TRS213CDWG4 [TI]
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION; 5 -V多通道RS - 232线路驱动器/接收器【 15 kV ESD保护型号: | TRS213CDWG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER WITH ±15-kV ESD PROTECTION |
文件: | 总17页 (文件大小:406K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
FEATURES
DB, DW, OR PW PACKAGE
(TOP VIEW)
•
ESD Protection for RS-232 Bus Pins
–
±15-kV Human-Body Model (HBM)
DOUT4
RIN3
ROUT3
1
28
27
26
DOUT3
DOUT1
DOUT2
RIN2
ROUT2
DIN2
DIN1
ROUT1
RIN1
•
Meets or Exceeds the Requirements of
TIA/EIA-232-F and ITU v.28 Standards
2
3
•
•
•
•
Operates at 5-V VCC Supply
Four Drivers and Five Receivers
Operates up to 120 kbit/s
4
25 SHDN
24 EN
5
6
23
22
21
20
19
18
17
16
15
RIN4
ROUT4
DIN4
DIN3
ROUT5
RIN5
V–
7
Low Supply Current in Shutdown
Mode . . . 15 μA Typ
8
9
•
•
External Capacitors . . . 4 × 0.1 F
10
11
12
13
14
GND
Designed to Be Interchangeable With Industry
Standard '213 Devices
V
CC
C1+
V+
C1–
•
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
C2–
C2+
APPLICATIONS
•
•
•
•
•
•
Battery-Powered Systems
PDAs
Notebooks
Laptops
Palmtop PCs
Hand-Held Equipment
DESCRIPTION/ ORDER INFORMATION
The TRS213 device consists of four line drivers, five line receivers, and a dual charge-pump circuit with ±15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The device meets the requirements of
TIA/EIA-232-F and provides the electrical interface between an asynchronous communication controller and the
serial-port connector. The charge pump and four small external capacitors allow operation from a single 5-V
supply. The devices operate at data signaling rates up to 120 kbit/s and a maximum of 30-V/μs driver output
slew rate.
The TRS213 has an active-low shutdown (SHDN) and an active-high enable control (EN). In shutdown mode,
the charge pumps are turned off, V+ is pulled down to VCC, V– is pulled to GND, and the transmitter outputs are
disabled. This reduces supply current typically to 1 μA. Two receivers of the TRS213 are active during
shutdown.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2007, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
ORDERING INFORMATION
TA
PACKAGE(1)(2)
ORDERABLE PART NUMBER
TRS213CDW
TOP-SIDE MARKING
Tube of 20
SOIC – DW
TRS213C
Reel of 1000
Tube of 50
TRS213CDWR
TRS213CDB
0°C to 70°C
SSOP – DB
TSSOP – PW
SOIC – DW
TRS213C
TRS213C
TRS213I
Reel of 2000
Tape and reel
Tube of 20
TRS213CDBR
TRS213CPWR
TRS213IDW
Reel of 1000
Tube of 50
TRS213IDWR
TRS213IDB
–40°C to 85°C
SSOP – DB
TRS213I
TRS213I
Reel of 2000
Tape and reel
TRS213IDBR
TSSOP – PW
TRS213IPWR
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
website at www.ti.com.
FUNCTION TABLE
INPUTS
RECEIVER
DRIVER
D1–D4
DEVICE STATUS
SHDN
EN
L
R1–R3
R4–R5
L
L
Z
Z
Z
Z
Shutdown
Shutdown
H
L
Z
Active(1)
H
H
All active
All active
Z
Z
Normal operation
Normal operation
H
Active
Active
(1) See the VIT+ and VIT– change in the Electrical Characteristics table.
2
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
LOGIC DIAGRAM (POSITIVE LOGIC)
7
2
DIN1
DIN2
DIN3
DIN4
DOUT1
DOUT2
6
3
TTL/CMOS
Inputs
RS-232
Outputs
20
21
1
DOUT3
DOUT4
28
25
24
SHDN
EN
89
5
ROUT1
ROUT2
ROUT3
RIN1
RIN2
RIN3
4
TTL/CMOS
Outputs
26
27
RS-232
Inputs
22
19
23
18
ROUT4
ROUT5
RIN4
RIN5
3
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.3
MAX
UNIT
VCC
V+
Supply voltage range
6
V
Positive charge-pump voltage range(2)
Negative charge-pump voltage range(2)
VCC – 0.3
0.3
14
–14
V
V
V–
Drivers
–0.3
V+ + 0.3
±30
VI
Input voltage range
V
V
Receivers
Drivers
V– – 0.3
–0.3
V+ + 0.3
VCC + 0.3
Continuous
62
VO
Output voltage range
Short-circuit duration
Receivers
DOUT
DB package
DW package
PW package
θJA
Package thermal impedance(3)(4)
46
C°/W
TJ
Operating virtual junction temperature
Storage temperature range
150
150
C°
C°
Tstg
–65
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to network GND.
(3) Maximum power dissipation is a function of TJ(max),θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(4) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
See Figure 4
MIN NOM
MAX UNIT
Supply voltage
4.5
2
5
5.5
V
V
V
V
Driver high-level input voltage
Control high-level input voltage
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN
VIH
VIL
VI
EN, SHDN
DIN, EN, SHDN
DIN, EN, SHDN
RIN
2.4
0.8
5.5
30
70
85
0
–30
0
TRS213C
TRS213I
TA
Operating free-air temperature
°C
–40
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
Electrical Characteristics(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
Supply current
ISHDN Shutdown supply current
TEST CONDITIONS
See Figure 6
See Figure 1
MIN TYP(2)
MAX UNIT
ICC
No load,
14
15
20
50
mA
TA = 25°C,
μA
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
4
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
DRIVER SECTION
Electrical Characteristics(1)
over operating free-air temperature range (unless otherwise noted) (see Figure 4)
PARAMETER
High-level output voltage
Low-level output voltage
Control high-level input current
Driver low-level input current
Control low-level input current
Short-circuit output current
Output resistance
TEST CONDITIONS
DOUT at RL = 3 kΩ to GND
MIN TYP(2)
MAX UNIT
VOH
VOL
IIH
5
9
–9
V
V
DOUT at RL = 3 kΩ to GND
EN, SHDN = 5 V
DIN = 0 V
–5
3
10
–200
–10
μA
–15
–3
IIL
μA
EN, SHDN = 0 V
VCC = 5.5 V,
(3)
IOS
ro
VO = 0 V
±10
±60
mA
VCC, V+, and V– = 0 V,
VO = ±2 V
300
Ω
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one
output should be shorted at a time.
Switching Characteristics(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
CL = 50 pF to 1000 pF,
One DOUT switching,
RL = 3 kΩ to 7 kΩ,
See Figure 3
Maximum data rate
120
kbit/s
Propagation delay time,
low- to high-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 3
tPLH(D)
tPHL(D)
tsk(p)
2
2
μs
μs
Propagation delay time,
high- to low-level output
CL = 2500 pF,
All drivers loaded,
RL = 3 kΩ,
See Figure 3
CL = 150 pF to 2500 pF,
See Figure 3
RL = 3 kΩ to 7 kΩ,
Pulse skew(3)
300
ns
Slew rate, transition region
(see Figure 2)
CL = 50 pF to 1000 pF,
VCC = 5 V
RL = 3 kΩ to 7 kΩ,
SR(tr)
3
6
30 V/μs
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) Pulse skew is defined as (tPLH – tPHL) of each channel of the same device.
ESD Protection
over operating free-air temperature range (unless otherwise noted)
PIN
TEST CONDITIONS
TYP UNIT
DOUT
Human-Body Model
±15
kV
5
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
RECEIVER SECTION
Electrical Characteristics(1)
over operating free-air temperature range (unless otherwise noted) (see Figure 6)
PARAMETER
TEST CONDITIONS
MIN
TYP(2)
MAX UNIT
VOH
VOL
High-level output voltage
Low-level output voltage
IOH = –1 mA
IOH = 1.6 mA
VCC – 0.4
V
0.4
2.4
2.4
V
Active mode
1.7
1.5
Positive-going
input threshold voltage
VIT+
VCC = 5 V, TA = 25°C
VCC = 5 V, TA = 25°C
V
Shutdown mode (R4–R5)
Active mode
0.8
0.6
1.2
Negative-going
input threshold voltage
VIT–
V
Shutdown mode (R4–R5)
1.5
(3)
Vhys
rI
Input hysteresis (VIT+, VIT–
)
VCC = 5 V
0.5
1
7
V
Input resistance
VCC = 5 V, TA = 25°C
3
5
kΩ
μA
Output leakage current
EN = 0 V, 0 ≤ ROUT ≤ VCC, R1–R3
±0.05
±10
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
(3) No hysteresis in shudown mode
Switching Characteristics(1)
over operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
MIN TYP(2)
MAX UNIT
SHDN = VCC
0.5
4
10
μs
40
Propagation delay time,
low- to high-level output
tPLH(R)
CL = 150 pF,
CL = 150 pF,
See Figure 4
See Figure 4
SHDN = 0 V, R4–R5
Propagation delay time,
high- to low-level output
tPHL(R)
0.5
10
μs
ten
Output enable time
Output disable time
CL = 150 pF,
CL = 150 pF,
See Figure 5
See Figure 5
600
200
ns
ns
tdis
(1) Test conditions are C1–C4 = 0.1 μF at VCC = 5 V ± 0.5 V.
(2) All typical values are at VCC = 5 V, and TA = 25°C.
ESD Protection
over operating free-air temperature range (unless otherwise noted)
PIN
TEST CONDITIONS
TYP UNIT
±15 kV
RIN
Human-Body Model
6
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
PARAMETER MEASUREMENT INFORMATION
0.1 mF
I
SHDN
–
+
5.5 V
0.1 mF
+
–
V
CC
V+
V–
C1+
+
–
0.1 mF
0.1 mF
0.1 mF
–
+
C1–
C2+
+
–
C2–
DIN
V
CC
400 kΩ
DOUT
5.5 V
D1−D4
3 kΩ
RIN
ROUT
EN
5.5 V
5 kΩ
0-V or 5.5-V Drive
5.5 V
R1−R5
SHDN
GND
Figure 1. Shutdown Current Test Circuit
7
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
5-V
SHDN
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH(D)
THL(D)
C
L
R
L
(see Note A)
V
OH
OL
3 V
–3 V
3 V
–3 V
Output
V
TEST CIRCUIT
6 V
or t
VOLTAGE WAVEFORMS
SR(tr) =
t
THL(D)
TLH(D)
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Slew Rate
5-V
SHDN
3 V
0 V
RS-232
Input
Output
1.5 V
1.5 V
Generator
(see Note B)
50 Ω
t
t
PLH(D)
PHL(D)
R
L
C
L
(see Note A)
V
OH
50%
50%
Output
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Driver Pulse Skew and Propagation Delay Times
5-V
SHDN
3 V
Input
1.5 V
1.5 V
–3 V
Output
Generator
(see Note B)
50 Ω
t
t
PLH(R)
PHL(R)
C
L
V
OH
5-V
EN
(see Note A)
50%
50%
Output
V
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A. C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 4. Receiver Propagation Delay Times
8
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
3 V
1.5 V
1.5 V
V
GND
CC
Input
0 V
5-V
S1
SHDN
t
t
PZH
PHZ
(S1 at GND)
R
(S1 at GND)
L
Output
V
OH
3 V or 0 V
Output
3.5 V
V
V
– 0.1 V
OH
C
L
EN
(see Note A)
t
t
PZL
(S1 at V
PLZ
(S1 at V
)
CC
)
CC
Generator
(see Note B)
50 Ω
+ 0.1 V
0.8 V
OL
Output
V
OL
TEST CIRCUIT
NOTES: A. C includes probe and jig capacitance.
VOLTAGE WAVEFORMS
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PHZ
PZH
are the same as t
en
Figure 5. Receiver Enable and Disable Times
9
Submit Documentation Feedback
TRS213
5-V MULTICHANNEL RS-232 LINE DRIVER/RECEIVER
WITH ±15-kV ESD PROTECTION
www.ti.com
SLLS807–JUNE 2007
APPLICATION INFORMATION
28
27
1
DOUT4
DOUT3
DOUT1
DOUT2
RIN2
2
3
4
RIN3
5 kΩ
26
25
ROUT3
5 kΩ
=
SHDN 5 V
24
23
5
6
EN
ROUT2
DIN2
RIN4
5 V
5 kΩ
400 kΩ
22
ROUT4
5 V
5 V
400 kΩ
7
8
DIN1
400 kΩ
21
20
DIN4
ROUT1
9
5 V
RIN1
GND
10
5 kΩ
400 kΩ
–
DIN3
C
BYPASS
= 0.1 mF
+
19
18
11
ROUT5
RIN5
V
CC
V
CC
(1) =
–
+
C3
0.1 mF
6.3 V
12
13
C1+
V+
=
C4
0.1 mF
16 V
5 kΩ
17
16
V–
–
+
=
+
–
C1
0.1 mF
6.3 V
14
C1–
C2–
=
C2
0.1 mF
16 V
–
+
15
C2+
(1) C3 can be connected to V or GND.
CC
NOTES: A. Resistor values shown are nominal.
B. Nonpolarizedceramic capacitors are acceptable. If polarized tantalum or electrolytic capacitors are used, they
should be connected as shown.
Figure 6. Typical Operating Circuit and Capacitor Values
10
Submit Documentation Feedback
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
PACKAGING INFORMATION
Orderable Device
TRS213CDB
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS213CDBG4
TRS213CDBR
TRS213CDBRG4
TRS213CDW
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
SSOP
SSOP
SSOP
SSOP
SOIC
SOIC
SOIC
SOIC
DB
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS213CDWG4
TRS213CDWR
TRS213CDWRG4
TRS213IDB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS213IDBG4
TRS213IDBR
DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS213IDBRG4
TRS213IDW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TRS213IDWG4
TRS213IDWR
TRS213IDWRG4
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Sep-2007
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
TRS213CDBR
TRS213CDWR
TRS213IDBR
TRS213IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
28
28
28
28
2000
1000
2000
1000
330.0
330.0
330.0
330.0
16.4
32.4
16.4
32.4
8.2
11.35
8.2
10.5
18.67
10.5
2.5
3.1
2.5
3.1
12.0
16.0
12.0
16.0
16.0
32.0
16.0
32.0
Q1
Q1
Q1
Q1
DW
11.35
18.67
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TRS213CDBR
TRS213CDWR
TRS213IDBR
TRS213IDWR
SSOP
SOIC
SSOP
SOIC
DB
DW
DB
28
28
28
28
2000
1000
2000
1000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
49.0
33.0
49.0
DW
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All products are
sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard
warranty. Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty. Except where
mandated by government requirements, testing of all parameters of each product is not necessarily performed.
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and
applications using TI components. To minimize the risks associated with customer products and applications, customers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any TI patent right, copyright, mask work right,
or other TI intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information
published by TI regarding third-party products or services does not constitute a license from TI to use such products or services or a
warranty or endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual
property of the third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied
by all associated warranties, conditions, limitations, and notices. Reproduction of this information with alteration is an unfair and deceptive
business practice. TI is not responsible or liable for such altered documentation. Information of third parties may be subject to additional
restrictions.
Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all
express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not
responsible or liable for any such statements.
TI products are not authorized for use in safety-critical applications (such as life support) where a failure of the TI product would reasonably
be expected to cause severe personal injury or death, unless officers of the parties have executed an agreement specifically governing
such use. Buyers represent that they have all necessary expertise in the safety and regulatory ramifications of their applications, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products
and any use of TI products in such safety-critical applications, notwithstanding any applications-related information or support that may be
provided by TI. Further, Buyers must fully indemnify TI and its representatives against any damages arising out of the use of TI products in
such safety-critical applications.
TI products are neither designed nor intended for use in military/aerospace applications or environments unless the TI products are
specifically designated by TI as military-grade or "enhanced plastic." Only products designated by TI as military-grade meet military
specifications. Buyers acknowledge and agree that any such use of TI products which TI has not designated as military-grade is solely at
the Buyer's risk, and that they are solely responsible for compliance with all legal and regulatory requirements in connection with such use.
TI products are neither designed nor intended for use in automotive applications or environments unless the specific TI products are
designated by TI as compliant with ISO/TS 16949 requirements. Buyers acknowledge and agree that, if they use any non-designated
products in automotive applications, TI will not be responsible for any failure to meet such requirements.
Following are URLs where you can obtain information on other Texas Instruments products and application solutions:
Products
Amplifiers
Applications
Audio
Automotive
Broadband
Digital Control
Medical
Military
Optical Networking
Security
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
www.ti.com/audio
Data Converters
DLP® Products
DSP
Clocks and Timers
Interface
www.ti.com/automotive
www.ti.com/broadband
www.ti.com/digitalcontrol
www.ti.com/medical
www.ti.com/military
www.ti.com/opticalnetwork
www.ti.com/security
www.ti.com/telephony
www.ti.com/video
dsp.ti.com
www.ti.com/clocks
interface.ti.com
logic.ti.com
power.ti.com
microcontroller.ti.com
www.ti-rfid.com
Logic
Power Mgmt
Microcontrollers
RFID
Telephony
Video & Imaging
Wireless
RF/IF and ZigBee® Solutions www.ti.com/lprf
www.ti.com/wireless
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2009, Texas Instruments Incorporated
相关型号:
©2020 ICPDF网 联系我们和版权申明