SN75C3238PWG4 [TI]
3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER; 3V至5.5V多通道RS - 232兼容线路驱动器/接收器型号: | SN75C3238PWG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | 3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER |
文件: | 总20页 (文件大小:371K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
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ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢏꢐ ꢑꢌꢒ ꢄ ꢓꢔꢁ ꢁꢕꢑ ꢖꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕ ꢒ ꢋ ꢕꢖ
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SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
DB, DW, OR PW PACKAGE
(TOP VIEW)
D
Auto-powerdown Plus
Operate With 3-V to 5.5-V V
D
D
Supply
CC
Always-Active Noninverting Receiver
Output (ROUT1B)
C2+
GND
C2−
V−
C1+
27 V+
26
25 C1−
1
28
2
3
V
D
Support Operation From 250 kbit/s to
1 Mbit/s
CC
4
5
24
23
22
21
20
19
18
17
16
15
DOUT1
DOUT2
DOUT3
RIN1
DIN1
D
D
D
D
D
D
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
6
DIN2
7
DIN3
Accept 5-V Logic Input With 3.3-V Supply
8
ROUT1
ROUT2
DIN4
Inter-Operable With SN65C3243,
SN75C3243
9
RIN2
10
11
12
13
14
DOUT4
RIN3
ROUT3
DIN5
RS-232 Bus-Pin ESD Protection Exceeds
15-kV Using Human-Body Model (HBM)
DOUT5
FORCEON
FORCEOFF
ROUT1B
INVALID
Applications
− Battery-Powered Systems, PDAs,
Notebooks, Sub-Notebooks, Laptops,
Palmtop PCs, Hand-Held Equipment,
Modems, and Printers
description/ordering information
The ’C3238 devices consist of five line drivers, three line receivers, and a dual charge-pump circuit with 15-kV
ESD protection pin to pin (serial-port connection pins, including GND). The charge pump and four small external
capacitors allow operation from a single 3-V to 5.5-V supply. In addition, these devices include an always-active
noninverting output (ROUT1B), which allows applications using the ring indicator to transmit data while the
device is powered down. These devices operate at data signaling rates up to 1 Mbit/s and at an increased
slew-rate range of 24 V/µs to 150 V/µs.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
Tube of 20
SN75C3238DW
SOIC (DW)
SSOP (DB)
75C3238
Reel of 1000
Reel of 2000
Tube of 50
SN75C3238DWR
SN75C3238DBR
SN75C3238PW
SN75C3238PWR
SN65C3238DW
SN65C3238DWR
SN65C3238DBR
SN65C3238PW
SN65C3238PWR
75C3238
CA3238
−0°C to 70°C
−40°C to 85°C
TSSOP (PW)
Reel of 2000
Tube of 20
SOIC (DW)
SSOP (DB)
65C3238
65C3238
Reel of 1000
Reel of 2000
Tube of 50
TSSOP (PW)
CB3238
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎ ꢃꢊꢋ ꢏ ꢐꢑꢌꢒ ꢄ ꢓꢔ ꢁꢁꢕ ꢑ ꢖꢀ ꢊꢆ ꢅ ꢆ ꢄ ꢍꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕꢒ ꢋꢕꢖ
ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
description/ordering information (continued)
Flexible control options for power management are featured when the serial-port and driver inputs are inactive.
The auto-powerdown plus feature functions when FORCEON is low and FORCEOFF is high. During this mode
of operation, if the device does not sense valid signal transitions on all receiver and driver inputs for 30 s, the
built-in charge-pump and drivers are powered down, reducing the supply current to 1 µA. By disconnecting the
serial port or placing the peripheral drivers off, auto-powerdown plus will occur if there is no activity in the logic
levels for the driver inputs. Auto-powerdown plus can be disabled when FORCEON and FORCEOFF are high.
With auto-powerdown plus enabled, the device automatically activates once a valid signal is applied to any
receiver or driver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less
than −2.7 V or has been between −0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver
input voltages are between −0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
Function Tables
EACH DRIVER
INPUTS
OUTPUT
DOUT
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
DRIVER STATUS
DIN
FORCEON
FORCEOFF
X
L
X
H
H
L
L
X
Z
H
L
Powered off
H
H
H
H
H
H
X
Normal operation with
auto-powerdown plus disabled
H
L
X
<30 s
<30 s
>30 s
>30 s
H
L
Normal operation with
auto-powerdown plus enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown plus feature
H
L
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUTS
RIN1,
RIN3−RIN5
TIME ELAPSED SINCE LAST
RIN OR DIN TRANSITION
RECEIVER STATUS
RIN2
ROUT1B ROUT
FORCEOFF
L
H
X
X
L
L
X
L
H
L
Z
Z
H
L
Powered off while
ROUT1B is active
X
L
L
H
H
H
H
H
<30 s
<30 s
<30 s
<30 s
>30 s
L
H
L
Normal operation with
auto-powerdown plus
disabled/enabled
H
L
H
H
L
H
L
H
H
Open
Open
H
H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off
2
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ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
logic diagram (positive logic)
24
5
DIN1
DOUT1
23
22
19
17
6
DIN2
DOUT2
7
DIN3
DIN4
DIN5
DOUT3
10
DOUT4
12
DOUT5
14
13
FORCEOFF
FORCEON
15
Auto-powerdown
Plus
INVALID
16
21
ROUT1B
ROUT1
8
RIN1
20
18
9
ROUT2
ROUT3
RIN2
11
RIN3
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎ ꢃꢊꢋ ꢏ ꢐꢑꢌꢒ ꢄ ꢓꢔ ꢁꢁꢕ ꢑ ꢖꢀ ꢊꢆ ꢅ ꢆ ꢄ ꢍꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕꢒ ꢋꢕꢖ
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SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, V : Driver (FORCEOFF, FORCEON) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
I
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, V : Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . − 13.2 V to 13.2 V
O
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
JA
DW package . . . . . . . . . . . . . . . . . . . . . . . . . . 46°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 62°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
MIN NOM
MAX
3.6
UNIT
V
= 3.3 V
= 5 V
3
4.5
2
3.3
5
CC
CC
CC
CC
Supply voltage
V
V
V
V
5.5
= 3.3 V
= 5 V
V
IH
Driver and control high-level input voltage
V
DIN, FORCEOFF, FORCEON
2.4
V
V
V
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, FORCEOFF, FORCEON
DIN, FORCEOFF, FORCEON
0.8
5.5
25
70
85
V
V
V
IL
0
−25
0
I
I
SN75C3238
SN65C3238
T
A
Operating free-air temperature
°C
−40
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V
= 3.3 V 0.3 V; and C1 = 0.047 µF
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
‡
PARAMETER
FORCEOFF, FORCEON
TEST CONDITIONS
MIN TYP
MAX
UNIT
I
I
Input leakage current
0.01
0.5
1
1
µA
Auto-powerdown plus
disabled
No load,
2
mA
FORCEOFF and FORCEON at V
CC
Powered off
No load, FORCEOFF at GND
10
I
Supply current
CC
No load, FORCEOFF at V
FORCEON at GND,
All RIN are open or grounded
,
CC
µA
Auto-powerdown plus
enabled
1
10
‡
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V = 3.3 V 0.3 V; and C1 = 0.047 µF
CC
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
4
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ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
All DOUT at R = 3 kΩ to GND
MIN TYP
MAX
UNIT
V
V
V
High-level output voltage
Low-level output voltage
High-level input current
Low-level input current
5
5.4
−5.4
0.01
0.01
35
OH
L
All DOUT at R = 3 kΩ to GND
−5
V
OL
L
I
IH
V = V
I CC
1
1
µA
µA
I
IL
V at GND
I
V
V
V
= 3.6 V,
V
O
V
O
V
O
V
O
V
O
= 0 V
= 0 V
60
90
CC
CC
CC
‡
I
mA
Short-circuit output current
OS
= 5.5 V,
40
r
Output resistance
, V+, and V− = 0 V,
=
=
=
2 V
300
10M
Ω
o
12 V,
10 V,
V
V
= 3 V to 3.6 V
25
25
CC
I
off
Output leakage current
FORCEOFF = GND
µA
= 4.5 V to 5.5 V
CC
†
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V = 3.3 V 0.3 V; and C1 = 0.047 µF
CC
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
MIN TYP
250
MAX
UNIT
C
C
C
R
= 1000 pF
= 250 pF,
= 1000 pF,
L
L
L
L
Maximum data rate
(see Figure 1)
R = 3 kΩ,
L
V
V
= 3 V to 4.5 V
1000
kbit/s
CC
One DOUT switching
= 4.5 V to 5.5 V
1000
CC
§
t
Pulse skew
C
C
= 150 pF to 2500 pF,
= 150 pF to 1000 pF,
= 3 kΩ to 7 kΩ, See Figure 2
25
ns
sk(p)
L
L
Slew rate,
transition region
(see Figure 1)
SR(tr)
R
= 3 kΩ to 7 kΩ, = 3.3 V
V
CC
18
150
V/µs
L
†
§
All typical values are at V
Pulse skew is defined as |t
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V
= 3.3 V 0.3 V; and C1 = 0.047 µF
CC
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
5
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ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
MIN
− 0.6 V
TYP
MAX
UNIT
V
V
V
I
I
= −1 mA
= 1.6 mA
V
CC
V − 0.1 V
CC
OH
OH
0.4
2.4
2.4
V
OL
OL
V
V
V
V
= 3.3 V
= 5 V
1.5
1.8
1.2
1.5
0.3
0.05
5
CC
CC
CC
CC
V
IT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
= 3.3 V
= 5 V
0.6
0.8
V
V
IT−
Input hysteresis (V
IT+
− V
)
V
hys
IT−
I
off
Output leakage current (except ROUT1B)
Input resistance
FORCEOFF = 0 V
V = 3 V to 25 V
10
7
µA
kΩ
r
3
i
I
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V = 3.3 V 0.3 V; and C1 = 0.047 µF
CC
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
ns
t
t
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
150
150
200
200
50
PLH
PHL
en
C
C
= 150 pF, See Figure 3
L
L
ns
ns
= 150 pF, R = 3 kΩ, See Figure 4
L
Output disable time
ns
dis
‡
Pulse skew
See Figure 3
= 5 V, and T = 25°C.
ns
sk(p)
†
‡
All typical values are at V
CC
= 3.3 V or V
CC
A
Pulse skew is defined as |t
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Testing supply conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.15 V; C1−C4 = 0.22 µF at V
= 3.3 V 0.3 V; and C1 = 0.047 µF
CC
and C2−C4 = 0.33 µF at V
CC
= 5 V 0.5 V.
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢅ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢅ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢏꢐ ꢑꢌꢒ ꢄ ꢓꢔꢁ ꢁꢕꢑ ꢖꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕ ꢒ ꢋ ꢕꢖ
ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
AUTO-POWERDOWN PLUS SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
†
TYP
PARAMETER
TEST CONDITIONS
FORCEON = GND,
FORCEOFF = V
MIN
MAX
UNIT
Receiver input threshold
for INVALID high-level output voltage
V
V
V
V
V
2.7
V
T+(valid)
T−(valid)
T(invalid)
OH
CC
FORCEON = GND,
FORCEOFF = V
Receiver input threshold
for INVALID high-level output voltage
−2.7
−0.3
V
V
V
V
CC
FORCEON = GND,
FORCEOFF = V
Receiver input threshold
for INVALID low-level output voltage
0.3
0.4
CC
= −1 mA, FORCEON = GND,
I
OH
FORCEOFF = V
INVALID high-level output voltage
INVALID low-level output voltage
V
− 0.6
CC
CC
= 1.6 mA, FORCEON = GND,
I
OL
FORCEOFF = V
OL
CC
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
†
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
MIN TYP
MAX
UNIT
µs
t
t
t
t
0.1
50
25
30
valid
invalid
en
µs
µs
Receiver or driver edge to auto-powerdown plus
15
60
s
dis
†
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T = 25°C.
A
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢅꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢅ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎ ꢃꢊꢋ ꢏ ꢐꢑꢌꢒ ꢄ ꢓꢔ ꢁꢁꢕ ꢑ ꢖꢀ ꢊꢆ ꢅ ꢆ ꢄ ꢍꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕꢒ ꢋꢕꢖ
ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
TLH
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
−3 V
3 V
−3 V
3 V
Output
FORCEOFF
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
L
t
t
PHL
PLH
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3 V
−3 V
Input
1.5 V
1.5 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
V
V
OH
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢅ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢅ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢏꢐ ꢑꢌꢒ ꢄ ꢓꢔꢁ ꢁꢕꢑ ꢖꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕ ꢒ ꢋ ꢕꢖ
ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
1.5 V
1.5 V
V
CC
S1
GND
3 V or 0 V
FORCEON
t
t
PHZ
PZH
(S1 at GND)
(S1 at GND)
R
L
V
OH
RS-232 Input
Output
50%
Output
0.3 V
C
L
(see Note A)
FORCEOFF
t
t
PLZ
(S1 at V
PZL
(S1 at V
)
)
CC
CC
Generator
(see Note B)
50 Ω
0.3 V
Output
50%
V
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
and t
are the same as t
.
PLZ
PZL
PHZ
PZH
dis
t
and t
are the same as t
.
en
Figure 4. Receiver Enable and Disable Times
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢅꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢅ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎ ꢃꢊꢋ ꢏ ꢐꢑꢌꢒ ꢄ ꢓꢔ ꢁꢁꢕ ꢑ ꢖꢀ ꢊꢆ ꢅ ꢆ ꢄ ꢍꢏ ꢗꢔꢌ ꢒꢘꢑ ꢕ ꢑ ꢒꢁꢕ ꢙꢖꢒ ꢋꢕ ꢖꢚꢖꢕ ꢄꢕꢒ ꢋꢕꢖ
ꢛ
ꢛ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
Valid RS-232 Level, INVALID High
ROUT
2.7 V
0.3 V
Generator
(see Note B)
50 Ω
Indeterminate
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
Auto-
powerdown
plus
INVALID
= 30 pF
−2.7 V
C
L
Valid RS-232 Level, INVALID High
(see Note A)
†
Auto-powerdown plus disables drivers and reduces
supply current to 1 µA.
FORCEOFF
FORCEON
DIN
DOUT
TEST CIRCUIT
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following
characteristics: PRR = 5 kbit/s, Z = 50 Ω,
O
50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
r
f
3 V
2.7 V
Receiver
Input
0 V
0 V
−2.7 V
−3 V
t
invalid
t
valid
INVALID
Output
V
CC
50%
50%
0 V
3 V to 5 V
Driver
Input
50%
50%
0 V
≈5.5 V
Driver
Output
≈−5.5 V
t
t
dis
dis
t
t
en
en
V+
V+
V+ −0.3 V
Supply
Voltages
V− +0.3 V
V−
V−
Voltage Waveforms and Timing Diagrams
Figure 5. INVALID Propagation Delay Times and Supply Enabling Time
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢅ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢅ ꢇ
ꢒ
ꢛ
ꢛ
ꢅ
ꢊ
ꢋ
ꢌ ꢍ
ꢃ
ꢎ
ꢃ
ꢊ
ꢋ
ꢏ
ꢐ
ꢑꢌ
ꢒ
ꢄ
ꢓ
ꢔ
ꢁ
ꢁ
ꢕ
ꢑ
ꢖ
ꢀ
ꢊ
ꢆꢅ
ꢆ
ꢄ
ꢍ
ꢏ
ꢗꢔ
ꢌ
ꢒ
ꢘ
ꢑ
ꢕ
ꢑ
ꢁ
ꢕ
ꢙ
ꢖ
ꢒ
ꢋ
ꢕ
ꢖ
ꢚ
ꢖ
ꢕ
ꢄ
ꢕ
ꢒ
ꢋ
ꢕ
ꢖ
SLLS352F − JUNE 1999 − REVISED OCTOBER 2004
APPLICATION INFORMATION
+
−
C
= 0.1 µF
BYPASS
28
C1+
1
2
C2+
27
+
V+
+
GND
†
C3
C2
+
−
−
−
C1
3
4
26
25
24
C2−
V−
V
CC
+
−
C1−
C4
5
6
7
8
9
DIN1
DIN2
DIN3
DOUT1
DOUT2
23
22
21
20
DOUT3
RIN1
ROUT1
ROUT2
Serial Port
RIN2
Logic I/Os
5 kΩ
5 kΩ
10
11
19
18
DOUT4
RIN3
DIN4
ROUT3
12
17
16
DOUT5
DIN5
ROUT1B
5 kΩ
Auto-
powerdown
Plus
13
14
15
FORCEON
FORCEOFF
INVALID
†
C3 can be connected to V
CC
or GND.
V
CC
vs CAPACITOR VALUES
NOTE A: Resistor values shown are nominal.
V
CC
C1
C2, C3, and C4
3.3 V 0.15 V
3.3 V 0.3 V
5 V 0.5 V
0.1 µF
0.22 µF
0.047 µ F
0.22 µF
0.1 µF
0.22 µF
0.33 µF
1 µF
3 V to 5.5 V
Figure 6. Typical Operating Circuit and Capacitor Values
11
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
PACKAGING INFORMATION
Orderable Device
SN65C3238DB
Status (1)
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PREVIEW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SSOP
DB
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
28
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3238DBR
SN65C3238DBRE4
SN65C3238DBRG4
SN65C3238DW
SSOP
SSOP
SSOP
SOIC
DB
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
DW
PW
PW
PW
PW
PW
PW
DB
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3238DWE4
SN65C3238DWG4
SN65C3238DWR
SN65C3238DWRE4
SN65C3238DWRG4
SN65C3238PW
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
SSOP
SSOP
SSOP
SSOP
SOIC
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN65C3238PWE4
SN65C3238PWG4
SN65C3238PWR
SN65C3238PWRE4
SN65C3238PWRG4
SN75C3238DB
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3238DBR
SN75C3238DBRE4
SN75C3238DBRG4
SN75C3238DW
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DB
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DW
DW
DW
DW
DW
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3238DWE4
SN75C3238DWG4
SN75C3238DWR
SN75C3238DWRE4
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
20 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-May-2007
Orderable Device
SN75C3238DWRG4
SN75C3238PW
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
DW
28
28
28
28
28
28
28
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN75C3238PWE4
SN75C3238PWG4
SN75C3238PWR
SN75C3238PWRE4
SN75C3238PWRG4
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
TAPE AND REEL INFORMATION
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
330
330
330
330
330
330
330
(mm)
16
SN65C3238DBR
SN65C3238DWR
SN65C3238PWR
SN65C3238PWR
SN75C3238DBR
SN75C3238DWR
SN75C3238PWR
SN75C3238PWR
DB
DW
PW
PW
DB
28
28
28
28
28
28
28
28
MLA
TAI
8.2
11.35
6.9
10.5
18.67
10.2
10.4
10.5
18.67
10.2
10.4
2.5
3.1
1.8
1.6
2.5
3.1
1.8
1.6
12
16
12
12
12
16
12
12
16
32
16
16
16
32
16
16
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
32
TAI
16
MLA
MLA
TAI
16
7.1
16
8.2
DW
PW
PW
32
11.35
6.9
TAI
16
MLA
16
7.1
TAPE AND REEL BOX INFORMATION
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
SN65C3238DBR
SN65C3238DWR
SN65C3238PWR
SN65C3238PWR
SN75C3238DBR
SN75C3238DWR
SN75C3238PWR
SN75C3238PWR
DB
DW
PW
PW
DB
28
28
28
28
28
28
28
28
MLA
TAI
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
49.0
33.0
33.0
33.0
49.0
33.0
33.0
TAI
MLA
MLA
TAI
DW
PW
PW
TAI
MLA
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
16-Jul-2007
Pack Materials-Page 3
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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