TMP107BQDQ1 [TI]
TMP107-Q1 Automotive Grade, ±0.4°C Temperature Sensor with Daisy-Chain UART, EEPROM, and Alert Function;
| 型号： | TMP107BQDQ1 |
| 厂家： | 
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| 描述： | TMP107-Q1 Automotive Grade, ±0.4°C Temperature Sensor with Daisy-Chain UART, EEPROM, and Alert Function 可编程只读存储器 电动程控只读存储器 电可擦编程只读存储器 |
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TMP107-Q1
SBOS726A –OCTOBER 2015–REVISED OCTOBER 2015
TMP107-Q1 Automotive Grade, ±0.4°C Temperature Sensor with
Daisy-Chain UART, EEPROM, and Alert Function
1 Features
2 Applications
1
•
AEC-Q100 Qualified with:
•
•
•
•
•
•
•
•
Battery Management Systems (BMSs)
Distributed Temperature Sensing
Hybrid, Electric, and Power-Train Systems
Body Control Modules (BCMs)
Building Automation and HVACs
Engine Control Units
–
Temperature Grade 1: –40°C to +125°C
Ambient Operating Temperature Range
–
–
Device HBM ESD Classification Level 2
Device CDM ESD Classification Level C6
•
High Accuracy (Without Calibration):
–
–
–
±0.4°C (max) from –20°C to +70°C
±0.55°C (max) from –40°C to +100°C
±0.7°C (max) from –55°C to +125°C
Infotainment Processor Management
Diesel Urea Tanks
3 Description
The TMP107-Q1 digital output temperature sensor
supports a total of 32 daisy-chained devices. Each
•
•
High Resolution: 14 Bits (0.015625°C)
UART-Compatible, SMAART Wire™ Interface:
–
Allows Up To 32 Daisy-Chained Devices
sensor has
electrically-erasable
a
unique 5-bit address stored in
programmable memory
•
EEPROM Memory for Unique Addressing, Trip
Level Programming, and General-Purpose
Storage
(EEPROM). The TMP107-Q1 is capable of reading
temperatures with a resolution of 0.015625°C, and is
accurate to within ±0.4°C in the range from –20°C to
+70°C. The TMP107-Q1 is ideal for replacing NTC
and PTC thermistors where high accuracy is required.
•
•
Continuous Conversion and Shutdown Mode for
Power Savings
One-Shot Conversion Mode for Custom Update
Rates and Power Savings
Device Information(1)
DEVICE NAME
PACKAGE
BODY SIZE
•
•
•
•
Programmable Alert Feature
TMP107-Q1
SOIC (8)
4.90 mm × 3.90 mm
Operating Temperature Range: –55°C to +125°C
Operating Supply Range: 1.7 V to 5.5 V
Package: SOIC-8
(1) For all available packages, see the package option addendum
at the end of the datasheet.
Typical Application
1.7 V to 5.5 V
Sensor 1
Sensor 2
Sensor N
V+
TMP107
TMP107
TMP107
1
2
1
2
8
7
6
5
1
2
8
7
8
7
MCU
V+
R1
R2
V+
R1
R2
V+
R1
R2
4.1 kꢀ
I/O2
I/O2
I/O2
TX
0.1 ꢁF
0.1 ꢁF
0.1 ꢁF
3
4
6
5
3
4
6
5
3
4
I/O1
ALERT2
I/O1
ALERT2
GND
I/O1
ALERT2
UART
10 ꢀ
GND
ALERT1
100 ꢀ
ALERT1
GND
ALERT1
RX
GND
All figures shown as TMP107 represent TMP107-Q1 as well.
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
TMP107-Q1
SBOS726A –OCTOBER 2015–REVISED OCTOBER 2015
www.ti.com
Table of Contents
8.4 Device Functional Modes........................................ 21
8.5 Programming........................................................... 22
8.6 Register Map........................................................... 23
Application and Implementation ........................ 29
9.1 Application Information............................................ 29
9.2 Typical Applications ................................................ 29
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Description (continued)......................................... 3
Pin Configuration and Functions......................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 ESD Ratings.............................................................. 5
7.3 Recommended Operating Conditions....................... 5
7.4 Thermal Information.................................................. 5
7.5 Electrical Characteristics........................................... 6
7.6 Timing Requirements................................................ 7
7.7 Typical Characteristics.............................................. 8
Detailed Description ............................................ 11
8.1 Overview ................................................................. 11
8.2 Functional Block Diagram ....................................... 11
8.3 Feature Description................................................. 12
9
10 Power Supply Recommendations ..................... 33
11 Layout................................................................... 33
11.1 Layout Guidelines ................................................. 33
11.2 Layout Example .................................................... 33
12 Device and Documentation Support ................. 34
12.1 Documentation Support ........................................ 34
12.2 Community Resources.......................................... 34
12.3 Trademarks........................................................... 34
12.4 Electrostatic Discharge Caution............................ 34
12.5 Glossary................................................................ 34
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 34
4 Revision History
Changes from Original (October 2015) to Revision A
Page
•
Released to production .......................................................................................................................................................... 1
2
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5 Description (continued)
The unique 5-bit address stored in the EEPROM is determined during the automated address assignment
operation, and is based on the position of each sensor relative to the SMAART wire host. Multiple operating
modes provide maximum flexibility in selecting between low power consumption for battery operation, and high
update rates for real-time control applications.
The TMP107-Q1 is ideal for extended temperature measurement in a variety of industrial, instrumentation,
communication, and environmental applications. The TMP107-Q1 is available in an 8-pin SOIC package and is
specified for operation over a temperature range of −55°C to +125°C.
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6 Pin Configuration and Functions
D Package
8-Pin SOIC
Top View
1
2
3
4
8
7
6
5
V+
R1
R2
I/O2
I/O1
ALERT2
GND
ALERT1
Pin Functions
PIN
NAME
I/O
DESCRIPTION
NO.
1
V+
R1
—
I
Supply voltage, 1.7 V to 5.5 V
2
3
4
5
6
7
8
Built-in pullup resistor for ALERT1; float or connect to V+
SMAART wire input, output 1
I/O1
I/O
O
ALERT1
GND
ALERT2
I/O2
Over- and undertemperature alert. Open-drain output; internally connected to pullup resistor R1.
Ground
—
O
Over- and undertemperature alert. Open-drain output; internally connected to pullup resistor R2.
SMAART wire input, output 2
I/O
I
R2
Built-in pullup resistor for ALERT2; float or connect to V+
4
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7 Specifications
7.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN
MAX
UNIT
Supply voltage, V+
I/O1, I/O2
6
V
–0.3
–0.3
–0.3
(V+) + 0.3
Input voltage
R1, R2
6
V
ALERT1, ALERT2
ALERT1, ALERT2
Operating junction
Storage, Tstg
6
Sink current
Temperature
10
150
150
mA
°C
–55
–60
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE
±2000
±1000
UNIT
Human-body model (HBM), per AEC Q100-002(1)
Charged-device model (CDM), per AEC Q100-011
V(ESD)
Electrostatic discharge
V
(1) AEC Q100-002 indicates that HBM stressing shall be in accordance with the ANSI/ESDA/JEDEC JS-001 specification.
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
1.7
NOM
MAX
5.5
UNIT
Supply voltage, V+
3.3
V
Operating free-air temperature, TA
–55
125
°C
7.4 Thermal Information
TMP107-Q1
D (SOIC)
8 PINS
116.3
62.5
THERMAL METRIC(1)
UNIT
RθJA
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
RθJC(top)
RθJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
56.6
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
14.6
ψJB
56.0
RθJC(bot)
N/A
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
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7.5 Electrical Characteristics
At TA = –55°C to 125°C and V+ = +1.7 V to +5.5 V (unless otherwise noted). Typical values at TA = 25°C and V+ = 3.3 V.
PARAMETER
TEMPERATURE INPUT
Temperature range
TEST CONDITIONS
MIN
TYP
MAX
UNIT
–55
125
°C
°C
Temperature resolution
0.015625
±0.125
–20°C to +70°C; one-shot mode, bus inactive
–40°C to +100°C; one-shot mode, bus
±0.4
±0.125
±0.55
Temperature accuracy (error) inactive
°C
–55°C to +125°C; one-shot mode, bus
inactive
±0.5
14
±0.7
ADC resolution
Bits
DIGITAL OUTPUT (ALERT1, ALERT2)
VOL
Low-level output voltage
IOUT = –1 mA
0
0.02
0.1
0.4
1
V
High-level output leakage
current
IOH
VO = V+
μA
kΩ
RPU
Pullup resistors
75
100
125
DIGITAL INPUT/OUTPUT (I/O1, I/O2)
VIH
VIL
High-level input voltage
Low-level input voltage
Input current
0.7 (V+)
(V+) + 0.3
V
V
–0.3
0.3 (V+)
IIN
0 V < VIN < (V+) + 0.3 V
IOUT = –1 mA
–1
0
1
0.4
V+
μA
V
VOL
VOH
Low-level output voltage
High-level output voltage
0.1
IOUT = 1 mA
(V+) – 0.4
(V+) – 0.1
V
Short-circuit I/O1 and I/O2 to ground or V+,
V+ = 5 V
Short-circuit current
60
mA
DEVICE TIMING
Conversion time
One-shot mode
12
15
18
ms
Conversion rate
Programmable
1/16
62 Conv/s
Any communication
Global address-initialize command
35
1
40
ms
s
Device timeout time
1.25
EEPROM
Programming time
Number of writes
Data retention time
V+ > 1.8 V
V+ > 1.8 V
7
ms
1000
10
100,000
Times
Years
POWER SUPPLY
1.7
1.8
3.3
3.3
5.5
5.5
V
V
V+
Operating supply range
EEPROM write
ADC conversion on,
SMAART wire bus inactive
200
300
100
16
400
ADC conversion on, SMAART wire bus active
(bus baud rate = 57.6 kBd)
IQ
Quiescent current
ADC conversion off, SMAART wire bus active
(bus baud rate = 57.6 kBd)
μA
1 conversion per second average,
SMAART wire bus inactive
35
10
EEPROM write (ADC conversion off)
SMAART wire bus inactive (I/O1, I/O2 = V+)
Supply voltage rising
400
3.8
1.4
ISD
Shutdown current
μA
Power-on reset voltage
V
6
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7.6 Timing Requirements
MIN
NOM
MAX
UNIT
FROM HOST TO THE TMP107-Q1
1/tBAUD
SMAART bus baud rate
4.8
115.4
kBd
tRISE + tJITTER SMAART bus transition from low to high + edge timing variance
tFALL + tJITTER SMAART bus transition from high to low + edge timing variance
FROM THE TMP107-Q1 TO HOST OR NEXT TMP107-Q1 IN DAISY-CHAIN
15 % of (1/baud)
15 % of (1/baud)
tJITTER
tSKEW
tRISE
Edge timing variance
1
µs
ns
ns
ns
Average phase shift between IO1 and IO2
SMAART bus transition from low to high, 10-pF load
SMAART bus transition from high to low, 10-pF load
33
10
10
tFALL
tBAUD
tRISE
tJITTER
tFALL
VIH
From Host to TMP107
VIL
tBAUD
tJITTER
tRISE
tJITTER
tFALL
tSKEW
tSKEW
From TMP107 to Host
or
From TMP107 to Next
TMP107 in Daisy-Chain
VIH
VIL
tJITTER
Figure 1. Timing Diagram
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7.7 Typical Characteristics
at TA = 25°C and V+ = 3.3 V (unless otherwise noted)
0.6
0.6
0.5
0.4
0.3
0.2
0.1
0
Mean ꢀ 3V
Mean ꢀ 3V
Mean
Mean + 3V
0.5
0.4
0.3
0.2
0.1
0
Mean
Mean + 3V
-0.1
-0.2
-0.3
-0.4
-0.1
-0.2
-0.3
-0.4
-70
-45
-20
5
30
55
80
105 125
-70
-45
-20
5
30
55
80
105 125
Temperature (qC)
Temperature (qC)
One-shot mode, specified from –55ºC to +125ºC only
One-shot mode, V+ = 5.5 V, specified from –55ºC to +125ºC only
Figure 2. Temperature Error vs Temperature
Figure 3. Temperature Error vs Temperature
0.6
300
Mean ꢀ 3V
Mean
0.5
250
200
150
100
50
Mean + 3V
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
0
-70
-45
-20
5
30
55
80
105 125
Temperature (qC)
Temperature Error at 25qC
One-shot mode, V+ = 1.7 V, specified from –55ºC to +125ºC only
Figure 5. Temperature Error Histogram
Figure 4. Temperature Error vs Temperature
1
800
Mean - 3V
Mean
Mean + 3V
0.8
0.6
0.4
0.2
0
700
600
500
400
300
200
100
0
-0.2
-0.4
-0.6
-70
-45
-20
5
30
55
80
105 125
Temperature (qC)
Continuous-conversion mode, maximum conversion rate,
bus inactive
PSR (qC/V)
One-shot mode, V+ = 1.7 V to 5.5 V
Figure 7. Temperature Error vs Temperature
Figure 6. Power-Supply Rejection Histogram
8
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Typical Characteristics (continued)
at TA = 25°C and V+ = 3.3 V (unless otherwise noted)
330
315
300
285
270
255
240
225
210
195
180
165
150
135
120
0.5
5.5V
3.3V
1.7V
0.4
0.3
0.2
0.1
0
-0.1
-0.2
-0.3
-0.4
-0.5
ꢀ55qC
ꢀ20qC
+25qC
+80qC
+125qC
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
-55 -40 -25 -10
5
20 35 50 65 80 95 110 125
Power Supply Voltage (V)
Temperature (qC)
One-shot mode
No bus communication
Figure 8. Temperature Error vs Power Supply Voltage
Figure 9. Continuous-Conversion Current vs Temperature
8
250
5.5 V
3.3 V
1.7 V
5.5 V
4.4 V
3.3 V
2.2 V
1.7 V
225
200
175
150
125
100
75
7
6
5
4
3
2
1
0
50
25
0
-55 -40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (qC)
0
10 20 30 40 50 60 70 80 90 100 110 120
Bus Speed (KBaud)
Shutdown mode
Figure 10. Shutdown Current vs Temperature
Figure 11. Quiescent Current vs SMAART Wire Bus Speed
30
25
20
15
10
5
500
+125C
+25C
ꢀ40C
5.5 V
3.3 V
1.7 V
475
450
425
400
375
350
325
300
275
250
0
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
-55 -40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (qC)
Power Supply Voltage (V)
1 conversion per second
Figure 13. EEPROM Programming (Write) Current
vs Power Supply Voltage
Figure 12. Average Quiescent Current vs Temperature
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Typical Characteristics (continued)
at TA = 25°C and V+ = 3.3 V (unless otherwise noted)
2
6
5
4
3
2
1
0
-55qC
-15qC
+25qC
+75qC
+125qC
V+ = 1.7V
V+ = 3.3V
V+ = 5.5V
1.5
1
0.5
0
-0.5
-1
-1.5
1.5
2
2.5
3
3.5
4
4.5
5
5.5
6
0
5
10
15
20
25
30
35
40
Power Supply Voltage (V)
Alert Pin Sink Current (mA)
Figure 14. Sample Period Drift vs Power Supply Voltage
Figure 15. Alert Pin Sink Current Capability
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8 Detailed Description
8.1 Overview
The TMP107-Q1 is a digital temperature sensor that is optimal for thermal monitoring of large areas over long
distances. The robust UART-compatible SMAART wire interface transfers data over a single wire at distances of
up to 1000 feet (300 meters) between consecutive devices in the chain, and is capable of communicating in a
daisy-chained configuration with up to 32 devices on a single bus.
The TMP107-Q1 supports individual commands to a specific device in the daisy chain, and also supports global
commands that allow multiple TMP107-Q1s in the chain to respond to a single command.
8.2 Functional Block Diagram
V+
R1
R2
Oscillator
EEPROM
100 kꢀꢀ
100 kꢀꢀ
ALERT1
ALERT2
Digital Controls
ALERT
Power-On Reset
I/O1
I/O2
Temperature
Sensor
Input/Output
Thermal
Path
GND
NOTE: The temperature sensor of the TMP107-Q1 is the silicon chip. Thermal paths run through the package leads.
The lower thermal resistance of metal enables the leads to provide the primary thermal path.
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8.3 Feature Description
8.3.1 Digital Temperature Output
The 14-bit digital output from each temperature measurement conversion is stored in the temperature register.
Read two bytes to obtain the data. Table 1 summarizes the temperature data format. Negative numbers are
represented in binary twos complement format. The temperature sensor resolution is 0.015625ºC/LSB.
Table 1. Temperature Data Format
DIGITAL OUTPUT
TEMPERATURE (°C)
BINARY
HEX
1FFF
1900
1408
12C0
C80
640
127.984
100
80
01 1111 1111 1111
01 1001 0000 0000
01 0100 0000 1000
01 0010 1100 0000
00 1100 1000 0000
00 0110 0100 0000
00 0000 0001 0000
00 0000 0000 0000
11 1111 1111 0000
11 1001 1100 0000
11 0010 0100 0000
75
50
25
0.25
0
10
0
–0.25
–25
–55
3FF0
39C0
3240
Use the following rules to obtain the data for a given temperature, and vice versa.
•
•
•
To convert positive temperatures to a digital data format:
Divide the temperature by the resolution. Then, convert the result to binary code with a 14-bit, left-justified
format.
Example: (50°C) / (0.015625°C / LSB) = 3200 = C80h = 00 1100 1000 0000 = C80h
To convert a positive digital data format to temperature:
Convert the 14-bit, left-justified, binary temperature result to a decimal number. Then, multiply the decimal
number by the resolution to obtain the positive temperature.
Example: 00 1100 1000 0000 = C80h = 3200 × (0.015625°C / LSB) = 50°C
To convert negative temperatures to a digital data format:
Divide the absolute value of the temperature by the resolution and convert the result to binary code with a 14-
bit, left-justified format. Then, generate the twos complement of the result by complementing the binary
number and adding one.
Example: (|–25°C|) / (0.015625°C / LSB) = 1600 = 640h = 00 0110 0100 0000
Twos complement format: 11 1001 1011 1111 + 1 = 11 1001 1100 0000 = 39C0h
To convert a negative digital data format to temperature:
•
Generate the twos complement of the 14-bit, left-justified binary number of the temperature result by
complementing the binary number and adding one. This number is the binary representation of the absolute
value of the temperature. Convert to a decimal number and multiply by the resolution to obtain the absolute
temperature, then multiply by –1 for the negative sign.
Example: 11 1001 1100 0000 has a twos complement of 00 0110 0011 1111 + 1 = 00 0110 0100 0000
Convert to temperature: 00 0110 0100 0000 = 640h = 1600; 1600 × (0.015625°C / LSB) = 25°C = (|–25°C|);
(|–25°C|) × (–1) = –25°C
12
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8.3.2 Temperature Limits and Alert
The TMP107-Q1 has two ALERTx pins (ALERT1 and ALERT2) for under- and overtemperature monitor
functions. Both pins have independent, dynamically-programmable limits. At the end of each conversion, the
temperature result is compared with the high limit and low limit registers. If the temperature is outside the limit
window, the respective ALERTx pin trips. There are two polarity bits that set the active state of the ALERTx pin.
The TMP107-Q1 has two flag bits (FHx and FLx) for each alert condition to indicate in which direction the
temperature has moved outside of the limit window.
There are two operating modes used for alerts and flags: therm and alert. In therm mode, the ALERTx pins and
FHx and FLx flags are outputs of a transparent comparator. In alert mode, the ALERTx pins and FHx and FLx
flags are latched interrupts. Select between alert mode or therm mode by using the Tx/Ax (T1/A1 and T2/A2) bits
in the configuration register.
In alert mode (Tx/Ax = 0, default), the high and low limits form a temperature window. At the end of a conversion,
if the temperature result exceeds the high limit or is less than the low limit, the respective flag (either FHx or FLx)
and the ALERTx pin are asserted. If the alert outputs of multiple TMP107-Q1s are connected together, the
TMP107-Q1 tripped alerts are still identifiable. To clear the ALERTx pin, issue a global alert clear x command, or
read the configuration register as shown in Figure 16. To clear the FHx or FLx flag, read the configuration
register. Alert-mode operation is shown in Figure 16.
High Limit
Low Limit
Measured
Temperature
FHx
FLx
Configuration and Temperature
Register Reads
ALERTx Pin
Global Alert Clear x Command
Time
Figure 16. ALERTx Pin Behavior in Alert Mode (POLx = 0)
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In therm mode (Tx/Ax = 1), the high and low limits are used to form an upper-limit threshold detector. If the
temperature result exceeds the high limit, the FHx flag and the ALERTx pin are asserted. The FHx flag and the
ALERTx pin are then deasserted only after the temperature falls below the low limit. In therm mode, only the FHx
flag is active. The FLx flag always reads 0. In therm mode, ALERTx and the flags are asserted and deasserted
only at the end of a conversion and cannot be cleared by a configuration register read or global alert clear x
command. Figure 17 shows therm-mode operation.
High Limit
Low Limit
Measured
Temperature
FHx
FLx (Always 0)
Configuration and Temperature
Register Reads
ALERTx Pin
Global Alert Clear x Command
Time
Figure 17. ALERTx Pin Behavior in Therm Mode (POLx = 0)
The limit registers default values are programmed in the EEPROM, and are acquired during power up or reset.
The values can be dynamically changed by writing to the register. Disable alert and flag functionality by
programming the high limit register to the highest temperature (7FFCh) and the low limit register to the lowest
temperature (8000h). When disabled, the alert pins can still be controlled by polarity bits POL1 and POL2 (bit 7
and bit 3, respectively, in the configuration register) so that they work like general-purpose outputs (GPOs).
8.3.2.1 ALERT1, ALERT2, R1, and R2 Pins
ALERT1 and ALERT2 are open-drain output pins that require pullup resistors to operate properly. The TMP107-
Q1 contains internal 100-kΩ pullup resistors connected between pins ALERT1 and R1, and pins ALERT2 and
R2. To use the internal pullup resistors, connect pins R1 and R2 to V+, or to a voltage suitable for use with
pullup resistors in the system. If external pullup resistors are used, float pins R1 and R2.
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8.3.3 SMAART Wire Communication Interface
The TMP107-Q1 uses a TI proprietary, one-wire, UART-compatible, bidirectional, communication protocol called
SMAART wire. It is a true one-wire communication protocol where the host can communicate with multiple daisy-
chained TMP107-Q1 devices. The host device can be an off-the-shelf UART transceiver, or a microcontroller in
which communication is performed by bit banging of the GPIO pins. When bit banging, follow the communication
protocol format and specified parameters. All TMP107-Q1 devices have the default device addresses set to 0h.
After the devices are assembled in a daisy-chain configuration per the application requirements, the host must
send the address-initialize command. This command initializes the daisy-chain so that all of the devices in the
chain are assigned a unique incremental address respective to their position from the host controller (see the
Address Initialize section for more information). The generated device addresses are stored in the internal
EEPROM memory of each TMP107-Q1 in the chain. After the address initialization process is completed, the
TMP107-Q1 devices restore their addresses from their respective EEPROM memories upon reset events.
After the daisy-chain is initialized with the address-initialize command operation, the host device can perform
individual read and write operations to any device in the daisy chain by directly addressing that device. The host
can also perform global read, global write, or global software reset operations on all devices in the daisy chain.
The inactive state of the bus is logic high. Every communication operation in the SMAART wire protocol consists
of multiple 10-bit words. Each word is transferred least significant bit (LSB) first, with a start bit that is logic low in
the beginning, a stop bit that is logic high in the end, and 8-bit data located between the start and stop bits. Each
phase consists of one or more words that are transferred least significant word first. By using a start bit and stop
bit for each word, the TMP107-Q1 devices can detect the start of every word and maintain synchronous
communication. SMAART wire protocol communication is divided into two categories: address operations and
command operations. Address operations are used to perform individual and multiple device read and write
operations. Command operations are address initialize, last device polling, and global software reset operations.
Figure 18 shows the top-level phase sequences for the two types of operation. Detailed descriptions with timing
diagrams are provided.
Address Operation
Calibration Phase
Command and Address Phase
Register Pointer Phase
Data Phase
Command Operation
Calibration Phase
Command and Address Phase
Data Phase
Figure 18. Address and Command Operations
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8.3.3.1 Communication Protocol
Only the host initiates communication. Before communication begins, all the daisy-chained devices are in
transparent mode. In this mode, all the host operations are sequentially transferred to all the devices in the chain.
The devices in the chain cannot communicate with each other with the exception of the address initialize
command. After initialization, the devices in the chain are in one of the following four modes:
•
•
•
•
wait for a command from the host (default mode)
transmit the device data back to the host
transmit the commands from the host to the subsequent device in the chain
transmit the data from the subsequent device back to the host
8.3.3.1.1 Calibration Phase
The calibration phase is the first phase of every communication, and consists of the host sending 10-bits, as
shown in Figure 19. Pull the line low in the beginning to notify each device that the host is initiating
communication. Next, the host transmits calibration sequence 55h at the desired communication baud rate. The
connected devices receive this calibration byte and calculate the baud rate to communicate with the host. This
calibration byte is sent at the beginning of every operation; therefore, each address or command operation can
be performed at a different baud rate.
1
0
1
0
1
0
1
0
P
S
Figure 19. Calibration Phase
8.3.3.1.2 Command and Address Phase
The second phase of every communication is the command and address phase. The values of the bits in this
phase determine the format and structure of subsequent phases in the communication operation. Table 2 lists
the command and address phase values.
Table 2. Command and Address Phase Values
COMMAND AND ADDRESS PHASE VALUES
COMMAND AND
ADDRESS OPERATIONS
0
1
2
3
4
5
6
7
HEX VALUE
G/nI
AC4
(LSB)
R/nW
C/nA
AC0
0
AC1
1
AC2
0
AC3
0
(MSB)
Address initialize
Last device poll
Global software reset
Global alert clear 1
Global alert clear 2
Global read
1
1
1
1
1
1
1
0
0
0
1
0
0
0
1
0
1
0
1
1
1
1
1
0
0
0
0
1
0
95
0
1
0
1
57
1
1
0
1
0
5D
0
1
1
0
1
B5
0
1
1
1
0
75
A0
A0
A0
A0
A1
A1
A1
A1
A2
A2
A2
A2
A3
A3
A3
A3
A4
A4
A4
A4
Varies based on A0-A4
Varies based on A0-A4
Varies based on A0-A4
Varies based on A0-A4
Global write
Individual read
Individual write
8.3.3.1.2.1 Global or Individual (G/nI) Bit
The G/nI bit indicates if the communication is a global operation (intended for more than one device) or individual
(intended for only one device).
All command operations are global; therefore, for command operations, always set the G/nI bit to 1.
For read and write address operations to multiple devices in the daisy chain simultaneously, set this bit to 1. To
access an individual device, set the G/nI bit to 0.
During global operation, the host sets the address portion of the command to the maximum address required to
perform the communication. For example, to perform a write to the high-limit register of all devices between
addresses 1h to 5h in the daisy chain, set the G/nI bit to 1 and the address field to 5h. For individual accesses,
set the address field to the desired device address.
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8.3.3.1.2.2 Read/Write (R/nW) Bit
The R/nW bit indicates whether the operation is read or write to the TMP107-Q1 device.
8.3.3.1.2.3 Command or Address (C/nA) Bit:
The C/nA bit indicates whether the current communication is a command operation or address operation. The
C/nA bit = 1 indicates a command operation. The codes for specific commands in the TMP107-Q1 are listed in
Table 2. Codes other than those listed in Table 2 are reserved for factory use only.
The C/nA bit = 0 indicates an address operation. The five bits following the C/nA bit (A4 to A0) are the address
bits of the device or devices that the host intends to communicate with in the chain, as shown in Figure 20.
Command Phase
C/nA
=1
R/nW
G/nI
C0 C1 C2 C3 C4
P
S
P
P
Address Phase
C/nA
=0
R/nW
S
G/nI
A0 A1
A2 A3
A4
P
Figure 20. Command and Address Phase
8.3.3.1.3 Register Pointer Phase
The register pointer phase is provided only if the communication is an address operation. This phase of the
communication shows the register pointer of the device that the host in going to write to or read from. The pointer
byte has special identification code bits, as shown in Figure 21.
P0 P1 P2 P3
0
1
0
1
S
P
P
Figure 21. Register Pointer Phase
8.3.3.1.4 Data Phase
The data phase is the last phase of communication. Every register location consists of two words of data.
Therefore, this last phase of communication consists of at least two bytes of data with the least significant byte
sent first, followed by the most significant byte.
For a write operation, the host sends data to the device or devices at the specified register pointer location.
For a read operation, the specified device or devices respond back with the data from the location specified in
the register pointer phase.
Depending on the value of G/nI bit in the command and address phase, the data in this phase are either written
to a targeted individual device, or to multiple devices in the daisy-chain. Individual and global read or write
operations are explained in more detail in subsequent sections. Figure 22 shows a diagram of the data phase.
P
S
D0 D1 D2 D3 D4 D5 D6 D7
D8 D9 D10 D11 D12 D13 D14 D15
P
S
P
Data Byte 2
Data Byte 1
Figure 22. Data Phase for an Individual Read or Write Scenario
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8.3.3.2 SMAART Wire Operations
This section describes various types of communication operations and is illustrated with timing diagrams. The
diagrams in this section are used only to understand functional aspects of the communication; for timing aspects,
see the Timing Requirements table. The color of the phases in Figure 23 through Figure 29 indicates the
direction of the communication. The communication phases marked in black indicate the host controller is driving
the bus. The communication phases marked in red indicate one of the devices in the daisy chain is responding to
the host by driving the bus. The device communicates to the host controller through intermediate devices. The
intermediate devices are automatically configured as buffers to allow data to pass through from the I/O2 pin to
the I/O1 pin, and vice versa.
8.3.3.2.1 Command Operations
8.3.3.2.1.1 Address Initialize
The address-initialize command initializes the addresses of the devices in the daisy chain. This command must
be performed one time because the addresses are stored in the devices EEPROM and loaded on every reset
event.
After the address-initialize command phase, the host provides one word of address-assign, command-byte data,
as shown in Figure 23. This word contains the desired address of the first device on the daisy chain in the A4:A0
field. Although any value from 0 to 31 is allowed for this field, it is recommended to keep first device address at
01h. The last device address must never exceed 31. After the address-assign command bytes have been
transmitted by the host, the daisy chain goes through a sequence of position detection and self-programming
events where the devices in the chain identify their respective locations on the bus. During this process, the host
receives incremental address response data from the individual TMP107-Q1 devices in the daisy chain that
indicate the point in the chain up to which the address assignment has been completed. These responses arrive
at intervals of 7 ms. This procedure is represented in Figure 23.
AC0 AC1 AC2 AC3 AC4
G/nI R/nW C/nA
1
0
1
0
1
0
1
0
1
0
1
0
1
0
0
1
S
P
S
P
Calibration Byte (55h)
Command Phase
7 ms
7ms
S
S
1
0
1
A0
A1
A2
A3
A4
P
P
1
1
0
A0 A1
A2 A3
A4
Address Response Byte from Sensor 1
Address Assign Byte
7 ms
7ms
7 ms
7ms
S
S
P
P
1
1
0
A0 A1
A2 A3
A4
1
1
0
A0 A1
A2 A3
A4
Address Response Byte from Sensor 2
Address Response Byte from Sensor N
Figure 23. Address-Initialize Command
Until the initialization process is completed, daisy-chain communication is directed toward the host. Do not send
any new commands to the chain during this period. If the address initialization sequence is interrupted as a result
of glitches or disconnects in the daisy chain, the devices stall communication. In the event of a stall, each device
has an internal timeout of one second (only for the address-initialize command). After one second, the
communication interface in the TMP107-Q1 device resets, and the host regains control of the chain. Float the
I/O2 pin of the last device in the chain. The address initialization procedure occurs serially from one device to the
next; therefore, the maximum current consumed by the chain must not exceed the current required to initialize
one device.
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8.3.3.2.1.2 Last Device Poll
When the host issues a last-device-poll command, the last sensor on the initialized daisy chain responds back
with the last device address, as shown in Figure 24. The last-device-poll command is also used to check if the
daisy-chain address set is intact. If the daisy chain is not intact, the host does not receive a response to the last-
device-poll command. This command only works if the last device in the chain was the last device during
initialization. For example, if there are ten devices in the chain during address initialization and two devices are
removed, running this command does not provide the host with the address of device eight. Device eight was not
the last device during chain initialization, so it cannot report that device eight is the last device in the chain. In
this example, the command is not answered.
G/nI R/nW C/nA AC0 AC1 AC2 AC3 AC4
1
0
1
0
1
0
1
0
P
1
1
1
0
1
0
1
0
P
S
S
S
1
1
0
A0 A1
A2
A3 A4
P
Address Response Byte from Sensor N
Figure 24. Last-Device-Poll Command
8.3.3.2.1.3 Global Software Reset
Use the global-software-reset command to issue a software reset to the chain in order for the devices to load the
power-on reset values from EEPROM and clear the temperature result register. This command performs the
same function as writing a 1 to RST (bit 1 in the configuration register). The sequence of this command is shown
in Figure 25.
AC0 AC1 AC2 AC3 AC4
G/nI R/nW C/nA
1
0
1
1
1
0
1
0
S
1
0
1
0
1
0
1
0
P
S
P
Figure 25. Global Software Reset Command
8.3.3.2.2 Address Operations
8.3.3.2.2.1 Individual Write
Use the individual write operation to write data to a specific register in a specific device in the daisy chain, as
shown in Figure 26.
G/nI R/nW
C/nA
0
0
0
A0
A1 A2
A3 A4
1
0
1
0
1
0
1
0
0
1
0
1
S
P
S
P
S
P
P0 P1
P2 P3
Calibration Byte (55h)
Command and Address Phase
Register Pointer Phase
P
S
D0 D1 D2 D3 D4 D5 D6 D7
P
S
D8 D9 D10 D11 D12 D13 D14 D15
P
Data Byte 2
Data Byte 1
Figure 26. Individual Write Operation
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8.3.3.2.2.2 Individual Read
Use the individual read operation to read the value of a register in a single device in the daisy chain, as shown in
Figure 27. There is delay of up to 1.5 baud before the device responds back to the host. The host reads the data
from the device by synchronizing to the falling edge of the start bit.
G/nI R/nW
C/nA
0
0
1
A0
A1 A2 A3 A4
S
1
0
1
0
1
0
1
0
P
S
P
Calibration Byte (55h)
Command and Address Phase
1.5 Bd
7ms
S
D0 D1 D2 D3 D4 D5 D6 D7
P
S
D8 D9 D10 D11 D12 D13 D14 D15
P
S
P0 P1
P2 P3
0
1
0
1
P
Data Byte 1
Data Byte 2
Register Pointer Phase
Figure 27. Individual Read Address Operation
8.3.3.2.2.3 Global Write
Use the global write operation to write data to a specific register in multiple parts. The sequence of the
communication is shown in Figure 28. Data in this operation are written to the registers in all the devices from the
first device to the address specified in the address field of the command and address phase.
G/nI R/nW
C/nA
1
0
0
A0 A1
A2 A3
A4
P0 P1 P2 P3
0
1
0
1
P
S
1
0
1
0
1
0
1
0
P
S
P
S
Calibration Byte (55h)
Command and Address Phase
Register Pointer Phase
P
S
D0 D1 D2 D3 D4 D5 D6 D7
P
S
D8 D9 D10 D11 D12 D13 D14 D15
P
Data Byte 1
Data Byte 2
Figure 28. Global Write Operation
8.3.3.2.2.4 Global Read
Use the global read address operation to read the value of the register pointed to by the Register Pointer Phase
section. The daisy chain returns data starting from the address specified in the command or address phase, and
ending with the address of the first device in the daisy chain. The data phase of the global read address
operation is different from other address operations because the data phase consists of data read back from
every device on the bus between the addressed device and first device, as shown in Figure 29. If the address
specified exceeds the address of the last device, the operation halts and the bus times out after 35 ms. There is
a delay of up to 1.5 baud before the devices respond back to the host. The host reads the data from the devices
by synchronizing to the falling edge of the start bits.
1.5 Bd
7ms
G/nI R/nW
C/nA
0
A0 A1 A2 A3 A4
1
1
P0 P1 P2 P3
0
1
0
1
1
0
1
0
1
0
1
0
P
S
P
S
P
S
Calibration Byte (55h)
Command and Address Phase (A4:A0 = N)
Register Pointer Phase
1.5 Bd
7ms
D8 D9 D10 D11 D12 D13 D14 D15
D0 D1 D2 D3 D4 D5 D6 D7
S
P
S
P
Data Byte 2 (From Device N)
Data Byte 1 (From Device N)
1.5 Bd
7ms
D8 D9 D10 D11 D12 D13 D14 D15
D0 D1 D2 D3 D4 D5 D6 D7
S
P
S
P
Data Byte 2 (From Device N - 1)
Data Byte 1 (From Device N - 1)
1.5 Bd
7ms
D8 D9 D10 D11 D12 D13 D14 D15
D0 D1 D2 D3 D4 D5 D6 D7
S
S
P
P
S
S
P
P
Data Byte 2 (From Device N - 2)
Data Byte 1 (From Device N - 2)
D8 D9 D10 D11 D12 D13 D14 D15
D0 D1 D2 D3 D4 D5 D6 D7
Data Byte 2 (From Device 1)
Data Byte 1 (From Device 1)
Figure 29. Global Read Operation
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8.4 Device Functional Modes
8.4.1 Continuous-Conversion Mode
Continuous conversion is the default operating mode for the TMP107-Q1. In continuous-conversion mode, the
TMP107-Q1 continuously measures temperature (see Table 6). After each temperature conversion, the
temperature register updates with the conversion result, and the configuration register updates with the alert
flags.
8.4.2 Shutdown Mode
Shutdown mode minimizes power dissipation because the TMP107-Q1 shuts down all of the internal active
circuitry except for those that are required to allow communication with the device. During shutdown mode, all
registers can be read from or written to. To trigger a single temperature conversion in shutdown mode, issue a
one-shot command (see the One-Shot Mode section for more details). When the conversion is complete, the
TMP107-Q1 returns to shutdown mode.
8.4.3 One-Shot Mode
One-shot mode triggers single temperature measurements by writing a 1 to OS (bit 12 in the configuration
register) when the device is in shutdown mode. Following the completion of the single temperature conversion,
the TMP107-Q1 returns to shutdown mode. Reading the OS bit always results in a 0. Use one-shot mode to
achieve the lowest power consumption. For highest power savings and accuracy, do not communicate through
the I/O bus during this mode.
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8.5 Programming
8.5.1 EEPROM
The TMP107-Q1 has an internal EEPROM that is used to program and store values for writable registers, such
as the configuration, high limit, and low limit registers. The EEPROM also has eight, 16-bit locations of general-
purpose memory. By programming the configuration register, the EEPROM is used to store critical, system
information, such as unique calibration information for the host, unique system serial ID, or a user-specific
conversion rate. During the reset event, the data from the EEPROM are copied into the corresponding registers.
Two registers that are not updated by the EEPROM are the temperature register and die identification register.
The electrical and timing specifications for the EEPROM are provided in the Specifications section. See Table 3
for the register map to the eight, internal EEPROM locations (register addresses 6h to Dh).
8.5.2 EEPROM Operations
8.5.2.1 EEPROM Unlock
After power up, the EEPROM is locked for programming by default. When locked, all writes to the EEPROM are
ignored. In order to program the EEPROM, first unlock the memory for programming by writing logic 1 to NUS
(bit 0 in the temperature register) using a regular write communication. EEPROM locations are readable whether
locked or unlocked. Locking the EEPROM by default is a protection provided to prevent unintentional triggering
of EEPROM programming during normal device operations.
8.5.2.2 EEPROM Lock
If the EEPROM is unlocked for programming, make sure to lock the EEPROM after the programming operations.
Lock the EEPROM by writing logic 0 to NUS (bit 0 in the temperature register).
8.5.2.3 EEPROM Programming
After the EEPROM is unlocked, a write to any EEPROM-associated register triggers EEPROM programming. A
programming event takes up to 16 ms, depending on the device conditions; therefore, space out successive
commands in 16-ms write periods.
Poll BUSY (bit 1 in the temperature register) to check the EEPROM programming status. The BUSY bit = 1 when
the EEPROM program is in progress. The BUSY bit = 0 after programming is complete and the EEPROM is
ready for another program operation. While the EEPROM is being programmed, writes to every other register are
prevented in order to protect device data from corruption until programming is complete.
When the global write operation is issued to program the EEPROM locations, all of the devices in the daisy chain
specified within the address field perform the programming simultaneously. This simultaneous programming
leads to an increase in current in the supply wire of the daisy chain, and may create a drop in the supply voltage.
It is important to maintain the supply voltage at greater than 1.8 V during the EEPROM programming in order to
program devices in the daisy chain.
8.5.2.4 EEPROM Acquire or Read
The EEPROM locations that store the power-on reset values of the registers are automatically loaded into the
corresponding registers at reset. The general-purpose EEPROM locations are readable even when the EEPROM
is locked. While a read is performed on an EEPROM location in the register map, there is a slightly longer delay
in the stop bit (~100 µs) between the pointer phase and the phase data in the communication in order to allow
the EEPROM to be read. The standard UART protocol allows for such delays when the UART transceiver is
being used. The amount of current consumption from the EEPROM read is negligible compared to the current
consumption from communication.
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8.6 Register Map
Figure 30 shows the internal register structure of the TMP107-Q1.
Command and
Register
Pointer
Temperature
Register
I/O1
I/O2
I/O
Control
Interface
Configuration
and
Limit
Registers
EEPROM
Figure 30. Register Structure
Table 3 describes the registers available with their addresses, followed by the description of the bits in each
register. All register default values (except for the temperature register and die ID register) can be modified by
writing to the EEPROM. All reset values listed are the factory-default values.
Table 3. Register Map and Pointer Addresses
ADDRESS
(HEX)
P3
P2
P1
P0
REGISTER NAME
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
1
0h
Temperature register
1h
Configuration register
High limit 1
2h
3h
Low limit 1
4h
High limit 2
5h
Low limit 2
6h
EEPROM 1 register
EEPROM 2 register
EEPROM 3 register
EEPROM 4 register
EEPROM 5 register
EEPROM 6 register
EEPROM 7 register
EEPROM 8 register
Die identification (read only)
7h
8h
9h
Ah
Bh
Ch
Dh
Fh
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8.6.1 Temperature Register (address = 0h) [reset = 0h]
The temperature register of the TMP107-Q1 is configured as a 16-bit register that stores the output of the most
recent conversion and two status bits. Two bytes must be read to obtain data, and they are described in
Figure 31. The upper 14 bits are used to indicate temperature. One LSB equals 0.015625°C. The temperature is
represented in binary twos complement format. Following power-up or reset, the temperature register reads 0°C
until the first conversion is complete. The remaining two bits indicate the EEPROM status. When the EEPROM is
locked, the EEPROM cannot be programmed and all writes to the EEPROM addresses are ignored. By default,
the EEPROM is locked for programming at power-on reset and must be unlocked in order to be programmed.
Figure 31. Temperature Register
15
14
13
12
11
T9
10
T8
9
8
T13
T12
T11
T10
T7
T6
R-0h
7
6
5
4
3
2
1
0
T5
T4
T3
T2
T1
T0
BUSY
R-0h
NUS
R-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
R/W-0h
Table 4. Temperature Register Field Descriptions
Bit
15-2
1
Field
Type
R
Reset
0h
Description
T13-T0
BUSY
Temperature result (resolution of 0.015625°C). Range: –128°C to +128°C.
R
0h
This bit indicates the status of the EEPROM.
0: Indicates that the EEPROM is ready; the EEPROM has finished the last
transaction and is ready to accept new commands.
1: Indicates that the EEPROM is busy completing a command and must not be given
more commands. Any new commands given to the EEPROM are ignored by the
EEPROM controller.
0
NUS
R/W
0h
EEPROM unlock state.
0: EEPROM locations are locked for programming.
1: EEPROM locations are unlocked for programming.
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8.6.2 Configuration Register (address = 1h) [reset = A000h]
The configuration register is a read and write register used to store bits that control the part operation. The
format and power-up or reset value of the configuration register for the TMP107-Q1 is shown in Figure 32 and
Table 5. When the NUS bit is 0, all writes to this register are stored in register logic. When NUS is 1, then all
writes to this register program the EEPROM location that stores the configuration bits. Writes to this location are
followed by a 16-ms wait period for programming the EEPROM. When the configuration register is written, the
current conversion is aborted and new action is taken based on the new written bits. Thus, if the TMP107-Q1 is
put into shutdown, the device goes into shutdown immediately. If the conversion rate is changed, any ongoing
conversion is aborted and a new conversion starts with the new conversion rate.
Figure 32. Configuration Register
15
14
13
12
OS
11
SD
10
9
8
CR2
CR1
CR0
FH1
R-0h
FL1
R-0h
T1/A1
R/W-0h
R/W-5h
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
POL1
R/W-0h
FH2
R-0h
FL2
R-0h
T2/A2
R/W-0h
POL2
R/W-0h
Reserved
R-0h
RST
W-0h
Reserved
R-0h
LEGEND: R/W = Read/Write; R = Read only; W = Write only; -n = value after reset
Table 5. Configuration Register Field Descriptions
Bit
Field
Type
Reset
Description
15-13
CR2-CR0
R/W
5h
Conversion rate.
The conversion rate bits control the update rate of the analog-to-digital converter
(ADC). Table 6 describes the relationship between the values of the conversion rate
bits and the corresponding conversion time and average quiescent current. These
bits only affect continuous-conversion mode and not one-shot mode.
12
11
OS
SD
R/W
R/W
0h
0h
One-shot mode.
0: Default.
1: Starts a single temperature conversion if the SD bit is set to 1. The TMP107-Q1
returns to the shutdown state at the completion of the single conversion. When the
configuration register is read, OS always reads zero.
Shutdown mode.
0: The TMP107-Q1 is in continuous-conversion mode.
1: The TMP107-Q1 is in shutdown mode. Initiate a conversion by writing a 1 to the
OS bit.
10
9
FH1
FL1
R
R
0h
0h
High limit 1 flag.
0: Indicates that the temperature result does not exceed high limit 1.
1: Indicates when the temperature result exceeds high limit 1.
Low limit 1 flag. In therm mode, this bit is not used and always reads 0.
0: In alert mode, this bit indicates that the temperature result is greater than low limit
1.
1: In alert mode, this bit indicates when the temperature result is less than low limit 1.
8
T1/A1
R/W
0h
Alert and therm mode 1.
0: Alert mode: In this mode, the high limit 1 and low limit 1 form a window. If the
temperature result is greater than high limit 1 or less than low limit 1, the respective
flag (either FH1 or FL1) is asserted. After the flag is asserted, clear the flag by
reading the configuration register.
1: Therm mode: In this mode, the limits are used to form an upper limit threshold
detector. If the temperature result is greater than high limit 1, the FH1 flag is
asserted. The FH1 flag is then deasserted only after the temperature drops below
low limit 1. In therm mode, only the FH1 flag is active. The FL1 flag always reads 0.
In this mode, the flags are asserted and deasserted only at the end of a conversion
and cannot be cleared by a configuration register read.
7
6
POL1
FH2
R/W
R
0h
0h
0: Polarity of the ALERT1 pin is active low.
1: Polarity of the ALERT1 pin is active high.
High limit 2 flag.
0: Indicates that the temperature result does not exceed high limit 2.
1: Indicates when the temperature result exceeds high limit 2.
5
FL2
R
0h
Low Limit 2 Flag. In therm mode, this bit is not used and always reads 0.
0: In alert mode, this bit indicates that the temperature result is greater than low limit
2.
1: In alert mode, this bit indicates when the temperature result is less than low limit 2.
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Table 5. Configuration Register Field Descriptions (continued)
Bit
Field
Type
Reset
Description
4
T2/A2
R/W
0h
Alert and therm mode 2.
0: Alert mode: in this mode, the high limit 2 and low limit 2 form a window. If the
temperature result is greater than high limit 2 or less than low limit 2, the respective
flag (either FH2 or FL2) is asserted. After the flag is asserted, clear the flag by
reading the configuration register.
1: Therm mode: in this mode, the limits are used to form an upper limit threshold
detector. If the temperature result is greater than high limit 2, the FH2 flag is
asserted. The FH2 flag is then deasserted only after the temperature drops below
low limit 2. In therm mode, only the FH2 flag is active. The FL2 flag always reads 0.
In this mode, the flags are asserted and deasserted only at the end of a conversion
and cannot be cleared by a configuration register read.
3
POL2
R/W
0h
0: Polarity of the ALERT2 pin is active low.
1: Polarity of the ALERT2 pin is active high.
2
1
Reserved
RST
R
0h
0h
Reserved
W
Software reset.
0: Default.
1: Reset. This bit is a write-only bit and is used to perform a software reset on the
TMP107-Q1.
0
Reserved
R/W
0h
Reserved
Table 6. Conversion Rates
CONVERSION
PERIOD
CONVERSIONS PER
SECOND
AVERAGE IQ
(V+ = 3.3 V)
CR2
CR1
0
CR0
0
0
0
0
0
1
1
1
1
15 ms
50 ms
62
200 µA
20 µA
15 µA
11 µA
9 µA
0
1
20
1
0
100 ms
250 ms
500 ms
1 s (default)
4 s
10
4
1
1
0
0
2
0
1
1 (default)
0.25
7 µA
1
0
6 µA
1
1
16 s
0.0625
5 µA
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8.6.3 High Limit 1 Register (address = 2h) [reset = 7FFCh]
Figure 33. High Limit 1 Register
15
14
13
12
11
10
9
8
TH1_13
TH1_12
TH1_11
TH1_10
TH1_9
TH1_8
TH1_7
TH1_6
R/W-7Fh
7
6
5
4
3
2
1
0
TH1_5
TH1_4
TH1_3
TH1_2
TH1_1
TH1_0
Reserved
R-0h
R/W-3Fh
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 7. High Limit 1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-2
TH1_13-TH1_0
R/W
1FFFh
High limit for alert function 1. Resolution is 0.015625°C. Data is in twos complement
form.
1-0
Reserved
R
0h
Reserved
8.6.4 Low Limit 1 Register (address = 3h) [reset = 8000h]
Figure 34. Low Limit 1 Register
15
14
13
12
11
10
9
8
TL1_13
TL1_12
TL1_11
TL1_10
TL1_9
TL1_8
TL1_7
TL1_6
R/W-80h
7
6
5
4
3
2
1
0
TL1_5
TL1_4
TL1_3
TL1_2
TL1_1
TL1_0
Reserved
R-0h
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 8. Low Limit 1 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-2
TL1_13-T1_L0
R/W
2000h
Low limit for alert function 1. Resolution is 0.015625°C. Data is in twos complement
form.
1-0
Reserved
R
0h
Reserved
8.6.5 High Limit 2 Register (address = 4h) [reset = 7FFCh]
Figure 35. High Limit 2 Register
15
14
13
12
11
10
9
8
TH2_13
TH2_12
TH2_11
TH2_10
TH2_9
TH2_8
TH2_7
TH2_6
R/W-7Fh
7
6
5
4
3
2
1
0
TH2_5
TH2_4
TH2_3
TH2_2
TH2_1
TH2_0
Reserved
R-0h
R/W-3Fh
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 9. High Limit 2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-2
TH2_13-TH2_0
R/W
1FFFh
High limit for alert function 2. Resolution is 0.015625°C. Data is in twos complement
form.
1-0
Reserved
R
0h
Reserved
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8.6.6 Low Limit 2 Register (address = 5h) [reset = 8000h]
Figure 36. Low Limit 2 Register
15
14
13
12
11
10
9
8
TL2_13
TL2_12
TL2_11
TL2_10
TL2_9
TL2_8
TL2_7
TL2_6
R/W-80h
7
6
5
4
3
2
1
0
TL2_5
TL2_4
TL2_3
TL2_2
TL2_1
TL2_0
Reserved
R-0h
R/W-0h
LEGEND: R/W = Read/Write; R = Read only; -n = value after reset
Table 10. Low Limit 2 Register Field Descriptions
Bit
Field
Type
Reset
Description
15-2
TL2_13-TL2_0
R/W
2000h
Low limit for alert function 2. Resolution is 0.015625°C. Data is in twos complement
form.
1-0
Reserved
R
0h
Reserved
8.6.7 EEPROM n Register (where n = 1 to 8) (addresses = 6h to Dh) [reset = 0h]
Figure 37. EEPROM Register
15
14
13
12
11
10
9
8
EEn_15
EEn_14
EEn_13
EEn_12
EEn_11
EEn_10
EEn_9
EEn_8
R/W-0h
R/W-0h
7
6
5
4
3
2
1
0
EEn_7
EEn_6
EEn_5
EEn_4
EEn_3
EEn_2
EEn_1
EEn_0
LEGEND: R/W = Read/Write; -n = value after reset
Table 11. EEPROM Register bits
Bit
Field
Type
Reset
Description
15-8
EEn_15-EEn_0
R/W
0h
16-bit programable EEPROM. Only available for programming when NUS (bit 0
in the temperature register) is set to 1. Writes to this location with the NUS bit
set to 0 are ignored.
8.6.8 Die ID Register (address = Fh) [reset = 1107h]
Figure 38. Die ID Register
15
14
13
12
11
10
9
8
D15
D14
D13
D12
D11
D10
D9
D8
R-11h
R-07h
7
6
5
4
3
2
1
0
D7
D6
D5
D4
D3
D2
D1
D0
LEGEND: R = Read only; -n = value after reset
Table 12. Die ID Register Field Descriptions
Bit
Field
Type
Reset
Description
15-0
D15 - D0
R
1107h
The die ID register is a read-only register.
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9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TMP107-Q1 is a digital temperature sensor that is optimal for thermal monitoring of large areas and over
long distances between the host and the sensors. The SMAART-wire interface of the TMP107-Q1 allows for data
transfer over a single wire at distances of up to 1000 feet (300 meters) between consecutive devices in the
chain.
9.2 Typical Applications
9.2.1 Connecting Multiple Devices
Figure 39 shows typical connections for TMP107-Q1 devices in a daisy-chain configuration.
1.7 V to 5.5 V
Sensor 1
Sensor 2
Sensor N
V+
0.1 ꢁF
4.1 kꢀ
10 ꢀ
TMP107
TMP107
TMP107
1
2
3
8
7
6
1
2
3
8
7
6
1
2
8
7
V+
R1
R2
V+
R1
R2
V+
R1
R2
MCU
I/O2
I/O2
I/O2
TX
UART
0.1 ꢁF
0.1 ꢁF
0.1 ꢁF
3
4
6
5
I/O1
ALERT2
I/O1
ALERT2
GND
I/O1
ALERT2
4
5
4
5
GND
ALERT1
100 ꢀ
ALERT1
GND
ALERT1
RX
GND
NOTE: Bold resistors represent wire resistance.
Figure 39. Connecting Multiple Devices
9.2.1.1 Design Requirements
To avoid any bus contention between the host and the TMP107-Q1 devices, use a tri-state buffer, such as the
SN74LVC1G125. Use a 100-Ω resistor (typical) in series with the RX input to limit the amount of current in case
of overshoot. A 10-Ω resistor (typical) between the tri-state buffer and the first TMP107-Q1 device reduces any
signal collisions between the buffer and the TMP107-Q1 by limiting the amount of current flow. The pullup
resistor at the output of the tri-state buffer defines the baud rate of communication. Use a 4.1-kΩ pullup resistor,
as shown in Figure 39, to support the entire baud rate range specified in the Timing Requirements. A 0.1-μF
bypass capacitor is recommended for each TMP107-Q1 device in the daisy-chain.
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Typical Applications (continued)
9.2.1.2 Detailed Design Procedure
Multiple devices are connected with cables in this typical application. The maximum cable length between two
TMP107-Q1 devices can vary because of the effective resistance and capacitance of the type of cable used in a
customer application.
9.2.1.2.1 Voltage Drop Effect
Take into account the voltage drop that occurs along the supply and ground lines as a result of the currents of all
the devices on the line. This voltage drop occurs as a result of multiple devices simultaneously consuming
current through the combined resistance of the common wire, connectors, and solder contacts. Make sure that
the supply on the last device does not fall below the minimum operating supply of 1.7 V during any mode of
operation, or below 1.8 V during EEPROM programming and chain initialization.
9.2.1.2.2 EEPROM Programming Current
Another parameter to consider is the EEPROM programming current. The device consumes higher current
during EEPROM programming than during regular operation, as specified in the Electrical Characteristics
section. This higher current consumption results in a larger voltage drop along the supply and ground lines and
may lead to similar issues as mentioned previously. To avoid large, simultaneous, programming currents from
multiple devices, program the EEPROM on the devices using the individual write commands instead of the global
write commands.
9.2.1.2.3 Power Savings
In continuous-conversion mode, the TMP107-Q1 continuously measures temperature and consumes the most
power out of any of the operating modes. For maximum power savings, place the TMP107-Q1 in shutdown
mode. In shutdown mode, the TMP107-Q1 shuts down all internal active circuitry except for the required circuit
elements that allow communication with the device. Issue a one-shot command when in shutdown mode to
trigger a single temperature measurement.
9.2.1.2.4 Accuracy
In order to achieve the best temperature accuracy when multiple devices are connected in the daisy-chain,
configure the devices in shutdown mode, and then issue a one-shot conversion. Read the temperature from all
devices on the bus by issuing a global read after a delay of 20 ms. This delay after the one-shot command
makes sure the internal ADC conversion is finished, and the voltages of the supply bypass capacitors over the
daisy chain are stable, before the data are read by the host.
9.2.1.2.5 Electromagnetic Interference (EMI)
The typical, three-conductor TMP107-Q1 measurement chain is fairly insensitive to electromagnetic distortions
because the supply, ground and signal wires are running in parallel and located in the same cable housing. To
help maintain this insensitivity, do not make any additional electric connections at intermediate nodes in the
cable, or at the end of the chain of TMP107-Q1 devices.
There can be environmental effects on a TMP107-Q1 cable implementation in the form of conducted emission.
The conducted susceptibility of the cable can be investigated if this is a suspected source of interference.
Designing for electromagnetic compatibility with the intended operating environment can mitigate interference.
There can be radiated emission from the TMP107-Q1 cable implementation that may affect the radiated
susceptibility of surrounding equipment. See specification IEC61000-4-3: Testing and measurement techniques -
Radiated, radio-frequency, electromagnetic field immunity test for more information on testing for radiated
immunity to signals in the 80-MHz to 6-GHz range. Also, see IEC61000-4-6: Testing and measurement
techniques - Immunity to conducted disturbances, induced by radio-frequency fields for information on testing for
conducted immunity in the 9-kHz to 80-MHz range.
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Typical Applications (continued)
Physical shielding and electrical filtering can mitigate much of the interference into and out of the surrounding
environment and electronics. See IEC62153-4-X: Metallic Communication Cable Test Methods for information on
determining the screening effectiveness of a metallic cable shield. The thermal conductivity of additional material
around the cable implementation can affect the settling time of the TMP107-Q1 at its position in the cable. This
thermal conductivity can also reduce the allowable temperature range exposure of the cable implementation
depending on the materials chosen. Generally, passive electrical filtering is very effective at suppressing
conducted interference. Circuit board components, such as an EMI filter that increases in resistance significantly
in response to higher frequency content, are widely available and often easy to implement. Even simple RC and
LC filter configurations on transmission lines provide some immunity.
9.2.1.3 Application Curves
Figure 40 shows the step response of the TMP107-Q1 to a submersion in an oil bath of 100ºC from room
temperature (24ºC) at a 3.3-V supply. The time-constant, or the time for the output to reach 63% of the input
step, is 1.375 s. The time-constant depends on the printed circuit board (PCB) that the device is mounted on. For
this test, the device is soldered to a two-layer PCB that measures 0.551 in × 0.748 in.
Figure 41 shows the TMP107-Q1 eye diagram as a measure of quality for the transmission path (cable).
Measurement of eye patterns is performed by a setup where a source generates a known bit stream that is fed
into a transmission channel. The eye diagram of TMP107-Q1 is taken on the I/O line at the far end of a 300-
meter cable connecting two TMP107-Q1 devices. The baud rate is 9600 Kbps, and the supply voltage is set to
3.3 V. The scope is set to trigger on I/O rising (or falling) edge, with an infinite persistent time. The
superimposed, captured waveforms create the eye diagram. Excellent eye diagram parameters are maintained at
9600 Kbps speed.
100
92
84
76
68
60
52
44
36
28
20
-1
0
1
2
3
4
5
6
7
8
9
10 11
Time (s)
D001
Figure 41. TMP107-Q1 Eye Diagram
Figure 40. Temperature Step Response
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Typical Applications (continued)
9.2.2 Connecting ALERT1 and ALERT2 Pins
As described in the ALERT1, ALERT2, R1, and R2 Pins section, the TMP107-Q1 contains internal 100-kΩ pullup
resistors connected between pins ALERT1 and R1, and pins ALERT2 and R2. Connect R1 and R2 to V+ in order
to enable the internal pullup resistors. Figure 42 shows a schematic example of how to connect these pins for
multiple TMP107-Q1 devices in a daisy-chain configuration.
1.7 V to 5.5 V
Sensor 1
Sensor 2
Sensor N
V+
MCU
TMP107
TMP107
TMP107
1
2
8
7
1
2
8
7
1
2
8
7
V+
R1
R2
V+
R1
R2
V+
R1
R2
4.1 kꢀ
10 ꢀ
I/O2
I/O2
I/O2
TX
UART
3
4
6
5
3
4
6
5
3
4
6
5
I/O1 ALERT2
GND
I/O1 ALERT2
GND
I/O1 ALERT2
GND
INT1
ALERT1
100 ꢀ
ALERT1
ALERT1
RX
GND
INT2
ALERT2
ALERT1
Figure 42. Connecting ALERT1 and ALERT2 Pins
9.2.3 ALERT1 and ALERT2 Pins Used as General-Purpose Output (GPO)
The TMP107-Q1 alert pins are also used as a GPO to control external switches or LEDs. This feature is useful in
applications wherein the wiring between general-purpose output lines from the microcontroller or host to a control
switch or LED can be eliminated by communicating through the I/O pins of TMP107-Q1. To configure the
ALERTx pins as a GPO, program the high-limit register to the highest temperature (7FFCh) and the low-limit
register to the lowest temperature (8000h). This programming disables the ALERTx pins from performing high-
and low-limit temperature controls. The configuration register polarity bits (POL1 and POL2) are used to toggle
the ALERTx pin output. The ALERTx pins are open-drain outputs; therefore, make sure the R1 and R2 pins are
connected to the supply voltage, as shown in Figure 43.
1.7 V to 5.5 V
Sensor 1
Sensor 2
V+
TMP107
TMP107
1
2
1
2
8
7
8
7
V+
R1
R2
V+
R1
R2
MCU
TX
4.1 kꢀ
10 ꢀ
I/O2
I/O2
0.1 ꢁF
6
5
3
4
6
5
3
4
I/O1 ALERT2
GND
I/O1 ALERT2
GND
UART
RX
ALERT1
100 ꢀ
ALERT1
GND
Switch / Control / LED
Switch / Control / LED
Figure 43. ALERT1 and ALERT2 Pins Used as General-Purpose Output
32
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Copyright © 2015, Texas Instruments Incorporated
Product Folder Links: TMP107-Q1
TMP107-Q1
www.ti.com
SBOS726A –OCTOBER 2015–REVISED OCTOBER 2015
10 Power Supply Recommendations
The TMP107-Q1 device operates with a power supply in the range of 1.7 V to 5.5 V. The device is optimized for
operation at a 3.3-V supply, but measures temperature accurately for the full supply range. For best
performance, use a 0.1-µF power-supply bypass capacitor. Place the bypass capacitor as close as possible to
the supply and ground pins of the device. Applications with noisy or high-impedance power supplies may require
additional bypass capacitors to reject power-supply noise.
11 Layout
11.1 Layout Guidelines
Mount the TMP107-Q1 to a PCB as shown in Figure 44. Obtaining acceptable performance with alternate layout
schemes is possible, however this layout produces good results and is intended as a guideline.
•
Bypass the V+ pin to ground with a low-ESR ceramic bypass-capacitor. The typical recommended bypass
capacitance is a 0.1-μF ceramic capacitor with a X5R or X7R dielectric. The optimum placement is closest to
the V+ and GND pins of the device. Take care to minimize the loop area formed by the bypass-capacitor
connection, the V+ pin, and the GND pin of the IC.
•
•
•
Use larger copper area pads to reduce self-heating and lower thermal resistance to the environment.
If possible, use PCB boards with thick copper layers.
If possible, do not use stain to protect the IC because stain can increase thermal resistance.
11.2 Layout Example
Supply Bypass
Capacitor
V+
V+
R1
V+
R2
I/O2
I/O1
GND
I/O2
GND
I/O1
ALERT2
GND
ALERT1
PCB border
Capacitor
Figure 44. Layout Example
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33
Product Folder Links: TMP107-Q1
TMP107-Q1
SBOS726A –OCTOBER 2015–REVISED OCTOBER 2015
www.ti.com
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
•
•
TMP107EVM User's Guide, SBOU158
SN74LVC1G125 Data Sheet, SCES223
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
UART-Compatible, SMAART Wire, E2E are trademarks of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
34
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Product Folder Links: TMP107-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Oct-2015
PACKAGING INFORMATION
Orderable Device
TMP107BQDQ1
TMP107BQDRQ1
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SOIC
SOIC
D
8
8
75
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-2-260C-1 YEAR
T107BQ
T107BQ
ACTIVE
D
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU-DCC
Level-2-260C-1 YEAR
-40 to 125
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
27-Oct-2015
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TMP107-Q1 :
Catalog: TMP107
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Addendum-Page 2
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
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TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
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