SN65C3221PWRG4 [TI]
3-V To 5.5-V Multichannel RS-232 Line Driver/Receiver 16-TSSOP -40 to 85;
| 型号： | SN65C3221PWRG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 3-V To 5.5-V Multichannel RS-232 Line Driver/Receiver 16-TSSOP -40 to 85 驱动 光电二极管 接口集成电路 驱动器 |
| 文件： | 总20页 (文件大小：656K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢆ ꢇ
ꢒ
ꢛ
ꢅ
ꢊ
ꢋ
ꢌ ꢍ
ꢃ
ꢎ
ꢃ
ꢊ
ꢋ
ꢀ
ꢏ
ꢁ
ꢐ
ꢑ
ꢒ
ꢊ
ꢄ
ꢓ
ꢔ
ꢁ
ꢁ
ꢒ
ꢑ
ꢕ
ꢀ
ꢊ
ꢆ
ꢅ
ꢆ
ꢄ
ꢍ
ꢖ
ꢗ
ꢔ
ꢌ
ꢏ
ꢘ
ꢑ
ꢒ
ꢑ
ꢏ
ꢁ
ꢙ
ꢕ
ꢏ
ꢋ
ꢒ
ꢕ
ꢚ
ꢕ
ꢒ
ꢄ
ꢒ
ꢏ
ꢋ
ꢒ
ꢕ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
DB OR PW PACKAGE
(TOP VIEW)
D
Operate With 3-V to 5.5-V V
Operate Up To 1 Mbit/s
Supply
CC
D
D
D
D
D
Low Standby Current . . . 1 µA Typ
External Capacitors . . . 4 × 0.1 µF
EN
C1+
V+
FORCEOFF
1
2
3
4
5
6
7
8
16
15
14
13
12
11
10
9
V
CC
GND
Accepts 5-V Logic Input With 3.3-V Supply
C1−
C2+
C2−
V−
DOUT
FORCEON
DIN
RS-232 Bus-Pin ESD Protection Exceeds
15 kV Using Human-Body Model (HBM)
D
D
Auto-Powerdown Feature Automatically
Disables Drivers for Power Savings
INVALID
ROUT
RIN
Applications
− Battery-Powered, Hand-Held, and
Portable Equipment
− PDAs and Palmtop PCs
− Notebooks, Sub-Notebooks, and Laptops
− Digital Cameras
− Mobile Phones and Wireless Devices
description/ordering information
The SN65C3221 and SN75C3221 consist of one line driver, one line receiver, and a dual charge-pump circuit
with 15-kV ESD protection pin to pin (serial-port connection pins, including GND). These devices provide the
electrical interface between an asynchronous communication controller and the serial-port connector. The
charge pump and four small external capacitors allow operation from a single 3-V to 5.5-V supply. These devices
operate at data signaling rates up to 1 Mbit/s and a driver output slew rate of 24 V/µs to 150 V/µs.
Flexible control options for power management are available when the serial port is inactive. The
auto-powerdown feature functions when FORCEON is low and FORCEOFF is high. During this mode of
operation, if the devices do not sense a valid RS-232 signal on the receiver input, the driver output is disabled.
If FORCEOFF is set low and EN is high, both the driver and receiver are shut off, and the supply current is
reduced to 1 µA. Disconnecting the serial port or turning off the peripheral drivers causes the auto-powerdown
condition to occur. Auto-powerdown can be disabled when FORCEON and FORCEOFF are high. With
auto-powerdown enabled, the device is activated automatically when a valid signal is applied to the receiver
input. The INVALID output notifies the user if an RS-232 signal is present at the receiver input. INVALID is high
(valid data) if the receiver input voltage is greater than 2.7 V or less than −2.7 V, or has been between −0.3 V
and 0.3 V for less than 30 µs. INVALID is low (invalid data) if the receiver input voltage is between −0.3 V and
0.3 V for more than 30 µs. Refer to Figure 5 for receiver input levels.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
T
A
PACKAGE
SSOP (DB)
Reel of 2000
Tube of 90
SN75C3221DBR
SN75C3221PW
SN75C3221PWR
SN65C3221DBR
SN65C3221PW
SN65C3221PWR
CA3221
−0°C to 70°C
−40°C to 85°C
TSSOP (PW)
SSOP (DB)
CA3221
CB3221
Reel of 2000
Reel of 2000
Tube of 90
TSSOP (PW)
CB3221
Reel of 2000
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
ꢗ
ꢗ
ꢕ
ꢍ
ꢬ
ꢙ
ꢧ
ꢜ
ꢄ
ꢥ
ꢌ
ꢦ
ꢏ
ꢠ
ꢍ
ꢞ
ꢁ
ꢟ
ꢙ
ꢔ
ꢌ
ꢔ
ꢝ
ꢞ
ꢨ
ꢟ
ꢠ
ꢦ
ꢡ
ꢢ
ꢣ
ꢣ
ꢤ
ꢤ
ꢝ
ꢝ
ꢠ
ꢠ
ꢞ
ꢞ
ꢝ
ꢥ
ꢥ
ꢩ
ꢦ
ꢧ
ꢡ
ꢡ
ꢨ
ꢨ
ꢞ
ꢤ
ꢣ
ꢢ
ꢥ
ꢥ
ꢠ
ꢟ
ꢩ
ꢌꢨ
ꢧ
ꢪ
ꢥ
ꢫ
ꢝ
ꢦ
ꢣ
ꢥ
ꢤ
ꢝ
ꢤ
ꢠ
ꢡ
ꢞ
ꢧ
ꢬ
ꢣ
ꢞ
ꢤ
ꢤ
ꢨ
ꢥ
ꢎ
Copyright 2004, Texas Instruments Incorporated
ꢡ
ꢠ
ꢦ
ꢤ
ꢠ
ꢡ
ꢢ
ꢤ
ꢠ
ꢥ
ꢩ
ꢝ
ꢟ
ꢝ
ꢦ
ꢨ
ꢡ
ꢤ
ꢭ
ꢤ
ꢨ
ꢡ
ꢠ
ꢟ
ꢮ
ꢣ
ꢏ
ꢞ
ꢢ
ꢨ
ꢥ
ꢤ
ꢣ
ꢞ
ꢬ
ꢣ
ꢡ
ꢬ
ꢯ
ꢣ
ꢤ ꢨ ꢥ ꢤꢝ ꢞꢱ ꢠꢟ ꢣ ꢫꢫ ꢩꢣ ꢡ ꢣ ꢢ ꢨ ꢤ ꢨ ꢡ ꢥ ꢎ
ꢡ
ꢡ
ꢣ
ꢞ
ꢤ
ꢰ
ꢎ
ꢗ
ꢡ
ꢠ
ꢬ
ꢧ
ꢦ
ꢤ
ꢝ
ꢠ
ꢞ
ꢩ
ꢡ
ꢠ
ꢦ
ꢨ
ꢥ
ꢥ
ꢝ
ꢞ
ꢱ
ꢬ
ꢠ
ꢨ
ꢥ
ꢞ
ꢠ
ꢤ
ꢞ
ꢨ
ꢦ
ꢨ
ꢥ
ꢥ
ꢣ
ꢡ
ꢝ
ꢫ
ꢰ
ꢝ
ꢞ
ꢦ
ꢫ
ꢧ
ꢬ
ꢨ
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢆ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎꢃ ꢊꢋ ꢀꢏ ꢁꢐ ꢑ ꢒꢊꢄ ꢓꢔꢁ ꢁꢒ ꢑ ꢕꢀ ꢊꢆ ꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕꢒ ꢄꢒꢏ ꢋꢒꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
Function Tables
EACH DRIVER
INPUTS
FORCEON FORCEOFF
OUTPUT
DOUT
VALID RIN
RS-232 LEVEL
DRIVER STATUS
DIN
X
L
X
H
H
L
L
X
X
Z
H
L
Powered off
H
H
H
H
H
H
Normal operation with
auto-powerdown disabled
H
L
X
Yes
Yes
No
No
H
L
Normal operation with
auto-powerdown enabled
H
L
L
L
Z
Z
Powered off by
auto-powerdown feature
H
L
H = high level, L = low level, X = irrelevant, Z = high impedance
EACH RECEIVER
INPUTS
OUTPUT
ROUT
VALID RIN
RIN
EN
RS-232 LEVEL
L
H
L
L
X
X
H
L
X
H
L
X
Z
H
Open
No
H = high level, L = low level, X = irrelevant,
Z = high impedance (off), Open = disconnected
input or connected driver off
logic diagram (positive logic)
11
13
10
DIN
DOUT
16
12
FORCEOFF
FORCEON
INVALID
Auto-powerdown
9
8
1
ROUT
RIN
EN
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢆ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢀ ꢏ ꢁꢐ ꢑꢒ ꢊꢄꢓꢔꢁ ꢁꢒꢑ ꢕꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕ ꢒꢄ ꢒ ꢏꢋ ꢒ ꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
CC
Positive output supply voltage range, V+ (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 7 V
Negative output supply voltage range, V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.3 V to −7 V
Supply voltage difference, V+ − V− (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 V
Input voltage range, V : Driver (FORCEOFF, FORCEON, EN) . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to 6 V
I
Receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −25 V to 25 V
Output voltage range, V : Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −13.2 V to 13.2 V
O
Receiver (INVALID) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.3 V to V
+ 0.3 V
CC
Package thermal impedance, θ (see Notes 2 and 3): DB package . . . . . . . . . . . . . . . . . . . . . . . . . . . 82°C/W
JA
PW package . . . . . . . . . . . . . . . . . . . . . . . . . 108°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltages are with respect to network GND.
2. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
J
JA
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
3. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions (see Note 4 and Figure 6)
MIN NOM
MAX
3.6
UNIT
V
= 3.3 V
= 5 V
3
4.5
2
3.3
5
CC
CC
CC
CC
Supply voltage
V
V
V
V
5.5
= 3.3 V
= 5 V
V
IH
Driver and control high-level input voltage
V
DIN, FORCEOFF, FORCEON, EN
2.4
V
V
V
Driver and control low-level input voltage
Driver and control input voltage
Receiver input voltage
DIN, FORCEOFF, FORCEON, EN
DIN, FORCEOFF, FORCEON
0.8
5.5
25
85
70
V
V
V
IL
0
−25
−40
0
I
I
SN65C3221
SN75C3221
T
A
Operating free-air temperature
°C
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
‡
PARAMETER
FORCEOFF, FORCEON, EN
TEST CONDITIONS
MIN TYP
MAX
UNIT
I
I
Input leakage current
0.01
0.3
1
1
µA
No load,
Auto-powerdown disabled
Powered off
1
mA
FORCEOFF and FORCEON at V
CC
Supply current
No load, FORCEOFF at GND
10
I
CC
(T = 25°C)
A
No load, FORCEOFF at V
FORCEON at GND,
,
CC
µA
Auto-powerdown enabled
1
10
All RIN are open or grounded
‡
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T = 25°C.
A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢆ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎꢃ ꢊꢋ ꢀꢏ ꢁꢐ ꢑ ꢒꢊꢄ ꢓꢔꢁ ꢁꢒ ꢑ ꢕꢀ ꢊꢆ ꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕꢒ ꢄꢒꢏ ꢋꢒꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
DRIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
DOUT at R = 3 kΩ to
GND,
L
V
V
High-level output voltage
DIN = GND
5
5.4
V
OH
DOUT at R = 3 kΩ to
L
Low-level output voltage
DIN = V
CC
−5
−5.4
V
OL
GND,
I
I
High-level input current
Low-level input current
V = V
CC
0.01
0.01
35
1
1
µA
µA
IH
I
V at GND
I
IL
V
CC
V
CC
V
CC
= 3.6 V,
V
O
V
O
V
O
V
O
V
O
= 0 V
60
90
‡
I
mA
Short-circuit output current
OS
= 5.5 V,
= 0 V
35
r
Output resistance
, V+, and V− = 0 V,
=
=
=
2 V
300
10M
Ω
o
12 V,
10 V,
V
V
= 3 V to 3.6 V
25
25
CC
I
off
Output leakage current
FORCEOFF = GND
µA
= 4.5 V to 5.5 V
CC
†
‡
All typical values are at V
= 3.3 V or V = 5 V, and T = 25°C.
CC A
CC
Short-circuit durations should be controlled to prevent exceeding the device absolute power-dissipation ratings, and not more than one output
should be shorted at a time.
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
CC
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V = 5 V 0.5 V.
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
TEST CONDITIONS
MIN TYP
250
MAX
UNIT
C
C
C
R
= 1000 pF
L
L
L
L
Maximum data rate
(see Figure 1)
= 250 pF,
V
V
= 3 V to 4.5 V
1000
R
C
= 3 kΩ
kbit/s
CC
L
= 1000 pF,
= 3 kΩ to 7 kΩ,
= 4.5 V to 5.5 V
1000
CC
§
t
Pulse skew
= 150 pF to 2500 pF
See Figure 2
100
ns
sk(p)
L
Slew rate,
transition region
(see Figure 1)
V
R
= 3.3 V,
= 3 kΩ to 7 kΩ
CC
L
SR(tr)
C
= 150 pF to 1000 pF
18
150
V/µs
L
†
§
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
Pulse skew is defined as |t
− t
| of each channel of the same device.
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
ESD protection
TERMINAL
TEST CONDITIONS
TYP
UNIT
NAME
NO.
DOUT
13
HBM
15
kV
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢆ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢀ ꢏ ꢁꢐ ꢑꢒ ꢊꢄꢓꢔꢁ ꢁꢒꢑ ꢕꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕ ꢒꢄ ꢒ ꢏꢋ ꢒ ꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
RECEIVER SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4 and Figure 6)
†
PARAMETER
High-level output voltage
Low-level output voltage
TEST CONDITIONS
MIN
TYP
MAX
UNIT
V
V
V
I
I
= −1 mA
= 1.6 mA
V
− 0.6 V
V
− 0.1 V
OH
OH
CC
CC
0.4
2.4
2.4
V
OL
OL
V
V
V
V
= 3.3 V
= 5 V
1.6
1.9
1.1
1.4
0.5
CC
CC
CC
CC
V
IT+
Positive-going input threshold voltage
Negative-going input threshold voltage
V
V
= 3.3 V
= 5 V
0.6
0.8
V
V
IT−
Input hysteresis (V
IT+
− V
)
V
hys
IT−
I
Output leakage current
Input resistance
FORCEOFF = 0 V
V = 3 V to 25 V
0.05
10
7
µA
kΩ
off
r
3
5
i
I
†
All typical values are at V
CC
= 3.3 V or V = 5 V, and T = 25°C.
CC A
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Note 4)
†
PARAMETER
TEST CONDITIONS
= 150 pF, See Figure 3
= 150 pF, See Figure 3
MIN TYP
MAX
UNIT
ns
t
t
t
t
t
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Output enable time
C
C
C
C
150
150
200
200
50
PLH
PHL
en
L
L
L
L
ns
= 150 pF, R = 3 kΩ, See Figure 4
ns
L
Output disable time
= 150 pF, R = 3 kΩ, See Figure 4
ns
dis
L
‡
Pulse skew
See Figure 3
ns
sk(p)
†
‡
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T = 25°C.
| of each channel of the same device.
A
Pulse skew is defined as |t
− t
PLH PHL
NOTE 4: Test conditions are C1−C4 = 0.1 µF at V
= 3.3 V 0.3 V; C1 = 0.047 µF, C2−C4 = 0.33 µF at V
= 5 V 0.5 V.
CC
CC
ESD protection
TERMINAL
TEST CONDITIONS
TYP
UNIT
NAME
NO.
RIN
8
HBM
15
kV
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢆ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎꢃ ꢊꢋ ꢀꢏ ꢁꢐ ꢑ ꢒꢊꢄ ꢓꢔꢁ ꢁꢒ ꢑ ꢕꢀ ꢊꢆ ꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕꢒ ꢄꢒꢏ ꢋꢒꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
AUTO-POWERDOWN SECTION
electrical characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
PARAMETER
TEST CONDITIONS
MIN
MAX
UNIT
Receiver input threshold
for INVALID high-level output voltage
V
V
V
V
V
FORCEON = GND,
FORCEOFF = V
FORCEOFF = V
FORCEOFF = V
2.7
V
T+(valid)
T−(valid)
T(invalid)
OH
CC
CC
CC
Receiver input threshold
for INVALID high-level output voltage
FORCEON = GND,
FORCEON = GND,
−2.7
−0.3
V
V
V
V
Receiver input threshold
for INVALID low-level output voltage
0.3
0.4
I
= −1 mA, FORCEON = GND,
OH
FORCEOFF = V
INVALID high-level output voltage
INVALID low-level output voltage
V
−0.6
CC
CC
= 1.6 mA, FORCEON = GND,
I
OL
FORCEOFF = V
OL
CC
switching characteristics over recommended ranges of supply voltage and operating free-air
temperature (unless otherwise noted) (see Figure 5)
†
PARAMETER
Propagation delay time, low- to high-level output
Propagation delay time, high- to low-level output
Supply enable time
MIN TYP
MAX
UNIT
µs
t
t
t
1
valid
invalid
en
30
µs
100
µs
†
All typical values are at V
CC
= 3.3 V or V
CC
= 5 V, and T = 25°C.
A
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢆ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢀ ꢏ ꢁꢐ ꢑꢒ ꢊꢄꢓꢔꢁ ꢁꢒꢑ ꢕꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕ ꢒꢄ ꢒ ꢏꢋ ꢒ ꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
0 V
Input
RS-232
Output
Generator
(see Note B)
50 Ω
t
t
TLH
THL
C
L
R
L
(see Note A)
V
OH
OL
3 V
3 V
−3 V
−3 V
VOLTAGE WAVEFORMS
3 V
Output
FORCEOFF
V
6 V
tTHL or tTLH
SR(tr) +
TEST CIRCUIT
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 1. Driver Slew Rate
3 V
0 V
Input
1.5 V
1.5 V
RS-232
Output
Generator
(see Note B)
50 Ω
C
t
t
PLH
L
PHL
R
L
(see Note A)
V
V
OH
3 V
FORCEOFF
50%
50%
VOLTAGE WAVEFORMS
Output
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
NOTES: A.
B. The pulse generator has the following characteristics: PRR = 250 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 2. Driver Pulse Skew
3 V or 0 V
FORCEON
3 V
−3 V
Input
1.5 V
1.5 V
Output
Generator
(see Note B)
t
t
PLH
PHL
50 Ω
C
L
(see Note A)
3 V
V
V
OH
FORCEOFF
50%
50%
Output
OL
TEST CIRCUIT
VOLTAGE WAVEFORMS
NOTES: A.
C includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 3. Receiver Propagation Delay Times
7
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢆ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎꢃ ꢊꢋ ꢀꢏ ꢁꢐ ꢑ ꢒꢊꢄ ꢓꢔꢁ ꢁꢒ ꢑ ꢕꢀ ꢊꢆ ꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕꢒ ꢄꢒꢏ ꢋꢒꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
Input
1.5 V
1.5 V
V
CC
S1
GND
3 V or 0 V
−3 V
FORCEON
t
t
PHZ
PZH
(S1 at GND)
(S1 at GND)
R
L
V
OH
3 V or 0 V
Output
50%
Output
0.3 V
C
L
(see Note A)
EN
t
t
PLZ
(S1 at V
PZL
(S1 at V
)
)
CC
CC
Generator
50 Ω
(see Note B)
0.3 V
Output
50%
V
OL
TEST CIRCUIT
C includes probe and jig capacitance.
L
VOLTAGE WAVEFORMS
NOTES: A.
B. The pulse generator has the following characteristics: Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
C.
D.
t
and t
are the same as t
.
PLZ
PZL
PHZ
PZH
dis
t
and t
are the same as t
.
en
Figure 4. Receiver Enable and Disable Times
8
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁꢂ ꢃ ꢄꢅ ꢆ ꢆ ꢇ ꢈ ꢀꢁ ꢉꢃ ꢄꢅ ꢆꢆ ꢇ
ꢅ ꢊꢋ ꢌ ꢍ ꢃ ꢎ ꢃ ꢊꢋ ꢀ ꢏ ꢁꢐ ꢑꢒ ꢊꢄꢓꢔꢁ ꢁꢒꢑ ꢕꢀ ꢊꢆꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕ ꢒꢄ ꢒ ꢏꢋ ꢒ ꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
PARAMETER MEASUREMENT INFORMATION
3 V
2.7 V
2.7 V
0 V
0 V
Receiver
Input
ROUT
−2.7 V
−2.7 V
−3 V
Generator
(see Note B)
50 Ω
t
t
valid
invalid
V
CC
50% V
t
50% V
CC
CC
INVALID
Output
0 V
Auto-
powerdown
INVALID
= 30 pF
en
C
L
≈V+
V+
(see Note A)
0.3 V
V
Supply
Voltages
CC
0 V
0.3 V
FORCEOFF
FORCEON
DIN
DOUT
≈V−
V−
TEST CIRCUIT
VOLTAGE WAVEFORMS
Valid RS-232 Level, INVALID High
2.7 V
Indeterminate
0.3 V
If Signal Remains Within This Region
For More Than 30 µs, INVALID Is Low
0 V
†
−0.3 V
Indeterminate
−2.7 V
Valid RS-232 Level, INVALID High
†
Auto-powerdown disables drivers and reduces supply
current to 1 µA.
NOTES: A.
C
includes probe and jig capacitance.
L
B. The pulse generator has the following characteristics: PRR = 5 kbit/s, Z = 50 Ω, 50% duty cycle, t ≤ 10 ns, t ≤ 10 ns.
O
r
f
Figure 5. INVALID Propagation Delay Times and Driver Enabling Time
9
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ ꢆ ꢆꢇ ꢈ ꢀꢁ ꢉ ꢃ ꢄꢅ ꢆ ꢆ ꢇ
ꢅꢊ ꢋ ꢌꢍ ꢃ ꢎꢃ ꢊꢋ ꢀꢏ ꢁꢐ ꢑ ꢒꢊꢄ ꢓꢔꢁ ꢁꢒ ꢑ ꢕꢀ ꢊꢆ ꢅ ꢆ ꢄꢍ ꢖ ꢗꢔꢌ ꢏꢘꢑ ꢒ ꢑ ꢏꢁꢒ ꢙꢕꢏ ꢋꢒ ꢕꢚꢕꢒ ꢄꢒꢏ ꢋꢒꢕ
ꢛ
ꢛ
SLLS351E − APRIL 2002 − REVISED OCTOBER 2004
APPLICATION INFORMATION
1
16
15
FORCEOFF
EN
2
3
V
CC
C1+
V+
+
C
= 0.1 µF
BYPASS
−
14
Auto-
powerdown
+
−
+
−
†
C3
GND
C1
4
5
C1−
C2+
13
DOUT
+
−
12
11
10
FORCEON
DIN
C2
6
7
C2−
V−
−
+
C4
INVALID
8
9
RIN
ROUT
5 kΩ
†
C3 can be connected to V
or GND.
NOTE A: Resistor values shown are nominal.
CC
V
CC
vs CAPACITOR VALUES
V
CC
C1
C2, C3, and C4
3.3 V 0.3 V
5 V 0.5 V
3 V to 5.5 V
0.1 µF
0.047 µF
0.1 µF
0.1 µF
0.33 µF
0.47 µF
Figure 6. Typical Operating Circuit and Capacitor Values
10
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
PACKAGING INFORMATION
Orderable Device
SN65C3221DB
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
SSOP
SSOP
DB
16
16
16
16
16
16
16
16
16
16
16
16
80
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CB3221
SN65C3221DBE4
SN65C3221DBG4
SN65C3221DBR
SN65C3221DBRE4
SN65C3221DBRG4
SN65C3221PW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DB
DB
DB
DB
DB
PW
PW
PW
PW
PW
PW
80
80
Green (RoHS
& no Sb/Br)
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
CB3221
SSOP
Green (RoHS
& no Sb/Br)
SSOP
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
SSOP
Green (RoHS
& no Sb/Br)
SSOP
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
SN65C3221PWE4
SN65C3221PWG4
SN65C3221PWR
SN65C3221PWRE4
SN65C3221PWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SN75C3221DBG4
SN75C3221DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
16
16
TBD
Call TI
Call TI
0 to 70
0 to 70
CA3221
CA3221
2000
2000
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
SN75C3221DBRE4
SN75C3221DBRG4
ACTIVE
ACTIVE
SSOP
SSOP
DB
DB
16
16
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
0 to 70
0 to 70
CA3221
CA3221
Green (RoHS
& no Sb/Br)
SN75C3221DW
SN75C3221PW
PREVIEW
ACTIVE
SOIC
DW
PW
16
16
40
90
TBD
Call TI
Call TI
0 to 70
0 to 70
TSSOP
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
CA3221
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
SN75C3221PWE4
SN75C3221PWG4
SN75C3221PWR
ACTIVE
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
16
16
16
16
16
90
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CA3221
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PW
PW
PW
PW
90
Green (RoHS
& no Sb/Br)
0 to 70
CA3221
CA3221
CA3221
CA3221
2000
2000
2000
Green (RoHS
& no Sb/Br)
0 to 70
SN75C3221PWRE4
SN75C3221PWRG4
Green (RoHS
& no Sb/Br)
0 to 70
Green (RoHS
& no Sb/Br)
0 to 70
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
26-Aug-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF SN65C3221 :
Automotive: SN65C3221-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
SN65C3221DBR
SN65C3221PWR
SN75C3221DBR
SN75C3221PWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
330.0
330.0
330.0
330.0
16.4
12.4
16.4
12.4
8.2
6.9
8.2
6.9
6.6
5.6
6.6
5.6
2.5
1.6
2.5
1.6
12.0
8.0
16.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
SN65C3221DBR
SN65C3221PWR
SN75C3221DBR
SN75C3221PWR
SSOP
TSSOP
SSOP
DB
PW
DB
PW
16
16
16
16
2000
2000
2000
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
35.0
38.0
35.0
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
Medical
Logic
Security
www.ti.com/security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense
Video and Imaging
www.ti.com/space-avionics-defense
www.ti.com/video
microcontroller.ti.com
www.ti-rfid.com
www.ti.com/omap
OMAP Applications Processors
Wireless Connectivity
TI E2E Community
e2e.ti.com
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2013, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明