- 最新上传
SHIKUES
IPN50R2K0CE
英飞凌正在拓展采用 SOT-223 封装的CoolMOS™ CE 产品组合，作为 DPAK 的一种高性价比替代产品，在某些设计中还可以减少占据的空间。此封装可以放置在典型的 DPAK 空间，且在热行为上的影响极小。英飞凌的 SOT-223 面向 LED 照明和移动充电器应用。
INFINEON
MSYSTEM
MSYSTEM
NXP
NXP
WALSIN
NXP
VATRONICS
FOTEK
W5TS-3C2-P/BL
Terminal Block Dual Output Signal Conditioners W5-UNIT
MSYSTEM
TDK
W5TS-441-P/BL
Terminal Block Dual Output Signal Conditioners W5-UNIT
MSYSTEM
LEDW10_24-600P
Constant current power LED Driver with PWM dimming - Wide Input - Non-Isolated & Regulated
GAPTEC
MSYSTEM
51U-A2-R2
Panel Mounted Multi Power Meter 51-UNIT
MSYSTEM
MSYSTEM
FCR-JF-P/Q
Space-saving Plug-in Signal Conditioners F-UNIT
MSYSTEM
FOTEK
VJ0805DR2RCXPARHT
Surface Mount Multilayer Ceramic Chip Capacitors for High Temperatures 175 °C / 200 °C
VISHAY
MSYSTEM
WJV-AC3-D/Q
Dual Output Plug-in Signal Conditioners W-UNIT
MSYSTEM
W5TS-33Y-P
Terminal Block Dual Output Signal Conditioners W5-UNIT
MSYSTEM
MSYSTEM
WALSIN
W5TS-14Y-R2/Q
Terminal Block Dual Output Signal Conditioners W5-UNIT
MSYSTEM
FSMIJ62BA04
ALCOSWITCH ILLUMINATED TACTILE SWITCH SERIES
TE
W5TS-22Y-P/Q
Terminal Block Dual Output Signal Conditioners W5-UNIT
MSYSTEM
ONSEMI
PANASONIC
- 元器件品牌
KYOCERA AVX
AMPHENOL
SAMTEC
WALSIN
VISHAY
MSYSTEM
GLENAIR
ITT
MICROSEMI
YAGEO
ECLIPTEK
ABRACON
MOLEX
VICOR
KEMET
MTRONPTI
TI
PANASONIC
CTS
SCHURTER
KNOWLES
MURATA
TE
TOREX
SILICON
BOURNS
GOLLEDGE
STMICROELECTRONICS
RCD
BEL
NXP
MICROCHIP
TDK
KOA
INFINEON
FOXCONN
EUROQUARTZ
MAXIM
LITTELFUSE
VCC
RENESAS
CDE
IDT
AVAGO
HONEYWELL
ONSEMI
FH
NICHICON
APITECH
ROHM
EPCOS
AGILENT
GRAYHILL
ADI
Carling Technologies
RICOH
