ULN2004AIDRG4 [TI]

0.5A, 50V, 7 CHANNEL, NPN, Si, POWER TRANSISTOR, MS-012AC, GREEN, PLASTIC, SOIC-16;
ULN2004AIDRG4
型号: ULN2004AIDRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

0.5A, 50V, 7 CHANNEL, NPN, Si, POWER TRANSISTOR, MS-012AC, GREEN, PLASTIC, SOIC-16

开关 光电二极管 晶体管
文件: 总17页 (文件大小:645K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢀ ꢁꢂ ꢃꢄꢄ ꢅꢆ ꢇ  
ꢈꢇ ꢉꢈ ꢊꢋꢌ ꢁꢍꢆꢉ ꢎ ꢈꢇ ꢉꢈ ꢊꢏꢀꢐꢐꢎ ꢂꢍ ꢑꢆꢐ ꢁꢇ ꢂꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂꢒ ꢇꢒꢍꢌꢐ ꢆ ꢐꢐ ꢆꢓ  
SLRS055 − APRIL 2004  
D, N, OR NS PACKAGE  
(TOP VIEW)  
D
500-mA-Rated Collector Current  
(Single Output)  
D
D
D
D
High-Voltage Outputs . . . 50 V  
Output Clamp Diodes  
1B  
2B  
3B  
4B  
5B  
6B  
7B  
E
1
2
3
4
5
6
7
8
16 1C  
15 2C  
14 3C  
Inputs Compatible With Various Types of  
Logic  
13  
12  
11  
10  
9
4C  
5C  
6C  
7C  
Relay-Driver Applications  
description/ordering information  
COM  
The ULN2004AI is a high-voltage, high-current  
Darlington transistor array. This device consists  
of seven npn Darlington pairs that feature  
high-voltage outputs with common-cathode clamp diodes for switching inductive loads. The collector-current  
rating of a single Darlington pair is 500 mA. The Darlington pairs can be paralleled for higher-current capability.  
Applications include relay drivers, hammer drivers, lamp drivers, display drivers (LED and gas discharge), line  
drivers, and logic buffers.  
The ULN2004AI has a 10.5-kseries base resistor for each Darlington pair for operation directly with TTL or  
5-V CMOS devices.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
PACKAGE  
T
A
PDIP (N)  
SOIC (D)  
SOP (NS)  
Tube of 25  
Tube of 40  
Reel of 2500  
Reel of 2000  
ULN2004AIN  
ULN2004AID  
ULN2004AIDR  
ULN2004AINSR  
ULN2004AIN  
ULN2004AI  
ULN2004AI  
−40°C to 105°C  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are  
available at www.ti.com/sc/package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
ꢍꢠ  
Copyright 2004, Texas Instruments Incorporated  
ꢜ ꢠ ꢝ ꢜꢕ ꢖꢪ ꢘꢗ ꢛ ꢣꢣ ꢡꢛ ꢙ ꢛ ꢚ ꢠ ꢜ ꢠ ꢙ ꢝ ꢥ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂꢃ ꢄ ꢄ ꢅ ꢆꢇ  
ꢈ ꢇꢉ ꢈꢊꢋ ꢌꢁꢍꢆ ꢉꢎ ꢈꢇ ꢉ ꢈꢊꢏ ꢀꢐꢐ ꢎꢂꢍ ꢑꢆ ꢐꢁꢇ ꢂꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂ ꢒꢇ ꢒꢍꢌꢐ ꢆꢐ ꢐꢆꢓ  
SLRS055 − APRIL 2004  
logic diagram  
9
COM  
1C  
1
16  
1B  
2B  
3B  
4B  
5B  
6B  
7B  
2
3
4
5
6
7
15  
14  
13  
12  
11  
10  
2C  
3C  
4C  
5C  
6C  
7C  
schematics (each Darlington pair)  
COM  
Output  
C
10.5 kΩ  
Input  
B
7.2 kΩ  
3 kΩ  
E
All resistor values shown are nominal.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢄ ꢅꢆ ꢇ  
ꢈꢇ ꢉꢈ ꢊꢋꢌ ꢁꢍꢆꢉ ꢎ ꢈꢇ ꢉꢈ ꢊꢏꢀꢐꢐꢎ ꢂꢍ ꢑꢆꢐꢁ ꢇꢂ ꢉ ꢍꢌ ꢂ  
SLRS055 − APRIL 2004  
absolute maximum ratings at 25°C free-air temperature (unless otherwise noted)  
Collector-emitter voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V  
Clamp diode reverse voltage (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V  
Input voltage, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V  
I
Peak collector current (see Notes 2 and 4) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA  
Output clamp current, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500 mA  
OK  
Total emitter-terminal current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −2.5 A  
Operating free-air temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −40°C to 105°C  
A
Package thermal impedance, θ (see Notes 2 and 3): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73°C/W  
JA  
N package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67°C/W  
NS package . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C  
J
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. All voltage values are with respect to the emitter/substrate terminal E, unless otherwise noted.  
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.  
D
J
A
JA  
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.  
electrical characteristics, T = 25°C  
A
TEST  
FIGURE  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
I
I
I
I
I
I
I
= 125 mA  
= 200 mA  
= 275 mA  
= 350 mA  
= 100 mA  
= 200 mA  
= 350 mA  
5
6
C
C
C
C
C
C
C
V
V
On-state input voltage  
6
V
= 2 V  
V
I(on)  
CE  
7
8
I = 250 µA,  
I
0.9  
1
1.1  
1.3  
1.6  
50  
2
I = 350 µA,  
I
Collector-emitter saturation voltage  
5
V
CE(sat)  
I = 500 µA,  
I
1.2  
I
Collector cutoff current  
Clamp forward voltage  
1
8
V
= 50 V,  
I = 0  
I
µA  
CEX  
CE  
= 350 mA  
F
V
F
I
1.7  
0.35  
1
V
V = 5 V  
I
0.5  
1.45  
50  
25  
I
I
Input current  
4
7
mA  
I
V = 12 V  
I
Clamp reverse current  
Input capacitance  
V
R
= 50 V  
µA  
R
C
V = 0,  
I
f = 1 MHz  
15  
pF  
i
3
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ꢀ ꢁꢂꢃ ꢄ ꢄ ꢅ ꢆꢇ  
ꢈ ꢇꢉ ꢈꢊꢋ ꢌꢁꢍꢆ ꢉꢎ ꢈꢇ ꢉ ꢈꢊꢏ ꢀꢐꢐ ꢎꢂꢍ ꢑꢆ ꢐꢁꢇ ꢂꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂ ꢒꢇ ꢒꢍꢌꢐ ꢆꢐ ꢐꢆꢓ  
SLRS055 − APRIL 2004  
electrical characteristics, T = −40°C to 105°C  
A
TEST  
PARAMETER  
FIGURE  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
I
I
I
I
I
I
I
= 125 mA  
= 200 mA  
= 275 mA  
= 350 mA  
= 100 mA  
= 200 mA  
= 350 mA  
5
6
C
C
C
C
C
C
C
V
On-state input voltage  
6
V
= 2 V  
V
I(on)  
CE  
7
8
I = 250 µA,  
I
0.9  
1
1.1  
1.3  
1.6  
50  
100  
500  
2
I = 350 µA,  
I
V
I
Collector-emitter saturation voltage  
Collector cutoff current  
5
V
CE(sat)  
I = 500 µA,  
I
1.2  
1
2
V
CE  
= 50 V,  
I = 0  
I
I = 0  
I
µA  
CEX  
V
CE  
= 50 V  
V = 1 V  
I
V
F
Clamp forward voltage  
Off-state input current  
8
3
I
F
= 350 mA  
1.7  
65  
V
I
V
= 50 V,  
I = 500 µA  
C
50  
µA  
I(off)  
CE  
V = 5 V  
0.35  
1
0.5  
1.45  
100  
25  
I
I
I
Input current  
4
7
mA  
V = 12 V  
I
I
R
Clamp reverse current  
Input capacitance  
V
R
= 50 V  
µA  
C
V = 0,  
I
f = 1 MHz  
15  
pF  
i
switching characteristics, T = 25°C  
A
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
0.25  
0.25  
MAX  
UNIT  
µs  
t
t
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
See Figure 8  
See Figure 8  
= 50 V,  
1
1
PLH  
µs  
PHL  
V
S
I
O
300 mA,  
V
OH  
High-level output voltage after switching  
V
S
− 20  
mV  
See Figure 9  
switching characteristics, T = −40°C to 105°C  
A
PARAMETER  
TEST CONDITIONS  
See Figure 8  
See Figure 8  
= 50 V, 300 mA,  
O
MIN  
TYP  
1
MAX  
10  
UNIT  
µs  
t
t
Propagation delay time, low- to high-level output  
Propagation delay time, high- to low-level output  
PLH  
1
10  
µs  
PHL  
V
I
S
V
OH  
High-level output voltage after switching  
V
S
− 500  
mV  
See Figure 9  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢄ ꢅꢆ ꢇ  
ꢈꢇ ꢉꢈ ꢊꢋꢌ ꢁꢍꢆꢉ ꢎ ꢈꢇ ꢉꢈ ꢊꢏꢀꢐꢐꢎ ꢂꢍ ꢑꢆꢐꢁ ꢇꢂ ꢉ ꢍꢌ ꢂ  
SLRS055 − APRIL 2004  
PARAMETER MEASUREMENT INFORMATION  
Open  
Open  
V
CE  
V
CE  
I
I
CEX  
CEX  
Open  
V
I
Figure 1. I  
Test Circuit  
Figure 2. I  
Test Circuit  
CEX  
CEX  
Open  
V
CE  
Open  
I
I
C
I(off)  
I
I(on)  
V
I
Open  
Figure 3. I  
Test Circuit  
Figure 4. I Test Circuit  
I
I(off)  
Open  
Open  
I
C
h
FE  
=
I
I
V
CE  
I
I
I
C
V
I(on)  
V
CE  
I
C
NOTE: I is fixed for measuring V  
, variable for  
I
CE(sat)  
measuring h  
.
FE  
Figure 5. h , V  
Test Circuit  
Figure 6. V  
Test Circuit  
I(on)  
FE CE(sat)  
V
R
I
R
V
F
I
F
Open  
Open  
Figure 7. I Test Circuit  
Figure 8. V Test Circuit  
F
R
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂꢃ ꢄ ꢄ ꢅ ꢆꢇ  
ꢈ ꢇꢉ ꢈꢊꢋ ꢌꢁꢍꢆ ꢉꢎ ꢈꢇ ꢉ ꢈꢊꢏ ꢀꢐꢐ ꢎꢂꢍ ꢑꢆ ꢐꢁꢇ ꢂꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂ ꢒꢇ ꢒꢍꢌꢐ ꢆꢐ ꢐꢆꢓ  
SLRS055 − APRIL 2004  
PARAMETER MEASUREMENT INFORMATION  
Input  
50%  
50%  
t
t
PHL  
PLH  
50%  
50%  
Output  
VOLTAGE WAVEFORMS  
Figure 9. Propagation Delay-Time Waveforms  
V
S
Input  
2 mH  
Open  
1N3064  
200 Ω  
Pulse  
Generator  
(see Note A)  
Output  
= 15 pF  
C
L
(see Note B)  
TEST CIRCUIT  
5 ns  
90%  
10 ns  
V
IH  
90%  
(see Note C)  
Input  
1.5 V  
1.5 V  
10%  
10%  
0 V  
40 µs  
V
V
OH  
Output  
OL  
VOLTAGE WAVEFORMS  
NOTES: A. The pulse generator has the following characteristics: PRR = 12.5 kHz, Z = 50 .  
O
B.  
C includes probe and jig capacitance.  
L
C. For testing, V = 3 V  
IH  
Figure 10. Latch-Up Test Circuit and Voltage Waveforms  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢄ ꢅꢆ ꢇ  
ꢈꢇ ꢉꢈ ꢊꢋꢌ ꢁꢍꢆꢉ ꢎ ꢈꢇ ꢉꢈ ꢊꢏꢀꢐꢐꢎ ꢂꢍ ꢑꢆꢐꢁ ꢇꢂ ꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂꢒ ꢇꢒꢍꢌ ꢐ ꢆ ꢐꢐ ꢆꢓ  
SLRS055 − APRIL 2004  
TYPICAL CHARACTERISTICS  
COLLECTOR-EMITTER  
SATURATION VOLTAGE  
vs  
COLLECTOR-EMITTER  
SATURATION VOLTAGE  
vs  
TOTAL COLLECTOR CURRENT  
(TWO DARLINGTONS IN PARALLEL)  
COLLECTOR CURRENT  
(ONE DARLINGTON)  
2.5  
2
2.5  
2
T
A
= 25°C  
T
A
= 25°C  
I = 250 µA  
I
I = 350 µA  
I
I = 250 µA  
I
I = 350 µA  
I
I = 500 µA  
I
1.5  
1
1.5  
1
I = 500 µA  
I
0.5  
0
0.5  
0
0
100 200 300 400 500 600 700 800  
0
100 200 300 400 500 600 700 800  
I
− Total Collector Current − mA  
I
C
− Collector Current − mA  
C(tot)  
Figure 12  
Figure 11  
COLLECTOR CURRENT  
vs  
INPUT CURRENT  
500  
R
T
A
= 10 Ω  
= 25°C  
L
450  
400  
350  
300  
250  
200  
150  
100  
50  
V
S
= 10 V  
V
S
= 8 V  
0
0
25  
50  
75  
100 125 150 175 200  
I − Input Current − µA  
I
Figure 13  
7
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ꢀ ꢁꢂꢃ ꢄ ꢄ ꢅ ꢆꢇ  
ꢈ ꢇꢉ ꢈꢊꢋ ꢌꢁꢍꢆ ꢉꢎ ꢈꢇ ꢉ ꢈꢊꢏ ꢀꢐꢐ ꢎꢂꢍ ꢑꢆ ꢐꢁꢇ ꢂꢉ ꢍꢌ ꢂ  
ꢍ ꢐꢆꢂ ꢒꢇ ꢒꢍꢌꢐ ꢆꢐ ꢐꢆꢓ  
SLRS055 − APRIL 2004  
APPLICATION INFORMATION  
V
CC  
V
V
CC  
V
1
16  
15  
14  
1
2
16  
15  
14  
2
3
4
5
R
P
3
4
13  
12  
11  
10  
9
13  
12  
11  
10  
9
5
6
6
7
8
7
8
Lamp  
Test  
TTL  
Output  
TTL  
Output  
Figure 15. Use of Pullup Resistors  
to Increase Drive Current  
Figure 14. TTL to Load  
8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
PACKAGING INFORMATION  
Orderable Device  
ULN2004AID  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
SOIC  
D
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
16  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
ULN2004AIDE4  
ULN2004AIDG4  
ULN2004AIDR  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
PDIP  
PDIP  
SO  
D
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
ULN2004AIDRE4  
ULN2004AIDRG4  
ULN2004AIN  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
ULN2004AINE4  
ULN2004AINSR  
ULN2004AINSRE4  
ULN2004AINSRG4  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
NS  
NS  
NS  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
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Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
4-Jun-2007  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
ULN2004AIDR  
SOIC  
SO  
D
16  
16  
2500  
2000  
330.0  
330.0  
16.4  
16.4  
6.5  
8.2  
10.3  
10.5  
2.1  
2.5  
8.0  
16.0  
16.0  
Q1  
Q1  
ULN2004AINSR  
NS  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
19-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
ULN2004AIDR  
SOIC  
SO  
D
16  
16  
2500  
2000  
333.2  
346.0  
345.9  
346.0  
28.6  
33.0  
ULN2004AINSR  
NS  
Pack Materials-Page 2  
IMPORTANT NOTICE  
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