TL393IPWLE [ROCHESTER]
Comparator, 2 Func, 9000uV Offset-Max, 650ns Response Time, BIPolar, PDSO8, 1.10 MM, TSSOP-8;
| 型号： | TL393IPWLE |
| 厂家： | 
Rochester Electronics |
| 描述： | Comparator, 2 Func, 9000uV Offset-Max, 650ns Response Time, BIPolar, PDSO8, 1.10 MM, TSSOP-8 放大器 光电二极管 |
| 文件： | 总13页 (文件大小：544K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
D, P, OR PW PACKAGE
(TOP VIEW)
Low-Voltage and Single-Supply Operation
= 2 V to 7 V
V
CC
Common-Mode Voltage Range That
Includes Ground
1OUT
1IN–
1IN+
GND
V
CC
1
2
3
4
8
7
6
5
2OUT
2IN–
2IN+
description
The TL393 is a dual differential comparator built using a new Texas Instruments-developed bipolar process. The
TL393 is intended as an enhanced alternative to the industry-standard LM393 in circuits with supply-voltage
limits of 7 V.
The new bipolar process allows the TL393 to perform with lower supply-current requirements than the LM393
(0.7 mA typical) while still providing a faster response time than the older device.
Package availability for this device includes the TSSOP (thin-shrink small-outline package). With a maximum
thickness of 1.1 mm and a package area that is 25% smaller than the standard surface-mount package, the
TSSOP is ideal for high-density circuits, particularly in hand-held and portable equipment.
AVAILABLE OPTIONS
PACKAGED DEVICES
SUPPLY
CURRENT
(TYP)
RESPONSE TIME
(TYP)
CHIP FORM
(Y)
T
A
SMALL OUTLINE
PLASTIC DIP
(P)
TSSOP
(PW)
†
(D)
–40°C to 105°C
0.7 mA
0.65 µs
TL393ID
TL393IP
TL393IPWLE
TL393Y
†
The PW packages are only available left-ended taped and reeled (e.g., TL393IPWLE).
symbol (each comparator)
IN+
IN–
OUT
Copyright 1993, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
equivalent schematic (each comparator)
V
CC
IN +
IN –
GND
OUT
COMPONENT COUNT
Transistors
Resistors
Diodes
48
5
7
Epi-FETs
2
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
TL393Y chip information
This chip, when properly assembled, displays characteristics similar to the TL393. Thermal compression or
ultrasonic bonding may be used on the doped-aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC
(8)
(3)
(2)
(7)
(6)
1IN+
1IN–
+
–
(1)
1OUT
(5)
(6)
+
2IN+
2IN–
(7)
2OUT
–
(4)
GND
(5)
(8)
(1)
38
CHIP THICKNESS: 13 TYPICAL
BONDING PADS: 3.54 × 3.54 MINIMUM
(4)
(3)
T max = 150°C
J
TOLERANCES ARE ±10%.
ALL DIMENSIONS ARE IN MILS.
(2)
PIN (4) IS INTERNALLY CONNECTED
TO BACKSIDE OF CHIP.
32
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
CC
Differential input voltage, V (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
ID
Input voltage, V (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
I
Output voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 V
O
Output current, I (each output) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA
O
Duration of short-circuit current to GND (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . unlimited
Continuous total dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Dissipation Rating Table
Operating free-air temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –40°C to 105°C
A
Storage temperature range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values, except differential voltages, are with respect to network GND.
2. Differential voltages are at IN+ with respect to IN –.
3. Short circuits from the outputs to V
can cause excessive heating and eventual destruction of the chip.
CC
DISSIPATION RATING TABLE
T
≤ 25°C
DERATING FACTOR
T
= 70°C
T = 85°C
A
A
A
PACKAGE
POWER RATING
ABOVE T = 25°C
POWER RATING POWER RATING
A
D
P
PW
725 mW
1000 mW
525 mW
5.8 mW/°C
8.0 mW/°C
4.2 mW/°C
464 mW
640 mW
336 mW
377 mW
520 mW
273 mW
recommended operating conditions
MIN
2
MAX
7
UNIT
V
Supply voltage, V
CC
Operating free-air temperature, T
–40
105
°C
A
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
electrical characteristics, V
= 5 V (unless otherwise noted)
CC
TL393
TYP
PARAMETER
TEST CONDITIONS
UNIT
T †
A
MIN
MAX
25°C
1.5
5
9
V
V
V
Input offset voltage
V
= 1.4 V,
V
= V min
ICR
mV
IO
O
IC
Full range
0 to
0 to
25°C
V
–1.5
V
–1.2
CC
0 to
–2
CC
Common-mode input voltage range
V
ICR
OL
Full range
V
CC
V
V
= –1 V,
= –1 V,
I
I
= 1 mA
= 4 mA
25°C
Full range
25°C
70
200
5
300
700
ID
OL
Low-level output voltage
Input offset current
Input bias current
mV
nA
nA
ID
OL
50
I
I
V
= 1.4 V
= 1.4 V
IO
O
O
Full range
25°C
150
–40
0.1
–250
–400
V
IB
Full range
25°C
V
ID
V
ID
V
ID
= 1 V,
= 1 V,
= –1 V,
V
OH
V
OH
V
OL
= 3 V
= 5 V
I
I
I
High-level output current
low-level output current
High-level supply current
nA
mA
µA
OH
Full range
25°C
100
= 1.5 V
6
OL
25°C
140
0.8
200
300
1
V
= V
= V
CCH
O
O
OH
OL
Full range
25°C
I
Low-level supply current
V
mA
CCL
Full range
1.2
†
Full range is –40°C to 105°C.
switching characteristics, V
= 5 V, C = 15 pF, T = 25°C
L A
CC
TL393
TYP
0.65
0.2
PARAMETER
TEST CONDITIONS
UNIT
MIN
MAX
100-mV input step with 5-mV overdrive,
TTL-level input step,
R
R
connected to 5 V through 5.1 kΩ
connected to 5 V through 5.1 kΩ
L
L
Response time
µs
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TL393, TL393Y
DUAL DIFFERENTIAL COMPARATORS
SLCS120A – AUGUST 1993 – REVISED DECEMBER 1993
electrical characteristics, V
= 5 V, T = 25°C (unless otherwise noted)
CC
A
TL393Y
TYP
1.5
PARAMETER
Input offset voltage
TEST CONDITIONS
MIN
UNIT
MAX
V
V
V
V
= 1.4 V,
5
mV
V
IO
O
0 to
–1.5
0 to
Common-mode input voltage range
ICR
OL
V
V
CC
–1.2
CC
Low-level output voltage
Input offset current
V
V
V
V
V
V
V
= –1 V,
= 1.4 V
= 1.4 V
= 1 V,
I
= 1 mA
70
300
50
mV
nA
nA
nA
mA
µA
mA
ID
OL
I
I
I
I
I
I
5
IO
O
Input bias current
–40
–250
IB
O
High-level output current
low-level output current
High-level supply current
Low-level supply current
V
V
= 3 V
0.1
OH
OL
ID
ID
O
OH
= –1 V,
= 1.5 V
6
OL
= V
= V
140
0.8
200
1
CCH
CCL
OH
OL
O
switching characteristics, V
= 5 V, C = 15 pF, T = 25°C
L A
CC
TL393Y
TYP
PARAMETER
TEST CONDITIONS
UNIT
MIN
MAX
100-mV input step with 5-mV overdrive,
TTL-level input step,
R
R
connected to 5 V through 5.1 kΩ
connected to 5 V through 5.1 kΩ
0.65
L
L
Response time
µs
0.2
TYPICAL CHARACTERISTICS
LOW- TO HIGH-LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
HIGH- TO LOW-LEVEL OUTPUT RESPONSE
FOR VARIOUS INPUT OVERDRIVES
5
5
40 mV
20 mV
10 mV
5 mV
40 mV
20 mV
10 mV
5 mV
2 mV
2 mV
0
100
0
0
100
0
V
T
A
= 5 V
CC
= 25°C
V
T
A
= 5 V
= 25°C
CC
0
0.5
1
1.5
2
2.5
0
0.2
0.4
0.6
0.8
t
– High- to Low-Level Output
Response Time – µs
t
– Low- to High-Level Output
Response Time – µs
PHL
PLH
Figure 1
Figure 2
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
30-Mar-2005
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
SOIC
SOIC
PDIP
Drawing
TL393ID
TL393IDR
TL393IP
OBSOLETE
OBSOLETE
OBSOLETE
D
D
8
8
8
8
TBD
TBD
TBD
TBD
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
Call TI
P
TL393IPWLE
OBSOLETE TSSOP
PW
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan
-
The planned eco-friendly classification: Pb-Free (RoHS) or Green (RoHS
&
no Sb/Br)
-
please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE OUTLINE
PW0008A
TSSOP - 1.2 mm max height
S
C
A
L
E
2
.
8
0
0
SMALL OUTLINE PACKAGE
C
6.6
6.2
SEATING PLANE
TYP
PIN 1 ID
AREA
A
0.1 C
6X 0.65
8
5
1
3.1
2.9
NOTE 3
2X
1.95
4
0.30
0.19
8X
4.5
4.3
1.2 MAX
B
0.1
C A
B
NOTE 4
(0.15) TYP
SEE DETAIL A
0.25
GAGE PLANE
0.15
0.05
0.75
0.50
0 - 8
DETAIL A
TYPICAL
4221848/A 02/2015
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
5. Reference JEDEC registration MO-153, variation AA.
www.ti.com
EXAMPLE BOARD LAYOUT
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
8X (0.45)
(R0.05)
1
4
TYP
8
SYMM
6X (0.65)
5
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK
OPENING
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
METAL
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
SOLDER MASK
DEFINED
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
6. Publication IPC-7351 may have alternate designs.
7. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
www.ti.com
EXAMPLE STENCIL DESIGN
PW0008A
TSSOP - 1.2 mm max height
SMALL OUTLINE PACKAGE
8X (1.5)
SYMM
(R0.05) TYP
8X (0.45)
1
4
8
SYMM
6X (0.65)
5
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:10X
4221848/A 02/2015
NOTES: (continued)
8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.
www.ti.com
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