SN74AHC16374DLRG4 [TI]

16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS; 16位边沿触发的D型触发器具有三态输出
SN74AHC16374DLRG4
型号: SN74AHC16374DLRG4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS WITH 3-STATE OUTPUTS
16位边沿触发的D型触发器具有三态输出

总线驱动器 总线收发器 触发器 逻辑集成电路 光电二极管 输出元件
文件: 总14页 (文件大小:370K)
中文:  中文翻译
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SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
SN54AHC16374 . . . WD PACKAGE  
SN74AHC16374 . . . DGG, DGV, OR DL PACKAGE  
(TOP VIEW)  
Members of the Texas Instruments  
Widebus Family  
EPIC (Enhanced-Performance Implanted  
CMOS) Process  
1OE  
1Q1  
1Q2  
GND  
1Q3  
1Q4  
1CLK  
1
2
3
4
5
6
7
8
9
48  
Operating Range 2-V to 5.5-V V  
CC  
47 1D1  
46 1D2  
45 GND  
44 1D3  
43 1D4  
3-State Outputs Drive Bus Lines Directly  
Distributed V and GND Pins Minimize  
CC  
High-Speed Switching Noise  
Flow-Through Architecture Optimizes PCB  
Layout  
V
42  
V
CC  
CC  
1Q5  
1Q6  
41 1D5  
40 1D6  
39 GND  
38 1D7  
37 1D8  
36 2D1  
35 2D2  
34 GND  
33 2D3  
32 2D4  
Latch-Up Performance Exceeds 250 mA Per  
JESD 17  
GND 10  
1Q7 11  
1Q8 12  
2Q1 13  
2Q2 14  
GND 15  
2Q3 16  
2Q4 17  
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
Package Options Include Plastic Shrink  
Small-Outline (DL), Thin Shrink  
Small-Outline (DGG), and Thin Very  
Small-Outline (DGV) Packages and 380-mil  
Fine-Pitch Ceramic Flat (WD) Package  
Using 25-mil Center-to-Center Spacings  
V
18  
31  
V
CC  
CC  
2Q5 19  
2Q6 20  
GND 21  
2Q7 22  
2Q8 23  
2OE 24  
30 2D5  
29 2D6  
28 GND  
27 2D7  
26 2D8  
25 2CLK  
description  
The  
’AHC16374  
devices  
are  
16-bit  
edge-triggered D-type flip-flops with 3-state  
outputs designed specifically for driving highly  
capacitive or relatively low-impedance loads.  
They are particularly suitable for implementing  
buffer registers, I/O ports, bidirectional bus  
drivers, and working registers.  
These devices can be used as two 8-bit flip-flops or one 16-bit flip-flop. On the positive transition of the clock  
(CLK) input, the Q outputs of the flip-flop take on the logic levels at the data (D) inputs.  
A buffered output-enable (OE) input can be used to place the eight outputs in either a normal logic state (high  
or low logic levels) or the high-impedance state. In the high-impedance state, the outputs neither load nor drive  
the bus lines significantly. The high-impedance state and the increased drive provide the capability to drive bus  
lines without need for interface or pullup components.  
To ensure the high-impedance state during power up or power down, OE should be tied to V through a pullup  
CC  
resistor; the minimum value of the resistor is determined by the current-sinking capability of the driver.  
OE does not affect internal operations of the flip-flop. Old data can be retained or new data can be entered while  
the outputs are in the high-impedance state.  
The SN54AHC16374 is characterized for operation over the full military temperature range of –55°C to 125°C.  
The SN74AHC16374 is characterized for operation from –40°C to 85°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC and Widebus are trademarks of Texas Instruments Incorporated.  
Copyright 2000, Texas Instruments Incorporated  
UNLESS OTHERWISE NOTED this document contains PRODUCTION  
DATA information current as of publication date. Products conform to  
specifications per the terms of Texas Instruments standard warranty.  
Production processing does not necessarily include testing of all  
parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
FUNCTION TABLE  
(each 8-bit flip-flop)  
INPUTS  
OUTPUT  
Q
CLK  
D
H
L
OE  
L
H
L
L
L
H or L  
X
X
X
Q
0
H
Z
logic symbol  
1
1OE  
1CLK  
2OE  
1EN  
C1  
48  
24  
25  
2EN  
C2  
2CLK  
47  
46  
44  
43  
41  
40  
38  
37  
36  
35  
33  
32  
30  
29  
27  
26  
2
3
1D1  
1D2  
1D3  
1D4  
1D5  
1D6  
1D7  
1D8  
2D1  
2D2  
2D3  
2D4  
2D5  
2D6  
2D7  
2D8  
1D  
1
1Q1  
1Q2  
1Q3  
1Q4  
1Q5  
1Q6  
1Q7  
1Q8  
2Q1  
2Q2  
2Q3  
2Q4  
2Q5  
2Q6  
2Q7  
2Q8  
5
6
8
9
11  
12  
13  
14  
16  
17  
19  
20  
22  
23  
2D  
2
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
logic diagram (positive logic)  
1
24  
25  
2OE  
1OE  
48  
2CLK  
1CLK  
C1  
1D  
C1  
2
13  
2Q1  
1Q1  
47  
36  
2D1  
1D1  
1D  
To Seven Other Channels  
To Seven Other Channels  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 7 V  
I
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
+ 0.5 V  
O
CC  
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –20 mA  
IK  
I
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±25 mA  
Continuous current through each V  
Package thermal impedance, θ (see Note 2): DGG package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 70°C/W  
O
O
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±75 mA  
CC  
JA  
DGV package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58°C/W  
DL package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 63°C/W  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The package thermal impedance is calculated in accordance with JESD 51.  
recommended operating conditions (see Note 3)  
SN54AHC16374 SN74AHC16374  
UNIT  
MIN  
2
MAX  
MIN  
2
MAX  
V
V
Supply voltage  
5.5  
5.5  
V
CC  
V
V
V
V
V
V
= 2 V  
1.5  
2.1  
3.85  
1.5  
2.1  
3.85  
CC  
CC  
CC  
CC  
CC  
CC  
High-level input voltage  
= 3 V  
V
V
IH  
= 5.5 V  
= 2 V  
0.5  
0.9  
0.5  
0.9  
V
IL  
Low-level input voltage  
= 3 V  
= 5.5 V  
1.65  
5.5  
1.65  
5.5  
V
V
Input voltage  
0
0
0
0
V
V
A
I
Output voltage  
V
V
CC  
O
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 2 V  
–50  
–4  
–8  
50  
4
–50  
–4  
–8  
50  
4
I
High-level output current  
Low-level output current  
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
= 2 V  
OH  
OL  
mA  
A
I
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
= 3.3 V ± 0.3 V  
= 5 V ± 0.5 V  
mA  
8
8
100  
20  
125  
100  
20  
85  
t/v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
T
A
–55  
–40  
°C  
NOTE 3: All unused inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
TYP  
2
SN54AHC16374 SN74AHC16374  
PARAMETER  
TEST CONDITIONS  
V
UNIT  
CC  
MIN  
1.9  
MAX  
MIN  
1.9  
MAX  
MIN  
1.9  
MAX  
2 V  
3 V  
I
= –50  
A
2.9  
3
2.9  
2.9  
OH  
V
4.5 V  
3 V  
4.4  
4.5  
4.4  
4.4  
V
OH  
OL  
I
I
= –4 mA  
= –8 mA  
2.58  
3.94  
2.48  
3.8  
2.48  
3.8  
OH  
4.5 V  
2 V  
OH  
0.1  
0.1  
0.1  
0.1  
0.1  
0.5  
0.5  
±1*  
±2.5  
40  
0.1  
0.1  
I
= 50  
A
3 V  
OL  
V
4.5 V  
3 V  
0.1  
0.1  
V
I
I
= 4 mA  
= 8 mA  
0.36  
0.36  
±0.1  
±0.25  
4
0.44  
0.44  
±1  
OL  
4.5 V  
0 V to 5.5 V  
5.5 V  
5.5 V  
5 V  
OL  
I
I
I
V = V  
or GND  
or GND  
CC  
A
A
I
I
CC  
V
= V  
±2.5  
40  
O
OZ  
CC  
V = V  
or GND,  
or GND  
I = 0  
O
A
I
CC  
CC  
C
C
V = V  
2.5  
3.5  
10  
10  
pF  
pF  
i
I
V
= V or GND  
CC  
5 V  
o
O
* On products compliant to MIL-PRF-38535, this parameter is not production tested at V  
CC  
= 0 V.  
timing requirements over recommended operating free-air temperature range,  
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
= 25°C  
SN54AHC16374 SN74AHC16374  
A
UNIT  
MIN  
5
MAX  
MIN  
5.5  
4
MAX  
MIN  
5.5  
4
MAX  
t
w
t
su  
t
h
Pulse duration, CLK high or low  
Setup time, data before CLK↑  
Hold time, data after CLK↑  
ns  
ns  
ns  
4.5  
2
2
2
timing requirements over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
= 25°C  
SN54AHC16374 SN74AHC16374  
A
UNIT  
MIN  
5
MAX  
MIN  
5
MAX  
MIN  
5
MAX  
t
w
t
su  
t
h
Pulse duration, CLK high or low  
Setup time, data before CLK↑  
Hold time, data after CLK↑  
ns  
ns  
ns  
3
3
3
2
2
2
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
switching characteristics over recommended operating free-air temperature range,  
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
130*  
85  
SN54AHC16374 SN74AHC16374  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
80*  
55  
MAX  
MIN  
70*  
50  
1*  
1*  
1*  
1*  
1*  
1*  
1
MAX  
MIN  
70  
50  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
max  
t
t
t
t
t
t
t
t
t
t
t
t
t
9*  
15*  
15*  
17*  
17*  
15*  
15*  
16*  
16*  
18.5  
18.5  
16  
17  
17  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
sk(o)  
CLK  
Q
Q
Q
Q
Q
Q
C
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 50 pF  
= 50 pF  
L
L
L
L
L
9*  
1
8*  
13*  
1
15  
ns  
OE  
OE  
8*  
13*  
1
15  
9*  
14*  
1
16  
ns  
10*  
10.6  
10.6  
9.6  
14*  
1
16  
16.2  
16.2  
14.9  
14.9  
15.5  
15.5  
1
18.5  
18.5  
16  
CLK  
ns  
1
1
1
1
ns  
OE  
OE  
9.6  
1
16  
1
16  
10.2  
11.8  
1
17  
1
17  
C
C
= 50 pF  
= 50 pF  
ns  
ns  
L
L
1
17  
1
17  
**  
1.5  
1.5  
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
** On products compliant to MIL-PRF-38535, this parameter does not apply.  
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
185*  
120  
5.4*  
5.4*  
5.1*  
5.1*  
5*  
SN54AHC16374 SN74AHC16374  
FROM  
(INPUT)  
TO  
(OUTPUT)  
LOAD  
CAPACITANCE  
PARAMETER  
UNIT  
MHz  
ns  
MIN  
130*  
85  
MAX  
MIN  
110*  
75  
1*  
1*  
1*  
1*  
1*  
1*  
1
MAX  
MIN  
110  
75  
1
MAX  
C
C
= 15 pF  
= 50 pF  
L
L
f
max  
t
t
t
t
t
t
t
t
t
t
t
t
t
9.1*  
9.1*  
9.1*  
9.1*  
9.5*  
9.5*  
10.1  
10.1  
10.1  
10.1  
10.5  
10.5  
10.1*  
10.1*  
10.1*  
10.1*  
10.5*  
10.5*  
11.5  
10.1  
10.1  
10.1  
10.1  
10.5  
10.5  
11.5  
11.5  
11.5  
11.5  
11.5  
11.5  
1
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
sk(o)  
CLK  
Q
Q
Q
Q
Q
Q
C
C
C
C
C
= 15 pF  
= 15 pF  
= 15 pF  
= 50 pF  
= 50 pF  
L
L
L
L
L
1
1
ns  
OE  
OE  
1
1
ns  
5*  
1
6.9  
1
CLK  
ns  
6.9  
1
11.5  
1
6.6  
1
11.5  
1
ns  
OE  
OE  
6.6  
1
11.5  
1
6.1  
1
11.5  
1
C
C
= 50 pF  
= 50 pF  
ns  
ns  
L
L
6.1  
1
11.5  
1
**  
1
* On products compliant to MIL-PRF-38535, this parameter is not production tested.  
** On products compliant to MIL-PRF-38535, this parameter does not apply.  
PRODUCT PREVIEW information concerns products in the formative or  
design phase of development. Characteristic data and other  
specifications are design goals. Texas Instruments reserves the right to  
change or discontinue these products without notice.  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
noise characteristics, V  
= 5 V, C = 50 pF, T = 25°C (see Note 4)  
CC  
L
A
SN74AHC16374  
PARAMETER  
UNIT  
MIN  
TYP  
0.36  
–0.16  
4.6  
MAX  
0.8  
V
V
V
V
V
Quiet output, maximum dynamic V  
V
V
V
V
V
OL(P)  
OL(V)  
OH(V)  
IH(D)  
IL(D)  
OL  
Quiet output, minimum dynamic V  
Quiet output, minimum dynamic V  
High-level dynamic input voltage  
Low-level dynamic input voltage  
–0.8  
OL  
OH  
3.5  
1.5  
NOTE 4: Characteristics are for surface-mount packages only.  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
No load, f = 1 MHz  
TYP  
UNIT  
C
Power dissipation capacitance  
32  
pF  
pd  
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
SN54AHC16374, SN74AHC16374  
16-BIT EDGE-TRIGGERED D-TYPE FLIP-FLOPS  
WITH 3-STATE OUTPUTS  
SCLS330G – MARCH 1996 – REVISED JANUARY 2000  
PARAMETER MEASUREMENT INFORMATION  
V
CC  
Open  
GND  
S1  
R
= 1 kΩ  
L
TEST  
S1  
From Output  
Under Test  
Test  
Point  
From Output  
Under Test  
t
t
/t  
Open  
PLH PHL  
/t  
C
C
L
t
V
CC  
L
PLZ PZL  
/t  
(see Note A)  
(see Note A)  
GND  
PHZ PZH  
Open Drain  
V
CC  
LOAD CIRCUIT FOR  
LOAD CIRCUIT FOR  
TOTEM-POLE OUTPUTS  
3-STATE AND OPEN-DRAIN OUTPUTS  
V
CC  
50% V  
CC  
Timing Input  
0 V  
t
w
t
h
t
su  
V
CC  
V
CC  
50% V  
50% V  
CC  
Input  
CC  
50% V  
50% V  
CC  
Data Input  
CC  
0 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
V
V
CC  
CC  
Output  
Control  
50% V  
50% V  
50% V  
50% V  
t
Input  
CC  
CC  
CC  
CC  
0 V  
0 V  
t
PZL  
t
t
t
PLZ  
PLH  
PHL  
Output  
Waveform 1  
V
OH  
V  
CC  
In-Phase  
Output  
50% V  
50% V  
CC  
50% V  
CC  
CC  
V
S1 at V  
(see Note B)  
V
OL  
+ 0.3 V  
CC  
V
OL  
OL  
t
t
t
PHL  
PLH  
PZH  
PHZ  
Output  
Waveform 2  
S1 at GND  
V
V
OH  
OH  
Out-of-Phase  
Output  
V
OH  
– 0.3 V  
50% V  
50% V  
50% V  
CC  
CC  
CC  
V
0 V  
(see Note B)  
OL  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A. includes probe and jig capacitance.  
C
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t 3 ns, t 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
27-Sep-2007  
PACKAGING INFORMATION  
Orderable Device  
74AHC16374DGGRE4  
74AHC16374DGGRG4  
74AHC16374DGVRE4  
74AHC16374DGVRG4  
SN74AHC16374DGGR  
SN74AHC16374DGVR  
SN74AHC16374DL  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
48  
48  
48  
48  
48  
48  
48  
48  
48  
48  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TVSOP  
TVSOP  
TSSOP  
TVSOP  
SSOP  
DGG  
DGV  
DGV  
DGG  
DGV  
DL  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SN74AHC16374DLG4  
SN74AHC16374DLR  
SN74AHC16374DLRG4  
SSOP  
DL  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SSOP  
DL  
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
TAPE AND REEL BOX INFORMATION  
Device  
Package Pins  
Site  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) (mm) Quadrant  
(mm)  
330  
(mm)  
24  
SN74AHC16374DGGR  
SN74AHC16374DGVR  
SN74AHC16374DLR  
DGG  
DGV  
DL  
48  
48  
48  
SITE 41  
SITE 41  
SITE 41  
8.6  
6.8  
15.8  
10.1  
16.2  
1.8  
1.6  
3.1  
12  
12  
16  
24  
24  
32  
Q1  
Q1  
Q1  
330  
24  
330  
32  
11.35  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
4-Oct-2007  
Device  
Package  
Pins  
Site  
Length (mm) Width (mm) Height (mm)  
SN74AHC16374DGGR  
SN74AHC16374DGVR  
SN74AHC16374DLR  
DGG  
DGV  
DL  
48  
48  
48  
SITE 41  
SITE 41  
SITE 41  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
41.0  
41.0  
49.0  
Pack Materials-Page 2  
MECHANICAL DATA  
MPDS006C – FEBRUARY 1996 – REVISED AUGUST 2000  
DGV (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
24 PINS SHOWN  
0,23  
0,13  
M
0,07  
0,40  
24  
13  
0,16 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
0°ā8°  
0,75  
1
12  
0,50  
A
Seating Plane  
0,08  
0,15  
0,05  
1,20 MAX  
PINS **  
14  
16  
20  
24  
38  
48  
56  
DIM  
A MAX  
A MIN  
3,70  
3,50  
3,70  
3,50  
5,10  
4,90  
5,10  
4,90  
7,90  
7,70  
9,80  
9,60  
11,40  
11,20  
4073251/E 08/00  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion, not to exceed 0,15 per side.  
D. Falls within JEDEC: 24/48 Pins – MO-153  
14/16/20/56 Pins – MO-194  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MSSO001C – JANUARY 1995 – REVISED DECEMBER 2001  
DL (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0.025 (0,635)  
48  
0.0135 (0,343)  
0.008 (0,203)  
0.005 (0,13)  
M
25  
0.010 (0,25)  
0.005 (0,13)  
0.299 (7,59)  
0.291 (7,39)  
0.420 (10,67)  
0.395 (10,03)  
Gage Plane  
0.010 (0,25)  
0°ā8°  
1
24  
0.040 (1,02)  
0.020 (0,51)  
A
Seating Plane  
0.004 (0,10)  
0.008 (0,20) MIN  
PINS **  
0.110 (2,79) MAX  
28  
48  
0.630  
56  
DIM  
0.380  
(9,65)  
0.730  
A MAX  
A MIN  
(16,00) (18,54)  
0.370  
(9,40)  
0.620  
0.720  
(15,75) (18,29)  
4040048/E 12/01  
NOTES: A. All linear dimensions are in inches (millimeters).  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0.006 (0,15).  
D. Falls within JEDEC MO-118  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS003D – JANUARY 1995 – REVISED JANUARY 1998  
DGG (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
48 PINS SHOWN  
0,27  
0,17  
M
0,08  
0,50  
48  
25  
6,20  
6,00  
8,30  
7,90  
0,15 NOM  
Gage Plane  
0,25  
1
24  
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
48  
56  
64  
DIM  
A MAX  
12,60  
12,40  
14,10  
13,90  
17,10  
16,90  
A MIN  
4040078/F 12/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements,  
improvements, and other changes to its products and services at any time and to discontinue any product or service without notice.  
Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
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TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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DSP  
Applications  
Audio  
amplifier.ti.com  
dataconverter.ti.com  
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Military  
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logic.ti.com  
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Microcontrollers  
RFID  
power.ti.com  
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Security  
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