TL391B [TI]
36V、标准、单通道比较器;
| 型号： | TL391B |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 36V、标准、单通道比较器 比较器 |
| 文件： | 总28页 (文件大小：1428K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL331,TL331B, TL391B
ZHCSLD4J – AUGUST 1999 – REVISED NOVEMBER 2020
TL331B、TL391B 和 TL331 单路比较器
1 特性
3 说明
•
•
新增了 TL331B 和 TL391B
TL331B 和 TL391B 器件是业界通用 TL331 比较器的
下一代版本。下一代器件为成本敏感型应用提供了卓越
的价值，其特性包括更低的失调电压、更高的电源电压
能力、更低的电源电流、更低的输入偏置电流、更低的
传播延迟、更宽的温度范围以及更高的 2kV ESD 性
能，并提供了直接替代的便利性。TL331B 是经改进的
TL331I 和 TL331K 版本直接替代产品，而 TL391B 可
提供 TL331B 的替代引脚排列，以替代同类竞争器
件。
改进了 B 版本的规格
– 最大额定值：高达 38V
– ESD 等级 (HBM)：2kV
– 提高了反向电压性能
– 低输入失调电压：0.37mV
– 低输入偏置电流：3.5nA
– 低电源电流：430µA
– 更短的响应时间 (1µsec)
如果两个电源的电压差处于 2V 至 36V 范围内且 VCC
比输入共模电压至少高 1.5V，那么也可以使用双电
源。漏极电流不受电源电压的影响。可将输出连接到其
它集电极开路输出，以实现有线 AND 关联。
– TL391B 提供了替代引脚排列
• TL331B 是经改进的 TL331 直接替代产品
•
•
•
•
共模输入电压范围包括接地
差分输入电压范围等于最大额定电源电压：±38V
低输出饱和电压
器件信息
器件型号(1)
TL331、
封装尺寸（标称值）
封装
输出与 TTL、MOS 和 CMOS 兼容
SOT-23 (5)
2.90mm × 1.60mm
TL331B、
TL391B
2 应用
•
•
•
•
•
•
•
•
•
•
扫地机器人
(1) 如需了解所有可用封装，请参阅数据表末尾的可订购产品附录
单相 UPS
服务器 PSU
无线电动工具
无线基础设施
电器
楼宇自动化
工厂自动化与控制
电机驱动器
信息娱乐系统与仪表组
系列比较表
TL331B
TL391B
TL331I
TL331K
规格
单位
V
mA
°C
2 至 36
2 至 36
2 至 36
电源电压
0.43
0.7
0.7
总电源电流（5V 至 36V 最大值）
−40 至 125
2000
± 4
-40 至 85
1000
± 9
-40 至 105
1000
温度范围
ESD (HBM)
V
± 9
mV
nA
失调电压（整个温度范围内的最大值）
输入偏置电流（典型值/最大值）
响应时间（典型值）
3.5/25
1
25/250
1.3
25/250
1.3
µsec
本文档旨在为方便起见，提供有关 TI 产品中文版本的信息，以确认产品的概要。有关适用的官方英文版本的最新信息，请访问
www.ti.com，其内容始终优先。TI 不保证翻译的准确性和有效性。在实际设计之前，请务必参考最新版本的英文版本。
English Data Sheet: SLVS238
TL331, TL331B, TL391B
ZHCSLD4J – AUGUST 1999 – REVISED NOVEMBER 2020
www.ti.com.cn
Table of Contents
7 Detailed Description......................................................15
7.1 Overview...................................................................15
7.2 Functional Block Diagram.........................................15
7.3 Feature Description...................................................15
7.4 Device Functional Modes..........................................15
8 Application and Implementation..................................16
8.1 Application Information............................................. 16
8.2 Typical Application.................................................... 16
9 Power Supply Recommendations................................18
10 Layout...........................................................................18
10.1 Layout Guidelines................................................... 18
10.2 Layout Example...................................................... 18
11 Device and Documentation Support..........................19
11.1 Documentation Support.......................................... 19
11.2 Receiving Notification of Documentation Updates..19
11.3 Support Resources................................................. 19
11.4 Trademarks............................................................. 19
11.5 Electrostatic Discharge Caution..............................19
11.6 Glossary..................................................................19
12 Mechanical, Packaging, and Orderable
1 特性................................................................................... 1
2 应用................................................................................... 1
3 说明................................................................................... 1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings, TL331 and TL331K....... 4
6.2 Absolute Maximum Ratings, TL331B and TL391B.....4
6.3 ESD Ratings, TL331 and TL331K...............................5
6.4 ESD Ratings, TL331B and TL391B............................ 5
6.5 Recommended Operating Conditions, TL331
and TL331K...................................................................5
6.6 Recommended Operating Conditions, TL331B
and TL391B...................................................................5
6.7 Thermal Information....................................................5
6.8 Electrical Characteristics, TL331B and TL391B......... 6
6.9 Switching Characteristics, TL331B and TL391B.........6
6.10 Electrical Characteristics, TL331 and TL331K..........7
6.11 Switching Characteristics, TL331 and TL331K......... 7
6.12 Typical Characteristics, TL331 and TL331K............. 8
6.13 Typical Characteristics, TL331B and TL391B...........9
Information.................................................................... 19
4 Revision History
注：以前版本的页码可能与当前版本的页码不同
Changes from Revision I (August 2020) to Revision J (November 2020)
Page
通篇将 TL331B 和 TL391B 最小建议电源电压更改为 2V................................................................................... 1
更正了系列比较表中“B”、“K”和“I”版本的电源电压................................................................................1
•
•
• Updated Supply Voltage vs Supply Current Typical Graph for 2V......................................................................9
Changes from Revision H (April 2020) to Revision I (August 2020)
更新了整个文档的表、图和交叉参考的编号格式................................................................................................ 1
• Added "B" device Typical Char graphs...............................................................................................................9
Page
•
Changes from Revision G (January 2015) to Revision H (April 2020)
Page
•
添加了 TL331B 和 TL391B 表和引脚排列，更新了 APL 的新增 B 器件的首页.................................................. 1
• Added Input current, IIK in Absolute Maximum Ratings .....................................................................................4
• Changed incorrect TL331 and TL331K Temp Ranges in Recommended Operating Conditions ...................... 5
• Changed text from: open-drain output to: open-collector output ..................................................................... 15
• Removed sentence: This is enables much head room for modern day supplies of 3.3 V and 5.0 V. ..............15
• Changed the text 'The output NPN will sink current when the positive input voltage is higher than the negative
input voltage and the offset voltage' to 'The output NPN will sink current when the negative input voltage is
higher than the positive input voltage and the offset voltage.'.......................................................................... 15
• Changed Output Current specifications from: to: in Design Parameters .........................................................16
• Changed first paragraph of the Response Time section ................................................................................. 17
• Added Receiving Notification of Documentation Updates section and Community Resources section...........19
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5 Pin Configuration and Functions
IN-
GND
IN+
1
2
3
5
4
V
CC
+
OUT
Note reversed inputs compared to similar common pinout
图 5-1. TL331, TL331B DBV Package, 5-Pin SOT-23, Top View
OUT
GND
IN-
1
2
3
5
4
V
CC
IN+
Note reversed inputs compared to similar common pinout
图 5-2. TL391B DBV Package, 5-Pin SOT-23, Top View
Pin Functions
PIN
TL331, TL331B
TL391B
TYPE
DESCRIPTION
NAME
IN+
NO.
3
NO.
4
I
Positive Input
Negative Input
1
3
I
IN–
OUT
VCC
4
1
O
—
—
Open Collector/Drain Output
Power Supply Input
Ground
5
5
GND
2
2
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6 Specifications
6.1 Absolute Maximum Ratings, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)(1)
MIN
0
MAX
36
UNIT
V
VCC
VID
VI
Supply voltage(2)
Differential input voltage(3)
Input voltage range (either input)
Output voltage
36
V
–36
–0.3
0
36
V
VO
IO
36
V
Output current
0
20
mA
Duration of output short-circuit to ground(4)
Input current(5)
Unlimited
IIK
mA
°C
–50
150
150
TJ
Operating virtual junction temperature
Storage temperature
–40
–65
Tstg
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
6.2 Absolute Maximum Ratings, TL331B and TL391B
over operating free-air temperature range (unless otherwise noted)(1)
MIN
-0.3
MAX
38
UNIT
V
VCC
VID
VI
Supply voltage(2)
Differential input voltage(3)
Input voltage range (either input)
Output voltage
38
V
–38
–0.3
-0.3
38
V
VO
IO
38
V
Output current
20
mA
Duration of output short-circuit to ground(4)
Input current(5)
Unlimited
IIK
mA
°C
–50
150
150
TJ
Operating virtual junction temperature
Storage temperature
–40
–65
Tstg
°C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
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6.3 ESD Ratings, TL331 and TL331K
VALUE
±1000
±750
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.4 ESD Ratings, TL331B and TL391B
VALUE
UNIT
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)
±2000
±750
V(ESD)
Electrostatic discharge
V
Charged device model (CDM), per JEDEC specification JESD22-C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.5 Recommended Operating Conditions, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
36
UNIT
V
VCC
TJ
Supply voltage
2
–40
–40
Junction temperature, TL331
Junction temperature, TL331K
85
°C
TJ
105
°C
6.6 Recommended Operating Conditions, TL331B and TL391B
over operating free-air temperature range (unless otherwise noted)
MIN
2
MAX
36
UNIT
V
VCC
TJ
Supply voltage
Junction temperature
125
°C
–40
6.7 Thermal Information
TL331,
TL331K
TL331B,
TL391B
THERMAL METRIC(1)
UNIT
DBV (SOT-23) DBV (SOT-23)
5 PINS
218.3
87.3
5 PINS
211.7
133.6
79.9
RθJA
RθJC(top)
RθJB
ψJT
Junction-to-ambient thermal resistance
°C/W
°C/W
°C/W
°C/W
°C/W
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
44.9
Junction-to-top characterization parameter
Junction-to-board characterization parameter
4.3
56.4
44.1
79.6
ψJB
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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6.8 Electrical Characteristics, TL331B and TL391B
VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
–2.5
–4
TYP
MAX
UNIT
VS = 5 to 36V
±0.37
2.5
4
VIO
Input offset voltage
mV
VS = 5 to 36V, TA = –40°C to +125°C
nA
nA
nA
nA
V
–3.5
–25
IB
Input bias current
Input offset current
Input voltage range
TA = –40°C to +125°C
–50
±0.5
10
–10
–25
IOS
25
TA = –40°C to +125°C
VS = 3 to 36V
(V–) – 0.1
(V–) – 0.05
(V+) – 1.5
(V+) – 2.0
VCM
V
VS = 3 to 36V, TA = –40°C to +125°C
VS = 15V, VO = 1.4V to 11.4V;
Large signal differential voltage
amplification
AVD
50
200
110
V/mV
mV
R
L ≥ 15k to (V+)
400
550
I
SINK ≤ 4mA, VID = -1V
SINK ≤ 4mA, VID = -1V
Low level output Voltage {swing
from (V–)}
VOL
I
mV
TA = –40°C to +125°C
IOH-LKG
IOH-LKG
IOL
High-level output leakage current
High-level output leakage current
Low level output current
(V+) = VO = 5 V; VID = 1V
0.1
20
nA
nA
mA
µA
µA
1000
(V+) = VO = 36V; VID = 1V; TA = –40°C to +125°C
VOL = 1.5V; VID = -1V; VS = 5V
VS = 5 V, no load
6
18
210
275
330
430
IQ
Quiescent current
VS = 36 V, no load, TA = –40°C to +125°C
6.9 Switching Characteristics, TL331B and TL391B
VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Propagation delay time, high-to-low;
Small scale input signal (1)
tresponse
tresponse
Input overdrive = 5mV, Input step = 100mV
1000
ns
Propagation delay time, high-to-low;
TTL input signal (1)
TTL input with Vref = 1.4V
300
ns
(1) High-to-low and low-to-high refers to the transition at the input.
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6.10 Electrical Characteristics, TL331 and TL331K
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
TEST CONDITIONS(1)
TA
MIN
TYP
MAX UNIT
(3)
PARAMETER
25°C
2
5
VCC = 5 V to 30 V, VO = 1.4 V,
VIC = VIC(min)
VIO
IIO
IIB
Input offset voltage
mV
9
Full range
25°C
5
50
nA
250
Input offset current
Input bias current
VO = 1.4 V
VO = 1.4 V
Full range
25°C
–25 –250
–400
nA
Full range
Common-mode input voltage
range(2)
0 to VCC
–
VICR
AVD
Full range
25°C
V
1.5
VCC = 15 V, VO = 1.4 V to 11.4 V,
RL ≥ 15 kΩ to VCC
Large-signal differential voltage
amplification
50
200
V/mV
VOH = 5 V, VID = 1 V
VOH = 30 V, VID = 1 V
25°C
Full range
25°C
0.1
50
1
nA
IOH
High-level output current
Low-level output voltage
μA
150
400
700
VOL
mV
IOL = 4 mA, VID = –1 V
Full range
25°C
IOL
ICC
Low-level output current
Supply current
6
mA
VOL = 1.5 V, VID = –1 V
RL = ∞, VCC = 5 V
25°C
0.4
0.7 mA
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
(3) Full range TA is –40°C to +85°C for I-suffix devices and –40°C to +105°C for K-suffix devices.
6.11 Switching Characteristics, TL331 and TL331K
VCC = 5 V, TA = 25°C
PARAMETER
TEST CONDITIONS
TYP UNIT
100-mV input step with 5-mV overdrive
TTL-level input step
1.3
μs
0.3
RL connected to 5 V through 5.1 kΩ, CL = 15 pF(1) (2)
Response time
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
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6.12 Typical Characteristics, TL331 and TL331K
1.0
70
60
50
40
30
20
10
0
-40C
85C
0C
25C
-40C
85C
0C
25C
125C
125C
0.8
0.6
0.4
0.2
0.0
0
10
20
Vcc (V)
30
40
0
8
16
24
32
40
Vcc (V)
C001
C002
图 6-1. Supply Current vs Supply Voltage
图 6-2. Input Bias Current vs Supply Voltage
10.000
1.000
0.100
0.010
0.001
-40C
25C
0C
85C
125C
0.01
0.1
1
10
100
Output Sink Current, Io(mA)
C005
图 6-3. Output Low Voltage vs Output Current (IOL
)
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6.13 Typical Characteristics, TL331B and TL391B
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
300
280
260
240
220
200
180
160
140
120
100
250
230
210
190
170
150
130
110
90
No Load, Output High
-40°C
0°C
25°C
85°C
125°C
-40°C
0°C
25°C
85°C
125°C
VS=3V
70
50
2
4
6
8
10 12 14 16 18 20 22 24 26 28 30 32 34 36
Supply Voltage (V)
-0.2
0
0.2 0.4 0.6 0.8
1
Input Voltage (V)
1.2 1.4 1.6 1.8
2
图 6-4. Supply Current vs. Supply Voltage
图 6-5. Total Supply Current vs. Input Voltage at 3V
250
230
210
190
170
150
130
110
90
250
230
210
190
170
150
130
-40°C
0°C
25°C
85°C
125°C
-40°C
0°C
25°C
85°C
125°C
110
90
70
70
VS=5V
VS=5V
0
50
-0.5
50
-0.5
0
0.5
1
1.5
Input Voltage (V)
2
2.5
3
3.5
4
0.5
1
1.5
Input Voltage (V)
2
2.5
3
3.5
4
图 6-6. Total Supply Current vs. Input Voltage at 3.3V
图 6-7. Total Supply Current vs. Input Voltage at 5V
250
230
210
190
170
150
130
300
280
260
240
220
-40°C
0°C
25°C
85°C
125°C
-40°C
0°C
25°C
85°C
125°C
110
90
200
180
160
70
VS=12V
VS=36V
2
50
-1
0
1
2
3
4
5
Input Voltage (V)
6
7
8
9
10 11
-1
5
8
11 14 17 20 23 26 29 32 35
Input Voltage (V)
图 6-8. Total Supply Current vs. Input Voltage at 12V
图 6-9. Total Supply Current vs. Input Voltage at 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
0
-0.5
-1
0
-0.5
-1
125°C
85°C
25°C
0°C
VCM=0V
VS=5V
-40°C
-1.5
-2
-1.5
-2
-2.5
-3
-2.5
-3
125°C
85°C
25°C
0°C
-3.5
-4
-3.5
-4
-4.5
-5
-4.5
-5
-40°C
-0.5
0
0.5
1
1.5
2
Input Voltage (V)
2.5
3
3.5
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
图 6-11. Input Bias Current vs. Input Voltage at 5V
图 6-10. Input Bias Current vs. Supply Voltage
0
1
VS=12V
VS=36V
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
-1.5
-2
-2.5
-3
-2.5
-3
125°C
85°C
25°C
0°C
-3.5
-4
125°C
85°C
25°C
0°C
-3.5
-4
-4.5
-5
-4.5
-5
-40°C
-40°C
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5
Input Voltage (V)
0
4
8
12
16 20
Input Voltage (V)
24
28
32
36
图 6-12. Input Bias Current vs. Input Voltage at 12V
图 6-13. Input Bias Current vs. Input Voltage at 36V
2
1.5
1
2
TA = 25°C
63 Channels
1.5
1
0.5
0
0.5
0
-0.5
-0.5
-1
-1
TA = -40°C
63 Channels
-1.5
-1.5
-2
-2
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
图 6-14. Input Offset Voltage vs. Supply Voltage at -40°C
图 6-15. Input Offset Voltage vs. Supply Voltage at 25°C
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
2
1.5
1
2
1.5
1
TA = 125°C
63 Channels
TA = 85°C
63 Channels
0.5
0
0.5
0
-0.5
-1
-0.5
-1
-1.5
-2
-1.5
-2
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
3
6
9
12 15 18 21 24 27 30 33 36
Supply Voltage (V)
图 6-16. Input Offset Voltage vs. Supply Voltage at 85°C
图 6-17. Input Offset Voltage vs. Supply Voltage at 125°C
2
2
VS = 3V
63 Units
VS = 5V
63 Units
1.5
1.5
1
0.5
0
1
0.5
0
-0.5
-1
-0.5
-1
-1.5
-1.5
-2
-2
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
图 6-18. Input Offset Voltage vs. Temperature at 3V
图 6-19. Input Offset Voltage vs. Temperature at 5V
2
2
VS = 12V
63 Units
VS = 36V
63 Units
1.5
1.5
1
0.5
0
1
0.5
0
-0.5
-1
-0.5
-1
-1.5
-1.5
-2
-2
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
图 6-20. Input Offset Voltage vs. Temperature at 12V
图 6-21. Input Offset Voltage vs. Temperature at 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
10
1
10
1
VS = 3V
VS = 5V
100m
10m
1m
100m
10m
1m
125°C
85°C
25°C
0°C
125°C
85°C
25°C
0°C
-40°C
-40°C
10m
100m
1m
Output Sinking Current (A)
10m
100m
10m
100m
1m
Output Sinking Current (A)
10m
100m
图 6-22. Output Low Voltage vs. Output Sinking Current at 3V
图 6-23. Output Low Voltage vs. Output Sinking Current at 5V
10
10
VS = 12V
VS = 36V
1
1
100m
100m
125°C
125°C
10m
1m
10m
1m
85°C
25°C
0°C
85°C
25°C
0°C
-40°C
-40°C
10m
100m
1m
Output Sinking Current (A)
10m
100m
10m
100m
1m
Output Sinking Current (A)
10m
100m
图 6-24. Output Low Voltage vs. Output Sinking Current at 12V
图 6-25. Output Low Voltage vs.Output Sinking Current at 36V
100
100
50 Output set high
VOUT = VS
20
50 Output set high
VOUT = VS
20
10
5
10
5
2
1
2
1
0.5
0.5
0.2
0.1
0.2
0.1
0.05
0.05
0.02
0.01
0.02
0.01
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
-40 -25 -10
5
20 35 50 65 80 95 110 125
Temperature (°C)
图 6-26. Output High Leakage Current vs.Temperature at 5V
图 6-27. Output High Leakage Current vs. Temperature at 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
1000
900
800
700
600
500
400
300
200
100
0
1000
900
800
700
600
500
400
300
200
100
0
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 5V
VS = 5V
VCM = 0V
CL = 15pF
RP = 5.1k
VCM = 0V
CL = 15pF
RP = 5.1k
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
图 6-28. High to Low Propagation Delay vs. Input Overdrive
图 6-29. Low to High Propagation Delay vs. Input Overdrive
Voltage, 5V
Voltage, 5V
1000
1000
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
图 6-30. High to Low Propagation Delay vs. Input Overdrive
图 6-31. Low to High Propagation Delay vs. Input Overdrive
Voltage, 12V
Voltage, 12V
1000
1000
125°C
85°C
25°C
-40°C
125°C
85°C
25°C
-40°C
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
900
800
700
600
500
400
300
200
100
0
900
800
700
600
500
400
300
200
100
0
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
5 6 78 10
20 30 4050 70 100 200 300 500
Input Overdrive (mV)
1000
图 6-32. High to Low Propagation Delay vs. Input Overdrive
图 6-33. Low to High Propagation Delay vs. Input Overdrive
Voltage, 36V
Voltage, 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
6
5
6
5
VREF = VCC/2
VREF = VCC/2
4
4
20mV Overdrive
20mV Overdrive
3
3
100mV
Overdrive
5mV
Overdrive
2
2
5mV Overdrive
100mV
Overdrive
1
1
0
0
-1
-1
-0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Time (ms)
1
1.1
-0.1
0
0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9
Time (ms)
1
1.1
图 6-34. Response Time for Various Overdrives, High-to-Low
图 6-35. Response Time for Various Overdrives, Low-to-High
Transition
Transition
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7 Detailed Description
7.1 Overview
The TL331 family is a single comparator with the ability to operate up to 36 V on the supply pin. This standard
device has proven ubiquity and versatility across a wide range of applications. This is due to its very wide supply
voltages range (2 V to 36 V), low Iq, and fast response.
The open-collector output allows the user to configure the output's logic low voltage (VOL) and can be utilized to
enable the comparator to be used in AND functionality.
The TL331B and TL391B are performance upgrades to standard TL331 using the latest process technologies
allowing for lower offset voltages, lower input bias and supply currents and faster response time over an
extended temperature range. The TL331B can drop-in replace the "I" or "K" versions of TL331. The TL391B is
an alternate pinout for replacing competitive devices.
7.2 Functional Block Diagram
V
CC
80-mA
Current Regulator
80 mA
10 mA
60 mA
10 mA
COMPONENT COUNT
Epi-FET
1
Diodes
Resistors
Transistors
2
1
IN+
IN−
OUT
20
GND
Current values shown are nominal.
7.3 Feature Description
TL331x family consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast
response with minimal input bias current. The input Darlington pair creates a limit on the input common mode
voltage capability, allowing TL331x to accurately function from ground to VCC – 1.5 V differential input.
The output consists of an open collector NPN (pull-down or low side) transistor. The output NPN will sink current
when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is
resistive and will scale with the output current. Please see 图 6-3 for VOL values with respect to the output
current.
7.4 Device Functional Modes
7.4.1 Voltage Comparison
The TL331x operates solely as a voltage comparator, comparing the differential voltage between the positive
and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input
differential polarity.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
8.1 Application Information
TL331x will typically be used to compare a single signal to a reference or two signals against each other. Many
users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes TL331x optimal for level shifting
to a higher or lower voltage.
8.2 Typical Application
5 V
Vref
5 V
+
TL331
Input 0 V to 30 V
图 8-1. Typical Application Schematic
8.2.1 Design Requirements
For this design example, use the parameters listed in 表 8-1 as the input parameters.
表 8-1. Design Parameters
DESIGN PARAMETER
Input Voltage Range
EXAMPLE VALUE
0 V to VCC – 1.5 V
2 V to 36 V
2 V to 36 V
1 µA to 4 mA
100 mV
Supply Voltage
Logic Supply Voltage (RPULLUP Voltage)
Output Current (VLOGIC/RPULLUP
Input Overdrive Voltage
Reference Voltage
)
2.5 V
Load Capacitance (CL)
15 pF
8.2.2 Detailed Design Procedure
When using TL331x in a general comparator application, determine the following:
• Input voltage range
• Minimum overdrive voltage
• Output and drive current
• Response time
8.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (VICR) must be taken in to
account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC – 1.5 V. This
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limits the input voltage range to as high as VCC – 1.5 V and as low as 0 V. Operation outside of this range can
yield incorrect comparisons.
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not
conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
8.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD
)
should be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of
the comparator, with the response time decreasing with increasing overdrive. 图 8-2 and 图 8-3 show positive
and negative response times with respect to overdrive voltage.
8.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will
produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use
图 6-3 to determine VOL based on the output current.
The output current can also effect the transient response. More is explained in the next section.
8.2.2.4 TL331B & TL391B ESD Protection
The "B" versions add dedicated ESD protections on all the pins for improved ESD performance. Please see
Application Note SNOAA35 for more information.
8.2.2.5 Response Time
Response time is a function of input over drive. See 节 8.2.3 for typical response times. The rise and fall times
can be determined by the load capacitance (CL), load/pullup resistance (RPULLUP), and equivalent collector-
emitter resistance (RCE).
• The rise time (τR) is approximately τR ~ RPULLUP × CL
• The fall time (τF) is approximatelyτF ~ RCE × CL
– RCE can be determined by taking the slope of 图 6-3 in its linear region at the desired temperature, or by
dividing the VOL by Iout
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8.2.3 Application Curves
The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
6
5
6
5
4
4
3
3
5mV OD
2
2
5mV OD
1
1
20mV OD
20mV OD
100mV OD
0
0
100mV OD
2.25
œ1
-0.25
œ1
0.25
0.75
1.25
1.75
œ0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Time (usec)
Time (usec)
C004
C006
图 8-2. Response Time for Various Overdrives
图 8-3. Response Time for Various Overdrives
(Positive Transition)
(Negative Transition)
9 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the
comparator's input common mode range and create an inaccurate comparison.
10 Layout
10.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches, which can affect the high level input common mode voltage range. In order to
achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be
implemented on the positive power supply and negative supply (if available). If a negative supply is not being
used, do not put a capacitor between the IC's GND pin and system ground.
10.2 Layout Example
Ground
Bypass
Capacitor
0.1 μF
Positive Supply
IN–
1
2
3
5
V
CC
Negative Supply or Ground
GND
IN+
Only needed
for dual power
supplies
OUT
4
0.1 μF
Ground
图 10-1. TL331 Layout Example
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
Application Design Guidelines for LM339, LM393, TL331 Family Comparators - SNOAA35
Analog Engineers Circuit Cookbook: Amplifiers (See Comparators section) - SLYY137
Precision Design, Comparator with Hysteresis Reference Design- TIDU020
Window comparator circuit - SBOA221
Reference Design, Window Comparator Reference Design- TIPD178
Comparator with and without hysteresis circuit - SBOA219
Inverting comparator with hysteresis circuit - SNOA997
Non-Inverting Comparator With Hysteresis Circuit - SBOA313
Zero crossing detection using comparator circuit - SNOA999
PWM generator circuit - SBOA212
How to Implement Comparators for Improving Performance of Rotary Encoder in Industrial Drive Applications -
SNOAA41
A Quad of Independently Func Comparators - SNOA654
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
所有商标均为其各自所有者的财产。
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary
This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
(6)
TL331BIDBVR
TL331IDBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 125
-40 to 85
331B
Samples
Samples
NIPDAU
(T1I8, T1IG, T1IL,
T1IS)
TL331IDBVRE4
TL331IDBVRG4
TL331IDBVT
LIFEBUY
LIFEBUY
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
3000 RoHS & Green
3000 RoHS & Green
NIPDAU
NIPDAU
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
-40 to 85
(T1I8, T1IG)
(T1I8, T1IG)
250
RoHS & Green
(T1I8, T1IG, T1IL,
T1IU)
Samples
TL331IDBVTG4
TL331KDBVR
ACTIVE
ACTIVE
SOT-23
SOT-23
DBV
DBV
5
5
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
T1IG
Samples
Samples
3000 RoHS & Green
3000 RoHS & Green
NIPDAU | SN
-40 to 105
(T1K8, T1KG, T1KJ,
T1KL)
TL331KDBVRG4
TL331KDBVT
TL391BIDBVR
LIFEBUY
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
5
5
5
NIPDAU
NIPDAU | SN
NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 105
-40 to 105
-40 to 125
(T1K8, T1KG, T1KJ,
T1KL)
250
RoHS & Green
(T1K8, T1KG, T1KJ,
T1KL)
Samples
Samples
3000 RoHS & Green
391B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
29-Jun-2023
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331, TL331B, TL391B :
Automotive : TL331-Q1, TL331B-Q1, TL391B-Q1
•
Enhanced Product : TL331-EP
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Enhanced Product - Supports Defense, Aerospace and Medical Applications
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL INFORMATION
REEL DIMENSIONS
TAPE DIMENSIONS
K0
P1
W
B0
Reel
Diameter
Cavity
A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
Overall width of the carrier tape
W
P1 Pitch between successive cavity centers
Reel Width (W1)
QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE
Sprocket Holes
Q1 Q2
Q3 Q4
Q1 Q2
Q3 Q4
User Direction of Feed
Pocket Quadrants
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TL331BIDBVR
TL331IDBVR
TL331IDBVR
TL331IDBVR
TL331IDBVRG4
TL331IDBVRG4
TL331IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
3000
3000
3000
250
180.0
178.0
180.0
180.0
180.0
178.0
178.0
180.0
180.0
178.0
180.0
178.0
178.0
178.0
178.0
180.0
8.4
9.0
8.4
8.4
8.4
9.0
9.0
8.4
8.4
9.0
8.4
9.0
9.0
9.0
9.0
8.4
3.2
3.23
3.2
3.2
3.17
3.2
1.4
1.37
1.4
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
3.23
3.2
3.17
3.2
1.37
1.4
3.23
3.3
3.17
3.2
1.37
1.4
TL331IDBVT
250
3.2
3.2
1.4
TL331IDBVTG4
TL331IDBVTG4
TL331KDBVR
TL331KDBVR
TL331KDBVR
TL331KDBVT
TL331KDBVT
TL331KDBVT
250
3.2
3.2
1.4
250
3.3
3.2
1.4
3000
3000
3000
250
3.2
3.2
1.4
3.23
3.3
3.17
3.2
1.37
1.4
3.3
3.2
1.4
250
3.23
3.2
3.17
3.2
1.37
1.4
250
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TL391BIDBVR
SOT-23
DBV
5
3000
180.0
8.4
3.2
3.2
1.4
4.0
8.0
Q3
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
9-Aug-2022
TAPE AND REEL BOX DIMENSIONS
Width (mm)
H
W
L
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TL331BIDBVR
TL331IDBVR
TL331IDBVR
TL331IDBVR
TL331IDBVRG4
TL331IDBVRG4
TL331IDBVT
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
DBV
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000
3000
3000
3000
3000
3000
250
210.0
180.0
210.0
202.0
210.0
180.0
180.0
210.0
210.0
180.0
210.0
180.0
180.0
180.0
180.0
210.0
210.0
185.0
180.0
185.0
201.0
185.0
180.0
180.0
185.0
185.0
180.0
185.0
180.0
180.0
180.0
180.0
185.0
185.0
35.0
18.0
35.0
28.0
35.0
18.0
18.0
35.0
35.0
18.0
35.0
18.0
18.0
18.0
18.0
35.0
35.0
TL331IDBVT
250
TL331IDBVTG4
TL331IDBVTG4
TL331KDBVR
TL331KDBVR
TL331KDBVR
TL331KDBVT
TL331KDBVT
TL331KDBVT
TL391BIDBVR
250
250
3000
3000
3000
250
250
250
3000
Pack Materials-Page 3
PACKAGE OUTLINE
DBV0005A
SOT-23 - 1.45 mm max height
S
C
A
L
E
4
.
0
0
0
SMALL OUTLINE TRANSISTOR
C
3.0
2.6
0.1 C
1.75
1.45
1.45
0.90
B
A
PIN 1
INDEX AREA
1
2
5
(0.1)
2X 0.95
1.9
3.05
2.75
1.9
(0.15)
4
3
0.5
5X
0.3
0.15
0.00
(1.1)
TYP
0.2
C A B
NOTE 5
0.25
GAGE PLANE
0.22
0.08
TYP
8
0
TYP
0.6
0.3
TYP
SEATING PLANE
4214839/G 03/2023
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
5. Support pin may differ or may not be present.
www.ti.com
EXAMPLE BOARD LAYOUT
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X (0.95)
4
(R0.05) TYP
(2.6)
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
EXPOSED METAL
EXPOSED METAL
0.07 MIN
ARROUND
0.07 MAX
ARROUND
NON SOLDER MASK
DEFINED
SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
4214839/G 03/2023
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
DBV0005A
SOT-23 - 1.45 mm max height
SMALL OUTLINE TRANSISTOR
PKG
5X (1.1)
1
5
5X (0.6)
SYMM
(1.9)
2
3
2X(0.95)
4
(R0.05) TYP
(2.6)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
4214839/G 03/2023
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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