LM385BYM-1.2/NOPB [TI]
LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode; LM185-1.2 -N / LM285-1.2 -N / LM385-1.2 -N微功耗电压基准二极管
| 型号： | LM385BYM-1.2/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode |
| 文件： | 总23页 (文件大小：1210K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E –JANUARY 2000–REVISED APRIL 2013
LM185-1.2-N/LM285-1.2-N/LM385-1.2-N Micropower Voltage Reference Diode
Check for Samples: LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
Careful design of the LM185-1.2-N has made the
1
FEATURES
device exceptionally tolerant of capacitive loading,
making it easy to use in almost any reference
application. The wide dynamic operating range allows
its use with widely varying supplies with excellent
regulation.
2
•
±1% and 2% Initial Tolerance
Operating Current of 10μA to 20mA
1Ω Dynamic Impedance
•
•
•
•
•
Low Temperature Coefficient
Low Voltage Reference—1.235V
The extremely low power drain of the LM185-1.2-N
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life.
2.5V Device and Adjustable Device Also
Available
•
LM185-2.5 Series and LM185 Series,
respectively
Further, the wide operating current allows it to
replace older references with a tighter tolerance part.
DESCRIPTION
The LM185-1.2-N is rated for operation over a −55°C
to 125°C temperature range while the LM285-1.2-N is
rated −40°C to 85°C and the LM385-1.2-N 0°C to
70°C. The LM185-1.2-N/LM285-1.2-N are available in
a hermetic TO package and the LM285-1.2-N/LM385-
1.2-N are also available in a low-cost TO-92 molded
package, as well as SOIC and SOT-23.
The LM185-1.2-N/LM285-1.2-N/LM385-1.2-N are
micropower 2-terminal band-gap voltage regulator
diodes. Operating over a 10μA to 20mA current
range, they feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming is used to provide tight voltage tolerance.
Since the LM185-1.2-N band-gap reference uses only
transistors and resistors, low noise and good long
term stability result.
CONNECTION DIAGRAM
Figure 1. T0-92 Package (LP)
(Bottom View)
Figure 3. SOIC Package
* Pin 3 is attached to the Die Attach Pad
(DAP) and should be connected to Pin 2 or
left floating.
Figure 2. SOT-23
Figure 4. TO Package (NDV)
(Bottom View)
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2000–2013, Texas Instruments Incorporated
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
www.ti.com
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)(3)
Reverse Current
Forward Current
Operating Temperature Range
LM185-1.2-N
30mA
10mA
(4)
−55°C to +125°C
−40°C to +85°C
0°C to 70°C
LM285-1.2-N
LM385-1.2-N
(5)
ESD Susceptibility
2kV
Storage Temperature
Soldering Information
TO-92 package: 10 sec.
TO package:10 sec.
SOIC and SOT-23 Pkg.
Vapor phase (60 sec.)
Infrared (15 sec.)
−55°C to +150°C
260°C
300°C
215°C
220°C
See AN-450 “Surface Mounting Methods and Their Effect on Product Reliability” for other methods of soldering surface mount devices.
(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional. For specifications and test conditions, see the Electrical Characteristics. The specifications
apply only for the test conditions listed.
(2) Refer to RETS185H-1.2 for military specifications.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, see Table 1.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
Table 1. TJ(max) for Elevated Temperature Operation
DEVICE
TJ(max) (°C)
150
LM185-1.2-N
LM285-1.2-N
LM385-1.2-N
125
100
2
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Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E –JANUARY 2000–REVISED APRIL 2013
ELECTRICAL CHARACTERISTICS(1)
LM185-1.2-N
LM185BX-1.2-N
LM185BY-1.2-N
LM285-1.2-N
LM385B-1.2-N
LM385BX-1.2-N
LM385-1.2-N
LM385BY-1.2-N
Units
Parameter
Conditions
Typ
LM285BX-1.2-N
LM285BY-1.2-N
(Limit)
Tested
Design
Limit
Tested
Limit
Design
Limit
Tested
Limit
Design
Limit
(2)
(4)
(2)
(4)
(2)
(4)
Limit
(3)
Reverse Breakdown
Voltage
TA = 25°C,
1.23
5
1.223
1.223
1.205
V(Min)
10μA ≤ IR ≤ 20mA
1.247
10
1.247
15
1.260
15
V(Max)
μA
Minimum Operating
Current
8
20
1.5
20
20
1.5
25
20
15
LM385M3-1.2-N
10
(Max)
mV
Reverse Breakdown
Voltage Change with
Current
10μA ≤ IR ≤ 1mA
1
1
1
1.5
(Max)
mV
1mA ≤ IR ≤ 20mA
10
20
20
25
(Max)
Ω
Reverse Dynamic
Impedance
IR = 100μA, f = 20Hz
1
Wideband Noise
(rms)
IR = 100μA,
60
20
μV
10Hz ≤ f ≤ 10kHz
IR = 100μA, T = 1000 Hr,
TA = 25°C ±0.1°C
IR = 100μA
Long Term Stability
ppm
Average Temperature
(5)
Coefficient
X Suffix
30
50
30
50
ppm/°C
ppm/°C
ppm/°C
(Max)
Y Suffix
All Others
150
150
150
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C.
(2) Production tested.
(3) A military RETS electrical specification is available on request.
(4) Specified by design. Not production tested. These limits are not used to calculate average outgoing quality levels.
(5) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX − TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
THERMAL CHARACTERISTICS
Thermal Resistance
TO-92
TO
SOIC
165°C/W
N/A
SOT-23
283°C/W
N/A
180°C/W (0.4″ leads)
170°C/W (0.125″ leads)
θJA (junction to ambient)
440°C/W
80°C/W
θJC (junction to case)
N/A
Copyright © 2000–2013, Texas Instruments Incorporated
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
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TYPICAL PERFORMANCE CHARACTERISTICS
Reverse Characteristics
Reverse Characteristics
Figure 5.
Figure 6.
Temperature Drift of 3
Representative Units
Forward Characteristics
Figure 7.
Figure 8.
Reverse Dynamic Impedance
Reverse Dynamic Impedance
Figure 9.
Figure 10.
4
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E –JANUARY 2000–REVISED APRIL 2013
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Noise Voltage
Filtered Output Noise
Figure 11.
Figure 12.
Response Time
Figure 13.
Copyright © 2000–2013, Texas Instruments Incorporated
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
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TYPICAL APPLICATIONS
Figure 14. Wide Input Range Reference
Figure 15. Micropower Reference from 9V Battery
Figure 16. Reference from 1.5V Battery
*IQ ≃ 30μA
Figure 17. Micropower* 5V Regulator
6
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E –JANUARY 2000–REVISED APRIL 2013
*IQ ≃20μA standby current
Figure 18. Micropower* 10V Reference
Figure 19.
Figure 20. Precision 1μA to 1mA Current Sources
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7
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
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METER THERMOMETERS
Calibration
1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1μA/°K
2. Remove short, adjust R2 for correct reading in centigrade
†IQ at 1.3V≃500μA
IQ at 1.6V≃2.4mA
Figure 21. 0°C−100°C Thermometer
Figure 22.
*2N3638 or 2N2907 select for inverse HFE ≃ 5
†Select for operation at 1.3V
‡IQ ≃ 600μA to 900μA
Figure 23. Lower Power Thermometer
8
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
www.ti.com
SNVS742E –JANUARY 2000–REVISED APRIL 2013
Calibration
1. Short LM385-1.2-N, adjust R3 for IOUT= temp at 1.8μA/°K
2. Remove short, adjust R2 for correct reading in °F
Figure 24. 0°F−50°F Thermometer
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 25. Micropower Thermocouple Cold Junction Compensator
Copyright © 2000–2013, Texas Instruments Incorporated
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9
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
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Thermocouple
Type
Seebeck
Coefficient
(μV/°C)
R1
R2
Voltage
Across R1
@ 25°C
(mV)
Voltage
(Ω)
(Ω)
Across R2
(mV)
J
T
K
S
52.3
42.8
40.8
6.4
523
432
412
63.4
1.24k
1k
15.60
14.32
11.78
11.17
1.766
12.77
953Ω
150Ω
12.17
1.908
Typical supply current 50μA
Calibration
1. Adjust R1 so that V1 = temp at 1mV/°K
2. Adjust V2 to 273.2mV
†IQ for 1.3V to 1.6V battery volt-
age = 50μA to 150μA
Figure 26. Centigrade Thermometer
10
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LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
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SNVS742E –JANUARY 2000–REVISED APRIL 2013
SCHEMATIC DIAGRAM
Copyright © 2000–2013, Texas Instruments Incorporated
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11
Product Folder Links: LM185-1.2-N LM285-1.2-N LM385-1.2-N
LM185-1.2-N, LM285-1.2-N, LM385-1.2-N
SNVS742E –JANUARY 2000–REVISED APRIL 2013
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REVISION HISTORY
Changes from Revision D (April 2013) to Revision E
Page
•
Changed layout of National Data Sheet to TI format .......................................................................................................... 11
12
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PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM185BYH-1.2
ACTIVE
TO
TO
NDU
2
2
1000
TBD
Call TI
Call TI
-55 to 125
-55 to 125
LM185BYH1.2
LM185BYH-1.2/NOPB
ACTIVE
NDU
1000
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM185BYH1.2
LM185H-1.2
ACTIVE
ACTIVE
TO
TO
NDU
NDU
2
2
1000
1000
TBD
Call TI
Call TI
-55 to 125
-55 to 125
LM185H1.2
LM185H1.2
LM185H-1.2/NOPB
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM285BXM-1.2/NOPB
LM285BXMX-1.2/NOPB
LM285BXZ-1.2/LFT4
LM285BXZ-1.2/NOPB
LM285BYM-1.2/NOPB
LM285BYMX-1.2/NOPB
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
TO-92
SOIC
SOIC
D
D
8
8
3
3
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
SNCU
SNCU
CU SN
CU SN
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-40 to 85
-40 to 85
285BX
M1.2
2500
2000
1800
95
Green (RoHS
& no Sb/Br)
285BX
M1.2
LP
LP
D
Green (RoHS
& no Sb/Br)
285BX
Z-1.2
Green (RoHS
& no Sb/Br)
-40 to 85
-40 to 85
-40 to 85
285BX
Z-1.2
Green (RoHS
& no Sb/Br)
285BY
M1.2
D
2500
Green (RoHS
& no Sb/Br)
285BY
M1.2
LM285H-1.2
ACTIVE
ACTIVE
TO
TO
NDU
NDU
2
2
1000
1000
TBD
Call TI
-40 to 85
-40 to 85
LM285H1.2
LM285H-1.2/NOPB
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM285H1.2
LM285M-1.2/NOPB
LM285MX-1.2/NOPB
LM285Z-1.2/NOPB
LM385BM-1.2
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
SOIC
SOIC
SOIC
D
D
8
8
3
8
8
8
95
2500
1800
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
SNCU
Call TI
CU SN
Call TI
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Call TI
-40 to 85
-40 to 85
-40 to 85
0 to 70
LM285
M1.2
Green (RoHS
& no Sb/Br)
LM285
M1.2
LP
D
Green (RoHS
& no Sb/Br)
LM28
5Z-1.2
TBD
LM385
BM1.2
LM385BM-1.2/NOPB
LM385BMX-1.2
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
0 to 70
LM385
BM1.2
D
2500
TBD
0 to 70
LM385
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
2500
95
(1)
(2)
(3)
(4)
BM1.2
LM385BMX-1.2/NOPB
LM385BXM-1.2/NOPB
LM385BXMX-1.2/NOPB
LM385BXZ-1.2/NOPB
LM385BYM-1.2/NOPB
LM385BYMX-1.2
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
TO-92
SOIC
SOIC
SOIC
TO-92
TO-92
SOIC
SOIC
D
D
8
8
8
3
8
8
8
3
3
8
8
Green (RoHS
& no Sb/Br)
CU SN
CU SN
CU SN
SNCU
CU SN
Call TI
CU SN
SNCU
SNCU
Call TI
CU SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Call TI
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
0 to 70
LM385
BM1.2
Green (RoHS
& no Sb/Br)
385BX
M1.2
D
2500
1800
95
Green (RoHS
& no Sb/Br)
385BX
M1.2
LP
D
Green (RoHS
& no Sb/Br)
385BX
Z-1.2
Green (RoHS
& no Sb/Br)
385BY
M1.2
D
2500
2500
1800
1800
95
TBD
385BY
M1.2
LM385BYMX-1.2/NOPB
LM385BYZ-1.2/NOPB
LM385BZ-1.2/NOPB
LM385M-1.2
D
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
385BY
M1.2
LP
LP
D
Green (RoHS
& no Sb/Br)
385BY
Z-1.2
Green (RoHS
& no Sb/Br)
LM385
BZ1.2
TBD
LM385
M1.2
LM385M-1.2/NOPB
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM385
M1.2
LM385M3-1.2
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
R11
LM385M3-1.2/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
R11
LM385M3X-1.2
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
R11
R11
LM385M3X-1.2/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM385MX-1.2
LM385MX-1.2/NOPB
LM385Z-1.2/LFT3
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
D
D
8
8
3
2500
2500
2000
TBD
Call TI
CU SN
SNCU
Call TI
0 to 70
0 to 70
LM385
M1.2
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-NA-UNLIM
LM385
M1.2
LP
Green (RoHS
& no Sb/Br)
LM385
Z-1.2
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
LM385Z-1.2/LFT4
LM385Z-1.2/NOPB
ACTIVE
TO-92
TO-92
LP
3
3
2000
Green (RoHS
& no Sb/Br)
SNCU
SNCU
Level-1-NA-UNLIM
LM385
Z-1.2
ACTIVE
LP
1800
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
0 to 70
LM385
Z-1.2
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
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Addendum-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285BXMX-1.2/NOPB
LM285BYMX-1.2/NOPB
LM285MX-1.2/NOPB
LM385BMX-1.2
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
3
3
3
3
8
8
2500
2500
2500
2500
2500
2500
2500
2500
1000
1000
3000
3000
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
178.0
178.0
178.0
178.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
12.4
8.4
6.5
6.5
6.5
6.5
6.5
6.5
6.5
6.5
3.3
3.3
3.3
3.3
6.5
6.5
5.4
5.4
5.4
5.4
5.4
5.4
5.4
5.4
2.9
2.9
2.9
2.9
5.4
5.4
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q1
Q1
SOIC
D
2.0
SOIC
D
2.0
LM385BMX-1.2/NOPB
LM385BXMX-1.2/NOPB
LM385BYMX-1.2
SOIC
D
2.0
SOIC
D
2.0
SOIC
D
2.0
LM385BYMX-1.2/NOPB
LM385M3-1.2
SOIC
D
2.0
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBZ
DBZ
DBZ
DBZ
D
1.22
1.22
1.22
1.22
2.0
LM385M3-1.2/NOPB
LM385M3X-1.2
8.4
8.0
8.4
8.0
LM385M3X-1.2/NOPB
LM385MX-1.2
8.4
8.0
12.4
12.4
12.0
12.0
LM385MX-1.2/NOPB
SOIC
D
2.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM285BXMX-1.2/NOPB
LM285BYMX-1.2/NOPB
LM285MX-1.2/NOPB
LM385BMX-1.2
SOIC
SOIC
D
D
8
8
8
8
8
8
8
8
3
3
3
3
8
8
2500
2500
2500
2500
2500
2500
2500
2500
1000
1000
3000
3000
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
185.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
SOIC
D
SOIC
D
LM385BMX-1.2/NOPB
LM385BXMX-1.2/NOPB
LM385BYMX-1.2
SOIC
D
SOIC
D
SOIC
D
LM385BYMX-1.2/NOPB
LM385M3-1.2
SOIC
D
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBZ
DBZ
DBZ
DBZ
D
LM385M3-1.2/NOPB
LM385M3X-1.2
LM385M3X-1.2/NOPB
LM385MX-1.2
LM385MX-1.2/NOPB
SOIC
D
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
H02A (Rev F)
www.ti.com
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