TLV5614IYE [TI]

2.7-V TO 5.5-V, 12-BIT QUAD DAC IN WAFER CHIP SCALE PACKAGE; 2.7 V至5.5 V, 12位四DAC晶圆芯片级封装
TLV5614IYE
型号: TLV5614IYE
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

2.7-V TO 5.5-V, 12-BIT QUAD DAC IN WAFER CHIP SCALE PACKAGE
2.7 V至5.5 V, 12位四DAC晶圆芯片级封装

转换器 数模转换器
文件: 总24页 (文件大小:231K)
中文:  中文翻译
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ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉ  
SLAS391A − JULY 2003 − REVISED AUGUST 2003  
ꢊ ꢋꢌ ꢍ ꢂ ꢀ ꢎ ꢃꢋ ꢃꢍ ꢂꢏ ꢅꢊ ꢍ ꢐꢇ ꢀ ꢑ ꢒꢓ ꢔ ꢔ ꢓꢕ ꢇ ꢖ  
ꢗꢓ ꢘ ꢉꢙ ꢕ ꢚꢇ ꢛ ꢜ ꢕꢓ ꢁꢉ ꢛꢓ ꢕꢝꢓ ꢞ ꢉ  
FEATURES  
APPLICATIONS  
D
Four 12-Bit D/A Converters  
D
D
D
D
D
D
Battery Powered Test Instruments  
Digital Offset and Gain Adjustment  
Industrial Process Controls  
Machine and Motion Control Devices  
Communications  
D
Programmable Settling Time of Either 3 µs or  
9 µs Typ  
TMS320DSP Family, (Q)SPI, and  
MicrowireCompatible Serial Interface  
D
D
Internal Power-On Reset  
Arbitrary Waveform Generation  
D
Low Power Consumption:  
8 mW, Slow Mode − 5-V Supply  
3.6 mW, Slow Mode − 3-V Supply  
WCS PACKAGE  
(BOTTOM VIEW)  
OUTA OUTB OUTC OUTD  
D
D
Reference Input Buffer  
Voltage Output Range . . . 2× the Reference  
Input Voltage  
14 13  
15  
12  
11  
10  
REFINAB  
REFINCD  
D
Monotonic Over Temperature  
AV  
16  
1
DD  
DD  
AGND  
DGND  
FS  
9
D
Dual 2.7-V to 5.5-V Supply (Separate Digital  
and Analog Supplies)  
DV  
8
7
2
PD  
3
4
5
6
D
D
D
Hardware Power Down (10 nA)  
Software Power Down (10 nA)  
Simultaneous Update  
LDAC DIN  
SCLK CS  
DESCRIPTION  
The TLV5614IYE is a quadruple 12-bit voltage output digital-to-analog converter (DAC) with a flexible 4-wire serial  
interface. The serial interface allows glueless interface to TMS320, SPI, QSPI, and Microwire serial ports. The TLV5614IYE  
is programmed with a 16-bit serial word comprised of a DAC address, individual DAC control bits, and a 12-bit DAC value.  
The device has provision for two supplies: one digital supply for the serial interface (via pins DV and DGND), and one  
DD  
for the DACs, reference buffers, and output buffers (via pins AV and AGND). Each supply is independent of the other,  
DD  
and can be any value between 2.7 V and 5.5 V. The dual supplies allow a typical application where the DAC is controlled  
via a microprocessor operating on a 3 V supply (also used on pins DV and DGND), with the DACs operating on a 5 V  
DD  
supply. Of course, the digital and analog supplies can be tied together.  
The resistor string output voltage is buffered by a x2 gain rail-to-rail output buffer. The buffer features a Class AB output  
stage to improve stability and reduce settling time. A rail-to-rail output stage and a power-down mode makes it ideal for  
single voltage, battery based applications. The settling time of the DAC is programmable to allow the designer to optimize  
speed versus power dissipation. The settling time is chosen by the control bits within the 16-bit serial input string. A  
high-impedance buffer is integrated on the REFINAB and REFINCD terminals to reduce the need for a low source  
impedance drive to the terminal. REFINAB and REFINCD allow DACs A and B to have a different reference voltage then  
DACs C and D.  
The TLV5614IYE is implemented with a CMOS process and is available in a 16-terminal WCS package. The TLV5614IYE  
is characterized for operation from 40°C to 85°C in a wire-bonded small outline (SOIC) package.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments  
semiconductor products and disclaimers thereto appears at the end of this data sheet.  
TMS320 DSP is a trademark of Texas Instruments.  
SPI and QSPI are trademarks of Motorola, Inc.  
Microwire is a trademark of National Semiconductor Corporation.  
ꢛꢙ ꢎ ꢔꢒ ꢕ ꢀꢇ ꢎꢖ ꢔ ꢓꢀꢓ ꢟꢠ ꢡꢢ ꢣ ꢤꢥ ꢦꢟꢢꢠ ꢟꢧ ꢨꢩ ꢣ ꢣ ꢪꢠꢦ ꢥꢧ ꢢꢡ ꢫꢩꢬ ꢭꢟꢨ ꢥꢦꢟ ꢢꢠ ꢮꢥ ꢦꢪꢋ ꢛꢣ ꢢꢮꢩ ꢨꢦꢧ  
ꢨ ꢢꢠ ꢡꢢꢣ ꢤ ꢦꢢ ꢧ ꢫꢪ ꢨ ꢟ ꢡꢟ ꢨ ꢥ ꢦꢟ ꢢꢠꢧ ꢫ ꢪꢣ ꢦꢯꢪ ꢦꢪ ꢣ ꢤꢧ ꢢꢡ ꢀꢪꢰ ꢥꢧ ꢇꢠꢧ ꢦꢣ ꢩꢤ ꢪꢠꢦ ꢧ ꢧꢦ ꢥꢠꢮ ꢥꢣ ꢮ ꢱ ꢥꢣ ꢣ ꢥ ꢠꢦꢲꢋ  
ꢛꢣ ꢢ ꢮꢩꢨ ꢦ ꢟꢢ ꢠ ꢫꢣ ꢢ ꢨ ꢪ ꢧ ꢧ ꢟꢠ ꢳ ꢮꢢ ꢪ ꢧ ꢠꢢꢦ ꢠꢪ ꢨꢪ ꢧꢧ ꢥꢣ ꢟꢭ ꢲ ꢟꢠꢨ ꢭꢩꢮ ꢪ ꢦꢪ ꢧꢦꢟ ꢠꢳ ꢢꢡ ꢥꢭ ꢭ ꢫꢥ ꢣ ꢥꢤ ꢪꢦꢪ ꢣ ꢧꢋ  
Copyright 2003, Texas Instruments Incorporated  
ꢁꢂ  
www.ti.com  
SLAS391A − JULY 2003 − REVISED AUGUST 2003  
These devices have limited built-in ESD protection. The device should be placed in conductive foam during storage or handling to  
prevent electrostatic damage to the MOS gates.  
AVAILABLE OPTIONS  
PACKAGE  
T
A
WCS(1)  
(YE)  
−40°C to 85°C  
TLV5614IYE  
(1)  
Wafer chip scale package. See Figure 17.  
FUNCTIONAL BLOCK DIAGRAM  
AV  
16  
DV  
1
DD  
DD  
15  
REFINAB  
DAC A  
+
_
Power-On  
Reset  
+
_
14  
OUTA  
10  
12  
12-Bit  
DAC  
Latch  
14-Bit  
Data  
and  
2
Control  
Register  
2-Bit  
Control  
Data  
2
2
14  
Serial  
Input  
Register  
4
Power-Down/  
Speed Control  
DIN  
Latch  
2
7
DAC Select/  
Control  
FS  
SCLK  
CS  
5
6
13  
12  
11  
OUTB  
OUTC  
OUTD  
DAC B  
Logic  
DAC C  
DAC D  
10  
REFINCD  
3
2
9
8
PD  
AGND  
DGND  
LDAC  
2
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TERMINAL  
ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉ  
SLAS391A − JULY 2003 − REVISED AUGUST 2003  
Terminal Functions  
I/O  
DESCRIPTION  
NAME  
AGND  
AV  
NO.  
9
16  
6
Analog ground  
Analog supply  
DD  
CS  
I
I
Chip select. This terminal is active low.  
Digital ground  
DGND  
DIN  
8
4
Serial data input  
DV  
1
Digital supply  
DD  
7
I
I
I
Frame sync input. The falling edge of the frame sync pulse indicates the start of a serial data frame shifted out to the  
TLV5614IYE.  
FS  
2
3
Power down pin. Powers down all DACs (overriding their individual power down settings), and all output stages. This  
terminal is active low.  
PD  
Load DAC. When the LDAC signal is high, no DAC output updates occur when the input digital data is read into the  
serial interface. The DAC outputs are only updated when LDAC is low.  
LDAC  
REFINAB  
REFINCD  
SCLK  
15  
10  
5
I
I
Voltage reference input for DACs A and B.  
Voltage reference input for DACs C and D.  
Serial clock input  
I
OUTA  
14  
13  
12  
11  
O
O
O
O
DACA output  
OUTB  
DACB output  
OUTC  
DACC output  
OUTD  
DACD output  
ABSOLUTE MAXIMUM RATINGS  
over operating free-air temperature range unless otherwise noted  
(1)  
UNIT  
7 V  
Supply voltage, (DV , AV  
DD DD  
to GND)  
to DV  
Supply voltage difference, (AV  
)
DD  
−2.8 V to 2.8 V  
DD  
Digital input voltage range  
−0.3 V to DV  
+ 0.3 V  
DD  
Reference input voltage range  
−0.3 V to AV  
+ 0.3 V  
DD  
Operating free-air temperature range, T  
−40°C to 85°C  
A
(1)  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
RECOMMENDED OPERATING CONDITIONS  
MIN NOM  
MAX  
5.5  
UNIT  
5-V supply  
3-V supply  
4.5  
2.7  
2
5
3
Supply voltage, AV , DV  
DD DD  
V
3.3  
DV  
DV  
DV  
DV  
= 2.7 V  
= 5.5 V  
= 2.7 V  
= 5.5 V  
DD  
DD  
DD  
DD  
High-level digital input voltage, V  
IH  
V
V
V
2.4  
0.6  
1
Low-level digital input voltage, V  
IL  
(1)  
5-V supply  
3-V supply  
0
0
2
2.048  
1.024  
10  
V
V
−1.5  
DD  
Reference voltage, V to REFINAB, REFINCD terminal  
ref  
(1)  
−1.5  
DD  
Load resistance, R  
kΩ  
pF  
L
Load capacitance, C  
100  
20  
L
Serial clock rate, SCLK  
MHz  
Operating free-air temperature  
TLV5614IYE  
−40  
85  
°C  
(1)  
Voltages greater than AV /2 cause output saturation for large DAC codes.  
DD  
3
ꢁꢂ  
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
ELECTRICAL CHARACTERISTICS  
over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted)  
STATIC DAC SPECIFICATIONS  
PARAMETER  
Resolution  
TEST CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
bits  
12  
Integral nonlinearity (INL), end point adjusted  
Differential nonlinearity (DNL)  
See Note 1  
1.5  
0.5  
4
1
LSB  
See Note 2  
See Note 3  
See Note 4  
LSB  
E
E
Zero scale error (offset error at zero scale)  
Zero scale error temperature coefficient  
12  
mV  
ZS  
10  
ppm/°C  
% of FS  
voltage  
Gain error  
See Note 5  
See Note 6  
0.6  
G
Gain error temperature coefficient  
Zero scale  
10  
−80  
−80  
ppm/°C  
dB  
PSRR  
Power supply rejection ratio  
See Notes 7 and 8  
Full scale  
dB  
INDIVIDUAL DAC OUTPUT SPECIFICATIONS  
V
Voltage output range  
R
R
= 10 kΩ  
0
0
AV −0.4  
DD  
V
O
L
% of FS  
voltage  
Output load regulation accuracy  
= 2 kvs 10 kΩ  
0.1  
0.25  
L
REFERENCE INPUTS (REFINAB, REFINCD)  
V
I
Input voltage range  
Input resistance  
See Note 9  
AV −1.5  
DD  
V
R
10  
5
MΩ  
pF  
I
I
C
Input capacitance  
REFIN = 1 V at 1 kHz + 1.024 V dc  
pp  
Reference feed through  
−75  
dB  
(see Note 10)  
Slow  
0.5  
1
REFIN = 0.2 V + 1.024 V dc  
pp  
Reference input bandwidth  
MHz  
large signal  
Fast  
DIGITAL INPUTS (DIN, CS, LDAC, PD  
I
I
High-level digital input current  
Low-level digital input current  
Input capacitance  
V = V  
DD  
1
1
µA  
µA  
pF  
IH  
I
V = 0 V  
I
IL  
C
3
I
POWER SUPPLY  
5-V supply, No load,  
Clock running,  
Slow  
Fast  
Slow  
Fast  
1.6  
3.8  
1.2  
3.2  
10  
2.4  
5.6  
1.8  
4.8  
mA  
All inputs 0 V or V  
DD  
I
Power supply current  
DD  
3-V supply, No load,  
Clock running,  
mA  
nA  
All inputs 0 V or DV  
DD  
Power down supply current (see Figure 12)  
(1)  
(2)  
The relative accuracy or integral nonlinearity (INL) sometimes referred to as linearity error, is the maximum deviation of the output from the line  
between zero and full scale excluding the effects of zero code and full-scale errors.  
The differential nonlinearity (DNL) sometimes referred to as differential error, is the difference between the measured and ideal  
1 LSB amplitude change of any two adjacent codes. Monotonic means the output voltage changes in the same direction (or remains constant)  
as a change in the digital input code.  
(3)  
(4)  
(5)  
(6)  
(7)  
Zero-scale error is the deviation from zero voltage output when the digital input code is zero.  
6
Zero-scale-error temperature coefficient is given by: E  
TC = [E  
(T  
) − E (T )]/V × 10 /(T  
ZS min ref max  
− T ).  
min  
ZS  
ZS max  
Gain error is the deviation from the ideal output (2 V − 1 LSB) with an output load of 10 kexcluding the effects of the zero-error.  
ref  
G
6
Gain temperature coefficient is given by: E TC = [E (T  
) − E (T  
)]/V × 10 /(T  
DD  
− T ).  
G
max  
G
min ref  
max  
min  
Zero-scale-error rejection ratio (EZS−RR) is measured by varying the AV  
this signal imposed on the zero-code output voltage.  
from 5 0.5 V and 3 0.3 V dc, and measuring the proportion of  
(8)  
Full-scale rejection ratio (EG-RR) is measured by varying the AV  
from 5 0.5 V and 3 0.3 V dc and measuring the proportion of this signal  
imposed on the full-scale output voltage after subtracting the zero scale change.  
DD  
(9)  
(10)  
Reference input voltages greater than V /2 cause output saturation for large DAC codes  
DD  
Referencefeedthrough is measured at the DAC output with an input code = 000 hex and a V  
at 1 kHz.  
input = 1.024 Vdc + 1 V  
pp  
ref (REFINABor REFINCD)  
4
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
ELECTRICAL CHARACTERISTICS (CONTINUED)  
over recommended operating free-air temperature range, supply voltages, and reference voltages (unless otherwise noted)  
ANALOG OUTPUT DYNAMIC PERFORMANCE  
PARAMETER  
TEST CONDITIONS  
MIN  
TYP  
5
MAX  
UNIT  
V/µs  
V/µs  
Fast  
Slow  
Fast  
Slow  
Fast  
Slow  
C
V
= 100 pF, R = 10 k,  
L
O
L
SR  
Output slew rate  
= 10% to 90%, V = 2.048 V, 1024 V  
1
ref  
3
5.5  
20  
To 0.5 LSB, C = 100 pF,  
L
t
t
Output settling time  
µs  
s
R
L
= 10 k, See Notes 1 and 3  
9
1
Output settling time, code to To 0.5 LSB, C = 100 pF, R = 10 k,  
code  
L
L
µs  
s(c)  
See Note 2  
2
Glitch energy  
Code transition from 7FF to 800  
10  
74  
66  
−68  
nV-sec  
SNR  
Signal-to-noise ratio  
Signal to noise + distortion  
Total harmonic distortion  
Sinewave generated by DAC,  
Reference voltage = 1.024 at 3 V and 2.048 at 5 V,  
S/(N+D)  
THD  
dB  
f = 400 KSPS, f  
= 1.1 kHz sinewave, C = 100 pF,  
s
OUT  
L
Spurious free dynamic  
range  
R
L
= 10 k, BW = 20 kHz  
SFDR  
70  
DIGITAL INPUT TIMING REQUIREMENTS  
t
t
Setup time, CS low before FS↓  
Setup time, FS low before first negative SCLK edge  
10  
8
ns  
ns  
su(CS−FS)  
su(FS−CK)  
Setup time, sixteenth negative SCLK edge after FS low on which bit D0 is sampled before  
rising edge of FS  
t
t
10  
10  
ns  
ns  
su(C16−FS)  
Setup time. The first positive SCLK edge after D0 is sampled before CS rising edge. If FS  
is used instead of the SCLK positive edge to update the DAC, then the setup time is  
between the FS rising edge and CS rising edge.  
su(C16−CS)  
t
t
t
t
t
Pulse duration, SCLK high  
25  
25  
8
ns  
ns  
ns  
ns  
ns  
wH  
Pulse duration, SCLK low  
wL  
Setup time, data ready before SCLK falling edge  
Hold time, data held valid after SCLK falling edge  
Pulse duration, FS high  
su(D)  
h(D)  
wH(FS)  
5
20  
(1)  
Settling time is the time for the output signal to remain within 0.5 LSB of the final measured value for a digital input code change ofFFF hex to  
080 hex for 080 hex to FFF hex.  
(2)  
(3)  
Settling time is the time for the output signal to remain within 0.5 LSB of the final measured value for a digital input code change of one count.  
Limits are ensured by design and characterization, but are not production tested.  
5
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
PARAMETER MEASUREMENT INFORMATION  
t
t
wH  
wL  
SCLK  
DIN  
1
2
3
4
5
15  
16  
t
t
su(D)  
h(D)  
D14  
D15  
D13  
D12  
D1  
D0  
t
su(FS-CK)  
t
su(C16-CS)  
t
su(CS-FS)  
CS  
FS  
t
wH(FS)  
t
su(C16-FS)  
Figure 1. Timing Diagram  
6
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TYPICAL CHARACTERISTICS  
LOAD REGULATION  
LOAD REGULATION  
0.2  
0.35  
0.30  
0.25  
V
V
= 3 V,  
= 1 V,  
= Full Scale  
V
V
= 5 V,  
= 2 V,  
DD  
DD  
0.18  
0.16  
0.14  
0.12  
0.10  
0.08  
ref  
ref  
V = Full Scale  
O
V
O
3 V Slow Mode, Sink  
3 V Fast Mode, Sink  
5 V Slow Mode, Sink  
5 V Fast Mode, Sink  
0.20  
0.15  
0.10  
0.06  
0.04  
0.02  
0
0.05  
0
0
0.01 0.02 0.05 0.1 0.2 0.5 0.8  
Load Current − mA  
1
2
0
0.02 0.04 0.1 0.2 0.4 0.8  
Load Current − mA  
1
2
4
Figure 2  
Figure 3  
LOAD REGULATION  
LOAD REGULATION  
3 V Slow Mode, Source  
4.01  
2.0015  
2.001  
5 V Slow Mode, Source  
5 V Fast Mode, Source  
4.005  
2.0005  
2.000  
3 V Fast Mode, Source  
4
1.9995  
1.999  
3.995  
1.9985  
1.998  
3.99  
V
V
= 5 V,  
= 2 V,  
= Full Scale  
1.9975  
V
= 3 V,  
= 1 V,  
= Full Scale  
DD  
DD  
V
ref  
ref  
1.997  
V
O
V
O
3.985  
1.9965  
0
0.02 0.04 0.1 0.2 0.4 0.8  
Load Current − mA  
1
2
4
0
0.01 0.02 0.05 0.1 0.2 0.5 0.8  
Load Current − mA  
1
2
Figure 4  
Figure 5  
7
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SUPPLY CURRENT  
vs  
SUPPLY CURRENT  
vs  
TEMPERATURE  
TEMPERATURE  
4
4
V
V
= 3 V,  
= 1.024 V,  
Full Scale  
DD  
ref  
3.5  
3
3.5  
V
O
Fast Mode  
(Worst Case For I  
)
DD  
Fast Mode  
3
V
V
= 5 V,  
= 1.024 V,  
Full Scale  
2.5  
DD  
2.5  
ref  
V
O
2
2
(Worst Case For I )  
DD  
1.5  
1.5  
1
1
Slow Mode  
20  
Slow Mode  
0.5  
−40  
0.5  
−40  
−20  
0
40  
60  
80  
100  
−20  
0
20  
40  
60  
80  
100  
T − Temperature − °C  
T − Temperature − °C  
Figure 6  
Figure 7  
TOTAL HARMONIC DISTORTION  
TOTAL HARMONIC DISTORTION  
vs  
vs  
FREQUENCY  
FREQUENCY  
0
0
V
= 1 V dc + 1 V p/p Sinewave,  
ref  
V
= 1 V dc + 1 V p/p Sinewave,  
ref  
−10  
Output Full Scale  
−10  
Output Full Scale  
−20  
−30  
−20  
−30  
−−40  
−−40  
−50  
−60  
−50  
−60  
Fast Mode  
Slow Mode  
20  
−70  
−80  
−70  
−80  
0
5
10  
20  
30  
50  
100  
0
5
10  
30  
50  
100  
f − Frequency − kHz  
f − Frequency − kHz  
Figure 8  
Figure 9  
8
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
TOTAL HARMONIC DISTORTION AND NOISE  
TOTAL HARMONIC DISTORTION AND NOISE  
vs  
vs  
FREQUENCY  
FREQUENCY  
0
0
−10  
V
= 1 V dc + 1 V p/p Sinewave,  
V
= 1 V dc + 1 V p/p Sinewave,  
ref  
ref  
Output Full Scale  
−10  
Output Full Scale  
−20  
−30  
−20  
−30  
−−40  
−−40  
−50  
−50  
−60  
Fast Mode  
Slow Mode  
−60  
−70  
−80  
−70  
−80  
0
5
10  
20  
30  
50  
100  
0
5
10  
20  
30  
50  
100  
f − Frequency − kHz  
f − Frequency − kHz  
Figure 10  
Figure 11  
SUPPLY CURRENT  
vs  
TIME  
(WHEN ENTERING POWER-DOWN MODE)  
4000  
3500  
3000  
2500  
2000  
1500  
1000  
500  
0
0
200  
400  
600  
800  
1000  
t − Time − ns  
Figure 12  
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DIFFERENTIAL NONLINEARITY  
0.3  
V
CC  
= 5 V, V = 2 V, SCLK = 1 MHz)  
ref  
0.25  
0.2  
0.15  
0.1  
0.05  
0
−0.05  
−0.1  
−0.15  
−0.2  
−0.25  
−0.3  
0
256 512 768 1024 1280 1536 1792 2048 2304 2560 2816 3072 3328 3584 3840 4096  
Digital Code  
Figure 13  
INTEGRAL NONLINEARITY  
1
V
= 5 V, V = 2 V,  
ref  
CC  
SCLK = 1 MHz  
0.5  
0
−0.5  
−1  
−1.5  
0
256 512 768 1024 1280 1536 1792 2048 2304 2560 2816 3072 3328 3584 3840 4096  
Digital Code  
Figure 14  
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APPLICATION INFORMATION  
GENERAL FUNCTION  
The TLV5614IYE is a 12-bit single supply DAC based on a resistor string architecture. The device consists of a serial  
interface, speed and power down control logic, a reference input buffer, a resistor string, and a rail-to-rail output buffer.  
The output voltage (full scale determined by external reference) is given by:  
CODE  
2
2 REF  
[V]  
n
n
where REF is the reference voltage and CODE is the digital input value within the range of 0 to 2 −1, where n=12  
10  
(bits). The 16-bit data word, consisting of control bits and the new DAC value, is illustrated in the data format section.  
A power-on reset initially resets the internal latches to a defined state (all bits zero).  
SERIAL INTERFACE  
Explanation of data transfer: First, the device has to be enabled with CS set to low. Then, a falling edge of FS starts  
shifting the data bit-per-bit (starting with the MSB) to the internal register on the falling edges of SCLK. After 16 bits  
have been transferred or FS rises, the content of the shift register is moved to the DAC latch, which updates the  
voltage output to the new level.  
The serial interface of the TLV5614IYE can be used in two basic modes:  
D
D
Four wire (with chip select)  
Three wire (without chip select)  
Using chip select (four wire mode), it is possible to have more than one device connected to the serial port of the  
data source (DSP or microcontroller). The interface is compatible with the TMS320DSP family. Figure 15 shows  
an example with two TLV5614IYEs connected directly to a TMS320 DSP.  
TLV5614IYE  
TLV5614IYE  
CS FS DIN SCLK  
CS FS DIN SCLK  
TMS320  
DSP  
XF0  
XF1  
FSX  
DX  
CLKX  
Figure 15. TMS320 Interface  
TMS320 is a trademark of Texas Instruments.  
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If there is no need to have more than one device on the serial bus, then CS can be tied low. Figure 16 shows an  
example of how to connect the TLV5614IYE to a TMS320, SPI, or Microwire port using only three pins.  
TMS320  
DSP  
TLV5614IYE  
SPI  
TLV5614IYE  
Microwire  
TLV5614I  
YE  
FSX  
FS  
SS  
FS  
I/O  
FS  
DIN  
DIN  
DIN  
DX  
MOSI  
SCLK  
SO  
SK  
CLKX  
SCLK  
SCLK  
SCLK  
CS  
CS  
CS  
Figure 16. Three-Wire Interface  
Notes on SPI and Microwire: Before the controller starts the data transfer, the software has to generate a falling edge  
on the I/O pin connected to FS. If the word width is 8 bits (SPI and Microwire), two write operations must be performed  
to program the TLV5614IYE. After the write operation(s), the DAC output is updated automatically on the next positive  
clock edge following the sixteenth falling clock edge.  
SERIAL CLOCK FREQUENCY AND UPDATE RATE  
The maximum serial clock frequency is given by:  
1
f
+
+ 20 MHz  
SCLKmax  
t
) t  
wH(min)  
wL(min)  
The maximum update rate is:  
1
f
+
+ 1.25 MHz  
UPDATEmax  
16 ǒt  
Ǔ
) t  
wH(min)  
wL(min)  
Note that the maximum update rate is a theoretical value for the serial interface since the settling time of the  
TLV5614IYE has to be considered also.  
DATA FORMAT  
The 16-bit data word for the TLV5614IYE consists of two parts:  
D
D
Control bits  
(D15 . . . D12)  
(D11 . . . D0)  
New DAC value  
D15  
A1  
D14  
A0  
D13  
D12  
D11  
D10  
D9  
D8  
D7  
D6  
D5  
D4  
D3  
D2  
D1  
D0  
PWR  
SPD  
New DAC value (12 bits)  
X: don’t care  
SPD: Speed control bit.  
PWR: Power control bit.  
1 fast mode  
1 power down  
0 slow mode  
0 normal operation  
In power-down mode, all amplifiers within the TLV5614IYE are disabled. A particular DAC (A, B, C, D) of the  
TLV5614IYE is selected by A1 and A0 within the input word.  
A1  
0
A0  
0
DAC  
A
0
1
B
1
0
C
1
1
D
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USING TLV5614IYE, WAFER CHIP SCALE PACKAGE (WCSP)  
D
D
D
TLV5614 DIE qualification was done using a wire-bonded small outline (SOIC) package and includes: steady  
state life, thermal shock, ESD, latch-up, and characterization. This qualified device is orderable as TLV5614ID.  
The wafer chip-scale package (WCS), TLV5614IYE, uses the same DIE as TLV5614ID, but is not qualified. WCS  
qualification, including board level reliability (BLR), is the responsibility of the customer.  
It is recommended that underfill be used for increased reliability. BLR is application dependent, but may include  
test such as: temperature cycling, drop test, key push, bend, vibration, and package shear.  
The following WCSP information provides the user of the TLV5614IYE with some general guidelines for board  
assembly.  
D
D
D
Melting point of eutectic solder is 183°C.  
Recommended peak reflow temperatures are in the 220°C to 230°C range.  
The use of underfill is required. The use of underfill greatly reduces the risk of thermal mismatch fails.  
Underfill is an epoxy/adhesive that may be added during the board assembly process to improve board level/system  
level reliability. The process is to dispense the epoxy under the dice after die attach reflow. The epoxy adheres to  
the body of the device and to the printed-circuit board. It reduces stress placed upon the solder joints due to the  
thermal coefficient of expansion (TCE) mismatch between the board and the component. Underfill material is highly  
filled with silica or other fillers to increase an epoxy’s modulus, reduce creep sensitivity, and decrease the material’s  
TCE.  
The recommendation for peak flow temperatures of 220°C to 230°C is based on general empirical results that indicate  
that this temperature range is needed to facilitate good wetting of the solder bump to the substrate or circuit board  
pad. Lower peak temperatures may cause nonwets (cold solder joints).  
Bottom View  
Top View  
NOTES:A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
Figure 17. TLV5614IYE Wafer Chip Scale Package  
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TLV5614IYE INTERFACED TO TMS320C203 DSP  
Hardware Interfacing  
Figure 18 shows an example of how to connect the TLV5614IYE to a TMS320C203 DSP. The serial port is configured  
in burst mode, with FSX generated by the TMS320C203 to provide the frame sync (FS) input to the TLV5614IYE.  
Data is transmitted on the DX line, with the serial clock input on the CLKX line. The general-purpose input/output port  
bits IO0 and IO1 are used to generate the chip select (CS) and DAC latch update (LDAC) inputs to the TLV5614IYE.  
The active low power down (PD) is pulled high all the time to ensure the DACs are enabled.  
TMS320C203  
TLV5614IYE  
SDIN  
V
DX  
DD  
PD  
SCLK  
FS  
CLKX  
FSX  
I/O 0  
I/O 1  
CS  
VOUTA  
VOUTB  
VOUTC  
VOUTD  
LDAC  
REFINAB  
REFINCD  
REF  
V
SS  
Figure 18. TLV5614IYE Interfaced With TMS320C203  
Software  
The application example outputs a differential in-phase (sine) signal between the VOUTA and VOUTB pins, and its  
quadrature (cosine) signal as the differential signal between VOUTC and VOUTD.  
The on-chip timer is used to generate interrupts at a fixed frequency. The related interrupt service routine pulses  
LDAC low to update all 4 DACs simultaneously, then fetches and writes the next sample to all 4 DACs. The samples  
are stored in a look-up table, which describes two full periods of a sine wave.  
The synchronous serial port of the DSP is used in burst mode. In this mode, the processor generates an FS pulse  
preceding the MSB of every data word. If multiple, contiguous words are transmitted, a violation of the tsu(C16−FS)  
timing requirement occurs. To avoid this, the program waits until the transmission of the previous word has been  
completed.  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Processor: TMS320C203 runnning at 40 MHz  
;
; Description:  
;
; This program generates a differential in−phase (sine) on (OUTA−OUTB) and it’s quadrature  
(cosine) as a differential signal on (OUTC−OUTD).  
;
; The DAC codes for the signal samples are stored as a table of 64 12−bit values, describing  
; 2 periods of a sine function. A rolling pointer is used to address the table location in  
; the first period of this waveform, from which the DAC A samples are read. The samples for  
; the other 3 DACs are read at an offset to this rolling pointer  
;
;
;
;
;
;
DAC  
A
Function  
sine  
Offset from rolling pointer  
0
B
inverse sine 16  
C
D
cosine  
inverse cosine24  
8
; The on−chip timer is used to generate interrupts at a fixed rate. The interrupt service  
; routine first pulses LDAC low to update all DACs simultaneously with the values which  
; were written to them in the previous interrupt. Then all 4 DAC values are fetched and  
; written out through the synchronous serial interface. Finally, the rolling pointer is  
; incremented to address the next sample, ready for the next interrupt.  
; 1998, Texas Instruments Inc.  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−I/O and memory mapped regs −−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
.include ”regs.asm”  
;−−−−−−−jump vectors −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
.ps  
b
0h  
start  
int1  
int23  
timer_isr;  
b
b
b
−−−−−−−−−−− variables −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
temp  
.equ  
.equ  
.equ  
.equ  
.equ  
.equ  
.equ  
0060h  
0061h  
0062h  
0063h  
0064h  
0065h  
0066h  
r_ptr  
iosr_stat  
DACa_ptr  
DACb_ptr  
DACc_ptr  
DACd_ptr  
;−−−−−−−−−−−constants−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; DAC control bits to be OR’ed onto data  
; all fast mode  
DACa_control .equ  
DACb_control .equ  
DACc_control .equ  
DACd_control .equ  
01000h  
05000h  
09000h  
0d000h  
;−−−−−−−−−−− tables −−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
.ds  
sinevals  
02000h  
.word 00800h  
.word 0097Ch  
.word 00AE9h  
.word 00C3Ah  
.word 00D61h  
.word 00E53h  
.word 00F07h  
.word 00F76h  
.word 00F9Ch  
.word 00F76h  
.word 00F07h  
.word 00E53h  
.word 00D61h  
.word 00C3Ah  
.word 00AE9h  
.word 0097Ch  
.word 00800h  
.word 00684h  
.word 00517h  
.word 003C6h  
.word 0029Fh  
.word 001ADh  
.word 000F9h  
.word 0008Ah  
.word 00064h  
.word 0008Ah  
.word 000F9h  
.word 001ADh  
.word 0029Fh  
.word 003C6h  
.word 00517h  
.word 00684h  
.word 00800h  
.word 0097Ch  
.word 00AE9h  
.word 00C3Ah  
.word 00D61h  
.word 00E53h  
.word 00F07h  
.word 00F76h  
.word 00F9Ch  
.word 00F76h  
.word 00F07h  
.word 00E53h  
.word 00D61h  
.word 00C3Ah  
.word 00AE9h  
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.word 0097Ch  
.word 00800h  
.word 00684h  
.word 00517h  
.word 003C6h  
.word 0029Fh  
.word 001ADh  
.word 000F9h  
.word 0008Ah  
.word 00064h  
.word 0008Ah  
.word 000F9h  
.word 001ADh  
.word 0029Fh  
.word 003C6h  
.word 00517h  
.word 00684h  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Main Program  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
.ps  
.entry  
1000h  
start  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; disable interrupts  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
setc  
splk  
splk  
INTM  
; disable maskable interrupts  
#0ffffh, IFR; clear all interrupts  
#0004h, IMR; timer interrupts unmasked  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; set up the timer  
; timer period set by values in PRD and TDDR  
; period = (CLKOUT1 period) x (1+PRD) x (1+TDDR)  
; examples for TMS320C203 with 40MHz main clock  
; Timer rate  
TDDR  
9
9
PRD  
24 (18h)  
39 (27h)  
;
;
80 kHz  
50 kHz  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
prd_val.equ  
tcr_val.equ  
splk  
0018h  
0029h  
#0000h, temp; clear timer  
out  
temp, TIM  
splk  
#prd_val, temp; set PRD  
out  
temp, PRD  
splk  
#tcr_val, temp; set TDDR, and TRB=1 for auto−reload  
temp, TCR  
out  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Configure IO0/1 as outputs to be :  
; IO0 CS − and set high  
; IO1 LDAC  
− and set high  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
in  
lacl  
or  
sacl  
out  
in  
lacl  
or  
sacl  
out  
temp, ASPCR; configure as output  
temp  
#0003h  
temp  
temp, ASPCR  
temp, IOSR; set them high  
temp  
#0003h  
temp  
temp, IOSR  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; set up serial port for  
; SSPCR.TXM=1  
; SSPCR.MCM=1  
; SSPCR.FSM=1  
Transmit mode − generate FSX  
Clock mode − internal clock source  
Burst mode  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
splk  
out  
splk  
out  
#0000Eh, temp  
temp, SSPCR; reset transmitter  
#0002Eh, temp  
temp,SSPCR  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
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; reset the rolling pointer  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
lacl  
sacl  
#000h  
r_ptr  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; enable interrupts  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
clrc  
INTM  
; enable maskable interrupts  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; loop forever!  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
next  
idle  
b
;wait for interrupt  
next  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
;all else fails stop here  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
done  
b
done  
;hang there  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Interrupt Service Routines  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
int1  
ret  
; do nothing and return  
; do nothing and return  
int23 ret  
timer_isr:  
in  
iosr_stat, IOSR; store IOSR value into variable space  
lacl  
and  
sacl  
out  
or  
sacl  
out  
and  
sacl  
out  
lacl  
add  
sacl  
add  
iosr_stat  
#0FFFDh  
temp  
temp, IOSR;  
#0002h  
; load acc with iosr status  
; reset IO1 − LDAC low  
;
; set IO1 − LDAC high  
;
temp  
temp, IOSR;  
#0FFFEh  
temp  
temp, IOSR;  
r_ptr  
#sinevals  
DACa_ptr  
#08h  
; reset IO0 − CS low  
;
; load rolling pointer to accumulator  
; add pointer to table start  
; to get a pointer for next DAC a sample  
; add 8 to get to DAC C pointer  
sacl  
add  
sacl  
add  
sacl  
mar  
DACc_ptr  
#08h  
DACb_ptr  
#08h  
DACd_ptr  
*,ar0  
; add 8 to get to DAC B pointer  
; add 8 to get to DAC D pointer  
; set ar0 as current AR  
; DAC A  
lar  
ar0, DACa_ptr; ar0 points to DAC a sample  
; get DAC a sample into accumulator  
#DACa_control; OR in DAC A control bits  
temp  
temp, SDTR; send data  
lacl  
or  
*
sacl  
out  
;
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−;  
We must wait for transmission to complete before writing next word to the SDTR.;  
TLV5614/04 interface does not allow the use of burst mode with the full packet; rate, as  
we need a CLKX −ve edge to clock in last bit before FS goes high again,; to allow SPI  
compatibility.  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
17  
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ꢅꢆ  
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
rpt  
nop  
#016h  
; wait long enough for this configuration  
; of MCLK/CLKOUT1 rate  
; DAC B  
lar  
ar0, dacb_ptr; ar0 points to DAC a sample  
; get DAC a sample into accumulator  
#DACb_control; OR in DAC B control bits  
temp  
temp, SDTR; send data  
#016h ; wait long enough for this configuration  
; of MCLK/CLKOUT1 rate  
lacl  
or  
*
sacl  
out  
rpt  
nop  
;
; DAC C  
lar  
ar0, dacc_ptr; ar0 points to dac a sample  
; get DAC a sample into accumulator  
#DACc_control; OR in DAC C control bits  
temp  
temp, SDTR; send data  
#016h ; wait long enough for this configuration  
; of MCLK/CLKOUT1 rate  
lacl  
or  
sacl  
out  
rpt  
nop  
*
;
; DAC D  
lar  
ar0, dacd_ptr; ar0 points to DAC a sample  
; get DAC a sample into accumulator  
lacl  
or  
*
#dacd_control; OR in DAC D control bits  
temp  
temp, SDTR; send data  
sacl  
out  
;
lacl  
add  
r_ptr  
#1h  
#001Fh  
r_ptr  
#016h  
; load rolling pointer to accumulator  
; increment rolling pointer  
; count 0−31 then wrap back round  
; store rolling pointer  
and  
sacl  
rpt  
nop  
; wait long enough for this configuration  
; of MCLK/CLKOUT1 rate  
; now take CS high again  
lacl  
or  
iosr_stat  
#0001h  
; load acc with iosr status  
; set IO0 − CS high  
;
sacl  
out  
clrc  
ret  
temp  
temp, IOSR;  
intm  
; re-enable interrupts  
; return from interrupt  
.end  
18  
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ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉ  
SLAS391A − JULY 2003 − REVISED AUGUST 2003  
TLV5614IYE INTERFACED TO MCS 51 MICROCONTROLLER  
Hardware Interfacing  
Figure 19 shows an example of how to connect the TLV5614IYE to an MCS 51 Microcontroller. The serial DAC input  
data and external control signals are sent via I/O Port 3 of the controller. The serial data is sent on the RxD line, with  
the serial clock output on the TxD line. Port 3 bits 3, 4, and 5 are configured as outputs to provide the DAC latch update  
(LDAC), chip select (CS) and frame sync (FS) signals for the TLV5614IYE. The active low power down pin (PD) of  
the TLV5614IYE is pulled high to ensure that the DACs are enabled.  
MCS 51  
TLV5614IYE  
SDIN  
V
RxD  
DD  
PD  
SCLK  
LDAC  
CS  
TxD  
P3.3  
P3.4  
P3.4  
VOUTA  
VOUTB  
VOUTC  
VOUTD  
FS  
REFINAB  
REFINCD  
REF  
V
SS  
Figure 19. TLV5614IYE Interfaced With MCS 51  
Software  
The example is the same as for the TMS320C203 in this data sheet, but adapted for a MCS 51 controller. It  
generates a differential in-phase (sine) signal between the VOUTA and VOUTB pins, and its quadrature (cosine)  
signal is the differential signal between VOUTC and VOUTD.  
The on-chip timer is used to generate interrupts at a fixed frequency. The related interrupt service routine pulses  
LDAC low to update all 4 DACs simultaneously, then fetches and writes the next sample to all 4 DACs. The samples  
are stored as a look-up table, which describes one full period of a sine wave.  
The serial port of the controller is used in Mode 0, which transmits 8 bits of data on RxD, accompanied by a  
synchronous clock on TxD. Two writes concatenated together are required to write a complete word to the  
TLV5614IYE. The CS and FS signals are provided in the required fashion through control of IO port 3, which has  
bit addressable outputs.  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Processor: 80C51  
;
; Description:  
;
; This program generates a differential in-phase  
(sine) on (OUTA−OUTB) ; and it’s quadrature (cosine)  
as a differential signal on (OUTC−OUTD).  
;
; 1998, Texas Instruments Inc.  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
NAME  
MAIN  
ISR  
SINTBL SEGMENT  
VAR1 SEGMENT  
STACK SEGMENT  
GENIQ  
SEGMENT  
SEGMENT  
CODE  
CODE  
CODE  
DATA  
IDATA  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Code start at address 0, jump to start  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
CSEG AT  
LJMP start  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
0
; Execution starts at address 0 on power−up.  
19  
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
; Code in the timer0 interrupt vector  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
CSEG AT  
0BH  
LJMP timer0isr  
; Jump vector for timer 0 interrupt is 000Bh  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Global variables need space allocated  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
RSEG  
VAR1  
DS  
temp_ptr:  
1
1
rolling_ptr: DS  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Interrupt service routine for timer 0 interrupts  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
RSEG  
timer0isr:  
PUSH  
ISR  
PSW  
ACC  
INT1  
INT1  
PUSH  
CLR  
SETB  
; pulse LDAC low  
; to latch all 4 previous values at the same time  
; 1st thing done in timer isr => fixed period  
; set CS low  
CLR  
T0  
; The signal to be output on each DAC is a sine function. One cycle of a sine wave is  
; held in a table @ sinevals as 32 samples of msb, lsb pairs (64 bytes).  
; We have ; one pointer which rolls round this table, rolling_ptr incrementing by  
; 2 bytes (1 sample) on each interrupt (at the end of this routine).  
; The DAC samples are read at an offset to this rolling pointer:  
; DAC Function Offset from rolling_ptr  
;
;
;
;
MOV  
MOV  
MOV  
MOVC  
A
B
C
D
sine  
0
inverse sine 32  
cosine  
inverse cosine48  
16  
DPTR,#sinevals; set DPTR to the start of the table of sine signal values  
R7,rolling_ptr; R7 holds the pointer into the sine table  
A,R7  
A,@A+DPTR  
; get DAC A msb  
; msb of DAC A is in the ACC  
CLR  
MOV  
T1  
SBUF,A  
; transmit it − set FS low  
; send it out the serial port  
INC  
R7  
; increment the pointer in R7  
; to get the next byte from the table  
; which is the lsb of this sample, now in ACC  
MOV  
A,R7  
MOVC  
A_MSB_TX:  
JNB  
CLR  
MOV  
A,@A+DPTR  
TI,A_MSB_TX ; wait for transmit to complete  
TI  
SBUF,A  
; clear for new transmit  
; and send out the lsb of DAC A  
; DAC C next  
; DAC C codes should be taken from 16 bytes (8 samples) further on  
; in the sine table − this gives a cosine function  
MOV  
ADD  
ANL  
MOV  
A,R7  
; pointer in R7  
A,#0FH  
; add 15 − already done one INC  
; wrap back round to 0 if > 64  
; pointer back in R7  
A,#03FH  
R7,A  
MOVC  
ORL  
A,@A+DPTR  
A,#01H  
; get DAC C msb from the table  
; set control bits to DAC C address  
A_LSB_TX:  
JNB  
TI,A_LSB_TX ; wait for DAC A lsb transmit to complete  
SETB  
CLRT1  
CLR  
T1  
; toggle FS  
TI  
; clear for new transmit  
; and send out the msb of DAC C  
; increment the pointer in R7  
; to get the next byte from the table  
; which is the lsb of this sample, now in ACC  
MOV  
SBUF,A  
R7  
INC  
MOV  
A,R7  
MOVC  
C_MSB_TX:  
JNB  
A,@A+DPTR  
TI,C_MSB_TX ; wait for transmit to complete  
CLR  
MOV  
TI  
SBUF,A  
; clear for new transmit  
; and send out the lsb of DAC C  
20  
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ꢀ ꢁꢂ ꢃꢄ ꢅꢆ ꢇꢈ ꢉ  
SLAS391A − JULY 2003 − REVISED AUGUST 2003  
; DAC B next  
; DAC B codes should be taken from 16 bytes (8 samples) further on  
; in the sine table − this gives an inverted sine function  
MOV  
ADD  
ANL  
MOV  
A,R7  
; pointer in R7  
A,#0FH  
; add 15 − already done one INC  
; wrap back round to 0 if > 64  
; pointer back in R7  
A,#03FH  
R7,A  
MOVC  
ORL  
A,@A+DPTR  
A,#02H  
; get DAC B msb from the table  
; set control bits to DAC B address  
C_LSB_TX:  
JNB  
TI,C_LSB_TX ; wait for DAC C lsb transmit to complete  
SETB  
CLR  
T1  
; toggle FS  
T1  
CLR  
MOV  
TI  
SBUF,A  
; clear for new transmit  
; and send out the msb of DAC B  
; get DAC B LSB  
INC  
R7  
; increment the pointer in R7  
; to get the next byte from the table  
; which is the lsb of this sample, now in ACC  
MOV  
A,R7  
A,@A+DPTR  
MOVC  
B_MSB_TX:  
JNB  
TI,B_MSB_TX ; wait for transmit to complete  
CLR  
TI  
; clear for new transmit  
MOV  
SBUF,A  
; and send out the lsb of DAC B  
; DAC D next  
; DAC D codes should be taken from 16 bytes (8 samples) further on  
; in the sine table − this gives an inverted cosine function  
MOV  
ADD  
ANL  
MOV  
MOVC  
ORL  
A,R7  
; pointer in R7  
A,#0FH  
; add 15 − already done one INC  
; wrap back round to 0 if > 64  
; pointer back in R7  
A,#03FH  
R7,A  
A,@A+DPTR  
A,#03H  
; get DAC D msb from the table  
; set control bits to DAC D address  
B_LSB_TX:  
JNB  
TI,B_LSB_TX ; wait for DAC B lsb transmit to complete  
SETB  
CLR  
T1  
T1  
; toggle FS  
CLR  
TI ; clear for new transmit  
MOV  
SBUF,A  
; and send out the msb of DAC D  
INC  
R7  
; increment the pointer in R7  
; to get the next byte from the table  
; which is the lsb of this sample, now in ACC  
MOV  
A,R7  
MOVC  
A,@A+DPTR  
D_MSB_TX:  
JNB  
TI,D_MSB_TX ; wait for transmit to complete  
CLR  
TI  
; clear for new transmit  
MOV  
SBUF,A  
; and send out the lsb of DAC D  
; increment the rolling pointer to point to the next sample  
; ready for the next interrupt  
MOV  
ADD  
A,rolling_ptr  
A,#02H  
; add 2 to the rolling pointer  
; wrap back round to 0 if > 64  
ANL  
A,#03FH  
MOV  
rolling_ptr,A; store in memory again  
D_LSB_TX:  
JNB  
TI,D_LSB_TX ; wait for DAC D lsb transmit to complete  
CLR  
TI  
; clear for next transmit  
; FS high  
SETB  
SETB  
POP  
POP  
RETI  
T1  
T0  
; CS high  
ACC  
PSW  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Stack needs definition  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
RSEG STACK  
DS  
10h  
; 16 Byte Stack!  
21  
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SLAS391A − JULY 2003 − REVISED AUGUST 2003  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Main program code  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
RSEG  
start:  
MAIN  
MOV  
CLRA  
MOV  
MOV  
MOV  
SETB  
SETB  
SETB  
SETB  
SETB  
MOV  
SP,#STACK−1 ; first set Stack Pointer  
SCON,A  
TMOD,#02H  
TH0,#038H  
INT1  
; set serial port 0 to mode 0  
; set timer 0 to mode 2 − auto−reload  
; set TH0 for 5kHs interrupts  
; set LDAC = 1  
T1  
; set FS = 1  
T0  
; set CS = 1  
; enable timer 0 interrupts  
; enable all interrupts  
ET0  
EA  
rolling_ptr,A; set rolling pointer to 0  
SETB  
always:  
SJMP  
RET  
TR0  
; start timer 0  
; while(1) !  
always  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
; Table of 32 sine wave samples used as DAC data  
;−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−−  
RSEG  
SINTBL  
sinevals:  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
DW  
01000H  
0903EH  
05097H  
0305CH  
0B086H  
070CAH  
0F0E0H  
0F06EH  
0F039H  
0F06EH  
0F0E0H  
070CAH  
0B086H  
0305CH  
05097H  
0903EH  
01000H  
06021H  
0A0E8H  
0C063H  
040F9H  
080B5H  
0009FH  
00051H  
00026H  
00051H  
0009FH  
080B5H  
040F9H  
0C063H  
0A0E8H  
DW 06021H  
END  
22  
PACKAGE OPTION ADDENDUM  
www.ti.com  
17-Aug-2012  
PACKAGING INFORMATION  
Status (1)  
Eco Plan (2)  
MSL Peak Temp (3)  
Samples  
Orderable Device  
Package Type Package  
Drawing  
Pins  
Package Qty  
Lead/  
Ball Finish  
(Requires Login)  
TLV5614IYE  
ACTIVE  
DIESALE  
YE  
16  
TBD  
Call TI  
Call TI  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
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