack Materials-Page 3
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