TPS61376 [TI]
具有 2.5% 精度输入平均电流限制和真正负载断开功能的 25V、4.5A 升压转换器;
| 型号： | TPS61376 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 具有 2.5% 精度输入平均电流限制和真正负载断开功能的 25V、4.5A 升压转换器 升压转换器 |
| 文件： | 总10页 (文件大小：1172K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS61376
ZHCSNV0 –JANUARY 2022
TPS61376 具有输入平均电流限制和负载断开功能的23VIN、25VOUT、4.5A 升压
转换器
1 特性
3 说明
• 宽输入电压和输出电压范围
– 输入电压范围：2.9 V 至23 V
– 输出电压范围：高达25 V
• 峰值电感器电流限制高达4.5A
• 可编程输入平均电流限制高达3A
• 两个开关频率选项
TPS61376 是一款具有输入平均电流限制和负载断开连
接功能的高压非同步升压转换器。输入平均电流限制阈
值可通过 ILIM 引脚在 0.1A 至 3.0A 之间进行编程。当
该器件禁用时，VP 和 SW 引脚之间的隔离 FET 将完
全切断输入和输出之间的路径。TPS61376 具有 2.9V
至23V 的宽输入电压范围，输出电压高达25V。
– TPS61376：1.2MHz
– TPS61376A：650 kHz
• 集成两个MOSFET
TPS61376 以自适应关断时间控制拓扑为基础实现了峰
值电流模式。在中等到重负载条件下，该器件会在
PWM 模式下工作。在轻载条件下，该器件会进入
PFM 模式，从而在整个负载电流范围内保持高效率。
– ISO FET：40mΩ
– 低侧FET：50mΩ
• 安全、可靠运行的特性
TPS61376 还集成了稳健的保护特性，包括输出过压保
护、输出过流和短路保护以及热关断保护。
– 输出过压保护
– 输入电流限制保护
– 在关断期间真正断开输入域输出之间的连接
– 输出过流和短路保护
– 热关断
TPS61376 采用 2.5mm × 2.0mm VQFN 封装，因而拥
有非常小巧的解决方案尺寸。
器件信息
封装(1)
封装尺寸（标称值）
器件型号
• 精密EN/UVLO 阈值
• 外部环路补偿
TPS61376
VQFN (13)
2.5mm × 2.0mm
• 2.5mm × 2.0mm VQFN 封装
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附
录。
2 应用
• ePOS 零售自动化和支付
• 条形码扫描仪
• 智能扬声器
• 电器
VOUT
VIN
L
D1
CIN
COUT
RUVLOT
VP
SW
ON
VIN
CBOOT
OFF
EN/UVLO
BST
RUVLOB
ISEL
ILIM
TPS61376
VOUT
RFBT
GND
FB
RILIM
VCC
PGND
AGND
COMP
RCOMP
CCOMP
RFBB
GND
CVCC
GND
典型应用电路
本文档旨在为方便起见，提供有关TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVSGB6
TPS61376
ZHCSNV0 –JANUARY 2022
www.ti.com.cn
4 Device and Documentation Support
4.1 Device Support
4.1.1 第三方产品免责声明
TI 发布的与第三方产品或服务有关的信息，不能构成与此类产品或服务或保修的适用性有关的认可，不能构成此
类产品或服务单独或与任何TI 产品或服务一起的表示或认可。
4.2 接收文档更新通知
要接收文档更新通知，请导航至 ti.com 上的器件产品文件夹。点击订阅更新 进行注册，即可每周接收产品信息更
改摘要。有关更改的详细信息，请查看任何已修订文档中包含的修订历史记录。
4.3 支持资源
TI E2E™ 支持论坛是工程师的重要参考资料，可直接从专家获得快速、经过验证的解答和设计帮助。搜索现有解
答或提出自己的问题可获得所需的快速设计帮助。
链接的内容由各个贡献者“按原样”提供。这些内容并不构成 TI 技术规范，并且不一定反映 TI 的观点；请参阅
TI 的《使用条款》。
4.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
4.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
4.6 术语表
TI 术语表
本术语表列出并解释了术语、首字母缩略词和定义。
5 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2022 Texas Instruments Incorporated
2
Submit Document Feedback
Product Folder Links: TPS61376
TPS61376
ZHCSNV0 –JANUARY 2022
www.ti.com.cn
PACKAGE OUTLINE
RYH0013A
VQFN-HR - 1 mm max height
SCALE 4.500
PLASTIC QUAD FLATPACK - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
2.1
1.9
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
0.375
0.275
4X
2X 2.05
(0.125) TYP
0.2 TYP
4X 0.525
8
7
5
0.425
4X
4
0.325
1.25
1.05
2X
PKG
6X 0.5
2X 1.5
0.3
9 X
0.2
1
0.1
C A B
C
11
0.3
13
12
0.05
4X
0.2
0.1
0.05
0.425
0.225
6X
0.25
0.15
C A B
C
PIN 1 ID
4X 0.5
SYMM
4X
4226722/A 04/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
3
Product Folder Links: TPS61376
TPS61376
ZHCSNV0 –JANUARY 2022
www.ti.com.cn
EXAMPLE BOARD LAYOUT
RYH0013A
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.375)
2X (2.05)
13
12
13X (0.25)
11
1
(0.938)
6X
(0.525)
(2.4)
2X (1.5)
PKG
(0.525)
6X (0.5)
4
8
4X
(0.575)
(R0.05) TYP
4X (0.2)
7
5
4X (0.5)
4X (0.525)
2X (1.35)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:25X
0.05 MAX
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED
METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
METAL EDGE
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226722/A 04/2021
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
4
Submit Document Feedback
Product Folder Links: TPS61376
TPS61376
ZHCSNV0 –JANUARY 2022
www.ti.com.cn
EXAMPLE STENCIL DESIGN
RYH0013A
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.375)
2X (2.05)
3X (0.667)
13
12
13X (0.25)
11
1
(0.938)
6X
(0.525)
2X
(0.867)
(0.138)
PKG
2X (1.5)
6X (0.5)
(0.913)
4
8
4X
(0.575)
(R0.05) TYP
4X (0.2)
5
7
4X (0.525)
4X (0.5)
4X (0.575)
SYMM
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PIN 5 & 7 SOLDER COVERAGE = 85%
PIN 6 SOLDER COVERAGE = 83%
SCALE : 25X
4226722/A 04/2021
NOTES: (continued)
5. For alternate stencil design recommendations, see IPC-7525 or board assembly site preference.
www.ti.com
Copyright © 2022 Texas Instruments Incorporated
Submit Document Feedback
5
Product Folder Links: TPS61376
PACKAGE OPTION ADDENDUM
www.ti.com
21-Oct-2022
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TPS61376RYHR
ACTIVE
VQFN-HR
RYH
13
3000 RoHS & Green
NIPDAU
Level-2-260C-1 YEAR
-40 to 125
1376
Samples
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
RYH0013A
VQFN-HR - 1 mm max height
SCALE 4.500
PLASTIC QUAD FLATPACK - NO LEAD
2.6
2.4
B
A
PIN 1 INDEX AREA
2.1
1.9
1 MAX
C
SEATING PLANE
0.08 C
0.05
0.00
0.375
4X
0.275
(0.125) TYP
2X 2.05
0.2 TYP
4X 0.525
8
7
5
0.425
4X
4
0.325
1.25
1.05
2X
PKG
6X 0.5
2X 1.5
0.3
9 X
0.2
1
0.1
C A B
C
11
0.3
13
12
0.05
4X
0.2
0.1
0.05
0.425
0.225
6X
0.25
0.15
C A B
C
PIN 1 ID
4X 0.5
SYMM
4X
4226722/A 04/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
www.ti.com
EXAMPLE BOARD LAYOUT
RYH0013A
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.375)
2X (2.05)
13
12
13X (0.25)
11
1
(0.938)
6X
(0.525)
(2.4)
2X (1.5)
(0.525)
PKG
6X (0.5)
4
8
4X
(0.575)
(R0.05) TYP
4X (0.2)
7
5
4X (0.5)
4X (0.525)
2X (1.35)
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:25X
0.05 MAX
ALL AROUND
0.05 MAX
ALL AROUND
SOLDER MASK
OPENING
SOLDER MASK
OPENING
EXPOSED
METAL
EXPOSED METAL
METAL UNDER
SOLDER MASK
METAL EDGE
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
4226722/A 04/2021
NOTES: (continued)
3. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
4. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
RYH0013A
VQFN-HR - 1 mm max height
PLASTIC QUAD FLATPACK - NO LEAD
(2.375)
2X (2.05)
3X (0.667)
13
12
13X (0.25)
11
1
(0.938)
6X
(0.525)
2X
(0.867)
(0.138)
PKG
2X (1.5)
6X (0.5)
(0.913)
4
8
4X
(0.575)
(R0.05) TYP
4X (0.2)
5
7
4X (0.525)
4X (0.5)
SYMM
4X (0.575)
SOLDER PASTE EXAMPLE
BASED ON 0.1 mm THICK STENCIL
PIN 5 & 7 SOLDER COVERAGE = 85%
PIN 6 SOLDER COVERAGE = 83%
SCALE : 25X
4226722/A 04/2021
NOTES: (continued)
5. For alternate stencil design recommendations, see IPC-7525 or board assembly site preference.
www.ti.com
重要声明和免责声明
TI“按原样”提供技术和可靠性数据（包括数据表）、设计资源（包括参考设计）、应用或其他设计建议、网络工具、安全信息和其他资源，
不保证没有瑕疵且不做出任何明示或暗示的担保，包括但不限于对适销性、某特定用途方面的适用性或不侵犯任何第三方知识产权的暗示担
保。
这些资源可供使用 TI 产品进行设计的熟练开发人员使用。您将自行承担以下全部责任：(1) 针对您的应用选择合适的 TI 产品，(2) 设计、验
证并测试您的应用，(3) 确保您的应用满足相应标准以及任何其他功能安全、信息安全、监管或其他要求。
这些资源如有变更，恕不另行通知。TI 授权您仅可将这些资源用于研发本资源所述的 TI 产品的应用。严禁对这些资源进行其他复制或展示。
您无权使用任何其他 TI 知识产权或任何第三方知识产权。您应全额赔偿因在这些资源的使用中对 TI 及其代表造成的任何索赔、损害、成
本、损失和债务，TI 对此概不负责。
TI 提供的产品受 TI 的销售条款或 ti.com 上其他适用条款/TI 产品随附的其他适用条款的约束。TI 提供这些资源并不会扩展或以其他方式更改
TI 针对 TI 产品发布的适用的担保或担保免责声明。
TI 反对并拒绝您可能提出的任何其他或不同的条款。IMPORTANT NOTICE
邮寄地址：Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2022，德州仪器 (TI) 公司
相关型号：
TPS61378-Q1-V01
TPS61378-Q1 25-μA Quiescent Current Synchronous Boost Converter with Load Disconnect
TI
TPS613783QWRTERQ1
TPS61378-Q1 25-μA Quiescent Current Synchronous Boost Converter with Load Disconnect
TI
TPS613784-Q1
TPS61378-Q1 25-μA Quiescent Current Synchronous Boost Converter with Load Disconnect
TI
TPS613785-Q1
TPS61378-Q1 25-μA Quiescent Current Synchronous Boost Converter with Load Disconnect
TI
TPS613785QWRTERQ1
TPS61378-Q1 25-μA Quiescent Current Synchronous Boost Converter with Load Disconnect
TI
©2020 ICPDF网 联系我们和版权申明