UC3176V [TI]

VOICE COIL MOTOR CONTROLLER, 2.5A, PZFM15;
UC3176V
型号: UC3176V
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

VOICE COIL MOTOR CONTROLLER, 2.5A, PZFM15

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UC3176  
UC3177  
Full Bridge Power Amplifier  
FEATURES  
DESCRIPTION  
Dual Power Operational Amplifiers  
The UC3176/7 family of full bridge power amplifiers is rated for a continu-  
ous output current of 2A. Intended for use in demanding servo applica-  
tions such as disk head positioning, the onboard current sense amplifier  
can be used to obtain precision control of load current, or where voltage  
mode drive is required, a standard voltage feedback scheme can be used.  
Output stage protection includes foldback current limiting and thermal  
shutdown, resulting in a very rugged device.  
• ±2A Output Current Guaranteed  
Precision Current Sense Amplifier  
Two Supply Monitoring Inputs  
Parking Function and Under-Voltage  
Lockout  
Auxiliary functions on this device include a dual input under-voltage com-  
parator that can be programmed to respond to low voltage conditions on  
two independent supplies. In response to an under-voltage condition the  
power Op-Amps are inhibited and a high current, 100mA, open collector  
drive output is activated. A separate Park/Inhibit command input.  
Safe Operating Area Protection  
3V to 35V Operation  
The devices are operational over a 3V to 35V supply range. Internal un-  
der-voltage lockout provides predictable power-up and power-down char-  
acteristics.  
BLOCK DIAGRAM  
SLUS285A - OCTOBER 1994 - REVISED JANUARY 2005  
UC3176  
UC3177  
CONNECTION DIAGRAM  
ABSOLUTE MAXIMUM RATINGS (Note 1)  
Input Supply voltage, (+VIN) . . . . . . . . . . . . . . . . . . . . . . . . 40V  
Park/Inhibit, UV1 and UV2 inputs (zener clamped)  
PLCC-28 (Top View)  
QP Package  
PACKAGE PIN FUNCTION  
FUNCTION  
PIN  
Maximum forced voltage . . . . . . . . . . . . . . . . . –0.3V to 10V  
Maximum forced current . . . . . . . . . . . . . . . . . . . . . . ±10mA  
Other Input Voltages . . . . . . . . . . . . . . . . . . . . . . –0.3V to +VIN  
AlSINK and BlSINK Voltages . . . . . . . . . . . . . . . . . . . –0.3V to 6V  
Open Collector Output Voltages . . . . . . . . . . . . . . . . . . . . . 40V  
A and B Output Currents (Continuous)  
Source . . . . . . . . . . . . . . . . . . . . . . . . . . . . Internally Limited  
Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5A  
Total Supply Current (Continuous) . . . . . . . . . . . . . . . . . . . . 4A  
Parking Drive Output Current (Continuous) . . . . . . . . . . 200mA  
Supply OK Output Current, UC3177 (Continuous). . . . . . 30mA  
Operating Junction Temperature . . . . . . . . . . –55°C to +150°C  
Power Dissipation at TC = +75°C  
+VIN  
B Output  
1
2
3
4
BI  
BI  
(Sense)  
SINK  
SINK  
N/C  
5-7  
8
B– Input  
*
9
Park/Inhibit  
Parking Drive  
10  
11  
Gnd (Heat Flow Pins) 12-18  
UV1  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
UV2  
QP package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4W  
Storage Temperature . . . . . . . . . . . . . . . . . . . –65°C to +150°C  
Current Feedback  
A+ Input  
A– Input  
N/C  
THERMAL DATA  
QP package:  
*Pin 9: UC3176, B+ Input  
AI  
SINK  
UC3177, Supply OK  
AI  
(Sense)  
Thermal Resistance Junction to Leads, θJL . . . . . . . 15°C/W  
Thermal Resistance Junction to Ambient, θJA . . . . . 50°C/W  
Thermal Resistance Junction to COSC, θJC . . . . . . . 30°C/W  
SINK  
A Output  
Gnd  
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, specifications hold for TA = 0 to 70°C, +VIN = 12V, TA = TJ.  
PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNITS  
Input Supply  
Supply Current  
+VIN = 12V  
18  
21  
25  
30  
mA  
mA  
V
+VIN = 35V  
UVOL Threshold  
+VIN low to high  
2.8  
220  
3.0  
300  
Threshold Hysteresis  
mV  
Power, Amplifier, A and B  
Input Offset Voltage  
Input Bias Current  
VCM = 6V, VOUT = 6V  
8
mV  
nA  
VCM = 6V, Except A+ Input  
–500 –100  
Input Bias Current at A+/Reference Input (A+/REF - BISINK) /36k; TJ = 25°C  
23  
28  
35  
µA/V  
nA  
Input Offset Current B Amp  
(UC3176 Only)  
V
CM = 6V  
200  
CMRR  
VCM = 1 to 33V, +VIN = 35V, VOUT = 6V  
+VIN = 5 to 35V, VCM = 2.5V  
70  
70  
100  
100  
4
dB  
dB  
PSRR  
Large Signal Voltage Gain  
VOUT = 3V, w/IOUT = 1A to VOUT = 9V,  
w/IOUT = –1A  
1.5  
V/mV  
Thermal Feedback  
Saturation Voltage  
+VIN = 20V, Pd = 20W at opposite output  
25  
1.9  
1.6  
3.5  
1
200  
3.7  
µV/W  
V
I
OUT = –2A, High Side, TJ = 25°  
CIOUT = 2A, Low Side, TJ = 25°C  
Total VSAT at 2A, TJ = 25°C  
V
V
Unity Gain Bandwidth  
Slew Rate  
MHz  
V/µs  
1
Differential IOUT Sense Error Current in  
Bridge Configuration  
IOUT(A) = –IOUT(B), /IOUT / – /AISINK - BISINK /  
I
I
OUT 200mA  
OUT 2A  
3.0  
5.0  
6.0  
10  
mA  
mA  
A
High Side Current Limiting  
=VIN - VOUT < 12V  
–2.7  
–2.0  
2
UC3176  
UC3177  
ELECTRICAL CHARACTERISTICS:Unless otherwise stated, specifications hold for TA = 0 to 70°C, +VIN = 12V, TA = TJ.  
PARAMETER TEST CONDITIONS MIN. TYP. MAX. UNITS  
Current Sense Amplifier  
Input Offset Voltage  
VCM = 0V, A+ / REF at 6V  
3
mV  
REF = 2V to 20V, +VIN = 35, change with REF  
Input voltage  
600  
µV/V  
Thermal Gradient Sensitivity  
+VIN = 20V, REF = 10V Pd = 20W @ A or B  
Output  
5.0  
75.0 µV/W  
PSRR  
REF = 2.5V, +VIN = 5 to 35V  
70  
100  
8.0  
2
dB  
Gain  
/AISINK-BISINK / 0.5V  
7.8  
8.1  
V/V  
V/µS  
MHz  
mA  
V
Slew Rate  
3dB Bandwidth  
MAX Output Current  
Output Saturation Voltage  
1
ISOURCE = +VIN - VOUT = 0.5V  
ISOURCE = 1.5mA, High Side  
2.5  
3.5  
0.15  
1.4  
0.30  
1.85  
I
SINK = 5mA, Low Side  
V
Under-Voltage Comparator  
Threshold Voltage  
Low to High, other input at 5V  
Threshold Hysteresis  
Input = 2V, other input at 5V  
IOUT = 5mA  
1.44  
50  
1.50  
70  
1.56  
80  
V
mV  
µA  
V
Input Current  
–2.00 –.05  
Supply OK VSAT (UC3177 Only)  
Supply OK Leakage (UC3177 Only)  
Park/Inhibit  
0.45  
5
V
OUT = 35V  
µA  
Park/Inhibit Thl’d  
1.1  
1.3  
60  
1.7  
100  
0.7  
15  
V
µA  
V
Park/Inhibit Input Current  
Parking Drive Saturation Voltage  
Parking Drive Leakage  
Thermal Shutdown  
At threshold  
IOUT = 100mA  
0.3  
V
OUT = 35V  
µA  
Shutdown Temperature  
165  
°C  
Output saturation voltage vs. current. Maximum source current vs. + VIN  
VOUT.  
Crossover current error  
characteristic.  
3
UC3176  
UC3177  
APPLICATION AND OPERATION INFORMATION  
WAVEFORMS FOR ABOVE APPLICATION  
DESIGN EQUATIONS  
IL RF2  
=
1
Transconductance (GO) =  
×
VS RF1  
8R  
S
with: RSA = RSB and RF3 = RF4  
VIN 1.5  
Parking Current (IP) =  
RP +RL  
where: RL = load resistance  
Under-Voltage Thresholds, at Supplies  
High to Low Threshold, (VLH) = 1.425 (RA + RB)/RB  
Low to High Threshold, (VHL) = 1.5 (RA + RB)/RB  
4
PACKAGE OPTION ADDENDUM  
www.ti.com  
11-Apr-2013  
PACKAGING INFORMATION  
Orderable Device  
UC3176QP  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
0 to 70  
Top-Side Markings  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4)  
ACTIVE  
PLCC  
PLCC  
FN  
28  
28  
37  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Call TI  
Level-3-260C-168 HR  
UC3176QP  
UC3176QP  
UC3176QPTR  
ACTIVE  
FN  
750  
TBD  
Call TI  
0 to 70  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4)  
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a  
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
MECHANICAL DATA  
MPLC004A – OCTOBER 1994  
FN (S-PQCC-J**)  
PLASTIC J-LEADED CHIP CARRIER  
20 PIN SHOWN  
Seating Plane  
0.004 (0,10)  
0.180 (4,57) MAX  
0.120 (3,05)  
D
0.090 (2,29)  
D1  
0.020 (0,51) MIN  
3
1
19  
0.032 (0,81)  
0.026 (0,66)  
4
18  
D2/E2  
D2/E2  
E
E1  
8
14  
0.021 (0,53)  
0.013 (0,33)  
0.050 (1,27)  
9
13  
0.007 (0,18)  
M
0.008 (0,20) NOM  
D/E  
D1/E1  
D2/E2  
NO. OF  
PINS  
**  
MIN  
0.385 (9,78)  
MAX  
MIN  
MAX  
MIN  
MAX  
0.395 (10,03)  
0.350 (8,89)  
0.356 (9,04)  
0.141 (3,58)  
0.191 (4,85)  
0.291 (7,39)  
0.341 (8,66)  
0.169 (4,29)  
0.219 (5,56)  
0.319 (8,10)  
0.369 (9,37)  
20  
28  
44  
52  
68  
84  
0.485 (12,32) 0.495 (12,57) 0.450 (11,43) 0.456 (11,58)  
0.685 (17,40) 0.695 (17,65) 0.650 (16,51) 0.656 (16,66)  
0.785 (19,94) 0.795 (20,19) 0.750 (19,05) 0.756 (19,20)  
0.985 (25,02) 0.995 (25,27) 0.950 (24,13) 0.958 (24,33) 0.441 (11,20) 0.469 (11,91)  
1.185 (30,10) 1.195 (30,35) 1.150 (29,21) 1.158 (29,41) 0.541 (13,74) 0.569 (14,45)  
4040005/B 03/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Falls within JEDEC MS-018  
1
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