TPS22912D [TI]
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on; 超小尺寸，低导通电阻负载开关与受控的接通
| 型号： | TPS22912D |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on |
| 文件： | 总20页 (文件大小：743K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TPS22912
www.ti.com
SLVSB78 –APRIL 2012
Ultra-Small, Low on Resistance Load Switch with Controlled Turn-on
Check for Samples: TPS22912
1
FEATURES
DESCRIPTION
The TPS22912 is a small, low rON load switch with
controlled turn-on and contains a P-channel MOSFET
that can operate over an input voltage range of 1.4 V
to 5.5 V. The switch is controlled by a high input
(ON), which is capable of interfacing directly with low-
voltage control signals.
•
•
Integrated Single Load Switch
Ultra Small CSP-4 Package 0.9mm × 0.9mm,
0.5mm Pitch
•
•
Input Voltage Range: 1.4-V to 5.5-V
Low ON-Resistance
The slew rate of the device is internally controlled in
order to avoid inrush current. The TPS22912 family
has various rise time options and is active high
enable. (see Table 1).
–
–
–
–
rON = 60-mΩ at VIN = 5-V
rON = 61-mΩ at VIN = 3.3-V
rON = 74-mΩ at VIN = 1.8-V
rON = 84-mΩ at VIN = 1.5-V
The TPS22912 provides circuit breaker functionality
by latching off the power switch during reverse
voltage situations. An internal reverse voltage
comparator disables the power switch when the
output voltage (VOUT) is higher than the input (VIN).
This process quickly (10µs typical) stops the flow of
current towards the input side of the switch. Reverse
current protection is always active, even when the
device is disabled. Additionally, under-voltage lockout
(UVLO) protection turns the switch off if the input
voltage is too low.
•
•
•
•
•
2-A Maximum Continuous Switch Current
Low Threshold Control Input
Controlled Slew-rate Options
Under-Voltage Lock Out
Reverse Current Protection
APPLICATIONS
•
•
•
•
•
•
•
Portable Industrial / Medical Equipment
Portable Media Players
The TPS22912 is available in a ultra-small, space-
saving 4-pin CSP package and is characterized for
operation over the free-air temperature range of
–40°C to 85°C.
Point of Sales Terminals
GPS Navigation Devices
Digital Cameras
Portable Instrumentation
Smartphones / Wireless Handsets
TYPICAL APPLICATION
VIN
VOUT
Power
Supply
ON
CIN
ON
CL
RL
OFF
GND
TPS22912
GND
Table 1. Feature List
RISE TIME at 3.3V
QUICK OUTPUT
DISCHARGE(1)
MAXIMUM OUTPUT
CURRENT
DEVICE
rON (typ) at 3.3 V
ENABLE
(typ)
TPS22912A(2)
TPS22912B(2)
TPS22912C
61 mΩ
61 mΩ
61 mΩ
61 mΩ
1 µs
No
No
No
No
2-A
2-A
2-A
2-A
Active High
Active High
Active High
Active High
100 µs
1000 µs
4500 µs
TPS22912D(2)
(1) This feature discharges the output of the switch to ground through a 150-Ω resistor, preventing the output from floating.
(2) Contact local sales/distributor or factory for availability.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
TPS22912
SLVSB78 –APRIL 2012
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ORDERING INFORMATION
TOP-SIDE MARKING/
TA
PACKAGE(1)
YZV (0.5mm pitch)
ORDERABLE PART NUMBER
STATUS(2)
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
–40°C to 85°C
Tape and Reel
Tape and Reel
Tape and Reel
Tape and Reel
TPS22912AYZVR
TPS22912BYZVR
TPS22912CYZVR
TPS22912DYZVR
Contact factory for availability
Contact factory for availability
_ _ _ _ 78
YZV (0.5mm pitch)
YZV (0.5mm pitch)
YZV (0.5mm pitch)
Contact factory for availability
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
(2) Contact factory for details and availability for PREVIEW devices, minimum order quantities may apply.
DEVICE INFORMATION
YZV PACKAGE
TERMINAL ASSIGNMENTS
B
A
ON
VIN
2
GND
VOUT
1
PIN FUNCTIONS
DESCRIPTION
Ground
TPS22912
PIN NAME
YZV
B1
GND
ON
B2
Switch control input, active high. Do not leave floating
Switch output
A1
VOUT
VIN
A2
Switch input. Use ceramic capacitor to GND for bypass.
2
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SLVSB78 –APRIL 2012
BLOCK DIAGRAM
VIN
Reverse
Current
Protection
UVLO
Control
Logic
ON
GND
VOUT
Table 2. FUNCTION TABLE
ON
VIN to VOUT
L
OFF
ON
H
ABSOLUTE MAXIMUM RATINGS
VALUE
UNIT
V
VIN
Input voltage range
–0.3 to 6
–0.3 to 6
–0.3 to 6
2
VOUT Output voltage range
V
VON
IMAX
IPLS
TA
Input voltage range
V
Maximum continuous switch current
A
Maximum pulsed switch current, pulse ≤500 ms, 50% duty cycle
Operating free-air temperature range
Maximum junction temperature
3
A
–40 to 85
125
°C
°C
°C
°C
TJ
TSTG
Storage temperature range
–65 to 150
300
TLEAD Maximum lead temperature (10-s soldering time)
Human-Body Model (HBM) (VIN, VOUT, GND pins)
Charged-Device Model (CDM) (VIN, VOUT, ON, GND pins)
2000
ESD
Electrostatic discharge protection
V
1000
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THERMAL INFORMATION
TPS22912
CSP
THERMAL METRIC(1)
UNITS
4 PINS
189.1
1.9
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
θJCtop
θJB
Junction-to-board thermal resistance
36.8
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
11.3
ψJB
36.8
θJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
1.4
0
MAX
5.5
UNIT
V
VIN
Input voltage range
ON voltage range
VON
5.5
V
Output voltage range (Note: VOUT greater than VIN will cause the reverse current protection of this
device to trigger. See application section.)
(1)
VOUT
VIH
VIN
VIN = 3.61 V to 5.5 V
High-level input voltage, ON
1.1
1.1
5.5
5.5
0.6
0.4
V
V
VIN = 1.4 V to 3.6 V
VIN = 3.61 V to 5.5 V
Low-level input voltage, ON
V
VIL
VIN = 1.4 V to 3. 6V
V
(1)
CIN
Input Capacitor
1
µF
(1) Refer to the application section.
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ELECTRICAL CHARACTERISTICS
VIN = 1.4 V to 5.5 V, TA = –40ºC to 85ºC (unless otherwise noted)
PARAMETER
TEST CONDITIONS
IOUT = 0, VON = VIN = 5.25 V
TA
MIN
TYP
MAX UNIT
2
2
10
IOUT = 0, VON = VIN = 4.2 V
7.0
IIN
Quiescent current
IOUT = 0, VON = VIN = 3.6 V
Full
2
7.0
5
µA
µA
µA
IOUT = 0, VON = VIN = 2.5 V
0.9
0.7
1.2
0.2
0.1
0.1
0.1
1.2
0.2
0.1
0.1
0.1
60
IOUT = 0, VON = VIN = 1.5 V
5
RL = 1 MΩ, VIN = 5.25 V, VON = GND
RL = 1 MΩ, VIN = 4.2 V, VON = GND
RL = 1 MΩ, VIN = 3.6 V, VON = GND
RL = 1 MΩ, VIN = 2.5 V, VON = GND
RL = 1 MΩ, VIN = 1.5 V, VON = GND
VOUT = 0, VIN = 5.25 V, VON = GND
VOUT = 0, VIN = 4.2 V, VON = GND
VOUT = 0, VIN = 3.6 V, VON = GND
VOUT = 0, VIN = 2.5 V, VON = GND
VOUT = 0, VIN = 1.5 V, VON = GND
10
7.0
7.0
5
(1)
IIN(off)
Off supply current
Full
Full
5
10
7.0
7.0
5
IIN(Leakage) Leakage current
5
25°C
Full
80
VIN = 5.25 V, IOUT = –200 mA
VIN = 5.0 V, IOUT = –200 mA
VIN = 4.2 V, IOUT = –200 mA
VIN = 3.3 V, IOUT = –200 mA
VIN = 2.5 V, IOUT = –200 mA
VIN = 1.8 V, IOUT = –200 mA
VIN = 1.5 V, IOUT = –200 mA
110
80
25°C
Full
60
60
110
80
25°C
Full
110
80
25°C
Full
60.7
63.4
74.2
83.9
rON
On-resistance
mΩ
110
90
25°C
Full
120
100
130
120
150
25°C
Full
25°C
Full
VIN increasing, VON = 3.6 V,
IOUT = –100 mA
1.2
UVLO
Under voltage lockout
Full
V
VIN decreasing, VON = 3.6 V, IOUT = –100
mA
0.50
ION
ON input leakage current
VON = 1.4 V to 5.25 V or GND
Full
1
µA
Reverse Current Voltage
Threshold
VRCP
VOUT > VIN
25°C
54
0.3
10
mV
Reverse Current Protection
IRCP(leak) Leakage after Reverse
Current event
VOUT – VIN > VRCP
25°C
µA
µs
Reverse Current Response
tDELAY
Delay
VIN = 5V
(1) Verified by characterization, not production tested.
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UNIT
SWITCHING CHARACTERISTICS
PARAMETER
TPS22912
TYP
TEST CONDITION
VIN = 5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
840
6.6
912
3
µs
µs
µs
tF
VIN = 3.3 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
1147
8.6
1030
3
tF
VIN = 1.5 V, TA = 25ºC (unless otherwise noted)
tON
tOFF
tR
Turn-ON time
Turn-OFF time
VOUT rise time
VOUT fall time
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
RL = 10 Ω, CL = 0.1 µF
2513
17.4
1970
6.5
tF
PARAMETRIC MEASUREMENT INFORMATION
VIN
VOUT
CIN = 1µF
ON
(A)
ON
CL
+
-
RL
OFF
GND
TPS22912
GND
GND
TEST CIRCUIT
VON
50%
50%
tf
tOFF
tr
tON
90%
90%
VOUT
VOUT
50%
50%
10%
10%
tON/tOFF WAVEFORMS
(A) Rise and fall times of the control signal is 100ns.
A. Rise and fall times of the control signal are 100 ns.
Figure 1. Test Circuit and tON/tOFF Waveforms
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TYPICAL CHARACTERISTICS
ON-STATE RESISTANCE
vs
INPUT VOLTAGE
ON INPUT THRESHOLD
120
100
80
60
40
20
0
6
5.5
5
−40C
25C
85C
VIN = 5.0V
VIN = 4.2V
VIN = 3.3V
VIN = 2.5V
VIN = 1.8V
VIN = 1.5V
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
0
0.2
0.4
0.6
0.8
1
1.2
1.4
Voltage (V)
VON (V)
G000
G000
Figure 2.
Figure 3.
INPUT CURRENT, QUIESCENT
INPUT CURRENT, LEAK
vs
vs
INPUT VOLTAGE
INPUT VOLTAGE
3.5
3
3000
2500
2000
1500
1000
500
−40C
25C
85C
−40C
25C
85C
2.5
2
1.5
1
0.5
0
0
0
1
2
3
4
5
6
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
Voltage (V)
Voltage (V)
G000
G000
Figure 4.
Figure 5.
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TYPICAL CHARACTERISTICS (continued)
ON-STATE RESISTANCE
INPUT CURRENT, OFF
vs
vs
TEMPERATURE
INPUT VOLTAGE
180
VIN = 1.4V
VIN = 1.5V
VIN = 1.8V
VIN = 2.5V
VIN = 3.3V
VIN = 4.2V
VIN= 5.0V
VIN = 5.5V
160
140
120
100
80
60
40
20
0
−40
−15
10
35
60
85
Temperature (°C)
G000
Figure 6.
Figure 7.
1
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
−40 −30 −20 −10
0
10 20 30 40 50 60 70 80
Ambient Temperature (°C)
G001
Figure 8. Allowable Power Dissipation
Figure 9. ULVO Response IOUT = -100mA
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TYPICAL CHARACTERISTICS (continued)
Figure 10. Reverse Current Protection VOUT = 3.3V, VIN = 3.3V Decreasing to 0V
TYPICAL AC CHARACTERISTICS FOR TPS22912C
RISE TIME
vs
FALL TIME
vs
TEMPERATURE
TEMPERATURE
1200
1000
800
4
3
2
1
0
VIN =5.0V, CL = 0.1 µF, RL = 10 Ohms
600
400
200
VIN =5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
−15
10
35
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 11.
Figure 12.
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TYPICAL CHARACTERISTICS (continued)
RISE TIME
FALL TIME
vs
vs
TEMPERATURE
TEMPERATURE
3000
2500
2000
1500
1000
500
10
9
8
7
6
5
4
3
2
1
0
VIN =1.5V, CL = 0.1 µF, RL = 10 Ohms
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
60
85
−40
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 13.
Figure 14.
TURN-ON TIME
vs
TURN-OFF TIME
vs
TEMPERATURE
TEMPERATURE
1200
1000
800
600
400
200
0
10
8
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
6
4
2
VIN = 5.0V, CL = 0.1 µF, RL = 10 Ohms
−15 10 35
0
−40
−40
60
85
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 15.
Figure 16.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON TIME
TURN-OFF TIME
vs
vs
TEMPERATURE
TEMPERATURE
4000
3500
3000
2500
2000
1500
1000
500
25
20
15
10
5
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
VIN = 1.5V, CL = 0.1 µF, RL = 10 Ohms
0
−40
0
−40
−15
10
35
60
85
−15
10
35
60
85
Temperature (°C)
Temperature (°C)
G000
G000
Figure 17.
Figure 18.
RISE TIME
vs
INPUT VOLTAGE
3500
3000
2500
2000
1500
1000
500
−40C
25C
85C
CL = 1 µF, RL = 10 Ohms, VON = 1.8V
0.5 1.5 2.5 3.5
0
0
1
2
3
4
4.5
5
5.5
6
VIN (V)
G000
Figure 19.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE
TURN-OFF RESPONSE
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 20.
Figure 21.
TURN-ON RESPONSE TIME
TURN-OFF RESPONSE TIME
VIN = 5V, TA = 25°C, CIN =10µF, CL = 1µF, RL = 10Ω
VIN = 5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 22.
Figure 23.
TURN-ON RESPONSE TIME
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 1µF, CL = 0.1µF, RL = 10Ω
Figure 24.
Figure 25.
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TYPICAL CHARACTERISTICS (continued)
TURN-ON RESPONSE TIME
TURN-OFF RESPONSE TIME
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
VIN = 1.5V, TA = 25°C, CIN = 10µF, CL = 1µF, RL = 10Ω
Figure 26.
Figure 27.
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APPLICATION INFORMATION
On/Off Control
The ON pin controls the state of the switch. Asserting ON high enables the switch. ON is active high and has a
low threshold, making the pin capable of interfacing with low-voltage signals. The ON pin is compatible with
standard GPIO logic threshold. It can be used with any microcontroller with 1.2-V, 1.8-V, 2.5-V or 3.3-V GPIO.
Input Capacitor
To limit the voltage drop on the input supply caused by transient inrush currents, a capacitor needs to be placed
between VIN and GND. A 1-μF ceramic capacitor, CIN, placed close to the pins is usually sufficient. Higher
values of CIN can be used to further reduce the voltage drop.
Output Capacitor
A CIN to CL ratio of 10 to 1 is recommended for minimizing VIN dip caused by inrush currents during startup.
Devices with faster rise times may require a larger ratio to minimize VIN dip.
Under-Voltage Lockout
Under-voltage lockout protection turns off the switch if the input voltage is below the under-voltage lockout
threshold. During under-voltage lockout (UVLO), if the voltage level at VOUT exceeds the voltage level at VIN by
the Reverse Current Voltage Threshold (VRVP), the body diode will be disengaged to prevent any current flow to
VIN. With the ON pin active, the input voltage rising above the under-voltage lockout threshold will cause a
controlled turn-on of the switch to limit current over-shoot.
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Reverse Current Protection
In a scenario where VOUT is greater than VIN, there is potential for reverse current to flow through the pass FET
or the body diode. The TPS22912 monitors VIN and VOUT voltage levels. When the reverse current voltage
threshold (VRCP) is exceeded, the switch is disabled (within 10μs typ). Additionally, the body diode is disengaged
so as to prevent any reverse current flow to VIN. The FET, and the output (VOUT), will resume normal operation
when the reverse current scenario is no longer present. The peak instantaneous reverse current is the current it
takes to trip the reverse current protection. After the reverse current protection has tripped due to the peak
instantaneous reverse current, the DC (off-state) leakage current from VOUT and VIN is referred to as IRCP(leak)
(see figure below).
Use the following formula to calculate the amount of peak instantaneous reverse current for a particular
application:
VRCP
=
IRC
RON(VIN)
Where,
IRC is the amount of reverse current,
RON(VIN) is the on-resistance at the VIN of the reverse current condition.
VOUT
VRCP
IRC
VIN
IREVERSE_CURRENT
IRCP(LEAK)
Figure 28. Reverse Current
Board Layout
For best performance, all traces should be as short as possible. The input and output capacitors should be
placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation.
Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the
case to ambient thermal impedance.
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PACKAGE OPTION ADDENDUM
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30-May-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
TPS22912CYZVR
TPS22912CYZVT
ACTIVE
ACTIVE
DSBGA
DSBGA
YZV
YZV
4
4
3000
250
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
SNAGCU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Apr-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TPS22912CYZVR
TPS22912CYZVT
DSBGA
DSBGA
YZV
YZV
4
4
3000
250
178.0
178.0
9.2
9.2
1.0
1.0
1.0
1.0
0.63
0.63
4.0
4.0
8.0
8.0
Q1
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
18-Apr-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TPS22912CYZVR
TPS22912CYZVT
DSBGA
DSBGA
YZV
YZV
4
4
3000
250
220.0
220.0
220.0
220.0
35.0
35.0
Pack Materials-Page 2
D: Max = 0.918 mm, Min =0.858 mm
E: Max = 0.918 mm, Min =0.858 mm
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