LMV339PWRLE [TI]
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| 型号： | LMV339PWRLE |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 暂无描述 比较器 |
| 文件： | 总29页 (文件大小：1139K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136N –AUGUST 1999–REVISED APRIL 2011
GENERAL-PURPOSE LOW-VOLTAGE COMPARATORS
1
FEATURES
LMV339 . . . D OR PW PACKAGE
(TOP VIEW)
•
•
2.7-V and 5-V Performance
Low Supply Current
1
2
3
4
5
6
7
3OUT
2OUT
1OUT
VCC+
14
–
–
–
LMV331 . . . 130 μA Typ
LMV393 . . . 210 μA Typ
LMV339 . . . 410 μA Typ
13 4OUT
12 GND
11 4IN+
10 4IN–
1IN–
1IN+
2IN–
2IN+
•
Input Common-Mode Voltage Range Includes
Ground
9
8
3IN+
3IN–
•
•
Low Output Saturation Voltage 200 mV Typical
Open-Collector Output for Maximum Flexibility
LMV339 . . . RUC PACKAGE
(TOP VIEW)
DESCRIPTION/
ORDERING INFORMATION
The LMV393 and LMV339 devices are low-voltage
(2.7 V to 5.5 V) versions of the dual and quad
comparators, LM393 and LM339, which operate from
5 V to 30 V. The LMV331 is the single-comparator
version.
14
13
1
2
12
11
10
1OUT
VCC+
4OUT
GND
3
1IN–
4IN+
The LMV331, LMV339, and LMV393 are the most
cost-effective solutions for applications where
low-voltage operation, low power, space saving, and
price are the primary specifications in circuit design
for portable consumer products. These devices offer
specifications that meet or exceed the familiar LM339
and LM393 devices at a fraction of the supply current.
4
5
9
8
1IN+
2IN–
4IN–
3IN+
6
7
LMV393 . . . D, DDU, DGK OR PW PACKAGE
(TOP VIEW)
1
1OUT
1IN–
1IN+
GND
VCC+
2OUT
2IN–
2IN+
8
7
6
5
2
3
4
LMV331 . . . DBV OR DCK PACKAGE
(TOP VIEW)
1
2
3
5
1IN+
GND
1IN–
VCC+
OUT
4
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Copyright © 1999–2011, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
SLCS136N –AUGUST 1999–REVISED APRIL 2011
www.ti.com
ORDERING INFORMATION(1)
TOP-SIDE
MARKING(3)
TA
PACKAGE(2)
ORDERABLE PART NUMBER
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
LMV331IDCKR
LMV331IDCKT
LMV331IDBVR
LMV331IDBVT
LMV338IDGKR
LMV393ID
SC-70 – DCK
R2_
Single
Dual
SOT23-5 – DBV
R1I_
R9_
MSOP/VSSOP – DGK Reel of 2500
Tube of 75
SOIC – D
MV393I
Reel of 2500
LMV393IDR
–40°C to 85°C
Tube of 90
TSSOP – PW
LMV393IPW
LMV393IPWR
LMV393IDDUR
LMV339ID
MV393I
RABR
Reel of 2000
VSSOP – DDU
SOIC – D
Reel of 3000
Tube of 50
LM339I
Reel of 2500
Tube of 150
Reel of 2000
Reel of 3000
LMV339IDR
Quad
LMV339IPW
LMV339IPWR
LMV339IRUCR
TSSOP – PW
µQFN – RUC
MV339I
RT
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Package drawings, thermal data, and symbolization are available at www.ti.com/packaging.
(3) DBV/DCK/DGK: The actual top-side marking has one additional character that designates the wafer fab/assembly site.
SYMBOL (EACH COMPARATOR)
–
IN–
OUT
+
IN+
LMV324 SIMPLIFIED SCHEMATIC
V
CC+
Q6
Q7
M
OUT
Q1Q2
Q3Q4Q5
IN+
IN−
R1R2R3
GND
2
Copyright © 1999–2011, Texas Instruments Incorporated
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136N –AUGUST 1999–REVISED APRIL 2011
Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
5.5
UNIT
VCC
VID
VI
Supply voltage(2)
Differential input voltage(3)
V
V
V
±5.5
5.5
Input voltage range (either input)
0
At or below TA = 25°C,
CC ≤ 5.5 V
Duration of output short circuit (one amplifier) to ground(4)
Unlimited
V
8 pin
97
86
D package
14 pin
DBV package
DCK package
DDU package
RUC package
DGK package
206
252
TBD
TBD
172
149
113
150
150
θJA
Package thermal impedance(5) (6)
°C/W
8 pin
PW package
14 pin
TJ
Operating virtual junction temperature
Storage temperature range
°C
°C
Tstg
–65
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, and functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating
Conditions is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) All voltage values (except differential voltages and VCC specified for the measurement of IOS) are with respect to the network GND.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Maximum power dissipation is a function of TJ(max), θJA, and TA. The maximum allowable power dissipation at any allowable ambient
temperature is PD = (TJ(max) – TA)/θJA. Operating at the absolute maximum TJ of 150°C can affect reliability.
(6) The package thermal impedance is calculated in accordance with JESD 51-7.
Recommended Operating Conditions
MIN
MAX
UNIT
VCC
VOUT
TA
Supply voltage (single-supply operation)
Output voltage
2.7
5.5
V
VCC+
+
V
0.3
Operating free-air temperature
I temperature
–40
85
°C
Copyright © 1999–2011, Texas Instruments Incorporated
3
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
SLCS136N –AUGUST 1999–REVISED APRIL 2011
www.ti.com
Electrical Characteristics
VCC+ = 2.7 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
VIO
Input offset voltage
25°C
1.7
7
mV
Average temperature
coefficient of input offset
voltage
–40°C to
85°C
αVIO
5
μV/°C
25°C
15
250
400
50
IIB
Input bias current
nA
–40°C to
85°C
25°C
5
IIO
IO
Input offset current
nA
mA
µA
–40°C to
85°C
150
Output current (sinking)
Output Leakage Current
VO ≤ 1.5 V
25°C
25°C
5
23
0.003
–40°C to
85°C
1
Common-mode input
voltage range
VICR
VSAT
25°C
–0.1 to 2
V
Saturation voltage
I
O ≤ 1.5 mA
25°C
25°C
25°C
25°C
200
40
mV
LMV331
100
140
200
ICC
Supply current
LMV393 (both comparators)
LMV339 (all four comparators)
70
μA
140
Switching Characteristics
TA = 25°C, VCC+ = 2.7 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
1000
350
UNIT
Input overdrive = 10 mV
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
Propagation delay high to low level output
switching
tPHL
ns
500
Propagation delay low to high level output
switching
tPLH
ns
400
4
Copyright © 1999–2011, Texas Instruments Incorporated
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
www.ti.com
SLCS136N –AUGUST 1999–REVISED APRIL 2011
Electrical Characteristics
VCC+ = 5 V, GND = 0 V, at specified free-air temperature (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TA
MIN
TYP
MAX
UNIT
25°C
1.7
7
VIO
αVIO
IIB
Input offset voltage
mV
–40°C to
85°C
9
Average temperature
coefficient of input offset
voltage
25°C
25°C
5
μV/°C
25
250
400
50
Input bias current
nA
–40°C to
85°C
25°C
2
IIO
IO
Input offset current
nA
mA
µA
–40°C to
85°C
150
Output current (sinking)
Output Leakage Current
V
O ≤ 1.5 V
25°C
25°C
10
20
84
0.003
–40°C to
85°C
1
Common-mode input
voltage range
VICR
AVD
25°C
–0.1 to 4.2
V
Large-signal differential
voltage gain
25°C
25°C
50
V/mV
200
400
700
120
150
200
250
300
350
VSAT
Saturation voltage
IO ≤ 4 mA
mV
–40°C to
85°C
25°C
60
100
170
LMV331
–40°C to
85°C
25°C
ICC
Supply current
LMV393 (both comparators)
LMV339 (all four comparators)
μA
–40°C to
85°C
25°C
–40°C to
85°C
Switching Characteristics
TA = 25°C, VCC+ = 5 V, RL = 5.1 kΩ, GND = 0 V (unless otherwise noted)
PARAMETER
TEST CONDITIONS
TYP
600
200
450
300
UNIT
Input overdrive = 10 mV
Input overdrive = 100 mV
Input overdrive = 10 mV
Input overdrive = 100 mV
Propagation delay high to low level output
switching
tPHL
ns
Propagation delay low to high level output
switching
tPLH
ns
Copyright © 1999–2011, Texas Instruments Incorporated
5
LMV331 SINGLE, LMV393 DUAL
LMV339 QUAD
SLCS136N –AUGUST 1999–REVISED APRIL 2011
www.ti.com
REVISION HISTORY
Changes from Revision M (November 2005) to Revision N
Page
•
•
Changed document format from Quicksilver to DocZone. .................................................................................................... 1
Added RUC package pin out and RUC package ordering information. ............................................................................... 1
6
Copyright © 1999–2011, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2011
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
LMV331IDBVR
LMV331IDBVRE4
LMV331IDBVRG4
LMV331IDBVT
LMV331IDBVTE4
LMV331IDBVTG4
LMV331IDCKR
LMV331IDCKRE4
LMV331IDCKRG4
LMV331IDCKT
LMV331IDCKTE4
LMV331IDCKTG4
LMV339ID
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DCK
DCK
D
5
5
3000
3000
3000
250
250
250
3000
3000
3000
250
250
250
50
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
5
Green (RoHS
& no Sb/Br)
5
Green (RoHS
& no Sb/Br)
5
Green (RoHS
& no Sb/Br)
5
Green (RoHS
& no Sb/Br)
5
Green (RoHS
& no Sb/Br)
SC70
5
Green (RoHS
& no Sb/Br)
SC70
5
Green (RoHS
& no Sb/Br)
SC70
5
Green (RoHS
& no Sb/Br)
SC70
5
Green (RoHS
& no Sb/Br)
SC70
5
Green (RoHS
& no Sb/Br)
SOIC
14
14
14
14
14
Green (RoHS
& no Sb/Br)
LMV339IDE4
SOIC
D
50
Green (RoHS
& no Sb/Br)
LMV339IDG4
SOIC
D
50
Green (RoHS
& no Sb/Br)
LMV339IDR
SOIC
D
2500
2500
Green (RoHS
& no Sb/Br)
LMV339IDRE4
SOIC
D
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2011
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
LMV339IDRG4
LMV339IPW
SOIC
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
QFN
D
PW
PW
PW
PW
PW
PW
RUC
D
14
14
14
14
14
14
14
14
8
2500
90
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
LMV339IPWE4
LMV339IPWG4
LMV339IPWR
LMV339IPWRE4
LMV339IPWRG4
LMV339IRUCR
LMV393ID
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
3000
75
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
SOIC
Green (RoHS
& no Sb/Br)
LMV393IDDUR
LMV393IDDURE4
LMV393IDDURG4
LMV393IDE4
VSSOP
VSSOP
VSSOP
SOIC
DDU
DDU
DDU
D
8
3000
3000
3000
75
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
LMV393IDG4
SOIC
D
8
75
Green (RoHS
& no Sb/Br)
LMV393IDGKR
LMV393IDGKRG4
LMV393IDR
MSOP
MSOP
SOIC
DGK
DGK
D
8
2500
2500
2500
2500
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
8
Green (RoHS
& no Sb/Br)
LMV393IDRE4
SOIC
D
8
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2011
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
LMV393IDRG4
LMV393IPW
SOIC
D
8
8
8
8
8
8
8
2500
150
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PW
PW
PW
PW
PW
PW
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
LMV393IPWE4
LMV393IPWG4
LMV393IPWR
LMV393IPWRE4
LMV393IPWRG4
150
Green (RoHS
& no Sb/Br)
150
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
13-May-2011
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LMV331, LMV393 :
Automotive: LMV331-Q1, LMV393-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Aug-2011
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LMV331IDBVR
LMV331IDBVR
LMV331IDBVT
LMV331IDCKR
LMV331IDCKR
LMV331IDCKT
LMV331IDCKT
LMV339IDR
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
180.0
178.0
178.0
178.0
180.0
178.0
180.0
330.0
330.0
180.0
180.0
330.0
330.0
330.0
9.2
9.0
3.17
3.23
3.23
2.4
3.23
3.17
3.17
2.5
1.37
1.37
1.37
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q2
Q3
Q1
Q1
Q1
5
9.0
8.0
5
3000
3000
250
9.0
8.0
SC70
5
9.2
2.3
2.55
2.5
1.2
8.0
SC70
5
9.0
2.4
1.2
8.0
SC70
5
250
9.2
2.3
2.55
9.0
1.2
8.0
SOIC
14
14
14
8
2500
2000
3000
3000
2500
2500
2000
16.4
12.4
8.4
6.5
2.1
16.0
12.0
8.0
LMV339IPWR
LMV339IRUCR
LMV393IDDUR
LMV393IDGKR
LMV393IDR
TSSOP
QFN
PW
6.9
5.6
1.6
RUC
DDU
DGK
D
2.3
2.3
0.55
1.05
1.4
VSSOP
MSOP
SOIC
8.4
2.25
5.3
3.35
3.4
8.0
8
12.4
12.4
12.4
12.0
12.0
12.0
8
6.4
5.2
2.1
LMV393IPWR
TSSOP
PW
8
7.0
3.6
1.6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
20-Aug-2011
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV331IDBVR
LMV331IDBVR
LMV331IDBVT
LMV331IDCKR
LMV331IDCKR
LMV331IDCKT
LMV331IDCKT
LMV339IDR
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
205.0
180.0
180.0
180.0
205.0
180.0
205.0
346.0
346.0
202.0
202.0
358.0
340.5
346.0
200.0
180.0
180.0
180.0
200.0
180.0
200.0
346.0
346.0
201.0
201.0
335.0
338.1
346.0
33.0
18.0
18.0
18.0
33.0
18.0
33.0
33.0
29.0
28.0
28.0
35.0
20.6
29.0
5
5
3000
3000
250
SC70
5
SC70
5
SC70
5
250
SOIC
14
14
14
8
2500
2000
3000
3000
2500
2500
2000
LMV339IPWR
LMV339IRUCR
LMV393IDDUR
LMV393IDGKR
LMV393IDR
TSSOP
QFN
PW
RUC
DDU
DGK
D
VSSOP
MSOP
SOIC
8
8
LMV393IPWR
TSSOP
PW
8
Pack Materials-Page 2
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相关型号：
LMV341
Single with Shutdown/Dual/Quad General Purpose, 2.7V, Rail-to-Rail Output, 125∑C, Operational Amplifiers
NSC
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