SN75C3243DWG4 [TI]

TRIPLE LINE TRANSCEIVER, PDSO28, GREEN, PLASTIC, SOIC-28;


型号：	SN75C3243DWG4
厂家：	TEXAS INSTRUMENTS
描述：	TRIPLE LINE TRANSCEIVER, PDSO28, GREEN, PLASTIC, SOIC-28 驱动光电二极管接口集成电路驱动器
文件：	总23页 (文件大小：938K)
中文：	中文翻译
下载：	下载PDF数据表文档文件

SN65C3243, SN75C3243

www.ti.com ................................................................................................................................................. SLLS353H–JUNE 1999–REVISED SEPTEMBER 2008

3-V TO 5.5-V MULTICHANNEL RS-232 COMPATIBLE LINE DRIVER/RECEIVER

FEATURES

DB, DW, OR PW PACKAGE

•

Operates With 3-V to 5.5-V V_CCSupply

(TOP VIEW)

•

Always-Active Noninverting Receiver Output

(ROUT2B)

C2+

C2−

V−

C1+

27 V+

•

Low Standby Current . . . 1 µA Typ

26 V_CC

25 GND

24 C1−

External Capacitors . . . 4 × 0.1 µF

RIN1

RIN2

RIN3

RIN4

RIN5

DOUT1

DOUT2

DOUT3

DIN3

DIN2

DIN1

Accepts 5-V Logic Input With 3.3-V Supply

Inter-Operable With SN65C3238, SN75C3238

FORCEON

FORCEOFF

INVALID

ROUT2B

ROUT1

Supports Operation From 250 kbit/s to

1 Mbit/s

•

RS-232 Bus-Pin ESD Protection Exceeds

±15 kV Using Human-Body Model (HBM)

ROUT2

ROUT3

Latch-Up Performance Exceeds 100 mA Per

JESD 78, Class II

ROUT4

ROUT5

APPLICATIONS

•

Battery-Powered Systems

PDAs

Notebooks

Laptops

Palmtop PCs

Hand-Held Equipment

DESCRIPTION/ORDERING INFORMATION

The SN65C3243 and SN75C3243 consist of three line drivers, five line receivers, and a dual charge-pump circuit

with ±15-kV ESD protection pin to pin (serial-port connection pins, including GND). This device provides the

electrical interface between an asynchronous communication controller and the serial-port connector. The charge

pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. In addition, this device

includes an always-active noninverting output (ROUT2B), which allows applications using the ring indicator to

transmit data while the device is powered down. The device operates at data signaling rates up to 1 Mbit/s and

an increased slew-rate range of 24 V/µs to 150 V/µs.

Flexible control options for power management are available when the serial port is inactive. The

auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of

operation, if the device does not sense a valid RS-232 signal, the driver outputs are disabled. If FORCEOFF is

set low, both drivers and receivers (except ROUT2B) are shut off, and the supply current is reduced to 1 µA.

Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown condition to occur.

Auto-powerdown can be disabled when FORCEON and FORCEOFF are high and should be done when driving

a serial mouse. With auto-powerdown enabled, the device is activated automatically when a valid signal is

applied to any receiver input. The INVALID output is used to notify the user if an RS-232 signal is present at any

receiver input. INVALID is high (valid data) if any receiver input voltage is greater than 2.7 V or less than –2.7 V

or has been between –0.3 V and 0.3 V for less than 30 µs. INVALID is low (invalid data) if all receiver input

voltages are between –0.3 V and 0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas

Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

PRODUCTION DATA information is current as of publication date.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

SN65C3243, SN75C3243

SLLS353H–JUNE 1999–REVISED SEPTEMBER 2008 ................................................................................................................................................. www.ti.com

ORDERING INFORMATION

T_A

PACKAGE⁽¹⁾⁽²⁾

ORDERABLE PART NUMBER

SN75C3243DW

TOP-SIDE MARKING

75C3243

Tube of 20

SOIC – DW

SSOP – DB

TSSOP – PW

Reel of 1000

Reel of 2000

Tube of 50

SN75C3243DWR

SN75C3243DBR

SN75C3243PW

0°C to 70°C

75C3243

CA3243

Reel of 2000

Tube of 20

SN75C3243PWR

SN65C3243DW

SOIC – DW

SSOP – DB

TSSOP – PW

65C3243

CB3243

Reel of 1000

Reel of 2000

Tube of 50

SN65C3243DWR

SN65C3243DBR

SN65C3243PW

–40°C to 85°C

Reel of 2000

SN65C3243PWR

(1) Package drawings, thermal data, symbolization are available at www.ti.com/sc/packaging.

(2) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI

website at www.ti.com.

FUNCTION TABLES

EACH DRIVER⁽¹⁾

INPUTS

OUTPUT

DOUT

DRIVER STATUS

VALID RIN

RS-232 LEVEL

DIN

FORCEON

FORCEOFF

Powered off

Normal operation with auto-powerdown disabled

Yes

Normal operation with auto-powerdown enabled

Powered off by auto-powerdown feature

(1) H = high level, L = low level, X = irrelevant, Z = high impedance

EACH RECEIVER⁽¹⁾

INPUTS

OUTPUTS

VALID RIN

RS-232

LEVEL

RECEIVER STATUS

RIN1,

RIN3–RIN5

ROUT1,

ROUT3–5

RIN2

FORCEOFF

ROUT2B ROUT2

Powered off while

ROUT2B is active

YES

Normal operation with

auto-powerdown

disabled/enabled

Open

(1) H = high level, L = low level, X = irrelevant, Z = high impedance (off), Open = input disconnected or connected driver off

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

LOGIC DIAGRAM (POSITIVE LOGIC)

DIN1

DIN2

DIN3

DOUT1

DOUT2

DOUT3

FORCEOFF

FORCEON

INVALID

Auto-Powerdown

ROUT1

RIN1

RIN2

ROUT2B

ROUT2

ROUT3

ROUT4

ROUT5

RIN3

RIN4

RIN5

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

ABSOLUTE MAXIMUM RATINGS⁽¹⁾

over operating free-air temperature range (unless otherwise noted)

MIN

–0.3

0.3

MAX

UNIT

V_CC

V+

Supply voltage range⁽²⁾

Positive-output supply voltage range⁽²⁾

Negative-output supply voltage range⁽²⁾

V–

–7

V+ – V– Supply voltage difference⁽²⁾

Driver (FORCEOFF, FORCEON)

Receiver

–0.3

–25

V_I

Input voltage range

Output voltage range

13.2

150

V_O

Driver

–13.2

DB package

θ_JA

Package thermal impedance⁽³⁾⁽⁴⁾

DW package

°C/W

PW package

T_J

Operating virtual junction temperature

Storage temperature range

°C

T_stg

–65

(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating

conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2) All voltages are with respect to network GND.

(3) Maximum power dissipation is a function of T_J(max), θ_JA, and T_A. The maximum allowable power dissipation at any allowable ambient

temperature is P_D= (T_J(max) – T_A)/θ_JA. Operating at the absolute maximum T_Jof 150°C can affect reliability.

(4) The package thermal impedance is calculated in accordance with JESD 51-7.

RECOMMENDED OPERATING CONDITIONS⁽¹⁾

see Figure 6

MIN

NOM

3.3

MAX UNIT

V_CC= 3.3 V

V_CC= 5 V

V_CC= 3.3 V

V_CC= 5 V

3.6

Supply voltage

4.5

5.5

V_IH

Driver and control high-level input voltage DIN, FORCEOFF, FORCEON

Driver and control low-level input voltage DIN, FORCEOFF, FORCEON

2.4

V_IL

V_I

0.8

5.5

Driver and control input voltage

Receiver input voltage

DIN, FORCEOFF, FORCEON

–25

–40

V_I

SN65C3243

SN75C3243

T_A

Operating free-air temperature

°C

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

ELECTRICAL CHARACTERISTICS⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

PARAMETER

TEST CONDITIONS

MIN TYP⁽²⁾

MAX UNIT

I_I

Input leakage current

FORCEOFF, FORCEON

±0.01

±1

µA

No load,

Auto-powerdown disabled

Powered off

0.3

FORCEOFF and FORCEON = V_CC

No load, FORCEOFF = GND

I_CC

Supply current

No load, FORCEOFF = V_CC

µA

FORCEON = GND,

All RIN are open or grounded,

All DIN are grounded

Auto-powerdown enabled

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

(2) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

DRIVER SECTION

Electrical Characteristics⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

PARAMETER

TEST CONDITIONS

All DOUT at R_L= 3 kΩ to GND

MIN TYP⁽²⁾

MAX UNIT

High-level output

voltage

V_OH

V_OL

V_O

–5

±5

5.4

Low-level output

voltage

All DOUT at R_L= 3 kΩ to GND

–5.4

Output voltage

(mouse driveability)

DIN1 = DIN2 = GND, DIN3 = V_CC, 3-kΩ to GND at DOUT3,

DOUT1 = DOUT2 = 2.5 mA

I_IH

I_IL

High-level input current V_I= V_CC

Low-level input current V_I= GND

±0.01

±35

±1

µA

V_CC= 3.6 V,

V_CC= 5.5 V,

V_O= 0 V

±60

±90

Short-circuit output

current⁽³⁾

I_OS

r_o

Ω

±35

Output resistance

V_CC, V+, and V– = 0 V, V_O= ±2 V

V_O= ±12 V,

300

10M

V_CC= 3 V to 3.6 V

±25

I_off

Output leakage current FORCEOFF = GND

µA

V_O= ±10 V,

V_CC= 4.5 V to 5.5 V

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

(2) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

(3) Short-circuit durations should be controlled to prevent exceeding the device absolute power dissipation ratings, and not more than one

output should be shorted at a time.

Switching Characteristics⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

PARAMETER

TEST CONDITIONS

C_L= 1000 pF

MIN TYP⁽²⁾

MAX UNIT

250

1000

Maximum data rate

(see Figure 1)

R_L= 3 kΩ,

One DOUT switching

C_L= 250 pF,

V_CC= 3 V to 4.5 V

V_CC= 4.5 V to 5.5 V

See Figure 2

kbit/s

C_L= 1000 pF,

t_sk(p)

Pulse skew⁽³⁾

Slew rate,

SR(tr) transition region

(see Figure 1)

C_L= 150 pF to 2500 pF, R_L= 3 kΩ to 7 kΩ,

C_L= 150 pF to 1000 pF, R_L= 3 kΩ to 7 kΩ,

V_CC= 3.3 V

150 V/µs

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

(2) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

(3) Pulse skew is defined as |t_PLH– t_PHL| of each channel of the same device.

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

RECEIVER SECTION

Electrical Characteristics⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 6)

PARAMETER

High-level output voltage

Low-level output voltage

TEST CONDITIONS

I_OH= –1 mA

I_OL= 1.6 mA

V_CC= 3.3 V

V_CC= 5 V

MIN

TYP⁽²⁾

MAX

UNIT

V_OH

V_OL

V_CC– 0.6

V_CC– 0.1

0.4

2.4

1.6

1.9

V_IT+

Positive-going input threshold voltage

Negative-going input threshold voltage

V_CC= 3.3 V

V_CC= 5 V

0.6

0.8

1.1

V_IT–

1.4

V_hys

I_off

r_i

Input hysteresis (V_IT+– V_IT–

)

0.5

Output leakage current (except ROUT2B)

Input resistance

FORCEOFF = 0 V

V_I= ±3 V to ±25 V

±0.05

±10

µA

kΩ

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

(2) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

Switching Characteristics⁽¹⁾

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted)

PARAMETER

Propagation delay time, low- to high-level output

Propagation delay time, high- to low-level output

Output enable time

TEST CONDITIONS

C_L= 150 pF, See Figure 3

TYP⁽²⁾

150

200

UNIT

t_PLH

t_PHL

t_en

C_L= 150 pF, See Figure 3

C_L= 150 pF, R_L= 3 kΩ, See Figure 4

See Figure 3

t_dis

Output disable time

Pulse skew⁽³⁾

t_sk(p)

(1) Test conditions are C1–C4 = 0.1 µF at V_CC= 3.3 V ± 0.3 V; C1 = 0.047 µF, C2–C4 = 0.33 µF at V_CC= 5 V ± 0.5 V.

(2) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

(3) Pulse skew is defined as |t_PLH– t_PHL| of each channel of the same device.

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

AUTO-POWERDOWN SECTION

Electrical Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)

PARAMETER

TEST CONDITIONS

MIN

MAX

UNIT

Receiver input threshold

for INVALID high-level output voltage

V_T+(valid)

V_T–(valid)

V_T(invalid)

V_OH

FORCEON = GND, FORCEOFF = V_CC

2.7

Receiver input threshold

for INVALID high-level output voltage

FORCEON = GND, FORCEOFF = V_CC

–2.7

–0.3

Receiver input threshold

for INVALID low-level output voltage

0.3

0.4

I_OH= –1 mA, FORCEON = GND,

FORCEOFF = V_CC

INVALID high-level output voltage

INVALID low-level output voltage

V_CC– 0.6

I_OL= 1.6 mA, FORCEON = GND,

FORCEOFF = V_CC

V_OL

Switching Characteristics

over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (see Figure 5)

PARAMETER

Propagation delay time, low- to high-level output

TYP⁽¹⁾

UNIT

µs

t_valid

t_invalid

t_en

Propagation delay time, high- to low-level output

Supply enable time

µs

100

µs

(1) All typical values are at V_CC= 3.3 V or V_CC= 5 V, and T_A= 25°C.

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

PARAMETER MEASUREMENT INFORMATION

3 V

Input

RS-232

Output

0 V

Generator

(see Note B)

50 Ω

TLH

THL

(see Note A)

3 V

−3 V

3 V

FORCEOFF

3 V

−3 V

Output

6 V

t_THLor t_TLH

SR(tr) +

TEST CIRCUIT

NOTES: A. C includes probe and jig capacitance.

VOLTAGE WAVEFORMS

B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

Figure 1. Driver Slew Rate

3 V

0 V

Input

1.5 V

RS-232

Output

Generator

(see Note B)

50 Ω

PHL

PLH

(see Note A)

3 V

FORCEOFF

50%

Output

TEST CIRCUIT

NOTES: A. C includes probe and jig capacitance.

VOLTAGE WAVEFORMS

B. The pulse generator has the following characteristics: PRR = 1 Mbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

Figure 2. Driver Pulse Skew

3 V or 0 V

FORCEON

3 V

Input

1.5 V

−3 V

Output

Generator

(see Note B)

PLH

PHL

50 Ω

(see Note A)

3 V

FORCEOFF

50%

Output

TEST CIRCUIT

NOTES: A. C includes probe and jig capacitance.

VOLTAGE WAVEFORMS

B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

Figure 3. Receiver Propagation Delay Times

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

PARAMETER MEASUREMENT INFORMATION (continued)

3 V

Input

1.5 V

GND

0 V

3 V or 0 V

FORCEON

PZH

PHZ

(S1 at GND)

±3 V

Output

50%

Output

0.3 V

(see Note A)

FORCEOFF

50 Ω

PZL

(S1 at V

PLZ

(S1 at V

)

Generator

(see Note B)

0.3 V

Output

50%

TEST CIRCUIT

NOTES: A. C includes probe and jig capacitance.

VOLTAGE WAVEFORMS

B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

and t

are the same as t

dis

PLZ

PZL

PHZ

PZH

are the same as t

Figure 4. Receiver Enable and Disable Times

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

PARAMETER MEASUREMENT INFORMATION (continued)

3 V

2.7 V

0 V

Receiver

Input

−2.7 V

ROUT

−3 V

Generator

(see Note B)

50 Ω

valid

invalid

50% V

INVALID

Output

0 V

Auto-

powerdown

INVALID

C = 30 pF

≈V+

V+

(see Note A)

0.3 V

Supply

Voltages

FORCEOFF

FORCEON

0 V

0.3 V

DIN

DOUT

≈V−

V−

TEST CIRCUIT

VOLTAGE WAVEFORMS

Valid RS-232 Level, INVALID High

2.7 V

0.3 V

Indeterminate

If Signal Remains Within This Region

for More Than 30 µs, INVALID Is Low

0 V

†

−0.3 V

Indeterminate

−2.7 V

Valid RS-232 Level, INVALID High

†

Auto-powerdowndisables drivers and reduces supply

current to 1 µA.

NOTES: A. C includes probe and jig capacitance.

B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.

Figure 5. INVALID Propagation Delay Times and Supply Enabling Time

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

SN65C3243, SN75C3243

PARAMETER MEASUREMENT INFORMATION (continued)

C1+

V+

C2+

C2−

−

†

−

BYPASS

= 0.1 µF

V−

GND

C1−

−

RIN1

FORCEON

FORCEOFF

RIN2

RIN3

Serial-Port Inputs

RIN4

RIN5

INVALID

ROUT2B

DOUT1

DOUT2

ROUT1

ROUT2

Serial-Port Outputs

5 kΩ

DOUT3

5 kΩ

Logic Outputs

DIN3

DIN2

DIN1

ROUT3

5 kΩ

Logic Inputs

ROUT4

ROUT5

5 kΩ

†

C3 can be connected to V or GND.

NOTE A: Resistor values shown are nominal.

vs CAPACITOR VALUES

C2, C3, and C4

3.3 V ± 0.3 V

5 V ± 0.5 V

3 V to 5.5 V

0.1 µF

0.047 µF

0.1 µF

0.33 µF

0.47 µF

Figure 6. Typical Operating Circuit and Capacitor Values

Submit Documentation Feedback

Product Folder Link(s): SN65C3243 SN75C3243

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

PACKAGING INFORMATION

Orderable Device

SN65C3243DBR

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

-40 to 85

0 to 70

Top-Side Markings

Samples

Drawing

(1)

(2)

(3)

(4)

ACTIVE

SSOP

SOIC

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

65C3243

SN65C3243DBRE4

SN65C3243DBRG4

SN65C3243DW

ACTIVE

Green (RoHS

& no Sb/Br)

65C3243

CB3243

75C3243

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

SN65C3243DWE4

SN65C3243DWG4

SN65C3243DWR

SN65C3243DWRE4

SN65C3243DWRG4

SN65C3243PW

SOIC

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

SOIC

1000

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

TSSOP

SSOP

Green (RoHS

& no Sb/Br)

SN65C3243PWE4

SN65C3243PWG4

SN65C3243PWR

SN65C3243PWRE4

SN65C3243PWRG4

SN75C3243DBR

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

SN75C3243DBRE4

Green (RoHS

& no Sb/Br)

0 to 70

Addendum-Page 1

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Orderable Device

Status Package Type Package Pins Package Qty

Eco Plan Lead/Ball Finish

MSL Peak Temp

Op Temp (°C)

0 to 70

Top-Side Markings

Samples

Drawing

(1)

(2)

(3)

(4)

SN75C3243DBRG4

SN75C3243DW

ACTIVE

SSOP

SOIC

2000

Green (RoHS

& no Sb/Br)

CU NIPDAU

Level-1-260C-UNLIM

75C3243

Green (RoHS

& no Sb/Br)

75C3243

CA3243

SN75C3243DWE4

SN75C3243DWG4

SN75C3243DWR

SN75C3243DWRE4

SN75C3243DWRG4

SN75C3243PW

SOIC

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

SOIC

1000

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

SOIC

Green (RoHS

& no Sb/Br)

TSSOP

Green (RoHS

& no Sb/Br)

SN75C3243PWE4

SN75C3243PWG4

SN75C3243PWR

SN75C3243PWRE4

SN75C3243PWRG4

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

2000

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

Green (RoHS

& no Sb/Br)

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

⁽²⁾Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability

information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Addendum-Page 2

PACKAGE OPTION ADDENDUM

www.ti.com

24-Jan-2013

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that

lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between

the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight

in homogeneous material)

⁽³⁾MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

⁽⁴⁾Only one of markings shown within the brackets will appear on the physical device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 3

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Feb-2013

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device

Package Package Pins

Type Drawing

SPQ

Reel

Pin1

Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant

(mm) W1 (mm)

SN65C3243DBR

SN65C3243DWR

SN65C3243PWR

SN75C3243DBR

SN75C3243DWR

SN75C3243PWR

SSOP

SOIC

2000

1000

2000

1000

2000

330.0

16.4

32.4

16.4

32.4

16.4

8.2

10.5

2.5

3.1

1.8

2.5

3.1

1.8

12.0

16.0

12.0

16.0

12.0

16.0

32.0

16.0

32.0

16.0

11.35 18.67

TSSOP

SSOP

SOIC

6.9

8.2

10.2

10.5

11.35 18.67

6.9 10.2

TSSOP

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

www.ti.com

5-Feb-2013

*All dimensions are nominal

Device

Package Type Package Drawing Pins

SPQ

Length (mm) Width (mm) Height (mm)

SN65C3243DBR

SN65C3243DWR

SN65C3243PWR

SN75C3243DBR

SN75C3243DWR

SN75C3243PWR

SSOP

SOIC

2000

1000

2000

1000

2000

367.0

38.0

55.0

38.0

55.0

38.0

TSSOP

SSOP

SOIC

TSSOP

Pack Materials-Page 2

MECHANICAL DATA

MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001

DB (R-PDSO-G**)

PLASTIC SMALL-OUTLINE

28 PINS SHOWN

0,38

0,22

0,65

0,15

0,25

0,09

5,60

5,00

8,20

7,40

Gage Plane

0,25

0°–ā8°

0,95

0,55

Seating Plane

0,10

2,00 MAX

0,05 MIN

PINS **

DIM

6,50

5,90

6,50

5,90

7,50

8,50

7,90

10,50

9,90

10,50 12,90

A MAX

A MIN

6,90

9,90

12,30

4040065 /E 12/01

NOTES: A. All linear dimensions are in millimeters.

B. This drawing is subject to change without notice.

C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.

D. Falls within JEDEC MO-150

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

IMPORTANT NOTICE

Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other

changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest

issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and

complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale

supplied at the time of order acknowledgment.

TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms

and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary

to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily

performed.

TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and

applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide

adequate design and operating safeguards.

TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or

other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information

published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or

endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the

third party, or a license from TI under the patents or other intellectual property of TI.

Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration

and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered

documentation. Information of third parties may be subject to additional restrictions.

Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service

voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.

TI is not responsible or liable for any such statements.

Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements

concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support

that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which

anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause

harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use

of any TI components in safety-critical applications.

In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to

help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and

requirements. Nonetheless, such components are subject to these terms.

No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties

have executed a special agreement specifically governing such use.

Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in

military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components

which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and

regulatory requirements in connection with such use.

TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of

non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.

Products

Applications

Audio

www.ti.com/audio

amplifier.ti.com

dataconverter.ti.com

www.dlp.com

Automotive and Transportation www.ti.com/automotive

Communications and Telecom www.ti.com/communications

Amplifiers

Data Converters

DLP® Products

DSP

Computers and Peripherals

Consumer Electronics

Energy and Lighting

Industrial

www.ti.com/computers

www.ti.com/consumer-apps

www.ti.com/energy

dsp.ti.com

Clocks and Timers

Interface

www.ti.com/clocks

interface.ti.com

logic.ti.com

www.ti.com/industrial

www.ti.com/medical

Medical

Logic

Security

www.ti.com/security

Power Mgmt

Microcontrollers

RFID

power.ti.com

Space, Avionics and Defense

Video and Imaging

www.ti.com/space-avionics-defense

www.ti.com/video

microcontroller.ti.com

www.ti-rfid.com

www.ti.com/omap

OMAP Applications Processors

Wireless Connectivity

TI E2E Community

e2e.ti.com

www.ti.com/wirelessconnectivity

Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265

SN75C3243DWG4 [TI]

相关型号：

SN75C3243DWR

SN75C3243DWRE4

SN75C3243DWRG4

SN75C3243PW

SN75C3243PWE4

SN75C3243PWG4

SN75C3243PWR

SN75C3243PWRE4

SN75C3243PWRG4

SN75DP118

SN75DP118RHHR

SN75DP118RHHRG4