SN74CB3Q16245DL [TI]
16-BIT SWITCH 2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH; 16位转换器2.5 -V / 3.3 V低压FET总线开关型号: | SN74CB3Q16245DL |
厂家: | TEXAS INSTRUMENTS |
描述: | 16-BIT SWITCH 2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH |
文件: | 总9页 (文件大小:101K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
FEATURES
DGG, DGV, OR DL PACKAGE
(TOP VIEW)
•
Member of the Texas Instruments Widebus™
Family
1
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
25
(1)
NC
1B1
1B2
GND
1B3
1B4
1OE
1A1
1A2
GND
1A3
1A4
•
•
High-Bandwidth Data Path (up to 500 MHz
)
2
5-V Tolerant I/Os With Device Powered Up or
Powered Down
3
4
•
•
Low and Flat ON-State Resistance (ron)
Characteristics Over Operating Range
(ron = 5 Ω Typ)
5
6
7
V
CC
V
CC
Rail-to-Rail Switching on Data I/O Ports
– 0- to 5-V Switching With 3.3-V VCC
– 0- to 3.3-V Switching With 2.5-V VCC
8
1B5
1B6
GND
1B7
1B8
2B1
2B2
GND
2B3
2B4
1A5
1A6
GND
1A7
1A8
2A1
2A2
GND
2A3
2A4
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
•
•
Bidirectional Data Flow With Near-Zero
Propagation Delay
Low Input/Output Capacitance Minimizes
Loading and Signal Distortion
(Cio(OFF) = 4 pF Typ)
•
•
Fast Switching Frequency (fOE = 20 MHz Max)
Data and Control Inputs Provide Undershoot
Clamp Diodes
V
CC
V
CC
2B5
2B6
GND
2B7
2B8
NC
2A5
2A6
GND
2A7
2A8
2OE
•
•
•
Low Power Consumption (ICC = 1 mA Typ)
VCC Operating Range From 2.3 V to 3.6 V
Data I/Os Support 0- to 5-V Signaling Levels
(0.8 V, 1.2 V, 1.5 V, 1.8 V, 2.5 V, 3.3 V, 5 V)
•
•
•
•
Control Inputs Can Be Driven by TTL or
5-V/3.3-V CMOS Outputs
NC - No internal connection
Ioff Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Performance Tested Per JESD 22
– 2000-V Human-Body Model (A114-B,
Class II)
– 1000-V Charged-Device Model (C101)
•
Supports Both Digital and Analog
Applications: PCI Interface, Differential Signal
Interface, Memory Interleaving, Bus Isolation,
Low-Distortion Signal Gating
(1) For additional information regarding the performance
characteristics of the CB3Q family, refer to the TI application
report, CBT-C, CB3T, and CB3Q Signal-Switch Families,
literature number SCDA008.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Widebus is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Copyright © 2004–2005, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
DESCRIPTION/ORDERING INFORMATION
The SN74CB3Q16245 is a high-bandwidth FET bus switch utilizing a charge pump to elevate the gate voltage of
the pass transistor, providing a low and flat ON-state resistance (ron). The low and flat ON-state resistance allows
for minimal propagation delay and supports rail-to-rail switching on the data input/output (I/O) ports. The device
also features low data I/O capacitance to minimize capacitive loading and signal distortion on the data bus.
Specifically designed to support high-bandwidth applications, the SN74CB3Q16245 provides an optimized
interface solution ideally suited for broadband communications, networking, and data-intensive computing
systems.
The SN74CB3Q16245 is organized as two 8-bit bus switches with separate output-enable (1OE, 2OE) inputs. It
can be used as two 8-bit bus switches, or as one 16-bit bus switch. When OE is low, the associated 8-bit bus
switch is ON, and the A port is connected to the B port, allowing bidirectional data flow between ports. When OE
is high, the associated 8-bit bus switch is OFF, and a high-impedance state exists between the A and B ports.
This device is fully specified for partial-power-down applications using Ioff. The Ioff circuitry prevents damaging
current backflow through the device when it is powered down. The device has isolation during power off.
To ensure the high-impedance state during power up or power down, OE should be tied to VCC through a pullup
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.
ORDERING INFORMATION
TA
PACKAGE(1)
ORDERABLE PART NUMBER
SN74CB3Q16245DL
TOP-SIDE MARKING
CB3Q16245
Tube
SSOP – DL
Tape and reel
SN74CB3Q16245DLR
SN74CB3Q16245DGG
SN74CB3Q16245DGGR
SN74CB3Q16245DGVR
–40°C to 85°C
Tube
TSSOP – DGG
TVSOP – DGV
CB3Q16245
BW245
Tape and reel
Tape and reel
(1) Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
FUNCTION TABLE
(EACH 8-BIT BUS SWITCH)
INPUT
OE
INPUT/OUTPUT
A
FUNCTION
L
B
Z
A port = B port
Disconnect
H
2
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
LOGIC DIAGRAM (POSITIVE LOGIC)
47
2
1A1
1B1
1B8
SW
SW
37
48
12
1A8
1OE
36
13
23
2A1
2B1
2B8
SW
SW
26
25
2A8
2OE
SIMPLIFIED SCHEMATIC, EACH FET SWITCH (SW)
A
B
V
CC
Charge
Pump
(1)
EN
(1) EN is the internal enable signal applied to the switch.
3
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
–0.5
–0.5
–0.5
MAX
4.6
UNIT
VCC
VIN
VI/O
IIK
Supply voltage range
V
Control input voltage range(2)(3)
Switch I/O voltage range(2)(3)(4)
Control input clamp current
I/O port clamp current
7
7
V
V
VIN < 0
VI/O < 0
–50
–50
±64
±100
70
mA
mA
mA
mA
II/OK
II/O
ON-state switch current(5)
Continuous current through VCC or GND
DGG package
DGV package
DL package
θJA
Package thermal impedance(6)
58
°C/W
°C
63
Tstg
Storage temperature range
–65
150
(1) Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating
conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltages are with respect to ground unless otherwise specified.
(3) The input and output voltage ratings may be exceeded if the input and output clamp-current ratings are observed.
(4) VI and VO are used to denote specific conditions for VI/O
(5) II and IO are used to denote specific conditions for II/O
.
.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions(1)
MIN
2.3
1.7
2
MAX
3.6
5.5
5.5
0.7
0.8
5.5
85
UNIT
VCC
VIH
Supply voltage
V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
VCC = 2.3 V to 2.7 V
VCC = 2.7 V to 3.6 V
High-level control input voltage
V
V
0
VIL
Low-level control input voltage
0
VI/O
TA
Data input/output voltage
0
V
Operating free-air temperature
–40
°C
(1) All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Refer to the TI application report,
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.
4
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
Electrical Characteristics(1)
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
TEST CONDITIONS
II = –18 mA
MIN
TYP(2) MAX
UNIT
V
VIK
IIN
VCC = 3.6 V,
–1.8
Control inputs VCC = 3.6 V,
VIN = 0 to 5.5 V
±1
µA
VO = 0 to 5.5 V,
VI = 0,
Switch OFF,
VIN = VCC or GND
(3)
IOZ
Ioff
VCC = 3.6 V,
±1
µA
µA
mA
µA
VCC = 0,
VO = 0 to 5.5 V,
VI = 0
1
II/O = 0,
Switch ON or OFF,
ICC
VCC = 3.6 V,
VIN = VCC or GND
Other inputs at VCC or GND
1
2
(4)
(5)
∆ICC
ICCD
Cin
Control inputs VCC = 3.6 V,
One input at 3 V,
30
VCC = 3.6 V,
A and B ports open,
Per control
input
mA/
MHz
0.15 0.25
Control input switching at 50% duty cycle
Control inputs VCC = 3.3 V,
VCC = 3.3 V,
VIN = 5.5 V, 3.3 V, or 0
3.5
4
5
6
pF
pF
Switch OFF,
VIN = VCC or GND,
Cio(OFF)
Cio(ON)
VI/O = 5.5 V, 3.3 V, or 0
VI/O = 5.5 V, 3.3 V, or 0
Switch ON,
VIN = VCC or GND,
VCC = 3.3 V,
VCC = 2.3 V,
10
13
pF
VI = 0,
IO = 30 mA
IO = –15 mA
IO = 30 mA
IO = –15 mA
6
5
6
5
8
10
8
TYP at VCC = 2.5 V
VI = 1.7 V,
VI = 0,
(6)
ron
Ω
VCC = 3 V
VI = 2.4 V,
9
(1) VIN and IIN refer to control inputs. VI, VO, II, and IO refer to data pins.
(2) All typical values are at VCC = 3.3 V (unless otherwise noted), TA = 25°C.
(3) For I/O ports, the parameter IOZ includes the input leakage current.
(4) This is the increase in supply current for each input that is at the specified TTL voltage level, rather than VCC or GND.
(5) This parameter specifies the dynamic power-supply current associated with the operating frequency of a single control input (see
Figure 2).
(6) Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
Switching Characteristics
over recommended operating free-air temperature range (unless otherwise noted) (see Figure 3)
VCC = 2.5 V
± 0.2 V
VCC = 3.3 V
± 0.3 V
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
UNIT
MIN
MAX
MIN
MAX
(1)
fOE
OE
A or B
OE
A or B
B or A
A or B
A or B
10
0.18
8
20
0.3
7
MHz
ns
(2)
tpd
ten
1.5
1
1.5
1
ns
tdis
OE
8
7
ns
(1) Maximum toggle frequency for OE control input (VO > VCC, VI = 5 V, RL ≥ 1 MΩ, CL = 0)
(2) The propagation delay is the calculated RC time constant of the typical ON-state resistance of the switch and the specified load
capacitance, when driven by an ideal voltage source (zero output impedance).
5
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
16
V
CC
= 3.3 V
14
12
10
8
T
= 25°C
= −15 mA
A
I
O
6
4
2
0
0.0
0.5
1.0
1.5
2.0
2.5
V − V
3.0
3.5
4.0
4.5
5.0
I
Figure 1. Typical ron vs VI
12
10
8
V
= 3.3 V
= 25°C
CC
T
A
A and B ports Open
6
4
One OE Switching
2
0
0
2
4
6
8
10
12
14
16
18
20
OE Switching Frequency − MHz
Figure 2. Typical ICC vs OE Switching Frequency
6
SN74CB3Q16245
16-BIT SWITCH
2.5-V/3.3-V LOW-VOLTAGE FET BUS SWITCH
www.ti.com
SCDS171A–JULY 2004–REVISED MARCH 2005
PARAMETER MEASUREMENT INFORMATION
V
CC
Input Generator
V
IN
50 Ω
50 Ω
V
V
G1
TEST CIRCUIT
DUT
2 × V
CC
Input Generator
S1
Open
GND
R
L
V
V
O
I
50 Ω
50 Ω
C
L
R
G2
L
(see Note A)
S1
V
I
C
L
V
∆
R
L
V
CC
TEST
2.5 V ± 0.2 V
3.3 V ± 0.3 V
Open
Open
500 Ω
500 Ω
V
V
or GND
or GND
30 pF
50 pF
CC
t
pd(s)
CC
2.5 V ± 0.2 V
3.3 V ± 0.3 V
2 × V
2 × V
500 Ω
500 Ω
GND
GND
30 pF
50 pF
0.15 V
0.3 V
CC
t
/t
PLZ PZL
CC
2.5 V ± 0.2 V
3.3 V ± 0.3 V
GND
GND
500 Ω
500 Ω
V
V
30 pF
50 pF
0.15 V
0.3 V
CC
t
/t
PHZ PZH
CC
Output
Control
(V
V
CC
V /2
CC
V /2
CC
)
IN
0 V
t
t
PLZ
PZL
Output
Waveform 1
V
V
CC
Output
Control
(V
V
CC
V /2
CC
S1 at 2 × V
V + V
∆
OL
V /2
CC
V /2
CC
CC
)
(see Note B)
IN
OL
0 V
t
t
PZH
PHZ
t
t
PLH
PHL
Output
Waveform 2
S1 at GND
V
OH
V
V
OH
V
OH
− V
∆
V /2
CC
Output
V /2
CC
V /2
CC
0 V
(see Note B)
OL
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES (t
VOLTAGE WAVEFORMS
ENABLE AND DISABLE TIMES
)
pd(s)
NOTES: A. C includes probe and jig capacitance.
L
B. Waveform 1 is for an output with internal conditions such that the output is low, except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high, except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 10 MHz, Z = 50 Ω, t ≤ 2.5 ns, t ≤ 2.5 ns.
O
r
f
D. The outputs are measured one at a time, with one transition per measurement.
E.
F.
G.
t
t
t
and t
and t
and t
are the same as t
.
dis
.
PLZ
PZL
PLH
PHZ
PZH
PHL
are the same as t
en
are the same as t
. The tpd propagation delay is the calculated RC time constant of the typical ON-state resistance
pd(s)
of the switch and the specified load capacitance, when driven by an ideal voltage source (zero output impedance).
H. All parameters and waveforms are not applicable to all devices.
Figure 3. Test Circuit and Voltage Waveforms
7
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
74CB3Q16245DGGRE4
74CB3Q16245DGVRE4
74CB3Q16245DLRG4
SN74CB3Q16245DGGR
SN74CB3Q16245DGVR
SN74CB3Q16245DL
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
TSSOP
DGG
48
48
48
48
48
48
48
48
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TVSOP
SSOP
TSSOP
TVSOP
SSOP
SSOP
SSOP
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DGG
DGV
DL
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74CB3Q16245DLG4
SN74CB3Q16245DLR
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
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Addendum-Page 1
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