RC4580QPWRQ1 [TI]
DUAL AUDIO OPERATIONAL AMPLIFIER; 双路音频运算放大器
| 型号： | RC4580QPWRQ1 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | DUAL AUDIO OPERATIONAL AMPLIFIER |
| 文件： | 总16页 (文件大小：1009K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
RC4580-Q1
www.ti.com
SLOS707A –DECEMBER 2010–REVISED JULY 2012
DUAL AUDIO OPERATIONAL AMPLIFIER
Check for Samples: RC4580-Q1
1
FEATURES
D PACKAGE
SOIC – 8
(TOP VIEW)
•
•
Qualified for Automotive Applications
AEC-Q100 Qualified With the Following
Results:
–
Device Temperature Grade 1: –40°C to
125°C Ambient Operating Temperature
Range
–
–
–
–
Device HBM ESD Classification Level H2
Device CDM ESD Classification Level C3B
–
•
•
•
•
•
•
Operating Voltage . . . ±2 V to ±18 V
Low Noise Voltage . . . 0.8 μVrms (TYP)
Wide GBW . . . 12 MHz (TYP)
PW PACKAGE
TSSOP – 8
(TOP VIEW)
Low THD . . . 0.0005% (TYP)
Slew Rate . . . 5 V/μs (TYP)
–
Suitable for Automotive Applications Such As
Audio Preamplifier, Active Filter, Headphone
Amplifier, Industrial Measurement Equipment
–
–
•
•
Drop-In Replacement for NJM4580
Pin and Function Compatible With LM833,
NE5532, NJM4558/9, and NJM4560/2/5
DESCRIPTION
The RC4580-Q1 device is a dual operational amplifier that is designed optimally for audio applications, such as
improving tone control. It offers low noise, high gain bandwidth, low harmonic distortion, and high output current.
All of these features make the device ideally suited for audio electronics, such as audio preamplifiers and active
filters, as well as industrial measurement equipment. When high output current is required, the RC4580-Q1
device can be used as a headphone amplifier. Due to its wide operating supply voltage, the RC4580-Q1 device
can also be used in low-voltage applications.
ORDERING INFORMATION(1)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
TOP-SIDE MARKING
R4580Q
–40°C to 125°C
–40°C to 125°C
SOIC – D
TSSOP - PW
Reel of 2000
Reel of 2000
RC4580QDRQ1
RC4580QPWRQ1
R4580Q
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 2010–2012, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
RC4580-Q1
SLOS707A –DECEMBER 2010–REVISED JULY 2012
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
Figure 1. EQUIVALENT SCHEMATIC
ABSOLUTE MAXIMUM RATINGS(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
±18
±15
±30
±50
125
125
2
UNIT
V
VCC
Supply voltage
Input voltage (any input)
V
VID
Differential input voltage
V
Output current
mA
°C
°C
kV
TA
Ambient temperature range
Storage temperature range
Human-body model (HBM) AEC-Q100 Classification Level H2
–40
–60
Tstg
Electrostatic
Discharge
(ESD) Ratings
Charged-device model (CDM) AEC-Q100 Classification Level C3B
750
V
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
2
Copyright © 2010–2012, Texas Instruments Incorporated
RC4580-Q1
www.ti.com
SLOS707A –DECEMBER 2010–REVISED JULY 2012
THERMAL INFORMATION
RC4580-Q1
UNIT
THERMAL METRIC(1)
D (8 PINS)
109
PW (8 PINS)
θJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
163
38
θJCtop
θJB
55.7
49
90.6
1.3
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
10.6
48.6
n/a
ψJB
88.9
n/a
θJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
RECOMMENDED OPERATING CONDITIONS
MIN
2
MAX
16
UNIT
VCC+
VCC–
VICR
TA
Supply voltage
V
–2
–16
13.5
125
Input common-mode voltage range
Operating free-air temperature
–13.5
–40
V
°C
ELECTRICAL CHARACTERISTICS
VCC± = ±15 V, TA = –40°C to 125°C (unless otherwise noted)
PARAMETER
Input offset voltage
TEST CONDITIONS
RS = < 10 kΩ
MIN
TYP
0.5
MAX
UNIT
mV
nA
nA
dB
V
VIO
IIO
3
200
500
Input offset current
5
IIB
Input bias current
100
110
±13.5
±13.5
110
110
6
AVD
VCM
VICR
Large-signal differential voltage amplification
Output voltage swing
RL ≥ 2 kΩ, VO = ±10 V
90
±12
±12
80
RL ≥ 2 kΩ
Common-mode input voltage
V
CMRR Common-mode rejection ratio
R
S ≤ 10 kΩ
S ≤ 10 kΩ
dB
dB
mA
kSVR
ICC
Supply-voltage rejection ratio(1)
R
80
Total supply current (all amplifiers)
9
(1) Measured with VCC± varied simultaneously
OPERATING CHARACTERISTICS
VCC± = ±15 V, TA = –40°C to 125°C (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
UNIT
V/μs
MHz
SR
Slew rate at unity gain
R
L ≥ 2 kΩ
5
12
GBW
THD
Vn
Gain-bandwidth product
Total harmonic distortion
Equivalent input noise voltage
f = 10 kHz
VO = 5 V, RL = 2 kΩ, f = 1 kHz, AVD = 20 dB
RIAA, RS ≤ 2.2 kΩ, 30-kHz LPF
0.0005%
0.8
μVrms
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Link(s): RC4580-Q1
RC4580-Q1
SLOS707A –DECEMBER 2010–REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS
W
Frequency (kHz)
Load Resistance, RL (W)
Figure 2.
Figure 3.
W
Frequency (Hz)
Output Current, IO (mA)
Figure 4.
Figure 5.
4
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): RC4580-Q1
RC4580-Q1
www.ti.com
SLOS707A –DECEMBER 2010–REVISED JULY 2012
TYPICAL CHARACTERISTICS (continued)
W
Ambient Temperature,TA (°C)
Ambient Temperature,TA (°C)
Figure 6.
Figure 7.
Ambient Temperature,TA (°C)
Ambient Temperature,TA (°C)
Figure 8.
Figure 9.
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
5
Product Folder Link(s): RC4580-Q1
RC4580-Q1
SLOS707A –DECEMBER 2010–REVISED JULY 2012
www.ti.com
TYPICAL CHARACTERISTICS (continued)
W
–
Operating Voltage, VCC (V)
Operating Voltage, VCC (V)
Figure 10.
Figure 11.
W
W
Output Voltage, VO (V)
Frequency (Hz)
Figure 12.
Figure 13.
6
Submit Documentation Feedback
Copyright © 2010–2012, Texas Instruments Incorporated
Product Folder Link(s): RC4580-Q1
RC4580-Q1
www.ti.com
SLOS707A –DECEMBER 2010–REVISED JULY 2012
REVISION HISTORY
Changes from Original (December 2010) to Revision A
Page
•
•
•
•
•
•
•
•
•
Added AEC-Q100 info to the features; changed Suitable for Applications to Suitable for Automotive Applications ........... 1
Added PW pinout drawing .................................................................................................................................................... 1
Added second row for PW package to Ordering Information table ...................................................................................... 1
Added ESDS ......................................................................................................................................................................... 2
Changed TJ to TA .................................................................................................................................................................. 2
Removed θJA row from Abs Max table because it is also listed in the thermal table ........................................................... 2
Added ESD ratings to Abs Max table ................................................................................................................................... 2
Added thermal table .............................................................................................................................................................. 3
Changed TA = 25°C to TA = –40°C to 125°C in condition statement for Elec Char table and Op Char table ...................... 3
Copyright © 2010–2012, Texas Instruments Incorporated
Submit Documentation Feedback
7
Product Folder Link(s): RC4580-Q1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2012
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
RC4580QDRQ1
ACTIVE
ACTIVE
SOIC
D
8
8
2500
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
RC4580QPWRQ1
TSSOP
PW
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF RC4580-Q1 :
Catalog: RC4580
•
NOTE: Qualified Version Definitions:
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-Aug-2012
Catalog - TI's standard catalog product
•
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
RC4580QDRQ1
SOIC
D
8
8
2500
2000
330.0
330.0
12.4
12.4
6.4
7.0
5.2
3.6
2.1
1.6
8.0
8.0
12.0
12.0
Q1
Q1
RC4580QPWRQ1
TSSOP
PW
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Aug-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
RC4580QDRQ1
SOIC
D
8
8
2500
2000
340.5
367.0
338.1
367.0
20.6
35.0
RC4580QPWRQ1
TSSOP
PW
Pack Materials-Page 2
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