TRS211IDWR [TI]
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 5 -V多通道RS - 232线路驱动器/接收器【 15 kV ESD保护
| 型号： | TRS211IDWR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
| 文件： | 总17页 (文件大小：243K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
FEATURES
DB OR DW PACKAGE
(TOP VIEW)
•
RS-232 Bus-Pin ESD Protection Exceeds
±15 kV Using Human-Body Model (HBM)
1
28
27
26
25
24
23
22
21
20
19
18
17
16
15
DOUT3
DOUT1
DOUT2
RIN2
ROUT2
DIN2
DOUT4
RIN3
ROUT3
SHDN
EN
RIN4
ROUT4
DIN4
DIN3
ROUT5
RIN5
V−
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
2
3
•
•
•
•
Operates at 5-V VCC Supply
Four Drivers and Five Receivers
Operates up to 120 kbit/s
4
5
6
7
Low Supply Current in Shutdown
Mode . . . 1 μA Typical
DIN1
8
ROUT1
RIN1
9
•
•
External Capacitors . . . 4 × 0.1 μF
10
11
12
13
14
GND
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
V
CC
C1+
V+
C2−
APPLICATIONS
C1−
C2+
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ORDERING INFORMATION
The TRS211 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
The TRS211 has both shutdown (SHDN) and enable control (EN). In shutdown mode, the charge pumps are
turned off, V+ is pulled down to VCC, V– is pulled to GND, and the transmitter outputs are disabled. This reduces
supply current typically to 1 μA. EN is used to put the receiver outputs into the high-impedance state to allow
wired-OR connection of two RS-232 ports. It has no effect on the RS-232 drivers or the charge pumps.
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS211CDW
TOP-SIDE MARKING
TRS211C
Tube of 20
SOIC – DW
SSOP – DB
SOIC – DW
SSOP – DB
Reel of 1000
Tube of 50
TRS211CDWR
TRS211CDB
0°C to 70°C
TRS211C
TRS211I
TRS211I
Reel of 2000
Tube of 20
TRS211CDBR
TRS211IDW
Reel of 1000
Tube of 50
TRS211IDWR
–40°C to 85°C
TRS211IDB
Reel of 2000
TRS211IDBR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
FUNCTION TABLES(1)
INPUTS
DRIVER
RECEIVER
DEVICE STATUS
SHDN
EN
L
L
L
All active
All active
Z
All active
Normal operation
Normal operation
Shutdown
H
Z
Z
H
X
(1) X = don't care, Z = high impedance
Each Driver(1)
INPUTS
OUTPUT
DOUT
DRIVER STATUS
DIN
L
SHDN
L
L
H
L
Normal operation
Powered off
H
X
H
Z
(1) X = don't care, Z = high impedance
Each Receiver(1)
INPUTS
OUTPUT
ROUT
RECEIVER STATUS
RIN
L
EN
L
H
L
Normal operation
Powered off
H
L
X
H
Z
(1) X = don't care, Z = high impedance
2
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
7
2
DIN1
DIN2
DIN3
DIN4
DOUT1
DOUT2
6
3
TTL/CMOS
Inputs
RS-232
Outputs
20
21
1
DOUT3
DOUT4
28
25
SHDN
RIN1
8
9
4
ROUT1
ROUT2
ROUT3
5
RIN2
RIN3
26
27
RS-232
Inputs
TTL/CMOS
Outputs
22
23
18
ROUT4
RIN4
RIN5
19
24
ROUT5
EN
3
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX UNIT
VCC
V+
Supply voltage range(2)
Positive charge pump voltage range(2)
Negative charge pump voltage range(2)
6
14
V
V
V
VCC – 0.3
0.3
V–
–14
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V– – 0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
62
VO
Output voltage range
Receivers
DOUT
Short-circuit duration
DB package
DW package
θJA
Package thermal impedance(3)(4)
°C/W
46
TJ
Operating virtual junction temperature
Storage temperature range
150
°C
°C
Tstg
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 6
MIN
4.5
2
NOM
MAX UNIT
Supply voltage
5
5.5
V
V
V
V
Driver high-level input voltage
Control high-level input voltage
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN
VIH
VIL
VI
EN, SHDN
DIN, EN, SHDN
DIN, EN, SHDN
2.4
0.8
5.5
30
70
85
0
–30
0
TRS211C
TRS211I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
Supply current
Shutdown supply current
TEST CONDITIONS
See Figure 6
MIN
TYP(2)
MAX
UNIT
mA
ICC
No load,
14
1
20
10
TA = 25°C,
See Figure 1
μA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
4
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
DRIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 4)
PARAMETER
TEST CONDITIONS
All DOUT at RL = 3 kΩ to GND
All DOUT at RL = 3 kΩ to GND
DIN = VCC
MIN
5
TYP(2)
9
MAX
UNIT
V
VOH
VOL
High-level output voltage
Low-level output voltage
Driver high-level input current
Control high-level input current
Driver low-level input current
Control low-level input current
Short-circuit output current(3)
Output resistance
–5
–9
V
15
200
10
IIH
μA
μA
EN, SHDN = VCC
3
DIN = 0 V
–15
–3
–200
–10
±60
IIL
EN, SHDN = 0 V
IOS
ro
VCC = 5.5 V,
VO = 0 V
VO = ±2 V
±10
mA
VCC, V+, and V– = 0 V,
300
Ω
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX
UNIT
CL = 50 pF to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 2
Maximum data rate
120
kbit/s
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 2
tPLH(D)
tPHL(D)
tsk(p)
2
2
μs
μs
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 2
CL = 150 pF to 2500 pF,
See Figure 3
RL = 3 kΩ to 7 kΩ,
Pulse skew(3)
300
6
ns
CL = 50 pF to 1000 pF,
VCC = 5 V
RL = 3 kΩ to 7 kΩ,
SR(tr)
Slew rate, transition region
3
30
V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
ESD Protection
PIN
DOUT, RIN
TEST CONDITIONS
TYP
UNIT
Human-Body Model
±15
kV
5
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
RECEIVER SECTION
Electrical Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX UNIT
VOH
VOL
VIT+
VIT–
Vhys
ri
High-level output voltage
IOH = –1 mA
IOH = 1.6 mA
VCC = 5 V,
VCC = 5 V,
3.5
VCC – 0.4
V
Low-level output voltage
0.4
2.4
V
V
Positive-going input threshold voltage
Negative-going input threshold voltage
TA = 25°C
TA = 25°C
1.7
1.2
0.8
0.2
3
V
Input hysteresis (VIT+ – VIT–
Input resistance
)
0.5
1
7
V
VCC = 5 V,
TA = 25°C
5
kΩ
μa
Output leakage current
EN = VCC
,
0 ≤ ROUT ≤ VCC
±0.05
±10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
Switching Characteristics(1)
over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX
UNIT
μs
tPLH(R)
tPHL(R)
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
CL = 150 pF,
See Figure 4
See Figure 4
RL = 1 kΩ,
0.5
0.5
10
10
CL = 150 pF,
μs
CL = 150 pF,
See Figure 5
ten
Output enable time
600
ns
CL = 150 pF,
See Figure 5
RL = 1 kΩ,
tdis
Output disable time
Pulse skew(3)
200
300
ns
ns
tsk(p)
See Figure 3
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as |tPLH – tPHL| of each channel of the same device.
6
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
PARAMETER MEASUREMENT INFORMATION
I
SHDN
0.1 µF
−
+
5.5 V
0.1 µF
+
−
V
CC
V+
V−
C1+
+
−
0.1 µF
0.1 µF
0.1 µF
−
+
C1−
C2+
+
−
C2−
DIN
V
CC
400 kΩ
DOUT
5.5 V
3 kΩ
D1 to D4
RIN
ROUT
EN
5.5 V
5 kΩ
0-V or 5.5-V Drive
R1 to R5
5.5 V
SHDN
GND
Figure 1. Shutdown Current Test Circuit
7
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
0 V
SHDN
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
C
L
PHL (D)
PLH (D)
R
L
(see Note A)
V
OH
OL
3 V
−3 V
3 V
−3 V
Output
V
TEST CIRCUIT
VOLTAGE WAVEFORMS
6 V
or t
SR(tr) +
t
PHL (D)
PLH (D)
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 2. Driver Slew Rate and Propagation Delay Times
0 V
SHDN
3 V
0 V
RS-232
Output
1.5 V
1.5 V
Input
t
Generator
(see Note B)
50 Ω
C
L
t
PLH (D)
PHL (D)
R
L
(see Note A)
V
OH
OL
50%
50%
Output
V
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: PRR = 120 kbit/s, ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns,
tf ≤ 10 ns.
Figure 3. Driver Pulse Skew
0 V
SHDN
3 V
Input
1.5 V
1.5 V
−3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH (R)
PHL (R)
C
L
(see Note A)
V
OH
0 V
EN
50%
50%
Output
V
OL
TEST CIRCUIT
A. CL includes probe and jig capacitance.
VOLTAGE WAVEFORMS
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
Figure 4. Receiver Propagation Delay Times
8
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
PARAMETER MEASUREMENT INFORMATION (continued)
3 V
0 V
1.5 V
1.5 V
V
CC
GND
0 V
SHDN
Input
S1
t
t
PZH
PHZ
(S1 at GND)
(S1 at GND)
R
L
Output
− 0.1 V
V
OH
3 V or 0 V
Output
V
OH
3.5 V
C
L
(see Note A)
EN
t
t
PZL
PLZ
(S1 at V )
CC
(S1 at V )
CC
Generator
(see Note B)
50 Ω
V
OL
+ 0.1 V
0.8 V
V
OL
Output
TEST CIRCUIT
A. CL includes probe and jig capacitance.
B. The pulse generator has the following characteristics: ZO = 50 Ω, 50% duty cycle, tr ≤ 10 ns, tf ≤ 10 ns.
C. tPLZ and tPHZ are the same as tdis
D. tPZL and tPZH are the same as ten
VOLTAGE WAVEFORMS
.
.
Figure 5. Receiver Enable and Disable Times
9
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
APPLICATION INFORMATION
28
27
1
DOUT4
DOUT3
DOUT1
DOUT2
RIN2
2
3
4
RIN3
5 kΩ
26
25
ROUT3
SHDN
5 kΩ
24
23
5
6
EN
ROUT2
DIN2
RIN4
5 V
5 kΩ
400 kΩ
22
ROUT4
5 V
5 V
400 kΩ
7
8
DIN1
400 kΩ
21
20
DIN4
ROUT1
9
5 V
RIN1
GND
10
5 kΩ
400 kΩ
C
−
DIN3
BYPASS
= 0.1 µF
+
19
18
11
ROUT5
V
V
CC
CC
−
+
†
=
C3
RIN5
0.1 µF
12
13
C1+
V+
6.3 V
C4 =
0.1 µF
16 V
5 kΩ
17
16
V−
−
+
+
−
C1 =
0.1 µF
6.3 V
14
C1−
C2−
C2 =
0.1 µF
16 V
−
+
15
C2+
†
C3 can be connected to V or GND.
CC
A. Resistor values shown are nominal.
B. Nonpolarized ceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they should
be connected as shown.
Figure 6. Typical Operating Circuit and Capacitor Values
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
APPLICATION INFORMATION (continued)
Capacitor Selection
The capacitor type used for C1–C4 is not critical for proper operation. The TRS211 requires 0.1-μF capacitors,
although capacitors up to 10 μF can be used without harm. Ceramic dielectrics are suggested for the 0.1-μF
capacitors. When using the minimum recommended capacitor values, make sure the capacitance value does
not degrade excessively as the operating temperature varies. If in doubt, use capacitors with a larger (e.g., 2×)
nominal value. The capacitors' effective series resistance (ESR), which usually rises at low temperatures,
influences the amount of ripple on V+ and V–.
Use larger capacitors (up to 10 μF) to reduce the output impedance at V+ and V–.
Bypass VCC to ground with at least 0.1 μF. In applications sensitive to power-supply noise generated by the
charge pumps, decouple VCC to ground with a capacitor the same size as (or larger than) the charge-pump
capacitors (C1–C4).
Electrostatic Discharge (ESD) Protection
TI TRS211 devices have standard ESD protection structures incorporated on the pins to protect against
electrostatic discharges encountered during assembly and handling. In addition, the RS232 bus pins (driver
outputs and receiver inputs) of these devices have an extra level of ESD protection. Advanced ESD structures
were designed to successfully protect these bus pins against ESD discharge of ±15 kV when powered down.
ESD Test Conditions
ESD testing is stringently performed by TI, based on various conditions and procedures. Please contact TI for a
reliability report that documents test setup, methodology, and results.
Human-Body Model (HBM)
The HBM of ESD testing is shown in Figure 7. Figure 8 shows the current waveform that is generated during a
discharge into a low impedance. The model consists of a 100-pF capacitor charged to the ESD voltage of
concern and subsequently discharged into the DUT through a 1.5-kΩ resistor.
R
D
1.5 kΩ
+
−
100 pF
C
S
DUT
V
HBM
Figure 7. HBM ESD Test Circuit
11
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TRS211
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS811–JULY 2007
APPLICATION INFORMATION (continued)
1.5
V
HBM
= 2 kV
DUT = 10 V, 1-Ω Zener Diode
1.0
0.5
0.0
0
50
100
Time − ns
150
200
Figure 8. Typical HBM Current Waveform
Machine Model (MM)
The MM ESD test applies to all pins, using a 200-pF capacitor with no discharge resistance. The purpose of the
MM test is to simulate possible ESD conditions that can occur during the handling and assembly processes of
manufacturing. In this case, ESD protection is required for all pins, not just RS-232 pins. However, after PC
board assembly, the MM test no longer is as pertinent to the RS-232 pins.
12
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PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TRS211CDB
ACTIVE
ACTIVE
SSOP
SSOP
DB
DB
28
28
50
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS211CDBG4
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
TRS211CDBR
TRS211CDBRG4
TRS211CDW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
DB
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
TBD
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DW
DW
DW
DW
DB
TRS211CDWG4
TRS211CDWR
TRS211CDWRG4
TRS211IDB
TRS211IDBG4
TRS211IDBR
DB
DB
TRS211IDBRG4
TRS211IDW
DB
DW
DW
DW
DW
TRS211IDWG4
TRS211IDWR
TRS211IDWRG4
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2010
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
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