LM4670SD [TI]

LM4670 Boomer Audio Power Amplifier Series Filterless High; LM4670的Boomer音频功率放大器系列滤波的
LM4670SD
型号: LM4670SD
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

LM4670 Boomer Audio Power Amplifier Series Filterless High
LM4670的Boomer音频功率放大器系列滤波的

商用集成电路 放大器 功率放大器 光电二极管
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LM4670  
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SNAS240C DECEMBER 2004REVISED MAY 2013  
LM4670 Boomer™ Audio Power Amplifier Series Filterless High Efficiency 3W Switching  
Audio Amplifier  
Check for Samples: LM4670  
1
FEATURES  
DESCRIPTION  
The LM4670 is a fully integrated single-supply high  
efficiency switching audio amplifier. It features an  
innovative modulator that eliminates the LC output  
filter used with typical switching amplifiers.  
Eliminating the output filter reduces external  
component count, simplifies circuit design, and  
reduces board area. The LM4670 processes analog  
inputs with a delta-sigma modulation technique that  
lowers output noise and THD when compared to  
conventional pulse width modulators.  
23  
No Output Filter Required for Inductive Loads  
Externally Configurable Gain  
Very Fast Turn on Time: 1.35ms (Typ)  
Minimum External Components  
"Click and Pop" Suppression Circuitry  
Micro-Power Shutdown Mode  
Short Circuit Protection  
Available in Space-Saving DSBGA and WSON  
Packages  
The LM4670 is designed to meet the demands of  
mobile phones and other portable communication  
devices. Operating on a single 5V supply, it is  
capable of driving a 4speaker load at a continuous  
average output of 2.3W with less than 1% THD+N. Its  
flexible power supply requirements allow operation  
from 2.4V to 5.5V.  
APPLICATIONS  
Mobile Phones  
PDAs  
Portable Electronic Devices  
The LM4670 has high efficiency with speaker loads  
compared to a typical Class AB amplifier. With a 3.6V  
supply driving an 8speaker, the IC's efficiency for a  
100mW power level is 77%, reaching 88% at 600mW  
output power.  
KEY SPECIFICATIONS  
Efficiency at 3.6V, 100mW into 8Speaker,  
77% (Typ)  
Efficiency at 3.6V, 600mW into 8Speaker,  
88% (Typ)  
The LM4670 features a low-power consumption  
shutdown mode. Shutdown may be enabled by  
driving the Shutdown pin to a logic low (GND).  
Efficiency at 5V, 1W into 8Speaker, 87%  
(Typ)  
The gain of the LM4670 is externally configurable  
which allows independent gain control from multiple  
sources by summing the signals.  
Quiescent Current, 3.6V Supply, 4.8mA (Typ)  
Total Shutdown Power Supply Current, 0.01µA  
(Typ)  
Single Supply Range, 2.4 to 5.5V  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
3
Boomer is a trademark of Texas Instruments.  
All other trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
LM4670  
SNAS240C DECEMBER 2004REVISED MAY 2013  
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Typical Application  
Figure 1. Typical Audio Amplifier Application Circuit  
Connection Diagram  
GND  
IN+  
A
B
C
V 1  
o
GND  
V
DD  
IN-  
V 2  
o
1
2
3
SHUTDOWN  
PV  
DD  
Figure 2. 9 Bump DSBGA Package  
Top View  
See Package Number YZR0009  
Figure 3. WSON Package  
Top View  
See Package Number NGQ0008A  
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
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Absolute Maximum Ratings(1)(2)  
Supply Voltage(1)  
6.0V  
Storage Temperature  
65°C to +150°C  
Voltage at Any Input Pin  
Power Dissipation(3)  
ESD Susceptibility(4)  
VDD + 0.3V V GND - 0.3V  
Internally Limited  
2.0kV  
ESD Susceptibility(5)  
200V  
Junction Temperature (TJMAX  
)
150°C  
θJA (DSBGA)  
θJA (WSON)  
220°C/W  
73°C/W  
Thermal Resistance  
Soldering Information  
See AN-1112 (SNVA009) "DSBGA Wafers Level Chip Scale Package."  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature  
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever  
is lower. For the LM4670, TJMAX = 150°C. The typical θJA is 220°C/W for the DSBGA package and 64°C/W for the WSON package.  
(4) Human body model, 100pF discharged through a 1.5kresistor.  
(5) Machine Model, 220pF – 240pF discharged through all pins.  
Operating Ratings(1) (2)  
T
MIN TA TMAX  
Supply Voltage(3)  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
40°C TA 85°C  
2.4V VDD 5.5V  
Temperature Range  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) The maximum operating voltage for the LM4670 in the SDA (WSON) package when driving 4loads to greater than 10% THD+N is  
5.0V.  
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Electrical Characteristics(1)(2)  
The following specifications apply for AV = 2V/V (RI = 150k), RL = 15µH + 8+ 15µH unless otherwise specified. Limits  
apply for TA = 25°C.  
LM4670  
Units  
(Limits)  
Symbol  
|VOS  
Parameter  
Conditions  
VI = 0V, AV = 2V/V,  
Typical(3)  
Limit(4)(5)  
|
Differential Output Offset Voltage  
25  
mV (max)  
dB  
VDD = 2.4V to 5.0V  
VDD = 2.4V to 5.0V,  
Input Referred  
PSRRGSM GSM Power Supply Rejection Ratio  
CMRRGSM GSM Common Mode Rejection Ratio  
64  
80  
VDD = 2.4V to 5.0V  
VIC = VDD/2 to 0.5V,  
VIC = VDD/2 to VDD – 0.8V,  
Input Referred  
dB  
|IIH  
|
Logic High Input Current  
Logic Low Input Current  
VDD = 5.0V, VI = 5.8V  
20  
1
100  
5
μA (max)  
μA (max)  
mA (max)  
mA  
|IIL|  
VDD = 5.0V, VI = –0.3V  
VIN = 0V, No Load, VDD = 5.0V  
VIN = 0V, No Load, VDD = 3.6V  
VIN = 0V, No Load, VDD = 2.4V  
7.0  
4.8  
3.8  
10  
IDD  
Quiescent Power Supply Current  
5
1
mA (max)  
VSHUTDOWN = 0V  
VDD = 2.4V to 5.0V  
ISD  
Shutdown Current(6)  
0.01  
μA (max)  
VSDIH  
VSDIL  
ROSD  
Shutdown voltage input high  
Shutdown voltage input low  
Output Impedance  
1.0  
0.8  
1.4  
0.4  
V (min)  
V (max)  
kΩ  
VSHUTDOWN = 0.4V  
>100  
270k/RI  
330k/RI  
V/V (min)  
V/V (max)  
AV  
Gain  
300k/RI  
Resistance from Shutdown Pin to  
GND  
RSD  
300  
kΩ  
RL = 15μH + 4+ 15μH,  
THD = 10% (max)  
f = 1kHz, 22kHz BW  
VDD = 5V  
VDD = 3.6V  
VDD = 2.5V  
3.0  
1.5  
675  
W
W
mW  
PO  
Output Power(7)(8)  
RL = 15μH + 4+ 15μH,  
THD+N = 1% (max)  
f = 1kHz, 22kHz BW  
VDD = 5V,  
2.3  
1.2  
550  
W
W
mW  
VDD = 3.6V,  
VDD = 2.5V,  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not ensured for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) Typical specifications are specified at 25°C and represent the parametric norm.  
(4) Tested limits are specified to Texas Instruments' AOQL (Average Outgoing Quality Level).  
(5) Datasheet min/max specification limits are ensured by design, test, or statistical analysis.  
(6) Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA. The  
Shutdown pin should be driven as close as possible to GND for minimal shutdown current. See Application Information under  
SHUTDOWN FUNCTION for more information.  
(7) Typical output power numbers are for the LM4670 in the ITL (DSBGA) package. In the WSON (SDA) package, the output power will be  
lower due to higher resistance seen from the IC output pad to PCB trace. The difference increases with lower impedance loads.  
(8) The maximum operating voltage for the LM4670 in the SDA (WSON) package when driving 4loads to greater than 10% THD+N is  
5.0V.  
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Electrical Characteristics(1)(2) (continued)  
The following specifications apply for AV = 2V/V (RI = 150k), RL = 15µH + 8+ 15µH unless otherwise specified. Limits  
apply for TA = 25°C.  
LM4670  
Units  
(Limits)  
Symbol  
Parameter  
Conditions  
Typical(3)  
Limit(4)(5)  
RL = 15μH + 8+ 15μH,  
THD = 10% (max)  
f = 1kHz, 22kHz BW  
VDD = 5V  
VDD = 3.6V  
VDD = 2.5V  
1.65  
850  
400  
W
mW  
mW  
PO  
Output Power(7)  
RL = 15μH + 8+ 15μH,  
THD+N = 1% (max)  
f = 1kHz, 22kHz BW  
VDD = 5V,  
1.35  
680  
325  
W
VDD = 3.6V,  
VDD = 2.5V,  
mW (min)  
mW  
600  
VDD = 5V, PO = 1WRMS  
f = 1kHz  
,
0.35  
0.30  
0.30  
0.30  
%
%
%
%
VDD = 3.6V, PO = 0.5WRMS  
f = 1kHz  
,
,
,
THD+N  
Total Harmonic Distortion + Noise  
VDD = 3.6V, PO = 0.5WRMS  
f = 5kHz  
VDD = 3.6V, PO = 0.5WRMS  
f = 10kHz  
VDD = 3.6V,  
VRipple = 200mVPP Sine,  
fRipple = 217Hz  
Inputs to AC GND, CI = 0.1μ,  
68  
65  
62  
dB  
dB  
dB  
Input Referred  
VDD = 3.6V,  
VRipple = 200mVPP Sine,  
fRipple = 1kHz  
Inputs to AC GND, CI = 0.1μF  
Input Referred  
PSRR  
Power Supply Rejection Ratio  
VDD = 3.6V,  
VRipple = 200mVPP Sine,  
fRipple = 217Hz  
fIN = 1kHz, PO = 10mWRMS  
Input Referred  
SNR  
Signal to Noise Ratio  
Output Noise  
VDD = 5V, PO = 1WRMS  
93  
85  
dB  
VDD = 3.6V, f = 20Hz – 20kHz  
Inputs to AC GND, CI = 0.1μF  
No Weighting, Input Referred  
μVRMS  
εOUT  
VDD = 3.6V, Inputs to AC GND  
CI = 0.1μF, A Weighted  
Input Referred  
65  
80  
μVRMS  
VDD = 3.6V, VRipple = 1VPP Sine  
fRipple = 217Hz, Input Referred  
CMRR  
Common Mode Rejection Ratio  
dB  
TWU  
TSD  
Wake-up Time  
Shutdown Time  
VDD = 3.6V  
VDD = 3.6V  
1.35  
0.01  
ms  
ms  
External Components Description  
See Figure 1  
Components  
Functional Description  
1.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to POWER SUPPLY BYPASSING for  
information concerning proper placement and selection of the supply bypass capacitor.  
2.  
RI  
Gain setting resistor. Differential gain is set by the equation AV = 2 * 150k/ Ri(V/V).  
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Typical Performance Characteristics(1)  
THD+N vs Frequency  
VDD = 2.5V, RL = 15µH + 4+ 15µH  
POUT = 375mW, 22kHz BW  
THD+N vs Frequency  
VDD = 3.6V, RL = 15µH + 4+ 15µH  
POUT = 750mW, 22kHz BW  
Figure 4.  
Figure 5.  
THD+N vs Frequency  
VDD = 5V, RL = 15µH + 4+ 15µH  
POUT = 1.5W, 22kHz BW  
THD+N vs Frequency  
VDD = 2.5V, RL = 15µH + 8+ 15µH  
POUT = 200mW, 22kHz BW  
Figure 6.  
Figure 7.  
THD+N vs Frequency  
VDD = 3.6V, RL = 15µH + 8+ 15µH  
POUT = 500mW, 22kHz BW  
THD+N vs Frequency  
VDD = 5V, RL = 15µH + 8+ 15µH  
POUT = 1W, 22kHz BW  
Figure 8.  
Figure 9.  
(1) The performance graphs were taken using the Audio Precision AUX-0025 Switching Amplifier Measurement Filter in series with the LC  
filter on the board.  
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Typical Performance Characteristics(1) (continued)  
THD+N vs Output Power  
RL = 15µH + 4+ 15µH  
f = 1kHz, 22kHz BW  
THD+N vs Output Power  
RL = 15µH + 8+ 15µH  
f = 1kHz, 22kHz BW  
Figure 10.  
Figure 11.  
CMRR vs Frequency  
VDD = 3.6V, RL = 15µH + 8+ 15µH  
VCM = 1VP-P Sine Wave, 22kHz BW  
PSRR vs Frequency  
VDD = 3.6V, RL = 15µH + 8+ 15µH  
VCM = 200mVP-P Sine Wave, 22kHz BW  
Figure 12.  
Figure 13.  
Efficiency and Power Dissipation  
vs Output Power  
RL = 15µH + 4+ 15µH, f = 1kHz, THD < 2%  
Efficiency and Power Dissipation  
vs Output Power  
RL = 15µH + 8+ 15µH, f = 1kHz, THD < 1%  
Figure 14.  
Figure 15.  
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Typical Performance Characteristics(1) (continued)  
Output Power vs Supply Voltage  
RL = 15µH + 4+ 15µH, f = 1kHz, 22kHz BW  
Output Power vs Supply Voltage  
RL = 15µH + 8+ 15µH, f = 1kHz, 22kHz BW  
Figure 16.  
Figure 17.  
Supply Current (RMS) vs Output Power  
Supply Current (RMS) vs Output Power  
RL = 15µH + 4+ 15µH, f = 1kHz  
RL = 15µH + 8+ 15µH, f = 1kHz  
Figure 18.  
Figure 19.  
Shutdown Threshold  
RL = 15µH + 8+ 15µH  
Shutdwon Threshold vs Supply Voltage  
RL = 15µH + 8+ 15µH  
Figure 20.  
Figure 21.  
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Typical Performance Characteristics(1) (continued)  
Supply Current vs Shutdown Voltage  
Supply Current vs Supply Voltage  
RL = 15µH + 8+ 15µH  
RL = 15µH + 8+ 15µH  
Figure 22.  
Figure 23.  
Supply Current vs Supply Voltage  
RL = Different µH loads  
Differential Gain vs Supply Voltage  
RL = 15µH + 8+ 15µH, Ri = 150k, f = 1kHz  
Figure 24.  
Figure 25.  
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APPLICATION INFORMATION  
GENERAL AMPLIFIER FUNCTION  
The output signals generated by the LM4670 consist of two, BTL connected, output signals that pulse  
momentarily from near ground potential to VDD. The two outputs can pulse independently with the exception that  
they both may never pulse simultaneously as this would result in zero volts across the BTL load. The minimum  
width of each pulse is approximately 350ns. However, pulses on the same output can occur sequentially, in  
which case they are concatenated and appear as a single wider pulse to achieve an effective 100% duty cycle.  
This results in maximum audio output power for a given supply voltage and load impedance. The LM4670 can  
achieve much higher efficiencies than class AB amplifiers while maintaining acceptable THD performance.  
The short (350ns) drive pulses emitted at the LM4670 outputs means that good efficiency can be obtained with  
minimal load inductance. The typical transducer load on an audio amplifier is quite reactive (inductive). For this  
reason, the load can act as it's own filter, so to speak. This "filter-less" switching amplifier/transducer load  
combination is much more attractive economically due to savings in board space and external component cost  
by eliminating the need for a filter.  
POWER DISSIPATION AND EFFICIENCY  
In general terms, efficiency is considered to be the ratio of useful work output divided by the total energy required  
to produce it with the difference being the power dissipated, typically, in the IC. The key here is “useful” work. For  
audio systems, the energy delivered in the audible bands is considered useful including the distortion products of  
the input signal. Sub-sonic (DC) and super-sonic components (>22kHz) are not useful. The difference between  
the power flowing from the power supply and the audio band power being transduced is dissipated in the  
LM4670 and in the transducer load. The amount of power dissipation in the LM4670 is very low. This is because  
the ON resistance of the switches used to form the output waveforms is typically less than 0.25. This leaves  
only the transducer load as a potential "sink" for the small excess of input power over audio band output power.  
The LM4670 dissipates only a fraction of the excess power requiring no additional PCB area or copper plane to  
act as a heat sink.  
DIFFERENTIAL AMPLIFIER EXPLANATION  
As logic supply voltages continue to shrink, designers are increasingly turning to differential analog signal  
handling to preserve signal to noise ratios with restricted voltage swing. The LM4670 is a fully differential  
amplifier that features differential input and output stages. A differential amplifier amplifies the difference between  
the two input signals. Traditional audio power amplifiers have typically offered only single-ended inputs resulting  
in a 6dB reduction in signal to noise ratio relative to differential inputs. The LM4670 also offers the possibility of  
DC input coupling which eliminates the two external AC coupling, DC blocking capacitors. The LM4670 can be  
used, however, as a single ended input amplifier while still retaining it's fully differential benefits. In fact,  
completely unrelated signals may be placed on the input pins. The LM4670 simply amplifies the difference  
between the signals. A major benefit of a differential amplifier is the improved common mode rejection ratio  
(CMRR) over single input amplifiers. The common-mode rejection characteristic of the differential amplifier  
reduces sensitivity to ground offset related noise injection, especially important in high noise applications.  
PCB LAYOUT CONSIDERATIONS  
As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load and  
power supply create a voltage drop. The voltage loss on the traces between the LM4670 and the load results is  
lower output power and decreased efficiency. Higher trace resistance between the supply and the LM4670 has  
the same effect as a poorly regulated supply, increase ripple on the supply line also reducing the peak output  
power. The effects of residual trace resistance increases as output current increases due to higher output power,  
decreased load impedance or both. To maintain the highest output voltage swing and corresponding peak output  
power, the PCB traces that connect the output pins to the load and the supply pins to the power supply should  
be as wide as possible to minimize trace resistance.  
The use of power and ground planes will give the best THD+N performance. While reducing trace resistance, the  
use of power planes also creates parasite capacitors that help to filter the power supply line.  
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The rising and falling edges are necessarily short in relation to the minimum pulse width (350ns), having  
approximately 16ns rise and fall times, typical, depending on parasitic output capacitance. The inductive nature  
of the transducer load can also result in overshoot on one or both edges, clamped by the parasitic diodes to  
GND and VDD in each case. From an EMI standpoint, this is an aggressive waveform that can radiate or conduct  
to other components in the system and cause interference. It is essential to keep the power and output traces  
short and well shielded if possible. Use of ground planes, beads, and micro-strip layout techniques are all useful  
in preventing unwanted interference.  
As the distance from the LM4670 and the speaker increase, the amount of EMI radiation will increase since the  
output wires or traces acting as antenna become more efficient with length. What is acceptable EMI is highly  
application specific. Ferrite chip inductors placed close to the LM4670 may be needed to reduce EMI radiation.  
The value of the ferrite chip is very application specific.  
POWER SUPPLY BYPASSING  
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply  
rejection ratio (PSRR). The capacitor (CS) location should be as close as possible to the LM4670. Typical  
applications employ a voltage regulator with a 10µF and a 0.1µF bypass capacitors that increase supply stability.  
These capacitors do not eliminate the need for bypassing on the supply pin of the LM4670. A 1µF tantalum  
capacitor is recommended.  
SHUTDOWN FUNCTION  
In order to reduce power consumption while not in use, the LM4670 contains shutdown circuitry that reduces  
current draw to less than 0.01µA. The trigger point for shutdown is shown as a typical value in Electrical  
Characteristics and in the Shutdown Hysteresis Voltage graphs found in Typical Performance Characteristics. It  
is best to switch between ground and supply for minimum current usage while in the shutdown state. While the  
LM4670 may be disabled with shutdown voltages in between ground and supply, the idle current will be greater  
than the typical 0.01µA value. Increased THD may also be observed with voltages less than VDD on the  
Shutdown pin when in PLAY mode.  
The LM4670 has an internal resistor connected between GND and Shutdown pins. The purpose of this resistor is  
to eliminate any unwanted state changes when the Shutdown pin is floating. The LM4670 will enter the shutdown  
state when the Shutdown pin is left floating or if not floating, when the shutdown voltage has crossed the  
threshold. To minimize the supply current while in the shutdown state, the Shutdown pin should be driven to  
GND or left floating. If the Shutdown pin is not driven to GND, the amount of additional resistor current due to the  
internal shutdown resistor can be found by Equation 1.  
(VSD - GND) / 300kΩ  
(1)  
With only a 0.5V difference, an additional 1.7µA of current will be drawn while in the shutdown state.  
PROPER SELECTION OF EXTERNAL COMPONENTS  
The gain of the LM4670 is set by the external resistors, Ri in Figure 1, The Gain is given by Equation 2. Best  
THD+N performance is achieved with a gain of 2V/V (6dB).  
AV = 2 * 150 k/ Ri (V/V)  
(2)  
It is recommended that resistors with 1% tolerance or better be used to set the gain of the LM4670. The Ri  
resistors should be placed close to the input pins of the LM4670. Keeping the input traces close to each other  
and of the same length in a high noise environment will aid in noise rejection due to the good CMRR of the  
LM4670. Noise coupled onto input traces which are physically close to each other will be common mode and  
easily rejected by the LM4670.  
Input capacitors may be needed for some applications or when the source is single-ended (see Figure 27 and  
Figure 29). Input capacitors are needed to block any DC voltage at the source so that the DC voltage seen  
between the input terminals of the LM4670 is 0V. Input capacitors create a high-pass filter with the input  
resistors, Ri. The –3dB point of the high-pass filter is found using Equation 3.  
fC = 1 / (2πRi Ci ) (Hz)  
(3)  
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The input capacitors may also be used to remove low audio frequencies. Small speakers cannot reproduce low  
bass frequencies so filtering may be desired . When the LM4670 is using a single-ended source, power supply  
noise on the ground is seen as an input signal by the +IN input pin that is capacitor coupled to ground (see  
Figure 29 to Figure 31). Setting the high-pass filter point above the power supply noise frequencies, 217Hz in a  
GSM phone, for example, will filter out this noise so it is not amplified and heard on the output. Capacitors with a  
tolerance of 10% or better are recommended for impedance matching.  
DIFFERENTIAL CIRCUIT CONFIGURATIONS  
The LM4670 can be used in many different circuit configurations. The simplest and best performing is the DC  
coupled, differential input configuration shown in Figure 26. Equation 2 above is used to determine the value of  
the Ri resistors for a desired gain.  
Input capacitors can be used in a differential configuration as shown in Figure 27. Equation 3 above is used to  
determine the value of the Ci capacitors for a desired frequency response due to the high-pass filter created by  
Ci and Ri. Equation 2 above is used to determine the value of the Ri resistors for a desired gain  
The LM4670 can be used to amplify more than one audio source. Figure 28 shows a dual differential input  
configuration. The gain for each input can be independently set for maximum design flexibility using the Ri  
resistors for each input and Equation 2. Input capacitors can be used with one or more sources as well to have  
different frequency responses depending on the source or if a DC voltage needs to be blocked from a source.  
SINGLE-ENDED CIRCUIT CONFIGURATIONS  
The LM4670 can also be used with single-ended sources but input capacitors will be needed to block any DC at  
the input terminals. Figure 29 shows the typical single-ended application configuration. The equations for Gain,  
Equation 2, and frequency response, Equation 3, hold for the single-ended configuration as shown in Figure 29.  
When using more than one single-ended source as shown in Figure 30, the impedance seen from each input  
terminal should be equal. To find the correct values for Ci3 and Ri3 connected to the +IN input pin the equivalent  
impedance of all the single-ended sources are calculated. The single-ended sources are in parallel to each other.  
The equivalent capacitor and resistor, Ci3 and Ri3, are found by calculating the parallel combination of all  
Civalues and then all Ri values. Equation 4 and Equation 5 below are for any number of single-ended sources.  
Ci3 = Ci1 + Ci2 + Cin ... (F)  
(4)  
(5)  
Ri3 = 1 / (1/Ri1 + 1/Ri2 + 1/Rin ...) ()  
The LM4670 may also use a combination of single-ended and differential sources. A typical application with one  
single-ended source and one differential source is shown in Figure 31. Using the principle of superposition, the  
external component values can be determined with the above equations corresponding to the configuration.  
Figure 26. Differential input configuration  
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Figure 27. Differential input configuration with input capacitors  
Figure 28. Dual differential input configuration  
Figure 29. Single-ended input configuration  
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Figure 30. Dual single-ended input configuration  
Figure 31. Dual input with a single-ended input and a differential input  
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SNAS240C DECEMBER 2004REVISED MAY 2013  
REFERENCE DESIGN BOARD SCHEMATIC  
Figure 32. Reference Design Board Schematic  
In addition to the minimal parts required for the application circuit, a measurement filter is provided on the  
evaluation circuit board so that conventional audio measurements can be conveniently made without additional  
equipment. This is a balanced input, grounded differential output low pass filter with a 3dB frequency of  
approximately 35kHz and an on board termination resistor of 300(see Figure 32). Note that the capacitive load  
elements are returned to ground. This is not optimal for common mode rejection purposes, but due to the  
independent pulse format at each output there is a significant amount of high frequency common mode  
component on the outputs. The grounded capacitive filter elements attenuate this component at the board to  
reduce the high frequency CMRR requirement placed on the analysis instruments.  
Even with the grounded filter the audio signal is still differential, necessitating a differential input on any analysis  
instrument connected to it. Most lab instruments that feature BNC connectors on their inputs are NOT differential  
responding because the ring of the BNC is usually grounded.  
The commonly used Audio Precision analyzer is differential, but its ability to accurately reject fast pulses of  
350ns width is questionable necessitating the on board measurement filter. When in doubt or when the signal  
needs to be single-ended, use an audio signal transformer to convert the differential output to a single ended  
output. Depending on the audio transformer's characteristics, there may be some attenuation of the audio signal  
which needs to be taken into account for correct measurement of performance.  
Measurements made at the output of the measurement filter suffer attenuation relative to the primary, unfiltered  
outputs even at audio frequencies. This is due to the resistance of the inductors interacting with the termination  
resistor (300) and is typically about -0.25dB (3%). In other words, the voltage levels (and corresponding power  
levels) indicated through the measurement filter are slightly lower than those that actually occur at the load  
placed on the unfiltered outputs. This small loss in the filter for measurement gives a lower output power reading  
than what is really occurring on the unfiltered outputs and its load.  
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LM4670 DSBGA BOARD ARTWORK  
Figure 33. Composite View  
Figure 34. Silk Screen  
Figure 35. Top Layer  
Figure 36. Internal Layer 1, GND  
Figure 37. Internal Layer 2, VDD  
Figure 38. Bottom Layer  
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LM4670 WSON BOARD ARTWORK  
Figure 39. Composite View  
Figure 40. Silk Screen  
Figure 41. Top Layer  
Figure 42. Internal Layer 1, GND  
Figure 43. Internal Layer 2, VDD  
Revision History  
Figure 44. Bottom Layer  
Rev  
1.0  
1.1  
Date  
Description  
12/15/04  
7/06/05  
Initial WEB of the D/S (TL pkg).  
Re-released D/S to the WEB (added the SD  
package).  
1.2  
C
7/13/06  
5/02/13  
Edited Note 9, then re-released D/S to the  
WEB.  
Changed layout of National Data Sheet to TI  
format  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2013  
PACKAGING INFORMATION  
Orderable Device  
LM4670ITL/NOPB  
LM4670ITLX/NOPB  
LM4670SD/NOPB  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-40 to 85  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
DSBGA  
DSBGA  
WSON  
YZR  
9
9
8
250  
Green (RoHS  
& no Sb/Br)  
SNAGCU  
SNAGCU  
Call TI  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
G
E6  
ACTIVE  
ACTIVE  
YZR  
3000  
1000  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
G
E6  
NGQ  
Green (RoHS  
& no Sb/Br)  
-40 to 85  
L4670  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
26-Aug-2013  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Aug-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM4670ITL/NOPB  
LM4670ITLX/NOPB  
LM4670SD/NOPB  
DSBGA  
DSBGA  
WSON  
YZR  
YZR  
NGQ  
9
9
8
250  
3000  
1000  
178.0  
178.0  
178.0  
8.4  
8.4  
1.57  
1.57  
3.3  
1.57  
1.57  
3.3  
0.76  
0.76  
1.0  
4.0  
4.0  
8.0  
8.0  
8.0  
Q1  
Q1  
Q1  
12.4  
12.0  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Aug-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
LM4670ITL/NOPB  
LM4670ITLX/NOPB  
LM4670SD/NOPB  
DSBGA  
DSBGA  
WSON  
YZR  
YZR  
NGQ  
9
9
8
250  
3000  
1000  
210.0  
210.0  
210.0  
185.0  
185.0  
185.0  
35.0  
35.0  
35.0  
Pack Materials-Page 2  
MECHANICAL DATA  
NGQ0008A  
SDA08A (Rev A)  
www.ti.com  
MECHANICAL DATA  
YZR0009xxx  
D
0.600±0.075  
E
TLA09XXX (Rev C)  
D: Max = 1.514 mm, Min =1.454 mm  
E: Max = 1.489 mm, Min =1.428 mm  
4215046/A  
12/12  
A. All linear dimensions are in millimeters. Dimensioning and tolerancing per ASME Y14.5M-1994.  
B. This drawing is subject to change without notice.  
NOTES:  
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