RC4580IPWRE4 [TI]
DUAL AUDIO OPERATIONAL AMPLIFIER; 双路音频运算放大器
| 型号： | RC4580IPWRE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL AUDIO OPERATIONAL AMPLIFIER |
| 文件： | 总12页 (文件大小：235K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀ ꢁꢂ ꢃꢄ ꢅ
ꢆꢇꢈ ꢉ ꢈꢇꢆ ꢊꢋ ꢋ ꢌꢍꢀ ꢈꢎ ꢊꢋ ꢏꢈꢉ ꢈꢐ ꢌ ꢉꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
D, P, OR PW PACKAGE
(TOP VIEW)
D
D
D
D
D
D
Operating Voltage . . . 2 V to 18 V
Low Noise Voltage . . . 0.8 µVrms (TYP)
Wide GBW . . . 12 MHz (TYP)
1OUT
V
CC+
1
2
3
4
8
7
6
5
1IN−
1IN+
2OUT
2IN−
2IN+
Low THD . . . 0.0005% (TYP)
Slew Rate . . . 5 V/µs (TYP)
V
CC−
Suitable for Applications Such As Audio
Preamplifier, Active Filter, Headphone
Amplifier, Industrial Measurement
Equipment
D
D
Drop-In Replacement for NJM4580
Pin and Function Compatible With LM833,
NE5532, NJM4558/9, and NJM4560/2/5
description/ordering information
The RC4580 is a dual operational amplifier that has been designed optimally for audio applications, such as
improving tone control. It offers low noise, high gain bandwidth, low harmonic distortion, and high output current,
all of which make the device ideally suited for audio electronics, such as audio preamplifiers and active filters,
as well as industrial measurement equipment. When high output current is required, the RC4580 also can be
used as a headphone amplifier. Due to its wide operating supply voltage, the RC4580 also can be used in
low-voltage applications.
ORDERING INFORMATION
ORDERABLE
PART NUMBER
TOP-SIDE
MARKING
†
PACKAGE
T
A
PDIP (P)
SOIC (D)
Tube of 50
RC4580IP
RC4580IP
Tube of 75
RC4580ID
R4580I
R4580I
Reel of 2500
Tube of 150
Reel of 2000
RC4580IDR
RC4580IPW
RC4580IPWR
−40°C to 85°C
TSSOP (PW)
†
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are
available at www.ti.com/sc/package.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2004, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ
ꢆ ꢇꢈꢉ ꢈ ꢇ ꢆꢊ ꢋ ꢋ ꢌꢍ ꢀꢈꢎꢊ ꢋ ꢏꢈ ꢉ ꢈꢐ ꢌꢉ ꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
equivalent schematic
V
CC+
Output
− Input
+ Input
V
CC−
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ
ꢆꢇꢈ ꢉ ꢈꢇꢆ ꢊꢋ ꢋ ꢌꢍꢀ ꢈꢎ ꢊꢋ ꢏꢈꢉ ꢈꢐ ꢌ ꢉꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 V
Input voltage (any input) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 V
Differential input voltage, V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 V
CC+
ID
Output current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mA
Package thermal impedance, θ (see Notes 1 and 2):D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W
JA
P package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85°C/W
PW package . . . . . . . . . . . . . . . . . . . . . . . . . . 149°C/W
Operating virtual junction temperature, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
J
Storage temperature range, T
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −60°C to 125°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable
JA
J
A
ambient temperature is P = (T (max) − T )/θ . Operating at the absolute maximum T of 150°C can affect reliability.
D
J
A
JA
J
2. The package thermal impedance is calculated in accordance with JESD 51-7.
recommended operating conditions
MIN
2
MAX
16
UNIT
V
V
CC+
CC−
ICR
Supply voltage
V
−2
−16
13.5
85
V
Input common-mode voltage range
Operating free-air temperature range
−13.5
−40
V
T
A
°C
electrical characteristics, V
= 15 V, T = 25°C (unless otherwise noted)
A
CC
PARAMETER
Input offset voltage
TEST CONDITIONS
MIN
TYP
0.5
5
MAX
3
UNIT
mV
nA
nA
dB
V
V
R
≤ 10 kΩ
IO
S
I
I
Input offset current
200
500
IO
Input bias current
100
110
13.5
13.5
110
110
6
IB
A
VD
Large-signal differential-voltage amplification
Output voltage swing
R
R
≥ 2 kΩ, V =
O
10 V
90
12
12
80
80
L
L
V
≥ 2 kΩ
OM
ICR
V
Common-mode input voltage range
V
CMRR Common-mode rejection ratio
‡
R
R
≤ 10 kΩ
≤ 10 kΩ
dB
dB
mA
S
S
k
Supply-voltage rejection ratio
Supply current (all amplifiers)
SVR
I
9
CC
‡
Measured with V
CC
varied simultaneously
operating characteristics, V
= 15 V, T = 25°C (unless otherwise noted)
CC
A
PARAMETER
TEST CONDITIONS
TYP
5
UNIT
V/µs
MHz
SR
Slew rate at unity gain
Gain-bandwidth product
Total harmonic distortion
R ≥ 2 kΩ
L
GBW
THD
f = 10 kHz
= 5 V, R = 2 kΩ, f = 1 kHz, A = 20 dB
VD
12
V
O
0.0005%
0.8 µVrms
L
V
n
Equivalent input noise voltage
RIAA, R ≤ 2.2 kΩ, 30-kHz LPF
S
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ
ꢆ ꢇꢈꢉ ꢈ ꢇ ꢆꢊ ꢋ ꢋ ꢌꢍ ꢀꢈꢎꢊ ꢋ ꢏꢈ ꢉ ꢈꢐ ꢌꢉ ꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE SWING
MAXIMUM OUTPUT VOLTAGE SWING
vs
vs
LOAD RESISTANCE
FREQUENCY
15
10
5
30
25
20
15
10
5
V+/V− = 15 V
R
T
A
= 2 kΩ
= 25°C
L
V
T
A
=
15 V
CC
= 25°C
V
OM+
0
−5
V
OM−
−10
−15
0
1
5
10 50 60 70 80 100 200 300 500 700 1M 10M
Frequency − kHz
1 k
100
10 k
R
− Load Resistance − Ω
L
Figure 2
Figure 1
EQUIVALENT INPUT NOISE VOLTAGE
OUTPUT VOLTAGE SWING
vs
vs
FREQUENCY
OUTPUT CURRENT
30
20
10
20
V
= 1.5 V
V
= 15 V
CC
S
CC
R
= 50 Ω
= 60 dB
= 25°C
A
15
10
5
A
V
T
V
OM+
0
−5
−10
−15
V
OM−
0
10
−20
100
100 k
1 k
10 k
1
10
100
1000
Frequency − Hz
I
O
− Output Current − mA
Figure 4
Figure 3
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂ ꢃꢄ ꢅ
ꢆꢇꢈ ꢉ ꢈꢇꢆ ꢊꢋ ꢋ ꢌꢍꢀ ꢈꢎ ꢊꢋ ꢏꢈꢉ ꢈꢐ ꢌ ꢉꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
OPERATING CURRENT
vs
OUTPUT VOLTAGE SWING
vs
TEMPERATURE
TEMPERATURE
15
18
16
14
V
OM+
V
CC
= 15 V
V
R
= 15 V
CC
= 2 kΩ
10
5
L
12
10
8
0
−5
6
4
−10
−15
V
OM−
2
0
−55
−55
−40
0
25
70
85
105
−40
0
25
70
85
125
T
A
− Ambient Temperature − °C
T
A
− Ambient Temperature − °C
Figure 5
Figure 6
INPUT OFFSET VOLTAGE
INPUT BIAS CURRENT
vs
vs
TEMPERATURE
TEMPERATURE
100
400
300
V
CC
=
15 V
V
CC
= 15 V
50
0
200
100
0
−50
−100
−50
−40
0
25
70
85
125
−40
0
T
25
70
85
T
− Ambient Temperature − °C
− Ambient Temperature − °C
A
A
Figure 7
Figure 8
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ
ꢆ ꢇꢈꢉ ꢈ ꢇ ꢆꢊ ꢋ ꢋ ꢌꢍ ꢀꢈꢎꢊ ꢋ ꢏꢈ ꢉ ꢈꢐ ꢌꢉ ꢊ ꢑꢊ ꢍꢀ
SLOS412C − APRIL 2003 − REVISED MARCH 2004
TYPICAL CHARACTERISTICS
MAXIMUM OUTPUT VOLTAGE SWING
vs
OPERATING VOLTAGE
OPERATING CURRENT
vs
OPERATING VOLTAGE
20
15
7
6
5
4
T
A
= 25°C
T
R
= 25°C
= 2 kΩ
A
L
+V
OM
10
5
0
3
2
−5
−10
−15
−V
OM
1
0
−20
0
5
10
15
20
0
2
4
6
8
10
12
14
16
V
/V
− Operating Voltage − V
CC+ CC−
V
/V
− Operating Voltage − V
CC+ CC−
Figure 9
Figure 10
VOLTAGE GAIN, PHASE
TOTAL HARMONIC DISTORTION
vs
vs
FREQUENCY
OUTPUT VOLTAGE
30
45
40
35
30
25
20
15
10
5
0.1
V
=
15 V
Gain = 20 dB
= 2 kΩ
V
R
=
15 V
CC
CC
L
0
= 2 kΩ
R
40-dB Amplification
L
−30
−60
−90
T
A
= 25°C
Phase
0.01
20 kHz
−120
−150
20 Hz
0.001
−180
−210
−240
−270
Gain
1 M
1 kHz
0
0.0001
0.1
1
10
10 k
100 k
10 M
V
O
− Output Voltage − V
Frequency − Hz
Figure 12
Figure 11
6
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
PACKAGING INFORMATION
Orderable Device
RC4580ID
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
SOIC
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4580IDE4
RC4580IDG4
RC4580IDR
SOIC
SOIC
D
D
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
75 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4580IDRE4
RC4580IDRG4
RC4580IP
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
RC4580IPE4
RC4580IPW
PDIP
P
50
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
RC4580IPWE4
RC4580IPWG4
RC4580IPWR
RC4580IPWRE4
RC4580IPWRG4
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
150 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
18-Jul-2006
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
MECHANICAL DATA
MPDI001A – JANUARY 1995 – REVISED JUNE 1999
P (R-PDIP-T8)
PLASTIC DUAL-IN-LINE
0.400 (10,60)
0.355 (9,02)
8
5
0.260 (6,60)
0.240 (6,10)
1
4
0.070 (1,78) MAX
0.325 (8,26)
0.300 (7,62)
0.020 (0,51) MIN
0.015 (0,38)
Gage Plane
0.200 (5,08) MAX
Seating Plane
0.010 (0,25) NOM
0.125 (3,18) MIN
0.100 (2,54)
0.021 (0,53)
0.430 (10,92)
MAX
0.010 (0,25)
M
0.015 (0,38)
4040082/D 05/98
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
For the latest package information, go to http://www.ti.com/sc/docs/package/pkg_info.htm
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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logic.ti.com
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