TMUX1237DCKR [TI]
在切换输入时无过冲的 5V、2:1 (SPDT) 通用开关 | DCK | 6 | -40 to 125;
| 型号： | TMUX1237DCKR |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 在切换输入时无过冲的 5V、2:1 (SPDT) 通用开关 | DCK | 6 | -40 to 125 开关 通用开关 光电二极管 |
| 文件： | 总31页 (文件大小：1356K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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TMUX1237
SCDS424A –DECEMBER 2019–REVISED MARCH 2020
TMUX1237 3-Ω Low R , 5-V, 2:1 (SPDT) General Purpose Switch
ON
With No Overshoot When Switching Inputs
1 Features
3 Description
The TMUX1237 is a general purpose 2:1, single-pole
1
•
•
•
•
•
•
•
•
•
•
•
No Overshoot When Switching Inputs
Rail-to-rail Operation
double-throw (SPDT), switch that supports a wide
operating range of 1.08 V to 5.5 V. The device
supports bidirectional analog and digital signals on
the source (Sx) and drain (D) pins ranging from GND
to VDD. The state of the select pin (SEL) controls
which of the two sources pins are connected to the
drain pin. Additionally, the TMUX1237 has a low
supply current of 7 nA which enables the device to be
used in a host of handheld or low power applications.
Bidirectional Signal Path
1.8 V Logic Compatible
Fail-safe Logic
Low On-resistance: 3 Ω
Wide Supply Range: 1.08 V to 5.5 V
-40°C to +125°C Operating Temperature
Low Supply Current: 7 nA
Break-before-make Switching
ESD Protection HBM: 2000 V
The TMUX1237 improves system reliability by
eliminating overshoot that might occur in a system
due to switching between two voltage levels on the
source (Sx) pins. In addition, the TMUX1237 also
maintains fast switching times, enabling it to improve
system performance for a wide range of applications
from communications equipment to building
automation.
2 Applications
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Analog and Digital Switching
I2C and SPI Bus Multiplexing
Remote Radio Units (RRU)
Active Antenna System mMIMO (AAS)
Rack Server
All logic inputs have 1.8
V
logic compatible
thresholds, ensuring both TTL and CMOS logic
compatibility when operating in the valid supply
voltage range. Fail-Safe Logic circuitry allows
voltages on the control pins to be applied before the
supply pin, protecting the device from potential
damage.
Network Interface Card (NIC)
Barcode Scanner
Building Automation
Analog Input Module
Motor Drives
Device Information(1)
PART NUMBER
PACKAGE
BODY SIZE (NOM)
TMUX1237
SC70 (6)
2.00 mm × 1.25 mm
Video Surveillance
(1) For all available packages, see the package option addendum
at the end of the data sheet.
Electronic Point of Sale
Desktop PC
SPACER
SPACER
Appliances
TMUX1237 Block Diagram
Application Example
TMUX1237
RF Input
RF Output
5 V
TMUX1237
S1
0 V
DAC
D
S2
1.8 V
SEL
SEL
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMUX1237
SCDS424A –DECEMBER 2019–REVISED MARCH 2020
www.ti.com
Table of Contents
7.7 Off Isolation............................................................. 16
7.8 Crosstalk ................................................................. 16
7.9 Bandwidth ............................................................... 17
Detailed Description ............................................ 18
8.1 Overview ................................................................. 18
8.2 Functional Block Diagram ....................................... 18
8.3 Feature Description................................................. 18
8.4 Device Functional Modes........................................ 19
8.5 Truth Tables............................................................ 19
Application and Implementation ........................ 20
9.1 Application Information............................................ 20
9.2 Typical Application ................................................. 20
1
2
3
4
5
6
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Pin Configuration and Functions......................... 3
Specifications......................................................... 4
6.1 Absolute Maximum Ratings ...................................... 4
6.2 ESD Ratings.............................................................. 4
6.3 Recommended Operating Conditions....................... 4
6.4 Thermal Information.................................................. 4
8
9
6.5 Electrical Characteristics (VDD = 5 V ±10 %), GND =
0 V unless otherwise specified. ................................. 5
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 24
11.1 Layout Guidelines ................................................. 24
11.2 Layout Example .................................................... 24
12 Device and Documentation Support ................. 25
12.1 Documentation Support ........................................ 25
12.2 Receiving Notification of Documentation Updates 25
12.3 Community Resources.......................................... 25
12.4 Trademarks........................................................... 25
12.5 Electrostatic Discharge Caution............................ 25
12.6 Glossary................................................................ 25
6.6 Electrical Characteristics (VDD = 3.3 V ±10 %), GND
= 0 V unless otherwise specified. .............................. 7
6.7 Electrical Characteristics (VDD = 1.8 V ±10 %), GND
= 0 V unless otherwise specified. .............................. 9
6.8 Electrical Characteristics (VDD = 1.2 V ±10 %), GND
= 0 V unless otherwise specified. ............................ 11
6.9 Typical Characteristics............................................ 12
Parameter Measurement Information ................ 13
7.1 On-Resistance ........................................................ 13
7.2 Off-Leakage Current ............................................... 13
7.3 On-Leakage Current ............................................... 14
7.4 Transition Time ....................................................... 14
7.5 Break-Before-Make................................................. 15
7.6 Charge Injection...................................................... 15
7
13 Mechanical, Packaging, and Orderable
Information ........................................................... 25
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Original (Decemeber 2019) to Revision A
Page
•
Changed the document status From: Product Preview To: Production Data ....................................................................... 1
2
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SCDS424A –DECEMBER 2019–REVISED MARCH 2020
5 Pin Configuration and Functions
DCK Package
6-Pin SC70
Top View
S2
VDD
S1
1
2
3
6
5
4
SEL
GND
D
Not to scale
Pin Functions
PIN
TYPE(1)
DESCRIPTION(2)
NAME
NO.
S2
1
I/O
P
Source pin 2. Can be an input or output.
Positive power supply. This pin is the most positive power-supply potential. For reliable operation, connect
a decoupling capacitor ranging from 0.1 µF to 10 µF between VDD and GND.
VDD
2
S1
3
4
5
6
I/O
I/O
P
Source pin 1. Can be an input or output.
D
Drain pin. Can be an input or output.
GND
SEL
Ground (0 V) reference
I
Select pin: controls state of the switch according to Table 1. (Logic Low = S1 to D, Logic High = S2 to D)
(1) I = input, O = output, I/O = input and output, P = power.
(2) Refer to Device Functional Modes for what to do with unused pins.
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SCDS424A –DECEMBER 2019–REVISED MARCH 2020
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6 Specifications
6.1 Absolute Maximum Ratings
Over operating free-air temperature range (unless otherwise noted).(1)(2)(3)
MIN
–0.5
–0.5
–30
–0.5
–50
–30
–65
MAX
UNIT
V
VDD
Supply voltage
6
6
VSEL or VEN
ISEL or IEN
VS or VD
IS or ID (CONT)
IK
Logic control input pin voltage (SEL)
Logic control input pin current (SEL)
Source or drain voltage (Sx, D)
Source or drain continuous current (Sx, D)
Diode clamp current(4)
V
30
mA
V
VDD+0.5
50
mA
mA
°C
°C
30
Tstg
Storage temperature
150
150
TJ
Junction temperature
(1) Stresses beyond those listed under Absolute Maximum Rating may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Condition. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) The algebraic convention, whereby the most negative value is a minimum and the most positive value is a maximum.
(3) All voltages are with respect to ground, unless otherwise specified.
(4) Pins are diode-clamped to the power-supply rails. Over voltage signals must be voltage and current limited to maximum ratings.
6.2 ESD Ratings
VALUE
UNIT
Human body model (HBM), per
±2000
ANSI/ESDA/JEDEC JS-001, all pins(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC
specification JESD22-C101, all pins(2)
±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions
Over operating free-air temperature range (unless otherwise noted).
MIN
1.08
0
NOM
MAX
5.5
UNIT
V
VDD
Supply voltage
VS or VD
VSEL
Signal path input/output voltage (source or drain pin) (Sx, D)
Logic control input pin voltage (SEL)
Signal path continuous current (source or drain pins: Sx, D)
Ambient temperature
VDD
5.5
V
0
V
IS or ID
TA
–50
–40
50
mA
°C
125
6.4 Thermal Information
TMUX1237
THERMAL METRIC(1)
SC70 (DCK)
6 PINS
243.6
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
180.9
106.3
ΨJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
89.1
ΨJB
106.0
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
4
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SCDS424A –DECEMBER 2019–REVISED MARCH 2020
6.5 Electrical Characteristics (VDD = 5 V ±10 %), GND = 0 V unless otherwise specified.
At TA = 25°C, VDD = 5 V (unless otherwise noted).
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
3
Ω
VS = 0 V to VDD
RON
On-resistance
ISD = 10 mA
Refer to On-Resistance
–40°C to +85°C
–40°C to +125°C
25°C
5
5
Ω
Ω
0.15
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Ω
Ω
1.5
2
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
FLAT
On-resistance flatness
–40°C to +85°C
–40°C to +125°C
25°C
Ω
3
Ω
VDD = 5 V
Switch Off
VD = 4.5 V / 1.5 V
VS = 1.5 V / 4.5 V
Refer to Off-Leakage Current
±75
nA
nA
–40°C to +85°C
–150
–175
150
175
IS(OFF)
Source off leakage current(1)
–40°C to +125°C
nA
VDD = 5 V
Switch On
VD = VS = 4.5 V / 1 V
Refer to On-Leakage Current
25°C
±200
nA
nA
ID(ON)
IS(ON)
–40°C to +85°C
–500
–750
500
750
Channel on leakage current
–40°C to +125°C
nA
LOGIC INPUTS
VIH
VIL
Input logic high
-40°C to 125°C
-40°C to 125°C
1.32
0
5.5
V
V
Input logic low
0.87
IIH
IIL
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
Input leakage current
–40°C to +125°C
±0.05
2
CIN
CIN
Digital input capacitance
Digital input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.007
µA
µA
IDD VDD supply current
Digital Inputs = 0 V or 5.5 V
–40°C to +125°C
2.6
(1) When VS is 4.5 V, VD is 1.5 V or when VS is 1.5 V, VD is 4.5 V.
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Electrical Characteristics (VDD = 5 V ±10 %), GND = 0 V unless otherwise specified. (continued)
At TA = 25°C, VDD = 5 V (unless otherwise noted).
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
12
ns
VS = 3 V
RL = 200 Ω, CL = 15 pF
tTRAN
Switching time between channels
–40°C to +85°C
–40°C to +125°C
25°C
19
20
ns
ns
ns
ns
ns
40
VS = 3 V
RL = 200 Ω, CL = 15 pF
tOPEN
(BBM)
Break before make time
Charge Injection
–40°C to +85°C
–40°C to +125°C
1
1
VS = VDD /2
RS = 0 Ω, CL = 1 nF
QC
25°C
25°C
25°C
25°C
25°C
–10
–65
–45
–65
–45
pC
dB
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
OISO
Off Isolation
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
RL = 50 Ω, CL = 5 pF
f = 1 MHz
XTALK
RL = 50 Ω, CL = 5 pF
f = 10 MHz
BW
Bandwidth
RL = 50 Ω, CL = 5 pF
25°C
25°C
400
8
MHz
pF
CSOFF
Source off capacitance
f = 1 MHz
CSON
CDON
On capacitance
f = 1 MHz
25°C
21
pF
6
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6.6 Electrical Characteristics (VDD = 3.3 V ±10 %), GND = 0 V unless otherwise specified.
At TA = 25°C, VDD = 3.3 V (unless otherwise noted).
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
4.5
Ω
VS = 0 V to VDD
RON
On-resistance
ISD = 10 mA
Refer to On-Resistance
–40°C to +85°C
–40°C to +125°C
25°C
12.5
13
Ω
Ω
0.15
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1
1
Ω
Ω
3.5
4
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
RON
FLAT
On-resistance flatness
–40°C to +85°C
–40°C to +125°C
25°C
Ω
5
Ω
VDD = 3.3 V
Switch Off
VD = 3 V / 1 V
VS = 1 V / 3 V
±75
nA
nA
–40°C to +85°C
–150
–175
150
175
IS(OFF)
Source off leakage current(1)
–40°C to +125°C
nA
Refer to Off-Leakage Current
VDD = 3.3 V
Switch On
VD = VS = 3 V / 1 V
Refer to On-Leakage Current
25°C
±200
nA
nA
ID(ON)
IS(ON)
–40°C to +85°C
–500
–750
500
750
Channel on leakage current
–40°C to +125°C
nA
LOGIC INPUTS
VIH
VIL
Input logic high
-40°C to 125°C
-40°C to 125°C
1.25
0
5.5
0.8
V
V
Input logic low
IIH
IIL
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
Input leakage current
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.004
µA
µA
IDD VDD supply current
Digital Inputs = 0 V or 5.5 V
–40°C to +125°C
1.6
(1) When VS is 3 V, VD is 1 V or when VS is 1 V, VD is 3 V.
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Electrical Characteristics (VDD = 3.3 V ±10 %), GND = 0 V unless otherwise specified. (continued)
At TA = 25°C, VDD = 3.3 V (unless otherwise noted).
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
14
ns
VS = 2 V
RL = 200 Ω, CL = 15 pF
tTRAN
Switching time between channels
–40°C to +85°C
–40°C to +125°C
25°C
20
22
ns
ns
ns
ns
ns
70
VS = 2 V
RL = 200 Ω, CL = 15 pF
tOPEN
(BBM)
Break before make time
Charge Injection
–40°C to +85°C
–40°C to +125°C
1
1
VS = VDD/2
RS = 0 Ω, CL = 1 nF
QC
25°C
–6
pC
RL = 50 Ω, CL = 5 pF
f = 1 MHz
25°C
–65
dB
Refer to Off Isolation
OISO
Off Isolation
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
25°C
25°C
25°C
–45
–65
–45
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Crosstalk
RL = 50 Ω, CL = 5 pF
Refer to Bandwidth
BW
Bandwidth
25°C
25°C
25°C
375
9
MHz
pF
CSOFF
Source off capacitance
On capacitance
f = 1 MHz
CSON
CDON
f = 1 MHz
23
pF
8
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6.7 Electrical Characteristics (VDD = 1.8 V ±10 %), GND = 0 V unless otherwise specified.
At TA = 25°C, VDD = 1.8 V (unless otherwise noted).
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
40
Ω
VS = 0 V to VDD
RON
On-resistance
ISD = 10 mA
Refer to On-Resistance
–40°C to +85°C
–40°C to +125°C
25°C
80
80
Ω
Ω
0.4
Ω
VS = 0 V to VDD
ISD = 10 mA
Refer to On-Resistance
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1.5
1.5
Ω
Ω
VDD = 1.98 V
Switch Off
VD = 1.8 V / 1 V
VS = 1 V / 1.8 V
Refer to Off-Leakage Current
±75
nA
nA
–40°C to +85°C
–150
–175
150
175
IS(OFF)
Source off leakage current(1)
Channel on leakage current
–40°C to +125°C
nA
25°C
±200
nA
nA
nA
VDD = 1.98 V
Switch On
VD = VS = 1.62 V / 1 V
ID(ON)
IS(ON)
–40°C to +85°C
–40°C to +125°C
–500
–750
500
750
DIGITAL INPUTS
VIH
VIL
Input logic high
–40°C to +125°C
–40°C to +125°C
1.07
0
5.5
V
V
Input logic low
0.68
IIH
IIL
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
Input leakage current
–40°C to +125°C
±0.05
2
CIN
CIN
Logic input capacitance
Logic input capacitance
25°C
1
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
0.002
µA
µA
IDD VDD supply current
Logic Inputs = 0 V or 5.5 V
–40°C to +125°C
1
(1) When VS is 1.8 V, VD is 1 V or when VS is 1 V, VD is 1.8 V.
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Electrical Characteristics (VDD = 1.8 V ±10 %), GND = 0 V unless otherwise specified. (continued)
At TA = 25°C, VDD = 1.8 V (unless otherwise noted).
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
DYNAMIC CHARACTERISTICS
25°C
24
ns
VS = 1 V
RL = 200 Ω, CL = 15 pF
tTRAN
Switching time between channels
–40°C to +85°C
–40°C to +125°C
25°C
44
45
ns
ns
ns
ns
ns
85
VS = 1 V
RL = 200 Ω, CL = 15 pF
tOPEN
(BBM)
Break before make time
Charge Injection
–40°C to +85°C
–40°C to +125°C
1
1
VS = VDD/2
RS = 0 Ω, CL = 1 nF
QC
25°C
–3
pC
RL = 50 Ω, CL = 5 pF
f = 1 MHz
25°C
–65
dB
Refer to Off Isolation
OISO
Off Isolation
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Off Isolation
25°C
25°C
25°C
–45
–65
–45
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
Refer to Crosstalk
XTALK
RL = 50 Ω, CL = 5 pF
f = 10 MHz
Refer to Crosstalk
BW
Bandwidth
RL = 50 Ω, CL = 5 pF
25°C
25°C
250
9
MHz
pF
CSOFF
Source off capacitance
f = 1 MHz
CSON
CDON
On capacitance
f = 1 MHz
25°C
23
pF
10
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SCDS424A –DECEMBER 2019–REVISED MARCH 2020
6.8 Electrical Characteristics (VDD = 1.2 V ±10 %), GND = 0 V unless otherwise specified.
At TA = 25°C, VDD = 1.2 V (unless otherwise noted).
PARAMETER
ANALOG SWITCH
TEST CONDITIONS
TA
MIN
TYP
MAX UNIT
25°C
70
Ω
VS = 0 V to VDD
IDS = 10 mA
RON
On-resistance
–40°C to +85°C
–40°C to +125°C
25°C
105
105
Ω
Ω
0.4
Ω
VS = 0 V to VDD
IDS = 10 mA
On-resistance matching between
channels
ΔRON
–40°C to +85°C
–40°C to +125°C
25°C
1.5
1.5
Ω
Ω
VDD = 1.32 V
Switch Off
VD = 1.2 V / 1 V
VS = 1 V / 1.2 V
±75
nA
nA
Source off leakage current(1)
Channel on leakage current
–40°C to +85°C
–150
–175
150
175
IS(OFF)
–40°C to +125°C
nA
25°C
±200
nA
nA
nA
VDD = 1.32 V
Switch On
VD = VS = 1 V / 0.8 V
ID(ON)
IS(ON)
–40°C to +85°C
–40°C to +125°C
–500
–750
500
750
DIGITAL INPUTS
VIH
VIL
Input logic high
–40°C to +125°C
–40°C to +125°C
0.96
V
V
Input logic low
0.36
IIH
IIL
Input leakage current
25°C
±0.005
µA
µA
IIH
IIL
Input leakage current
–40°C to +125°C
±0.10
2
CIN
CIN
Digital input capacitance
Digital input capacitance
25°C
1
0.002
40
pF
pF
–40°C to +125°C
POWER SUPPLY
25°C
µA
µA
IDD
VDD supply current
Digital Inputs = 0 V or 5.5 V
–40°C to +125°C
0.9
DYNAMIC CHARACTERISTICS
25°C
ns
ns
ns
ns
ns
ns
VIN = VDD
VS = 1 V
RL = 200 Ω, CL = 15 pF
tTRAN
Switching time between channels
–40°C to +85°C
–40°C to +125°C
25°C
300
300
425
VS = 1 V
RL = 200 Ω, CL = 15 pF
tOPEN
(BBM)
Break before make time
Charge Injection
–40°C to +85°C
–40°C to +125°C
1
1
VS = (VDD + VSS)/2
RS = 0 Ω, CL = 1 nF
QC
25°C
25°C
25°C
25°C
25°C
±5
-64
-44
-64
-44
pC
dB
dB
dB
dB
RL = 50 Ω, CL = 5 pF
f = 1 MHz
OISO
Off Isolation
Crosstalk
RL = 50 Ω, CL = 5 pF
f = 10 MHz
RL = 50 Ω, CL = 5 pF
f = 1 MHz
XTALK
RL = 50 Ω, CL = 5 pF
f = 10 MHz
BW
Bandwidth
RL = 50 Ω, CL = 5 pF
25°C
25°C
250
9
MHz
pF
CSOFF
Source off capacitance
f = 1 MHz
CSON
CDON
On capacitance
f = 1 MHz
25°C
23
pF
(1) When VS is 1 V, VD is 1.2 V or when VS is 1.2 V, VD is 1 V.
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6.9 Typical Characteristics
At TA = 25°C, VDD = 5 V (unless otherwise noted).
80
10
8
VDD = 1.08V
60
TA = 125èC
TA = 85èC
6
40
VDD = 1.62 V
4
20
2
VDD = 3 V
VDD = 4.5 V
TA = 25èC
TA = -40èC
0
0
0
0.5
1
1.5
2
2.5
3
3.5
Source or Drain Voltage (V)
4
4.5
5
0
0.5
1
1.5
2
Source or Drain Voltage (V)
2.5
3
D001
D002
TA = 25°C
VDD = 3 V
Figure 1. On-Resistance vs Source or Drain Voltage
Figure 2. On-Resistance vs Source or Drain Voltage
500
400
300
200
100
0
30
25
20
15
10
5
Rising
Falling
VDD = 3.3 V
VDD = 5 V
0
0
0.5
1
1.5
2
2.5
3
Logic Voltage (V)
3.5
4
4.5
5
0.5
1.5
2.5 3.5
VDD - Supply Voltage (V)
4.5
5.5
D003
D004
TA = 25°C
TA = 25°C
Figure 3. Supply Current vs Logic Voltage
Figure 4. Ttransition vs Supply Voltage
0
-1
-2
-3
-4
-5
-6
-7
-8
0
-10
-20
-30
-40
-50
-60
-70
-80
-90
100k
1M
10M
Frequency (Hz)
100M
1M
10M
Frequency (Hz)
100M
D005
D006
TA = 25°C
TA = 25°C
Figure 5. Crosstalk and Off-Isolation vs Frequency
Figure 6. Frequency Response
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7 Parameter Measurement Information
7.1 On-Resistance
The on-resistance of a device is the ohmic resistance between the source (Sx) and drain (D) pins of the device.
The on-resistance varies with input voltage and supply voltage. The symbol RON is used to denote on-resistance.
The measurement setup used to measure RON is shown in Figure 7. Voltage (V) and current (ISD) are measured
using this setup, and RON is computed with RON = V / ISD
:
V
ISD
Sx
D
VS
Figure 7. On-Resistance Measurement Setup
7.2 Off-Leakage Current
Source leakage current is defined as the leakage current flowing into or out of the source pin when the switch is
off. This current is denoted by the symbol IS(OFF)
.
The setup used to measure off-leakage current is shown in Figure 8.
VDD
VDD
Is (OFF)
S1
A
D
S2
VS
VD
GND
Figure 8. Off-Leakage Measurement Setup
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7.3 On-Leakage Current
Source on-leakage current is defined as the leakage current flowing into or out of the source pin when the switch
is on. This current is denoted by the symbol IS(ON)
.
Drain on-leakage current is defined as the leakage current flowing into or out of the drain pin when the switch is
on. This current is denoted by the symbol ID(ON)
.
Either the source pin or drain pin is left floating during the measurement. Figure 9 shows the circuit used for
measuring the on-leakage current, denoted by IS(ON) or ID(ON)
.
VDD
VDD
VDD
VDD
IS (ON)
S1
S2
S1
S2
ID (ON)
N.C.
A
D
D
A
N.C.
Vs
VS
VS
VD
GND
GND
Figure 9. On-Leakage Measurement Setup
7.4 Transition Time
Transition time is defined as the time taken by the output of the device to rise or fall 10% after the logic control
signal has risen or fallen past the logic threshold. The 10% transition measurement is utilized to provide the
timing of the device. System level timing can then account for the time constant added from the load resistance
and load capacitance. Figure 10 shows the setup used to measure transition time, denoted by the symbol
tTRANSITION
.
VDD
0.1…F
VDD
VDD
Logic
Control
(VSEL
tf < 5ns
tr < 5ns
VIH
)
VIL
S1
S2
VS
OUTPUT
0 V
D
RL
CL
tTRANSITION
tTRANSITION
SEL
90%
OUTPUT
VSEL
10%
GND
0 V
Figure 10. Transition-Time Measurement Setup
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7.5 Break-Before-Make
Break-before-make delay is a safety feature that prevents two inputs from connecting when the device is
switching. The output first breaks from the on-state switch before making the connection with the next on-state
switch. The time delay between the break and the make is known as break-before-make delay. Figure 11 shows
the setup used to measure break-before-make delay, denoted by the symbol tOPEN(BBM)
.
VDD
0.1…F
VDD
VDD
Logic
Control
S1
S2
tr < 5ns
tf < 5ns
VS
OUTPUT
D
(VSEL
)
0 V
RL
CL
90%
Output
SEL
tBBM
1
tBBM 2
0 V
VSEL
tOPEN (BBM) = min ( tBBM 1, tBBM 2)
GND
Figure 11. Break-Before-Make Delay Measurement Setup
7.6 Charge Injection
The TMUX1237 has a transmission-gate topology. Any mismatch in capacitance between the NMOS and PMOS
transistors results in a charge injected into the drain or source during the falling or rising edge of the gate signal.
The amount of charge injected into the source or drain of the device is known as charge injection, and is denoted
by the symbol QC. Figure 12 shows the setup used to measure charge injection from Drain (D) to Source (Sx).
VDD
VSS
0.1…F
0.1…F
VSS
VDD
VDD
VSEL
S2
N.C.
D
VD
OUTPUT
S1
VOUT
0 V
CL
Output
VOUT
SEL
VS
QC = CL
×
VOUT
VSEL
GND
Figure 12. Charge-Injection Measurement Setup
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7.7 Off Isolation
Off isolation is defined as the ratio of the signal at the drain pin (D) of the device when a signal is applied to the
source pin (Sx) of an off-channel. Figure 13 shows the setup used to measure, and the equation used to
calculate off isolation.
0.1µF
NETWORK
VDD
ANALYZER
VS
50Q
S
VSIG
D
VOUT
RL
SX
50Q
GND
RL
50Q
Figure 13. Off Isolation Measurement Setup
≈
∆
«
’
÷
◊
VOUT
VS
Off Isolation = 20 ∂ Log
(1)
7.8 Crosstalk
Crosstalk is defined as the ratio of the signal at the drain pin (D) of a different channel, when a signal is applied
at the source pin (Sx) of an on-channel. Figure 14 shows the setup used to measure, and the equation used to
calculate crosstalk.
0.1µF
NETWORK
VDD
ANALYZER
S1
VOUT
RL
D
50Q
VS
RL
S2
50Q
50Q
VSIG
GND
Figure 14. Crosstalk Measurement Setup
≈
∆
«
’
÷
◊
VOUT
VS
Channel-to-Channel Crosstalk = 20 ∂ Log
(2)
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7.9 Bandwidth
Bandwidth is defined as the range of frequencies that are attenuated by less than 3 dB when the input is applied
to the source pin (Sx) of an on-channel, and the output is measured at the drain pin (D) of the device. Figure 15
shows the setup used to measure bandwidth.
0.1µF
NETWORK
VDD
ANALYZER
VS
S
50Q
VSIG
D
VOUT
RL
50Q
SX
GND
RL
50Q
Figure 15. Bandwidth Measurement Setup
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8 Detailed Description
8.1 Overview
The TMUX1237 is an 2:1 (SPDT), 1-channel switch where the input is controlled with a single select (SEL)
control pin.
8.2 Functional Block Diagram
TMUX1237
S1
D
S2
SEL
Figure 16. TMUX1237 Functional Block Diagram
8.3 Feature Description
8.3.1 Bidirectional Operation
The TMUX1237 conducts equally well from source (Sx) to drain (D) or from drain (D) to source (Sx). The device
has very similar characteristics in both directions and supports both analog and digital signals.
8.3.2 Rail to Rail Operation
The valid signal path input/output voltage for TMUX1237 ranges from GND to VDD
.
8.3.3 1.8 V Logic Compatible Inputs
The TMUX1237 has 1.8-V logic compatible control for the logic control input (SEL). The logic input threshold
scales with supply but still provides 1.8-V logic control when operating at 5.5 V supply voltage. 1.8-V logic level
inputs allow the TMUX1237 to interface with processors that have lower logic I/O rails and eliminates the need
for an external translator, which saves both space and BOM cost. For more information on 1.8 V logic
implementations refer to Simplifying Design with 1.8 V logic Muxes and Switches
8.3.4 Fail-Safe Logic
The TMUX1237 supports Fail-Safe Logic on the control input pin (SEL) allowing for operation up to 5.5 V,
regardless of the state of the supply pin. This feature allows voltages on the control pin to be applied before the
supply pin, protecting the device from potential damage. Fail-Safe Logic minimizes system complexity by
removing the need for power supply sequencing on the logic control pins. For example, the Fail-Safe Logic
feature allows the select pin of the TMUX1237 to be ramped to 5.5 V while VDD = 0 V. Additionally, the feature
enables operation of the TMUX1237 with VDD = 1.2 V while allowing the select pin to interface with a logic level
of another device up to 5.5 V.
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8.4 Device Functional Modes
The select (SEL) pin of the TMUX1237 controls which switch is connected to the drain of the device. When a
given input is not selected, that source pin is in high impedance mode (HI-Z). The control pins can be as high as
5.5 V.
The TMUX1237 can be operated without any external components except for the supply decoupling capacitors.
Unused logic control pins should be tied to GND or VDD in order to ensure the device does not consume
additional current as highlighted in Implications of Slow or Floating CMOS Inputs. Unused signal path inputs (Sx
or D) should be connected to GND.
8.5 Truth Tables
Table 1. TMUX1237 Truth Table
CONTROL
Selected Source (Sx) Connected To Drain (D) Pin
LOGIC (SEL)
0
1
S1
S2
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TMUX12xx family offers good system performance across a wide operating supply (1.08 V to 5.5 V). These
devices include 1.8 V logic compatible control input pins that enable operation in systems with 1.8 V I/O rails.
Additionally, the control input pin supports Fail-Safe Logic which allows for operation up to 5.5 V, regardless of
the state of the supply pin. This protection stops the logic pins from back-powering the supply rail. These
features of the TMUX12xx, a family of general purpose multiplexers and switches, reduce system complexity,
board size, and overall system cost.
9.2 Typical Application
9.2.1 Input Control for Power Amplifier
One application of the TMUX1237 is for input control of a power amplifier. Utilizing a switch allows a system to
control when the DAC is connected to the power amplifier, and can stop biasing the power amplifier by switching
the gate to GND. Figure 17 shows the TMUX1237 configured for control of the power amplifier. The no overshoot
when switching between inputs feature of the TMUX1237 is beneficial in applications such as this where the
output is being switched across the full voltage range, and any overshoot on the output is undesired.
RF Input
RF Output
5 V
TMUX1237
0 V
DAC
1.8 V
SEL
Figure 17. Input Control of Power Amplifier
9.2.1.1 Design Requirements
This design example uses the parameters listed in Table 3.
Table 2. Design Parameters
PARAMETERS
Supply (VDD
VALUES
)
5 V
Switch I/O signal range
Control logic thresholds (SEL)
Signal overshoot
0 V to VDD (Rail to Rail)
1.8 V compatible (up to 5.5 V)
0 V
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9.2.1.2 Detailed Design Procedure
The application shown in Figure 17 demonstrates how to toggle between the DAC output and GND for control of
a power amplifier using a single control input. The DAC output is utilized to bias the gate of the power amplifier
and can be disconnected from the circuit using the select pin of the switch. The TMUX1237 helps eliminate
overshoot in a system caused by switching between two different voltage levels on the source (Sx) input pins.
Fast switching times create a step response on the output of switches or multiplexers which can cause system
level overshoot and ringing depending on many factors such as load capacitance and board parasitics. The
TMUX1237 improves system reliability by eliminating overshoot while still maintaining fast transition timing. The
TMUX1237 can support 1.8-V logic signals on the control input, allowing the device to interface with low logic
controls of an FPGA or MCU. The TMUX1237 can be operated without any external components except for the
supply decoupling capacitors. The select pin is recommended to have a pull-down or pull-up resistor to ensure
the input is in a known state if the control signal becomes disconnected. All inputs to the switch must fall within
the recommend operating conditions of the TMUX1237 including signal range and continuous current. For this
design with a supply of 5 V the signal range can be 0 V to 5 V and the max continuous current can be 50 mA.
9.2.1.3 Application Curve
The TMUX1237 improves system reliability by eliminating overshoot while still maintaining fast transition timing.
Figure 18 shows no overshoot on the TMUX1237 Drain - Output when switching between GND and a 3.3 V input
on the source pins. The logic voltage (SEL) toggles from GND to a 1.8 V logic input signal which cause the drain
pin (D) to switch from GND to 3.3 V. No overshoot is observed on the output and the system level transition
timing is 86 ns.
VDD = 5 V
S1 = 0 V
S2 = 3.3 V
SEL = 0 V to 1.8 V
Figure 18. No Overshoot When Switching Between Inputs
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9.2.2 Switchable Operational Amplifier Gain Setting
Another example application of the TMUX1237 is to change an Op Amp from unity gain setting to an inverting
amplifier configuration. Utilizing a switch allows a system to have a configurable gain and allows the same
architecture to be utilized across the board for various inputs to the system. shows the TMUX1237 configured for
gain setting application.
Input
R
R
Output
S1
S2
Unity Gain
Inverting
D
TLV9001
1.8 V
SEL
TMUX1237
Figure 19. Switchable Op Amp Gain Setting
9.2.2.1 Design Requirements
This design example uses the parameters listed in Table 3.
Table 3. Design Parameters
PARAMETERS
Input Signal
VALUES
0 V to 2.75 V
Mux Supply (VDD
)
2.75 V
Op Amp Supply (V+/ V-)
Mux I/O signal range
Control logic thresholds
±2.75 V
0 V to VDD (Rail to Rail)
1.8 V compatible (up to 5.5 V)
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9.2.2.2 Detailed Design Procedure
The application shown in demonstrates how to use a single control input and toggle between gain settings of -1
and +1. If switching between inverting and unity gain is not required, the TMUX1237 can be utilized in the
feedback path to select different feedback resistors and provide scalable gain settings for configurable signal
conditioning.
The TMUX1237 can be operated without any external components except for the supply decoupling capacitors.
The select pin is recommended to have a pull-down or pull-up resistor to ensure the input is in a known state if
the control signal becomes disconnected. All inputs to the switch must fall within the recommend operating
conditions of the TMUX1237 including signal range and continuous current. For this design with a supply of 2.75
V the signal range can be 0 V to 2.75 V and the max continuous current can be 50 mA.
9.2.2.3 Application Curve
80
VDD = 1.08V
60
40
VDD = 1.62 V
20
VDD = 3 V
VDD = 4.5 V
0
0
0.5
1
1.5
2
2.5
3
3.5
Source or Drain Voltage (V)
4
4.5
5
D001
TA = 25°C
Figure 20. On-Resistance vs Source or Drain Voltage
10 Power Supply Recommendations
The TMUX1237 operates across a wide supply range of 1.08 V to 5.5 V. Do not exceed the absolute maximum
ratings because stresses beyond the listed ratings can cause permanent damage to the devices.
Power-supply bypassing improves noise margin and prevents switching noise propagation from the VDD supply to
other components. Good power-supply decoupling is important to achieve optimum performance. For improved
supply noise immunity, use a supply decoupling capacitor ranging from 0.1 μF to 10 μF from VDD to ground.
Place the bypass capacitors as close to the power supply pins of the device as possible using low-impedance
connections. TI recommends using multi-layer ceramic chip capacitors (MLCCs) that offer low equivalent series
resistance (ESR) and inductance (ESL) characteristics for power-supply decoupling purposes. For very sensitive
systems, or for systems in harsh noise environments, avoiding the use of vias for connecting the capacitors to
the device pins may offer superior noise immunity. The use of multiple vias in parallel lowers the overall
inductance and is beneficial for connections to ground planes.
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11 Layout
11.1 Layout Guidelines
11.1.1 Layout Information
When a PCB trace turns a corner at a 90° angle, a reflection can occur. A reflection primarily occurs because the
width of the trace changes. At the apex of the turn, the trace width increases to 1.414 times its width. This
increase upsets the transmission-line characteristics, especially the distributed capacitance and self–inductance
of the trace which results in the reflection. Not all PCB traces can be straight and therefore some traces must
turn corners. Figure 21 shows progressively better techniques of rounding corners. Only the last example (BEST)
maintains constant trace width and minimizes reflections.
WORST
BETTER
BEST
1W min.
W
Figure 21. Trace Example
Route high-speed signals using a minimum of vias and corners which reduces signal reflections and
impedance changes. When a via must be used, increase the clearance size around it to minimize its
capacitance. Each via introduces discontinuities in the signal’s transmission line and increases the chance of
picking up interference from the other layers of the board. Be careful when designing test points, through-
hole pins are not recommended at high frequencies.
Figure 22 illustrates an example of a PCB layout with the TMUX1237. Some key considerations are:
•
Decouple the VDD pin with a 0.1-µF capacitor, placed as close to the pin as possible. Make sure that the
capacitor voltage rating is sufficient for the VDD supply.
•
•
•
Keep the input lines as short as possible.
Use a solid ground plane to help reduce electromagnetic interference (EMI) noise pickup.
Do not run sensitive analog traces in parallel with digital traces. Avoid crossing digital and analog traces if
possible, and only make perpendicular crossings when necessary.
11.2 Layout Example
Via to
GND plane
TMUX1237
Wide (low inductance)
trace for power
C
Figure 22. TMUX1237 Layout Example
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
Texas Instruments, Improve Stability Issues with Low CON Multiplexers.
Texas Instruments, Simplifying Design with 1.8 V logic Muxes and Switches.
Texas Instruments, Eliminate Power Sequencing with Powered-off Protection Signal Switches.
Texas Instruments, System-Level Protection for High-Voltage Analog Multiplexers.
12.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
12.3 Community Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
12.4 Trademarks
E2E is a trademark of Texas Instruments.
12.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TMUX1237DCKR
ACTIVE
SC70
DCK
6
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-40 to 125
237
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
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of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
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Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Mar-2020
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TMUX1237DCKR
SC70
DCK
6
3000
178.0
9.0
2.4
2.5
1.2
4.0
8.0
Q3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
28-Mar-2020
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SC70 DCK
SPQ
Length (mm) Width (mm) Height (mm)
180.0 180.0 18.0
TMUX1237DCKR
6
3000
Pack Materials-Page 2
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