TMS416800P-60DZ [TI]

2MX8 FAST PAGE DRAM, 60ns, PDSO28;
TMS416800P-60DZ
型号: TMS416800P-60DZ
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2MX8 FAST PAGE DRAM, 60ns, PDSO28

动态存储器 光电二极管 内存集成电路
文件: 总25页 (文件大小:353K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
Organization . . . 2097152 × 8  
DZ PACKAGE  
(TOP VIEW)  
Single 5 V Power Supply (±10% Tolerance)  
Performance Ranges:  
1
28  
27  
26  
25  
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
V
V
SS  
CC  
ACCESS ACCESS ACCESS READ OR  
TIME  
2
DQ0  
DQ1  
DQ2  
DQ3  
W
DQ7  
DQ6  
DQ5  
DQ4  
CAS  
OE  
A9  
TIME  
TIME  
WRITE  
CYCLE  
MIN  
3
t
t
t
RAC  
CAC  
AA  
MAX  
MAX  
MAX  
4
’41x800-60  
’41x800-70  
’41x800-80  
60 ns  
70 ns  
80 ns  
15 ns  
18 ns  
20 ns  
30 ns  
35 ns  
40 ns  
110 ns  
130 ns  
150 ns  
5
6
7
RAS  
Enhanced Page-Mode Operation With  
CAS-Before-RAS (CBR) Refresh  
8
A11  
9
A10  
A0  
A1  
A2  
A3  
A8  
High-Impedance State Unlatched Output  
10  
11  
12  
13  
14  
A7  
High-Reliability Plastic 28-Lead  
400-Mil-Wide Surface-Mount Small-Outline  
J-Lead (SOJ) Package  
A6  
A5  
A4  
Operating Free-Air Temperature Range  
V
V
SS  
CC  
0°C to 70°C  
Fabricated Using Enhanced Performance  
Implanted CMOS (EPIC ) Technology by  
Texas Instruments (TI )  
PIN NOMENCLATURE  
A0A11  
CAS  
Address Inputs  
Column-Address Strobe  
DQ0DQ7  
OE  
Data In/Data Out  
Output Enable  
Row-Address Strobe  
5 V  
description  
RAS  
The TMS41x800 series is a set of high-speed,  
16777216-bit dynamic random-access memo-  
ries (DRAMs) organized as 2097152 words of  
eight bits each. It employs TI’s state-of-the-art  
EPIC technology for high performance, reliability,  
and low power.  
V
V
CC  
Ground  
SS  
W
Write Enable  
A11 is NC (no internal connection) for TMS417800.  
These devices feature maximum RAS access  
timesof60ns, 70ns, and80ns. Alladdressesand  
data-in lines are latched on-chip to simplify  
system design. Data out is unlatched to allow  
greater system flexibility.  
The TMS416800 and TMS417800 are offered in  
a 28-lead plastic surface-mount SOJ package  
(DZ suffix). This package is characterized for  
operation from 0°C to 70°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC and TI are trademarks of Texas Instruments Incorporated.  
Copyright 1996, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
operation  
enhanced page mode  
Enhancedpage-modeoperationallowsfastermemoryaccessbykeepingthesamerowaddresswhileselecting  
random column addresses. The time for row-address setup and hold and address multiplex is eliminated. The  
maximum number of columns that can be accessed is determined by t  
(RAS) low time.  
, the maximum row-address strobe  
RASP  
Unlike conventional page-mode DRAMs, the column-address buffers in these devices are activated on the  
falling edge of RAS. The buffers act as transparent or flow-through latches while column-address strobe (CAS)  
is high. The falling edge of CAS latches the column addresses and enables the output. This feature allows the  
devicestooperateatahigherdatabandwidththanconventionalpage-modepartsbecausedataretrievalbegins  
as soon as the column address is valid rather than when CAS goes low. This performance improvement is  
referred to as enhanced page mode. A valid column address can be presented immediately after row-address  
hold time has been satisfied, usually well in advance of the falling edge of CAS. In this case, data is obtained  
aftert  
max(accesstimefromCASlow)ift max(accesstimefromcolumnaddress)andt  
(accesstime  
CAC  
AA  
RAC  
from RAS) have been satisfied. In the event that column address for the next cycle is valid at the time CAS goes  
high, access time for the next cycle is determined by the later occurrence of t (access time from CAS  
CPA  
precharge) or t  
.
CAC  
address: A0A11 (TMS416800) and A0A10 (TMS417800)  
Twenty-one address bits are required to decode one of 2097152 storage cell locations. For the TMS416800,  
12 row-address bits are set up on A0 through A11 and latched on the chip by the RAS. Nine column-address  
bits are set up on A0 through A8. For the TMS417800, 11 row-address bits are set up on inputs A0 through A10  
and latched on the chip by RAS. Ten column-address bits are set up on A0 through A9. All addresses must be  
stable on or before the falling edges of RAS and CAS. RAS is similar to a chip enable because it activates the  
sense amplifiers as well as the row decoder. CAS is used as a chip select, activating the output buffers and  
latching the address bits into the column-address buffers.  
write enable (W)  
The read or write mode is selected through W. A logic high on W selects the read mode, and a logic low selects  
the write mode. The data inputs are disabled when the read mode is selected. When W goes low prior to CAS  
(early write), data out remains in the high-impedance state for the entire cycle, permitting a write operation with  
OE grounded.  
data in (DQ0DQ7)  
Data is written during a write or read-modify-write cycle. Depending on the mode of operation, the falling edge  
of CAS or W strobes data into the on-chip data latch. In an early-write cycle, W is brought low prior to CAS, and  
the data is strobed in by CAS with setup and hold times referenced to this signal. In a delayed-write or  
read-modify-write cycle, CAS is already low, and the data is strobed in by W with setup and hold time referenced  
to this signal. In a delayed-write or read-modify-write cycle, OE must be high to bring the output buffers to the  
high-impedance state prior to impressing data on the I/O lines.  
data out (DQ0DQ7)  
Data out is the same polarity as data in. The output is in the high-impedance (floating) state until CAS and OE  
are brought low. In a read cycle, the output becomes valid after the access time interval t  
(which begins with  
CAC  
the negative transition of CAS) as long as t  
and t are satisfied.  
RAC  
AA  
2
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
RAS-only refresh  
TMS416800  
A refresh operation must be performed at least once every 64 ms to retain data. The refresh operation can be  
achieved by strobing each of the 4096 rows (A0A11). A normal read or write cycle refreshes all bits in each  
row that is selected. A RAS-only operation can be used by holding CAS at the high (inactive) level, conserving  
power as the output buffers remain in the high-impedance state. Externally generated addresses must be used  
for a RAS-only refresh.  
TMS417800  
A refresh operation must be performed at least once every 32 ms to retain data. The refresh operation can be  
achieved by strobing each of the 2048 rows (A0A10). A normal read or write cycle refreshes all bits in each  
row that is selected. A RAS-only operation can be used by holding CAS at the high (inactive) level, conserving  
power as the output buffers remain in the high-impedance state. Externally generated addresses must be used  
for a RAS-only refresh.  
hidden refresh  
A hidden refresh can be performed while maintaining valid data at the output pin. The hidden refresh operation  
is accomplished by holding CAS at V after a read or write operation and cycling RAS after a specified  
IL  
precharge period, similar to a RAS-only refresh cycle. The external address is ignored, and the refresh address  
is generated internally.  
CAS-before-RAS (CBR) refresh  
CBR refresh is performed by bringing CAS low earlier than RAS (see parameter t  
) and then holding it low  
CSR  
after RAS falls (see parameter t  
). For successive CBR refresh cycles, CAS can remain low while cycling  
CHR  
RAS. The external address is ignored, and the refresh address is generated internally.  
power up  
To achieve proper device operation, an initial pause of 200 µs followed by a minimum of eight initialization cycles  
is required after power up to the full V  
(RAS-only or CBR) cycle.  
level. The eight initialization cycles must include at least one refresh  
CC  
3
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
logic symbol for TMS416800  
RAM 2M x 8  
10  
A0  
A1  
20D9/21D0  
11  
12  
13  
16  
17  
18  
19  
20  
21  
9
A2  
A3  
A4  
0
A5  
A
2 097 151  
A6  
A7  
A8  
20D17/21D8  
20D18  
A9  
A10  
A11  
20D19  
8
20D20  
C20[ROW]  
G23/[REFRESH ROW]  
7
RAS  
24[PWR DWN]  
C21[COL]  
G24  
23  
6
CAS  
W
&
23C22  
24,25EN  
23,21D  
G25  
22  
2
OE  
DQ0  
A,22D  
26  
A,Z26  
3
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
4
5
24  
25  
26  
27  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 647-12.  
4
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
logic symbol for TMS417800  
RAM 2M x 8  
10  
11  
12  
13  
16  
17  
18  
19  
20  
21  
9
A0  
A1  
A2  
A3  
A4  
A5  
A6  
A7  
A8  
A9  
20D10/21D0  
0
A
2 097 151  
20D19/21D9  
20D20  
A10  
C20[ROW]  
G23/[REFRESH ROW]  
7
RAS  
24[PWR DWN]  
C21[COL]  
G24  
23  
6
CAS  
W
&
23C22  
24,25EN  
23,21D  
G25  
22  
2
OE  
DQ0  
A,22D  
26  
A,Z26  
3
DQ1  
DQ2  
DQ3  
DQ4  
DQ5  
DQ6  
DQ7  
4
5
24  
25  
26  
27  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 647-12.  
5
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
functional block diagram  
TMS416800  
RAS CAS  
W
OE  
Timing and Control  
A0  
A1  
9
Column Decode  
Sense Amplifiers  
256K Array  
8
Column-  
Address  
Buffers  
Data-  
In  
R
o
8
256K Array  
A8  
Reg.  
8
w
I/O  
8
Buffers  
D
e
c
o
d
e
64  
Data-  
Out  
Reg.  
Row-  
Address  
Buffers  
12  
256K Array  
DQ0DQ7  
A9, A10, A11  
12  
TMS417800  
RAS CAS  
W
OE  
Timing and Control  
A0  
A1  
10  
Column Decode  
Sense Amplifiers  
8
Column-  
Address  
Buffers  
256K Array  
256K Array  
256K Array  
256K Array  
Data-  
In  
R
o
8
A9  
Reg.  
8
w
I/O  
8
Buffers  
D
e
c
o
d
e
32  
32  
Data-  
Out  
Reg.  
Row-  
Address  
Buffers  
11  
256K Array  
11  
256K Array  
DQ0DQ7  
A10  
6
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1 V to 7 V  
CC  
Voltage range on any pin (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 1 V to 7 V  
Short-circuit output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA  
Power dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 W  
Operating free-air temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to 70°C  
A
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . – 55°C to 125°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTE 1: All voltage values are with respect to V  
.
SS  
recommended operating conditions  
TMS41x800  
MIN NOM  
UNIT  
MAX  
V
V
V
V
T
Supply voltage  
4.5  
5
0
5.5  
V
V
V
V
CC  
SS  
IH  
Supply voltage  
High-level input voltage  
Low-level input voltage (see Note 2)  
Operating free-air temperature  
2.4  
– 1  
0
6.5  
0.8  
70  
IL  
°C  
A
NOTE 2: The algebraic convention, where the more negative (less positive) limit is designated as minimum, is used for logic-voltage levels only.  
7
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted)  
TMS416800  
’416800-60  
’416800-70  
’416800-80  
PARAMETER  
UNIT  
TEST CONDITIONS  
= – 5 mA  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
High-level output  
voltage  
V
V
I
I
2.4  
2.4  
2.4  
V
V
OH  
OH  
Low-level output voltage  
Input current (leakage)  
= 4.2 mA  
= 5.5 V,  
0.4  
0.4  
0.4  
OL  
OL  
V
V = 0 V to 6.5 V,  
I
CC  
All others = 0 V to V  
I
I
I
± 10  
± 10  
± 10  
µA  
I
CC  
Output current  
(leakage)  
V
= 5.5 V,  
V
= 0 V to V ,  
CC  
CC  
CAS high  
O
± 10  
± 10  
± 10  
µA  
O
Read- or write-cycle  
current  
‡§  
V
V
= 5.5 V,  
Minimum cycle  
80  
70  
60  
mA  
CC1  
CC  
= 2.4 V (TTL),  
IH  
After one memory cycle,  
RAS and CAS high  
2
1
2
1
2
1
mA  
mA  
I
Standby current  
CC2  
V
IH  
= V  
– 0.2 V (CMOS),  
CC  
After one memory cycle,  
RAS and CAS high  
V
= 5.5 V,  
Minimum cycle,  
CC  
RAS cycling,  
Average refresh current  
(RAS-only refresh or  
CBR)  
‡§  
‡¶  
I
I
80  
70  
70  
60  
60  
50  
mA  
mA  
CC3  
CAS high (RAS only),  
RAS low after CAS low (CBR)  
V
= 5.5 V,  
t
= MIN,  
CC  
RAS low,  
PC  
CAS cycling  
Average page current  
CC4  
For conditions shown as MIN/MAX, use the appropriate value specified in the timing requirements.  
Measured with outputs open  
§
Measured with a maximum of one address change while RAS = V  
Measured with a maximum of one address change while CAS = V  
IL  
IH  
8
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
electrical characteristics over recommended ranges of supply voltage and operating free-air  
temperature (unless otherwise noted) (continued)  
TMS417800  
’417800-60  
’417800-70  
’417800-80  
PARAMETER  
UNIT  
TEST CONDITIONS  
= – 5 mA  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
High-level output  
voltage  
V
V
I
I
2.4  
2.4  
2.4  
V
V
OH  
OH  
Low-level output voltage  
Input current (leakage)  
= 4.2 mA  
= 5.5 V,  
0.4  
0.4  
0.4  
OL  
OL  
V
V = 0 V to 6.5 V,  
I
CC  
All others = 0 V to V  
I
I
I
± 10  
± 10  
± 10  
µA  
I
CC  
Output current  
(leakage)  
V
= 5.5 V,  
V
= 0 V to V  
,
CC  
CC  
CAS high  
O
± 10  
± 10  
± 10  
µA  
O
Read- or write-cycle  
current  
‡§  
V
V
= 5.5 V,  
Minimum cycle  
110  
100  
90  
mA  
CC1  
CC  
= 2.4 V (TTL),  
IH  
After one memory cycle,  
RAS and CAS high  
2
1
2
1
2
1
mA  
mA  
I
Standby current  
CC2  
V
IH  
= V  
– 0.2 V (CMOS),  
CC  
After one memory cycle,  
RAS and CAS high  
V
= 5.5 V,  
Minimum cycle,  
CAS high (RAS  
CC  
Average refresh current  
(RAS-only refresh or  
CBR)  
RAS cycling,  
only),  
RAS low after CAS low (CBR)  
‡§  
‡¶  
I
I
110  
70  
100  
60  
90  
50  
mA  
mA  
CC3  
V
= 5.5 V, = MIN,  
t
CC  
RAS low,  
PC  
CAS cycling  
Average page current  
CC4  
For conditions shown as MIN/MAX, use the appropriate value specified in the timing requirements.  
Measured with outputs open  
§
Measured with a maximum of one address change while RAS = V  
Measured with a maximum of one address change while CAS = V  
IL  
IH  
9
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
capacitance over recommended ranges of supply voltage and operating free-air temperature,  
f = 1 MHz (see Note 3)  
PARAMETER  
MIN  
MAX  
UNIT  
pF  
C
C
C
C
C
Input capacitance, A0A11  
5
7
7
7
7
i(A)  
Input capacitance, OE  
pF  
i(OE)  
i(RC)  
i(W)  
o
Input capacitance, CAS and RAS  
Input capacitance, W  
pF  
pF  
Output capacitance  
pF  
A11 is NC (no internal connection) for TMS417800.  
NOTE 3: = NOM supply voltage ±10%, and the bias on pins under test is 0 V.  
V
CC  
switching characteristics over recommended ranges of supply voltage and operating free-air  
temperature (see Note 4)  
’41x800-60  
’41x800-70  
’41x800-80  
PARAMETER  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
t
t
t
t
t
t
t
t
t
t
Access time from column address  
30  
15  
35  
60  
15  
35  
18  
40  
70  
18  
40  
20  
45  
80  
20  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
AA  
Access time from CAS  
CAC  
CPA  
RAC  
OEA  
CLZ  
OH  
Access time from CAS precharge  
Access time from RAS  
Access time from OE  
Delay time, CAS to output in the low-impedance state  
Output data hold time from CAS  
Output data hold time from OE  
0
3
3
0
0
0
3
3
0
0
0
3
3
0
0
OHO  
OFF  
OEZ  
Output buffer turn-off delay from CAS (see Note 5)  
Output buffer turn-off delay from OE (see Note 5)  
15  
15  
18  
18  
20  
20  
NOTES: 4. With ac parameters, it is assumed that t = 5 ns.  
T
5.  
t
and t are specified when the output is no longer driven.  
OEZ  
OFF  
10  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature (see Note 4)  
’41x800-60  
’41x800-70  
’41x800-80  
UNIT  
MIN  
110  
110  
155  
40  
MAX  
MIN  
130  
130  
181  
45  
MAX  
MIN  
150  
150  
205  
50  
MAX  
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
t
Cycle time, read  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
RC  
Cycle time, write  
WC  
Cycle time, read-write  
RWC  
PC  
Cycle time, page-mode read or write (see Note 6)  
Cycle time, page-mode read-write  
Pulse duration, RAS active, page mode (see Note 7)  
Pulse duration, RAS active, nonpage mode (see Note 7)  
Pulse duration, CAS active (see Note 8)  
Pulse duration, CAS precharge  
85  
96  
105  
PRWC  
RASP  
RAS  
CAS  
CP  
60 100 000  
70 100 000  
80 100 000  
60  
15  
10  
40  
10  
0
10 000  
10 000  
70  
18  
10  
50  
10  
0
10 000  
10 000  
80  
20  
10  
60  
10  
0
10 000  
10 000  
Pulse duration, RAS precharge  
RP  
Pulse duration, write command  
WP  
Setup time, column address  
ASC  
ASR  
DS  
Setup time, row address  
0
0
0
Setup time, data-in (see Note 9)  
Setup time, read command  
0
0
0
0
0
0
RCS  
CWL  
RWL  
Setup time, write command before CAS precharge  
Setup time, write command before RAS precharge  
15  
15  
18  
18  
20  
20  
Setup time, write command before CAS active (early-write  
only)  
t
0
0
0
ns  
WCS  
t
t
t
t
t
t
t
t
t
t
Setup time, CAS referenced to RAS (CBR refresh only)  
Hold time, column address  
5
10  
10  
10  
0
5
15  
15  
10  
0
5
15  
15  
10  
0
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CSR  
CAH  
DH  
Hold time, data-in (see Note 9)  
Hold time, row address  
RAH  
RCH  
RRH  
WCH  
RHCP  
OEH  
ROH  
Hold time, read command referenced to CAS (see Note 10)  
Hold time, read command referenced to RAS (see Note 10)  
Hold time, write command during CAS active (early-write only)  
Hold time, RAS active from CAS precharge  
Hold time, OE command  
0
0
0
10  
35  
15  
10  
15  
40  
18  
10  
15  
45  
20  
10  
Hold time, RAS referenced to OE  
NOTES: 4. With ac parameters, it is assumed that t = 5 ns.  
T
6. To ensure t  
7. In a read-write cycle, t  
8. In a read-write cycle, t  
min, t  
should be to t  
.
CP  
PC  
ASC  
and t  
and t  
must be observed.  
must be observed.  
RWD  
CWD  
RWL  
CWL  
9. Referenced to the later of CAS or W in write operations  
10. Either t or t must be satisfied for a read cycle.  
RRH  
RCH  
11  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
timing requirements over recommended ranges of supply voltage and operating free-air  
temperature (continued)  
’41x800-60  
’41x800-70  
’41x800-80  
UNIT  
MIN  
MAX  
MIN  
MAX  
MIN  
MAX  
Delay time, column address to write command  
(read-write operation only)  
t
55  
63  
70  
ns  
AWD  
t
t
t
t
t
t
t
t
t
t
t
t
t
Delay time, CAS referenced to RAS (CBR refresh only)  
Delay time, CAS precharge to RAS  
10  
5
10  
5
10  
5
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
ns  
CHR  
CRP  
CSH  
CWD  
OED  
RAD  
RAL  
Delay time, RAS active to CAS precharge  
60  
40  
15  
15  
30  
30  
20  
0
70  
46  
18  
15  
35  
35  
20  
0
80  
50  
20  
15  
40  
40  
20  
0
Delay time, CAS to write command (read-write operation only)  
Delay time, OE to data in  
Delay time, RAS to column address (see Note 11)  
Delay time, column address to RAS precharge  
Delay time, column address to CAS precharge  
Delay time, RAS to CAS (see Note 11)  
30  
45  
35  
52  
40  
60  
CAL  
RCD  
RPC  
RSH  
RWD  
CPW  
Delay time, RAS precharge to CAS  
Delay time, CAS active to RAS precharge  
15  
85  
60  
18  
98  
68  
20  
110  
75  
Delay time, RAS to write command (read-write operation only)  
Delay time, CAS precharge to write command (read-write only)  
’416800  
’417800  
64  
32  
30  
64  
32  
30  
64  
32  
30  
t
Refresh time interval  
ms  
ns  
REF  
t
T
Transition time  
3
3
3
NOTE 11: The maximum value is specified only to ensure access time.  
PARAMETER MEASUREMENT INFORMATION  
1.31 V  
5 V  
828 Ω  
218 Ω  
Output Under Test  
Output Under Test  
295 Ω  
C
= 100 pF  
L
C
= 100 pF  
L
(see Note A)  
(see Note A)  
(a) LOAD CIRCUIT  
(b) ALTERNATE LOAD CIRCUIT  
NOTE A: C includes probe and fixture capacitance.  
L
Figure 1. Load Circuits for Timing Parameters  
12  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RC  
t
RAS  
RAS  
t
RP  
t
T
t
CSH  
t
RCD  
t
RSH  
t
CRP  
t
CAS  
t
CAS  
ASR  
t
CP  
t
RAD  
t
ASC  
t
RAH  
t
CAL  
t
RAL  
Row  
Column  
Don’t Care  
Address  
t
t
RRH  
RCS  
t
CAH  
t
RCH  
Don’t Care  
Don’t Care  
W
t
CAC  
t
OFF  
OH  
t
AA  
t
Valid Data Out  
DQ0DQ7  
Hi-Z  
See Note A  
t
CLZ  
t
OHO  
t
RAC  
t
OEA  
t
OEZ  
t
ROH  
Don’t Care  
Don’t Care  
OE  
NOTE A: Output can go from the high-impedance state to an invalid-data state prior to the specified access time.  
Figure 2. Read-Cycle Timing  
13  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
WC  
t
RAS  
t
CAL  
RAS  
t
RP  
t
T
t
RSH  
t
RCD  
t
CAS  
t
CRP  
t
CSH  
t
CAS  
Address  
W
ASR  
t
CP  
t
ASC  
t
RAL  
t
RAH  
t
CAH  
Row  
Column  
Don’t Care  
t
CWL  
t
t
RAD  
RWL  
t
WCH  
Don’t Care  
Don’t Care  
t
WCS  
t
WP  
t
DH  
t
DS  
Valid Data  
Don’t Care  
DQ0DQ7  
Don’t Care  
OE  
Figure 3. Early-Write-Cycle Timing  
14  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
WC  
t
RAS  
RAS  
CAS  
t
RP  
t
T
t
RSH  
t
RCD  
t
CRP  
t
CSH  
t
t
CAS  
ASR  
t
CP  
t
ASC  
t
RAL  
CAL  
t
t
RAH  
t
CAH  
Row  
Column  
Don’t Care  
Address  
t
CWL  
t
RAD  
t
RWL  
Don’t Care  
Don’t Care  
W
t
WP  
t
DS  
t
DH  
Don’t Care  
Valid Data  
Don’t Care  
DQ0DQ7  
t
OED  
t
OEH  
Don’t Care  
Don’t Care  
OE  
Figure 4. Write-Cycle Timing  
15  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RWC  
t
RAS  
RAS  
CAS  
t
RP  
t
T
t
t
t
CRP  
RCD  
t
CAS  
t
ASR  
t
CP  
t
RAH  
t
CAH  
t
RAD  
T
t
ASC  
Row  
Column  
Don’t Care  
Address  
t
t
CWL  
RCS  
t
RWD  
t
RWL  
t
AWD  
t
CWD  
Don’t Care  
Don’t Care  
Don’t Care  
W
DQ0DQ7  
OE  
t
t
CAC  
WP  
t
DS  
t
t
DH  
AA  
t
CLZ  
Data  
Out  
Data  
In  
See Note A  
t
RAC  
t
t
OEH  
OEZ  
t
OHO  
t
t
OED  
OEA  
Don’t Care  
NOTE A: Output can go from the high-impedance state to an invalid-data state prior to the specified access time.  
Figure 5. Read-Write-Cycle Timing  
16  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RP  
t
RASP  
t
RHCP  
t
PC  
RAS  
t
RCD  
t
CRP  
t
t
t
CSH  
RSH  
CP  
t
CAS  
CAS  
Address  
W
t
RAH  
t
CAL  
t
t
t
CAH  
ASR  
t
ASC  
RAL  
Row  
Column  
Column  
Don’t Care  
t
t
AA  
RRH  
t
RCH  
t
RCS  
t
CAC  
t
RAD  
t
CPA  
t
CAC  
t
AA  
t
OFF  
t
RAC  
t
OH  
t
CLZ  
Valid  
Out  
Valid  
Out  
DQ0DQ7  
See Note A  
t
t
OHO  
OHO  
t
t
OEZ  
OEZ  
t
OEA  
t
OEA  
Don’t Care  
OE  
Access time is t  
-, t  
CPA CAC  
-, or t -dependent.  
AA  
NOTE A: Output can go from the high-impedance state to an invalid-data state prior to the specified access time.  
Figure 6. Enhanced-Page-Mode Read-Cycle Timing  
17  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RP  
t
RASP  
t
RAS  
RHCP  
t
PC  
t
CSH  
t
CRP  
t
RSH  
t
RCD  
t
CAL  
t
CAS  
t
ASC  
CAS  
t
RAH  
t
CP  
t
RAL  
t
t
ASR  
CAH  
Address  
Row  
Column  
Column  
Don’t Care  
t
RAD  
t
CWL  
t
CWL  
t
t
RWL  
WP  
t
WCS  
t
WCH  
W
Don’t Care  
Don’t Care  
Don’t Care  
t
DH  
t
DS  
Valid  
In  
Valid Data In  
Don’t Care  
DQ0DQ7  
OE  
Don’t Care  
NOTE A: Areadcycleoraread-writecyclecanbeintermixedwithwritecyclesaslongasreadandread-writetimingspecificationsarenotviolated.  
Figure 7. Enhanced-Page-Mode Early-Write-Cycle Timing  
18  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RP  
t
RASP  
t
RAS  
RHCP  
t
PC  
t
CSH  
t
CRP  
t
RSH  
t
RCD  
t
CAL  
t
CAS  
t
ASC  
CAS  
t
RAH  
t
CP  
t
RAL  
t
t
CAH  
ASR  
Address  
Row  
Column  
Column  
Don’t Care  
t
RAD  
t
CWL  
t
t
CWL  
t
RWL  
WP  
t
DS  
W
Don’t Care  
Don’t Care  
Don’t Care  
t
OEH  
t
DH  
Valid  
In  
Don’t Care  
Valid Data In  
OEH  
Don’t Care  
DQ0DQ7  
OE  
t
t
OED  
Don’t Care  
Don’t Care  
NOTE A: Areadcycleoraread-writecyclecanbeintermixedwithwritecyclesaslongasreadandread-writetimingspecificationsarenotviolated.  
Figure 8. Enhanced-Page-Mode Write-Cycle Timing  
19  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RP  
t
RASP  
RAS  
CAS  
t
RHCP  
t
t
CSH  
t
RSH  
t
PRWC  
t
CRP  
t
RCD  
CP  
t
CAS  
t
ASR  
t
ASC  
t
RAD  
t
CAH  
Column  
Don’t Care  
Row  
Column  
Address  
t
RAH  
t
CWL  
t
CWD  
t
t
AWD  
RWD  
CPW  
t
RWL  
t
t
WP  
W
t
CPA  
t
OEH  
t
RCS  
t
t
DH  
AA  
t
t
DS  
RAC  
Valid Out  
t
CAC  
Valid  
In  
Valid  
In  
DQ0DQ7  
t
CLZ  
Valid Out  
t
OED  
t
OEZ  
t
OEH  
t
OEA  
OE  
t
OHO  
Output can go from the high-impedance state to an invalid-data state prior to the specified access time.  
NOTE A: A read or write cycle can be intermixed with read-write cycles as long as the read and write timing specifications are not violated.  
Figure 9. Enhanced-Page-Mode Read-Write-Cycle Timing  
20  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
t
RC  
t
RAS  
RAS  
CAS  
t
t
CRP  
RP  
t
T
t
RPC  
Don’t Care  
Don’t Care  
t
ASR  
t
RAH  
Row  
Don’t Care  
Row  
Address  
W
Don’t Care  
DQ0DQ7  
OE  
Hi-Z  
Don’t Care  
Figure 10. RAS-Only Refresh-Cycle Timing  
t
RC  
t
RP  
t
RAS  
RAS  
CAS  
t
CSR  
t
RPC  
t
CHR  
t
T
Don’t Care  
Don’t Care  
Don’t Care  
W
Address  
OE  
Hi-Z  
DQ0DQ7  
Figure 11. Automatic-CBR-Refresh-Cycle Timing  
21  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
Refresh Cycle  
Refresh Cycle  
RP  
Memory Cycle  
t
RP  
t
t
RAS  
t
RAS  
RAS  
CAS  
t
CHR  
t
CAS  
t
CAH  
t
ASC  
t
RAH  
t
ASR  
Row  
Col  
Don’t Care  
Address  
t
RRH  
t
RCS  
Don’t Care  
W
t
CAC  
AA  
t
t
OFF  
t
RAC  
Valid Data Out  
DQ0DQ7  
OE  
t
CLZ  
t
OEZ  
t
OEA  
Figure 12. Hidden-Refresh-Cycle (Read) Timing  
22  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
PARAMETER MEASUREMENT INFORMATION  
Refresh Cycle  
Memory Cycle  
RAS  
Refresh Cycle  
t
t
RP  
RP  
t
t
RAS  
RAS  
CAS  
t
CHR  
t
CAS  
t
CAH  
t
ASC  
t
RAH  
t
ASR  
Don’t Care  
Don’t Care  
Row  
Col  
Address  
t
RRH  
t
WCS  
t
WP  
W
t
WCH  
t
DH  
t
DS  
Don’t Care  
Valid Data  
DQ0DQ7  
OE  
Don’t Care  
Figure 13. Hidden-Refresh-Cycle (Write) Timing  
23  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
TMS416800, TMS417800  
2097152-WORD BY 8-BIT HIGH-SPEED DRAMS  
SMKS883A – OCTOBER 1995 – REVISED MARCH 1996  
MECHANICAL DATA  
DZ (R-PDSO-J28)  
PLASTIC SMALL-OUTLINE J-LEAD PACKAGE  
0.730 (18,54)  
0.720 (18,29)  
28  
15  
0.445 (11,30)  
0.435 (11,05)  
0.405 (10,29)  
0.395 (10,03)  
1
14  
0.032 (0,81)  
0.026 (0,66)  
0.148 (3,76)  
0.128 (3,25)  
0.106 (2,69) NOM  
Seating Plane  
0.004 (0,10)  
0.020 (0,51)  
0.016 (0,41)  
0.380 (9,65)  
0.360 (9,14)  
0.007 (0,18)  
M
0.050 (1,27)  
0.008 (0,20) NOM  
4040094-3/C 4/95  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Plastic body dimensions do not include mold protrusion. Maximum mold protrusion is 0.005 (0,125).  
device symbolization (TMS416800 illustrated)  
-SS  
TI  
Speed ( -60, - 70, -80)  
Package Code  
TMS416800 DZ  
W
C
Y M LLLL P  
Assembly Site Code  
Lot Traceability Code  
Month Code  
Year Code  
Die Revision Code  
Wafer Fab Code  
24  
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251–1443  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgement, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
CERTAIN APPLICATIONS USING SEMICONDUCTOR PRODUCTS MAY INVOLVE POTENTIAL RISKS OF  
DEATH, PERSONAL INJURY, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE (“CRITICAL  
APPLICATIONS”). TI SEMICONDUCTOR PRODUCTS ARE NOT DESIGNED, AUTHORIZED, OR  
WARRANTED TO BE SUITABLE FOR USE IN LIFE-SUPPORT DEVICES OR SYSTEMS OR OTHER  
CRITICAL APPLICATIONS. INCLUSION OF TI PRODUCTS IN SUCH APPLICATIONS IS UNDERSTOOD TO  
BE FULLY AT THE CUSTOMER’S RISK.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 1998, Texas Instruments Incorporated  

相关型号:

TMS416800P-70DE

2MX8 FAST PAGE DRAM, 70ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32
TI

TMS416800P-70DZ

2MX8 FAST PAGE DRAM, 70ns, PDSO28
TI

TMS416800P-80DE

2MX8 FAST PAGE DRAM, 80ns, PDSO32, 0.400 INCH, 1.27 MM PITCH, PLASTIC, TSOP-32
TI

TMS416800P-80DZ

2MX8 FAST PAGE DRAM, 80ns, PDSO28
TI

TMS416809

2097152-WORD BY 8-BIT HIGH-SPEED DRAMS
TI

TMS416809-60DZ

2MX8 EDO DRAM, 60ns, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
TI

TMS416809-70DZ

2MX8 EDO DRAM, 70ns, PDSO28, 0.400 INCH, PLASTIC, SOJ-28
TI

TMS417400

4194304-WORD BY 4-BIT HIGH-SPEED DRAMS
TI

TMS417400-60DJ

4MX4 FAST PAGE DRAM, 60ns, PDSO24, 0.300 INCH, PLASTIC, SOJ-26/24
TI

TMS417400-60DR

4194304-WORD BY 4-BIT HIGH-SPEED DRAMS
TI

TMS417400-70DGA

4MX4 FAST PAGE DRAM, 70ns, PDSO24, PLASTIC, TSOP-26/24
TI

TMS417400-70DGB

4MX4 FAST PAGE DRAM, 70ns, PDSO24, PLASTIC, REVERSE, TSOP-26/24
TI