LM4666 [TI]

Filterless High Efficiency Stereo 1.2W Switching;
LM4666
型号: LM4666
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Filterless High Efficiency Stereo 1.2W Switching

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LM4666, LM4666SDBD  
www.ti.com  
SNAS189A MAY 2004REVISED MAY 2013  
LM4666  
Filterless High Efficiency Stereo 1.2W Switching  
Audio Amplifier  
Check for Samples: LM4666, LM4666SDBD  
1
FEATURES  
DESCRIPTION  
The LM4666 is a fully integrated single-supply high  
2
No Output Filter Required for Inductive  
Transducers  
efficiency switching audio amplifier. It features an  
innovative modulator that eliminates the LC output  
filter used with typical switching amplifiers.  
Eliminating the output filter reduces parts count,  
simplifies circuit design, and reduces board area. The  
LM4666 processes analog inputs with a delta-sigma  
modulation technique that lowers output noise and  
THD when compared to conventional pulse width  
modulators.  
Selectable Gain of 6dB or 12dB  
Very Fast Turn On Time: 6ms (typ)  
Minimum External Components  
"Click and Pop" Suppression Circuitry  
Micro-Power Shutdown Mode  
Short Circuit Protection  
Available in Space-Saving NHK0014A Package  
The LM4666 is designed to meet the demands of  
mobile phones and other portable communication  
devices. Operating on a single 3V supply, it is  
APPLICATIONS  
capable of driving 8transducer loads at  
a
Mobile Phones  
PDAs  
continuous average output of 450mW with less than  
1%THD+N. Its flexible power supply requirements  
allow operation from 2.8V to 5.5V.  
Portable Electronic Devices  
The LM4666 has high efficiency with an 8Ω  
transducer load compared to a typical Class AB  
amplifier. With a 3V supply, the IC's efficiency for a  
100mW power level is 79%, reaching 84% at 450mW  
output power.  
KEY SPECIFICATIONS  
Efficiency at 3V, 100mW into 8Transducer:  
79% (typ)  
Efficiency at 3V, 450mW into 8Transducer:  
84% (typ)  
The LM4666 features a low-power consumption  
shutdown mode. Shutdown may be enabled by  
driving the Shutdown pin to a logic low (GND).  
Efficiency at 5V, 1W into 8Transducer: 85%  
(typ)  
The LM4666 has fixed selectable gain of either 6dB  
or 12dB. The LM4666 has short circuit protection  
against a short from the outputs to VDD or GND.  
Total Quiescent Power Supply Current: 7.0mA  
(typ)  
Total Shutdown Power Supply Current: 0.02µA  
(typ)  
Single supply range: 2.8V to 5.5V  
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
2
All trademarks are the property of their respective owners.  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of the Texas  
Instruments standard warranty. Production processing does not  
necessarily include testing of all parameters.  
Copyright © 2004–2013, Texas Instruments Incorporated  
LM4666, LM4666SDBD  
SNAS189A MAY 2004REVISED MAY 2013  
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Typical Application  
Figure 1. Typical Audio Amplifier Application Circuit  
Connection Diagram  
Top View  
Figure 2. WSON Package  
See Package Number NHK0014A  
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These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam  
during storage or handling to prevent electrostatic damage to the MOS gates.  
Absolute Maximum Ratings(1)(2)(3)  
Supply Voltage(1)  
6.0V  
Storage Temperature  
65°C to +150°C  
Voltage at Any Input Pin  
Power Dissipation(4)  
ESD Susceptibility, pins 4, 7, 11, 14(5)  
ESD Susceptibility, all other pins(5)  
ESD Susceptibility(6)  
VDD + 0.3V V GND - 0.3V  
Internally Limited  
1kV  
2.0kV  
200V  
Junction Temperature (TJ)  
150°C  
θJA (NHK0014A)  
θJC (NHK0014A)  
63°C/W  
12°C/W  
Thermal Resistance  
Soldering Information: See AN-1112 (SNVA009) "microSMD Wafers Level Chip Scale Package."  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and  
specifications.  
(4) The maximum power dissipation must be derated at elevated temperatures and is dictated by TJMAX, θJA, and the ambient temperature  
TA. The maximum allowable power dissipation is PDMAX = (TJMAX–TA)/θJA or the number given in Absolute Maximum Ratings, whichever  
is lower. For the LM4666, TJMAX = 150°C. The typical θJA is 63°C/W and the typical θJC is 12°C/W for the NHK0014A package.  
(5) Human body model, 100pF discharged through a 1.5kresistor.  
(6) Machine Model, 220pF – 240pF discharged through all pins.  
Operating Ratings(1)(2)  
Temperature Range  
TMIN TA TMAX  
40°C TA 85°C  
2.8V VDD 5.5V  
Supply Voltage  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
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Electrical Characteristics VDD = 5V(1)(2)  
The following specifications apply for VDD = 5V and RL = 15µH + 8+ 15µH unless otherwise specified. Limits apply for TA =  
25°C.  
LM4666  
Limit(4)(5)  
Units  
(Limits)  
Parameter  
Test Conditions  
VIN = 0V, No Load  
Typ(3)  
IDD  
Quiescent Power Supply Current  
15  
16  
mA  
mA  
VIN = 0V, RL = 15µH + 8+ 15µH  
ISD  
Shutdown Current  
VSD = GND(6)  
0.02  
1.2  
1.1  
1.2  
1.1  
6
µA  
V
VSDIH  
VSDIL  
VGSIH  
VGSIL  
AV  
Shutdown Voltage Input High  
Shutdown Voltage Input Low  
Gain Select Input High  
Gain Select Input Low  
Closed Loop Gain  
V
V
V
VGain Select = VDD  
VGain Select = GND  
dB  
dB  
mV  
ms  
AV  
Closed Loop Gain  
12  
10  
6
VOS  
TWU  
Output Offset Voltage  
Wake-up Time  
THD = 1% (max), f = 1kHz,  
22kHz BW  
Po  
Output Power  
1.2  
W
PO = 100mWRMS/Channel,  
fIN = 1kHz, 22kHz BW,  
Both channels in phase  
THD+N  
Total Harmonic Distortion+Noise  
0.65  
%
XTALK  
RIN  
Channel Separation  
PO = 100mWRMS, f = 1kHz  
VGain Select = VDD  
57  
90  
60  
dB  
kΩ  
kΩ  
Differential Input Resistance  
VGain Select = GND  
VRipple = 100mVRMS sine wave,  
fRIPPLE = 217Hz  
60  
dB  
Inputs terminated to AC GND  
PSRR  
CMRR  
Power Supply Rejection Ratio  
Common Mode Rejection Ratio  
VRipple = 100mVRMS sine wave,  
fRIPPLE = 217Hz  
POUT = 10mW,1kHz  
65  
48  
dB  
dB  
VRipple = 100mVRMS  
,
fRipple = 217Hz, Input referred  
PO = 1WRMS; A-Weighted Filter  
A-Weighted filter, Vin = 0V  
SNR  
Signal to Noise Ratio  
Output Noise  
83  
dB  
µV  
εOUT  
200  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) Typical specifications are specified at 25°C and represent the parametric norm.  
(4) Tested limits are specified to AOQL (Average Outgoing Quality Level).  
(5) Datasheet min/max specification limits are specified by design, test, or statistical analysis.  
(6) Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA. The  
Shutdown pin should be driven as close as possible to GND for minimal shutdown current and to VDD for the best THD performance in  
PLAY mode. See the Application Information section under SHUTDOWN FUNCTION for more information.  
4
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Electrical Characteristics VDD = 3V(1)(2)  
The following specifications apply for VDD = 3V and RL = 15µH + 8+ 15µH unless otherwise specified. Limits apply for TA =  
25°C.  
LM4666  
Limit(4)(5)  
Units  
(Limits)  
Parameter  
Test Conditions  
VIN = 0V, No Load  
Typ(3)  
IDD  
Quiescent Power Supply Current  
6.5  
7.0  
10  
mA (max)  
VIN = 0V, RL = 15µH + 8+ 15µH  
ISD  
Shutdown Current  
VSD = GND(6)  
0.02  
1.0  
0.8  
1.0  
0.8  
2.0  
1.4  
0.4  
1.4  
0.4  
µA (max)  
V (min)  
V (max)  
V (min)  
V (max)  
VSDIH  
VSDIL  
VGSIH  
VGSIL  
Shutdown Voltage Input High  
Shutdown Voltage Input Low  
Gain Select Input High  
Gain Select Input Low  
5.25  
6.75  
dB (min)  
dB (max)  
AV  
AV  
Closed Loop Gain  
Closed Loop Gain  
VGain Select = VDD  
VGain Select = GND  
6
11.25  
12.75  
dB (min)  
dB (max)  
12  
VOS  
TWU  
Output Offset Voltage  
Wake-up Time  
10  
6
35  
mV (max)  
ms  
THD = 1% (max); f = 1kHz,  
22kHz BW  
Po  
Output Power  
450  
400  
mW (min)  
PO = 100mWRMS/Channel,  
fIN = 1kHz, 22kHz BW,  
Both channels in phase  
THD+N  
Total Harmonic Distortion+Noise  
0.65  
%
XTALK  
RIN  
Channel Separation  
PO = 100mWRMS, f = 1kHz  
VGain Select = VDD  
57  
90  
60  
dB  
kΩ  
kΩ  
Differential Input Resistance  
VGain Select = GND  
Vripple = 100mVRMS sine wave,  
fRIPPLE = 217Hz,  
60  
dB  
Inputs terminated to AC GND  
PSRR  
CMRR  
Power Supply Rejection Ratio  
Common Mode Rejection Ratio  
VRipple = 100mVRMS sine wave,  
fRIPPLE = 217Hz,  
POUT = 10mW,1kHz  
65  
48  
dB  
dB  
VRipple = 100mVRMS  
,
fRipple = 217Hz, Input referred  
PO = 400mWRMS, A-Weighted Filter  
A-Weighted filter, Vin = 0V  
SNR  
Signal to Noise Ratio  
Output Noise  
83  
dB  
µV  
εOUT  
125  
(1) All voltages are measured with respect to the ground pin, unless otherwise specified.  
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for  
which the device is functional, but do not ensure specific performance limits. Electrical Characteristics state DC and AC electrical  
specifications under particular test conditions which ensure specific performance limits. This assumes that the device is within the  
Operating Ratings. Specifications are not specified for parameters where no limit is given, however, the typical value is a good indication  
of device performance.  
(3) Typical specifications are specified at 25°C and represent the parametric norm.  
(4) Tested limits are specified to AOQL (Average Outgoing Quality Level).  
(5) Datasheet min/max specification limits are specified by design, test, or statistical analysis.  
(6) Shutdown current is measured in a normal room environment. Exposure to direct sunlight will increase ISD by a maximum of 2µA. The  
Shutdown pin should be driven as close as possible to GND for minimal shutdown current and to VDD for the best THD performance in  
PLAY mode. See the Application Information section under SHUTDOWN FUNCTION for more information.  
External Components Description  
(Figure 1)  
Components  
Functional Description  
1.  
CS  
Supply bypass capacitor which provides power supply filtering. Refer to the POWER SUPPLY BYPASSING section  
for information concerning proper placement and selection of the supply bypass capacitor.  
2.  
CI  
Input AC coupling capacitor which blocks the DC voltage at the amplifier's input terminals.  
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Typical Performance Characteristics(1)  
THD+N vs Frequency  
THD+N vs Frequency  
VDD = 3V, RL = 15µH + 8+ 15µH  
POUT = 100mW/Channel, 30kHz BW  
VDD = 5V, RL = 15µH + 8+ 15µH  
POUT = 100mW/Channel, 30kHz BW  
Figure 3.  
Figure 4.  
THD+N vs Frequency  
VDD = 3V, RL = 15µH + 4+ 15µH  
POUT = 100mW/Channel, 30kHz BW  
THD+N vs Output Power/Channel  
VDD = 5V, RL = 15µH + 8+ 15µH  
f = 1kHz, 22kHz BW  
Figure 5.  
Figure 6.  
THD+N vs Output Power/Channel  
VDD = 3V, RL = 15µH + 4+ 15µH  
f = 1kHz, 22kHz BW  
THD+N vs Output Power/Channel  
VDD = 3V, RL = 15µH + 8+ 15µH  
f = 1kHz, 22kHz BW  
Figure 7.  
Figure 8.  
(1) The performance graphs were taken using the Audio Precision AUX–0025 Switching Amplifier Measurement Filter in series with the LC  
filter on the demo board.  
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Typical Performance Characteristics(1) (continued)  
CMRR vs Frequency  
VDD = 5V, RL = 15µH + 8+ 15µH  
VCM = 100mVRMS Sine Wave, 30kHz BW  
CMRR vs Frequency  
VDD = 3V, RL = 15µH + 8+ 15µH  
VCM = 100mVRMS Sine Wave, 30kHz BW  
Figure 9.  
Figure 10.  
PSRR vs Frequency  
VDD = 5V, RL = 15µH + 8+ 15µH  
VRipple = 100mVRMS Sine Wave, 22kHz BW  
PSRR vs Frequency  
VDD = 3V, RL = 15µH + 8+ 15µH  
VRipple = 100mVRMS Sine Wave, 22kHz BW  
Figure 11.  
Figure 12.  
Efficiency and Power Dissipation  
vs Output Power  
VDD = 5V, RL = 15µH + 8+ 15µH, f = 1kHz, THD 1%  
Efficiency and Power Dissipation  
vs Output Power  
VDD = 3V, RL = 15µH + 8+ 15µH, f = 1kHz, THD 1%  
Figure 13.  
Figure 14.  
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Typical Performance Characteristics(1) (continued)  
Efficiency and Power Dissipation  
vs Output Power  
Gain Select Threshold  
VDD = 3V  
VDD = 3V, RL = 15µH + 4+ 15µH, f = 1kHz, THD 1%  
Figure 15.  
Figure 16.  
Gain Select Threshold  
vs Supply Voltage  
RL = 15µH + 8+ 15µH  
Gain Select Threshold  
VDD = 5V  
Figure 17.  
Figure 18.  
Output Power/Channel vs Supply Voltage  
RL = 15µH + 8+ 15µH, f = 1kHz  
22kHz BW  
Output Power/Channel vs Supply Voltage  
RL = 15µH + 4+ 15µH, f = 1kHz  
22kHz BW  
Figure 19.  
Figure 20.  
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Typical Performance Characteristics(1) (continued)  
Shutdown Threshold  
VDD = 5V  
Shutdown Threshold  
VDD = 3V  
Figure 21.  
Figure 22.  
Shutdown Threshold vs Supply Voltage  
RL = 15µH + 8+ 15µH  
Figure 23.  
Supply Current vs Shutdown Voltage  
Supply Current vs Supply Voltage  
RL = 15µH + 8+ 15µH  
RL = 15µH + 8+ 15µH  
Figure 24.  
Figure 25.  
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APPLICATION INFORMATION  
GENERAL AMPLIFIER FUNCTION  
The output signals generated by the LM4666 consist of two, BTL connected, output signals that pulse  
momentarily from near ground potential to VDD on each channel. The two outputs on a given channel can pulse  
independently with the exception that they both may never pulse simultaneously as this would result in zero volts  
across the BTL connected load. The minimum width of each pulse is approximately 160ns. However, pulses on  
the same output can occur sequentially, in which case they are concatenated and appear as a single wider pulse  
to achieve an effective 100% duty cycle. This results in maximum audio output power for a given supply voltage  
and load impedance. The LM4666 can achieve much higher efficiencies than class AB amplifiers while  
maintaining acceptable THD performance.  
The short (160ns) drive pulses emitted at the LM4666 outputs means that good efficiency can be obtained with  
minimal load inductance. The typical transducer load on an audio amplifier is quite reactive (inductive). For this  
reason, the load can act as it's own filter, so to speak. This "filter-less" switching amplifier/transducer load  
combination is much more attractive economically due to savings in board space and external component cost  
by eliminating the need for a filter.  
POWER DISSIPATION AND EFFICIENCY  
In general terms, efficiency is considered to be the ratio of useful work output divided by the total energy required  
to produce it with the difference being the power dissipated, typically, in the IC. The key here is “useful” work. For  
audio systems, the energy delivered in the audible bands is considered useful including the distortion products of  
the input signal. Sub-sonic (DC) and super-sonic components (>22kHz) are not useful. The difference between  
the power flowing from the power supply and the audio band power being transduced is dissipated in the  
LM4666 and in the transducer load. The amount of power dissipation in the LM4666 is very low. This is because  
the ON resistance of the switches used to form the output waveforms is typically less than 0.25. This leaves  
only the transducer load as a potential "sink" for the small excess of input power over audio band output power.  
The LM4666 dissipates only a fraction of the excess power requiring no additional PCB area or copper plane to  
act as a heat sink.  
DIFFERENTIAL AMPLIFIER EXPLANATION  
As logic supply voltages continue to shrink, designers are increasingly turning to differential analog signal  
handling to preserve signal to noise ratios with restricted voltage swing. The LM4666 is a fully differential  
amplifier that features differential input and output stages. A differential amplifier amplifies the difference between  
the two input signals. Traditional audio power amplifiers have typically offered only single-ended inputs resulting  
in a 6dB reduction in signal to noise ratio relative to differential inputs. The LM4666 also offers the possibility of  
DC input coupling which eliminates the two external AC coupling, DC blocking capacitors. The LM4666 can be  
used, however, as a single ended input amplifier while still retaining it's fully differential benefits. In fact,  
completely unrelated signals may be placed on the input pins. The LM4666 simply amplifies the difference  
between the signals. A major benefit of a differential amplifier is the improved common mode rejection ratio  
(CMRR) over single input amplifiers. The common-mode rejection characteristic of the differential amplifier  
reduces sensitivity to ground offset related noise injection, especially important in high noise applications.  
PCB LAYOUT CONSIDERATIONS  
As output power increases, interconnect resistance (PCB traces and wires) between the amplifier, load and  
power supply create a voltage drop. The voltage loss on the traces between the LM4666 and the load results is  
lower output power and decreased efficiency. Higher trace resistance between the supply and the LM4666 has  
the same effect as a poorly regulated supply, increase ripple on the supply line also reducing the peak output  
power. The effects of residual trace resistance increases as output current increases due to higher output power,  
decreased load impedance or both. To maintain the highest output voltage swing and corresponding peak output  
power, the PCB traces that connect the output pins to the load and the supply pins to the power supply should  
be as wide as possible to minimize trace resistance.  
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The rising and falling edges are necessarily short in relation to the minimum pulse width (160ns), having  
approximately 2ns rise and fall times, typical, depending on parasitic output capacitance. The inductive nature of  
the transducer load can also result in overshoot on one or both edges, clamped by the parasitic diodes to GND  
and VDD in each case. From an EMI standpoint, this is an aggressive waveform that can radiate or conduct to  
other components in the system and cause interference. It is essential to keep the power and output traces short  
and well shielded if possible. Use of ground planes, beads, and micro-strip layout techniques are all useful in  
preventing unwanted interference.  
As the distance from the LM4666 and the speakers increase the amount of EMI radiation will increase since the  
output wires or traces acting as antenna become more efficient with length. What is acceptable EMI is highly  
application specific. Ferrite chip inductors placed close to the LM4666 may be needed to reduce EMI radiation.  
The value of the ferrite chip is very application specific.  
POWER SUPPLY BYPASSING  
As with any power amplifier, proper supply bypassing is critical for low noise performance and high power supply  
rejection ratio (PSRR). The capacitor (CS) location should be as close as possible to the LM4666. Typical  
applications employ a voltage regulator with a 10µF and a 0.1µF bypass capacitors that increase supply stability.  
These capacitors do not eliminate the need for bypassing on the supply pin of the LM4666. A 1µF tantalum  
capacitor is recommended.  
SHUTDOWN FUNCTION  
In order to reduce power consumption while not in use, the LM4666 contains shutdown circuitry that reduces  
current draw to less than 0.01µA. The trigger point for shutdown is shown as a typical value in the Electrical  
Characteristics Tables and in the Shutdown Hysteresis Voltage graphs found in the Typical Performance  
Characteristics section. It is best to switch between ground and supply for minimum current usage while in the  
shutdown state. While the LM4666 may be disabled with shutdown voltages in between ground and supply, the  
idle current will be greater than the typical value. Increased THD may also be observed with voltages less than  
VDD on the Shutdown pin when in PLAY mode.  
The LM4666 has an internal resistor connected between GND and Shutdown pins. The purpose of this resistor is  
to eliminate any unwanted state changes when the Shutdown pin is floating. The LM4666 will enter the shutdown  
state when the Shutdown pin is left floating or if not floating, when the shutdown voltage has crossed the  
threshold. To minimize the supply current while in the shutdown state, the Shutdown pin should be driven to  
GND or left floating. If the Shutdown pin is not driven to GND, the amount of additional resistor current due to the  
internal shutdown resistor can be found by Equation 1 below.  
(VSD - GND) / 60kΩ  
(1)  
With only a 0.5V difference, an additional 8.3µA of current will be drawn while in the shutdown state.  
GAIN SELECTION FUNCTION  
The LM4666 has fixed selectable gain to minimize external components, increase flexibility and simplify design.  
For a differential gain of 6dB, the Gain Select pin should be permanently connected to VDD or driven to a logic  
high level. For a differential gain of 12dB, the Gain Select pin should be permanently connected to GND or driven  
to a logic low level. The gain of the LM4666 can be switched while the amplifier is in PLAY mode driving a load  
with a signal without damage to the IC. The voltage on the Gain Select pin should be switched quickly between  
GND (logic low) and VDD (logic high) to eliminate any possible audible artifacts from appearing at the output. For  
typical threshold voltages for the Gain Select function, refer to the Gain Threshold Voltages graph in the Typical  
Performance Characteristics section.  
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CIRCUIT CONFIGURATIONS  
Figure 26. Single-Ended Input with Low Gain Selection Configuration  
Figure 27. Differential Input with Low Gain Selection Configuration  
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REFERENCE DESIGN BOARD SCHEMATIC  
Figure 28.  
In addition to the minimal parts required for the application circuit, a measurement filter is provided on the  
evaluation circuit board so that conventional audio measurements can be conveniently made without additional  
equipment. This is a balanced input, grounded differential output low pass filter with a 3dB frequency of  
approximately 35kHz and an on board termination resistor of 300(see Figure 28). Note that the capacitive load  
elements are returned to ground. This is not optimal for common mode rejection purposes, but due to the  
independent pulse format at each output there is a significant amount of high frequency common mode  
component on the outputs. The grounded capacitive filter elements attenuate this component at the board to  
reduce the high frequency CMRR requirement placed on the analysis instruments.  
Even with the grounded filter the audio signal is still differential necessitating a differential input on any analysis  
instrument connected to it. Most lab instruments that feature BNC connectors on their inputs are NOT differential  
responding because the ring of the BNC is usually grounded.  
The commonly used Audio Precision analyzer is differential but its ability to accurately reject fast pulses of 160ns  
width is questionable necessitating the on board measurement filter. When the signal needs to be single-ended,  
use an audio signal transformer to convert the differential output to a single ended output. Depending on the  
audio transformer's characteristics, there may be some attenuation of the audio signal which needs to be taken  
into account for correct measurement of performance.  
Measurements made at the output of the measurement filter suffer attenuation relative to the primary, unfiltered  
outputs even at audio frequencies. This is due to the resistance of the inductors interacting with the termination  
resistor (300) and is typically about -0.35dB (4%). In other words, the voltage levels and corresponding power  
levels indicated through the measurement filter are slightly lower than those that actually occur at the load placed  
on the unfiltered outputs. This small loss in the filter for measurement gives a lower output power reading than  
what is really occurring on the unfiltered outputs and its load.  
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SNAS189A MAY 2004REVISED MAY 2013  
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The AUX-0025 Switching Amplifier Measurement Filter from Audio Precision may be used instead of the on  
board measurement filter. The AUX-0025 filter should be connected to the high current direct outputs on the  
evaluation board and in series with the measurement equipment. Attaching oscilloscope probes on the outputs of  
the AUX-0025 filter will display the audio waveforms. The AUX-0025 filter may also be connected to the on board  
filter without any adverse effects.  
LM4666 NHK0014A BOARD ARTWORK  
Figure 29. Composite View  
Figure 30. Silk Screen  
14  
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LM4666, LM4666SDBD  
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SNAS189A MAY 2004REVISED MAY 2013  
Figure 31. Top Layer  
Figure 32. Internal Layer 1, GND  
Copyright © 2004–2013, Texas Instruments Incorporated  
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SNAS189A MAY 2004REVISED MAY 2013  
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Figure 33. Internal Layer 2, VDD  
Figure 34. Bottom Layer  
16  
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SNAS189A MAY 2004REVISED MAY 2013  
REVISION HISTORY  
Changes from Original (May 2013) to Revision A  
Page  
Changed layout of National Data Sheet to TI format .......................................................................................................... 16  
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PACKAGE OPTION ADDENDUM  
www.ti.com  
9-Aug-2013  
PACKAGING INFORMATION  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
LM4666SD/NOPB  
ACTIVE  
WSON  
NHK  
14  
1000  
Green (RoHS  
& no Sb/Br)  
CU SN  
Level-1-260C-UNLIM  
-40 to 85  
L4666  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Aug-2013  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
LM4666SD/NOPB  
WSON  
NHK  
14  
1000  
178.0  
12.4  
3.3  
4.3  
1.0  
8.0  
12.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
12-Aug-2013  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
WSON NHK 14  
SPQ  
Length (mm) Width (mm) Height (mm)  
210.0 185.0 35.0  
LM4666SD/NOPB  
1000  
Pack Materials-Page 2  
MECHANICAL DATA  
NHK0014A  
SDA14A (Rev A)  
www.ti.com  
IMPORTANT NOTICE  
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