LM385BYM-2.5/NOPB [TI]
LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode; LM185-2.5 -N / LM285-2.5 -N / LM385-2.5 -N微功耗电压基准二极管
| 型号： | LM385BYM-2.5/NOPB |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode |
| 文件： | 总22页 (文件大小：1194K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
LM185-2.5-N/LM285-2.5-N/LM385-2.5-N Micropower Voltage Reference Diode
Check for Samples: LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
Careful design of the LM185-2.5-N has made the
1
FEATURES
device exceptionally tolerant of capacitive loading,
making it easy to use in almost any reference
application. The wide dynamic operating range allows
its use with widely varying supplies with excellent
regulation.
2
•
±20 mV (±0.8%) max. Initial Tolerance (A
Grade)
•
•
•
•
•
Operating Current of 20 μA to 20 mA
0.6Ω Dynamic Impedance (A Grade)
Low Temperature Coefficient
The extremely low power drain of the LM185-2.5-N
makes it useful for micropower circuitry. This voltage
reference can be used to make portable meters,
regulators or general purpose analog circuitry with
battery life approaching shelf life. Further, the wide
operating current allows it to replace older references
with a tighter tolerance part. For applications requiring
1.2V see LM185-1.2.
Low Voltage Reference—2.5V
1.2V Device and Adjustable Device Also
Available—LM185-1.2 Series and LM185
Series, respectively
DESCRIPTION
The LM185-2.5-N/LM285-2.5-N/LM385-2.5-N are
micropower 2-terminal band-gap voltage regulator
diodes. Operating over a 20 μA to 20 mA current
range, they feature exceptionally low dynamic
impedance and good temperature stability. On-chip
trimming is used to provide tight voltage tolerance.
Since the LM-185-2.5-N band-gap reference uses
only transistors and resistors, low noise and good
long term stability result.
The LM185-2.5-N is rated for operation over a −55°C
to 125°C temperature range while the LM285-2.5-N is
rated −40°C to 85°C and the LM385-2.5-N 0°C to
70°C. The LM185-2.5-N/LM285-2.5-N are available in
a hermetic TO package and the LM285-2.5-N/LM385-
2.5-N are also available in a low-cost TO-92 molded
package, as well as SOIC and SOT-23. The LM185-
2.5-N is also available in a hermetic leadless chip
carrier package.
Connection Diagram
Figure 1. TO-92 Package
(Bottom View)
Figure 2. SOIC Package
See Package Number D0008A
See Package Number LP0003A
* Pin 3 is attached to the Die Attach Pad (DAP) and should be connected to Pin 2 or left floating.
Figure 3. SOT-23
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
All trademarks are the property of their respective owners.
2
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2013, Texas Instruments Incorporated
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
www.ti.com
Figure 4. LCCC Leadless Chip Carrier
See Package Number NAJ0020A
Figure 5. TO Package
(Bottom View)
See Package Number NDU0002A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
ABSOLUTE MAXIMUM RATINGS(1)(2)(3)
Reverse Current
30 mA
10 mA
Forward Current
LM185-2.5-N
LM285-2.5-N
LM385-2.5-N
−55°C to + 125°C
−40°C to + 85°C
0°C to 70°C
2kV
Operating Temperature Range(4)
ESD Susceptibility(5)
Storage Temperature
−55°C to + 150°C
260°C
TO-92 Package (10 sec.)
TO Package (10 sec.)
300°C
Soldering Information
Vapor Phase (60 sec.)
Infrared (15 sec.)
215°C
SOIC and SOT-23 Package
220°C
See http://www.ti.com for other methods of soldering surface mount devices.
(1) Refer to RETS185H-2.5 for military specifications.
(2) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but do not ensure specific performance limits. For ensured specifications and test
conditions, see the Electrical Characteristics. The ensured specifications apply only for the test conditions listed.
(3) If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.
(4) For elevated temperature operation, TJ MAX is:
LM185-N: 150°C
LM285-N: 125°C
LM385-N: 100°C
See THERMAL CHARACTERISTICS.
(5) The human body model is a 100 pF capacitor discharged through a 1.5 kΩ resistor into each pin.
THERMAL CHARACTERISTICS
over operating free-air temperature range (unless otherwise noted)
LM185
LM285
150°C
125°C
100°C
TO
Thermal Resistance
SOIC-8
SOT-23
LM385
TO-92
θja (Junction to Ambient)
θjc (Junction to Case)
180°C/W (0.4″ Leads)
170°C/W (0.125″ Leads)
N/A
440°C/W
165°C/W
N/A
283°C/W
N/A
80°C/W
2
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Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
ELECTRICAL CHARACTERISTICS
LM385A-2.5-N
LM385AX-2.5-N
Units
(Limits)
Parameter
Conditions
Typ
LM385AY-2.5-N
Tested Limit(2) Design Limit(3)
Reverse Breakdown
Voltage
IR = 100 μA
2.500
2.500
12
2.480
2.520
2.470
2.530
V(Min)
V(Max)
V(Min)
V(Max)
μA
Minimum Operating
Current
18
20
1.5
20
(Max)
mV
Reverse Breakdown
Voltage Change with
Current
IMIN ≤ IR ≤ 1mA
1
(Max)
mV
1 mA ≤ IR ≤ 20 mA
10
(Max)
Ω
Reverse Dynamic
Impedance
IR = 100 μA,
0.2
120
20
0.6
f = 20 Hz
1.5
Wideband Noise (rms)
IR = 100 μA
μV
10 Hz ≤ f ≤ 10 kHz
IR = 100 μA, T = 1000 Hr,
TA = 25°C ±0.1°C
Long Term Stability
ppm
Average Temperature Coefficient(4)
IMIN ≤ IR ≤ 20 mA
X Suffix
Y Suffix
All Others
30
50
ppm/°C
(Max)
150
(1) Parameters identified with boldface type apply at temperature extremes. All other numbers apply at TA = TJ = 25°C.
(2) Specified and 100% production tested.
(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
Copyright © 1999–2013, Texas Instruments Incorporated
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3
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
www.ti.com
ELECTRICAL CHARACTERISTICS
LM185-2.5-N
LM185BX-2.5-N
LM185BY-2.5-N
LM285-2.5-N
LM385B-2.5-N
LM385BX-2.5-N
LM385-2.5-N
Units
(Limit)
Parameter
Conditions
Typ
LM285BX-2.5-N
LM285BY-2.5-N
LM385BY-2.5-N
Tested Limit(1)(2) Design
Tested
Limit(1)
Design
Limit(3)
Tested Design
Limit(1) Limit(3)
Limit(3)
Reverse Breakdown TA = 25°C,
2.5
13
2.462
2.538
2.462
2.538
20
2.425
2.575
V(Min)
V(Max)
Voltage
20 μA ≤ IR ≤ 20 mA
Minimum Operating
Current
20
30
30
20
30
μA
(Max)
LM385M3-2.5-N
15
20
Reverse Breakdown 20 μA ≤ IR ≤ 1 mA
Voltage Change
1
1.5
20
2.0
20
2.5
25
2.0
2.5
mV
(Max)
with Current
1 mA ≤ IR ≤ 20 mA
10
20
25
mV
(Max)
Reverse Dynamic
Impedance
IR = 100 μA,
f = 20 Hz
1
Ω
Wideband Noise
(rms)
IR = 100 μA,
10 Hz ≤ f ≤ 10 kHz
120
20
μV
Long Term Stability IR = 100 μA,
T = 1000 Hr,
ppm
TA = 25°C ±0.1°C
IR = 100 μA
Average
Temperature
X Suffix
Y Suffix
All Others
30
50
30
50
ppm/°C
ppm/°C
ppm/°C
(Max)
Coefficient(4)
150
150
150
(1) Specified and 100% production tested.
(2) A military RETS electrical specification available on request.
(3) Specified, but not 100% production tested. These limits are not used to calculate average outgoing quality levels.
(4) The average temperature coefficient is defined as the maximum deviation of reference voltage at all measured temperatures between
the operating TMAX and TMIN, divided by TMAX–TMIN. The measured temperatures are −55°C, −40°C, 0°C, 25°C, 70°C, 85°C, 125°C.
4
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Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
TYPICAL PERFORMANCE CHARACTERISTICS
Reverse Characteristics
Reverse Characteristics
Figure 6.
Figure 7.
Forward Characteristics
Temperature Drift
Figure 8.
Figure 9.
Reverse Dynamic
Impedance
Reverse Dynamic
Impedance
Figure 10.
Figure 11.
Copyright © 1999–2013, Texas Instruments Incorporated
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LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
www.ti.com
TYPICAL PERFORMANCE CHARACTERISTICS (continued)
Noise Voltage
Filtered Output Noise
Figure 12.
Figure 13.
Response Time
Figure 14.
6
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Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
APPLICATIONS
Figure 15. Wide Input Range Reference
Figure 16. Micropower Reference from 9V Battery
LM385-2.5-N Applications
IQ ≃ 30 μA standby current
IQ ≃ 40 μA
Figure 17. Micropower 5V Reference
Figure 18. Micropower 10V Reference
PRECISION 1 μA to 1 mA CURRENT SOURCES
Figure 19.
METER THERMOMETERS
Copyright © 1999–2013, Texas Instruments Incorporated
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Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
www.ti.com
Calibration
Calibration
1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1.8 μA/°K
1. Short LM385-2.5-N, adjust R3 for IOUT=temp at 1μA/°K.
2. Remove short, adjust R2 for correct reading in centigrade
2. Remove short, adjust R2 for correct reading in °F
Figure 20. 0°C–100°C Thermomemter
Figure 21. 0°F–50°F Thermomemter
Adjustment Procedure
1. Adjust TC ADJ pot until voltage across R1 equals Kelvin temperature multiplied by the thermocouple Seebeck
coefficient.
2. Adjust zero ADJ pot until voltage across R2 equals the thermocouple Seebeck coefficient multiplied by 273.2.
Figure 22. Micropower Thermocouple Cold Junction Compensator
Thermocouple Type(1)
Seebeck
Coefficient
(μV/°C)
R1
(Ω)
R2
(Ω)
Voltage Across R1
@25°C
Voltage Across R2
(mV)
(mV)
J
T
K
S
52.3
42.8
40.8
6.4
523
432
412
63.4
1.24k
1k
15.60
12.77
12.17
1.908
14.32
11.78
11.17
1.766
953Ω
150Ω
(1) Typical supply current 50 μA
8
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Copyright © 1999–2013, Texas Instruments Incorporated
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
www.ti.com
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
Figure 23. Improving Regulation of Adjstable Regulators
Schematic Diagram
Copyright © 1999–2013, Texas Instruments Incorporated
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9
Product Folder Links: LM185-2.5-N LM285-2.5-N LM385-2.5-N
LM185-2.5-N, LM285-2.5-N, LM385-2.5-N
SNVS743D –DECEMBER 1999–REVISED MARCH 2013
www.ti.com
REVISION HISTORY
Changes from Revision C (March 2013) to Revision D
Page
•
Changed layout of National Data Sheet to TI format ............................................................................................................ 9
10
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PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM185BXH-2.5
ACTIVE
TO
TO
NDU
2
2
1000
TBD
Call TI
Call TI
-55 to 125
-55 to 125
LM185BXH2.5
LM185BXH-2.5/NOPB
ACTIVE
NDU
1000
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM185BXH2.5
LM185BYH-2.5
ACTIVE
ACTIVE
TO
TO
NDU
NDU
2
2
1000
1000
TBD
Call TI
Call TI
-55 to 125
-55 to 125
LM185BYH2.5
LM185BYH2.5
LM185BYH-2.5/NOPB
Green (RoHS POST-PLATE
& no Sb/Br)
Level-1-NA-UNLIM
LM285BXM-2.5/NOPB
LM285BXMX-2.5/NOPB
LM285BXZ-2.5/NOPB
LM285BYM-2.5/NOPB
LM285BYMX-2.5/NOPB
LM285BYZ-2.5/NOPB
LM285M-2.5/NOPB
LM285MX-2.5/NOPB
LM285Z-2.5/LFT7
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
SOIC
SOIC
TO-92
SOIC
SOIC
TO-92
TO-92
SOIC
SOIC
SOIC
D
D
8
8
3
8
8
3
8
8
3
3
8
8
8
95
Green (RoHS
& no Sb/Br)
CU SN
CU SN
SNCU
CU SN
CU SN
SNCU
CU SN
CU SN
SN
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Call TI
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
285BX
M2.5
2500
1800
95
Green (RoHS
& no Sb/Br)
285BX
M2.5
LP
D
Green (RoHS
& no Sb/Br)
285BX
Z2.5
Green (RoHS
& no Sb/Br)
285BY
M2.5
D
2500
1800
95
Green (RoHS
& no Sb/Br)
285BY
M2.5
LP
D
Green (RoHS
& no Sb/Br)
285BY
Z2.5
Green (RoHS
& no Sb/Br)
LM285
M2.5
D
2500
2000
1800
95
Green (RoHS
& no Sb/Br)
LM285
M2.5
LP
LP
D
Green (RoHS
& no Sb/Br)
LM285
Z-2.5
LM285Z-2.5/NOPB
LM385BM-2.5
Green (RoHS
& no Sb/Br)
SNCU
Call TI
CU SN
Call TI
-40 to 85
0 to 70
0 to 70
0 to 70
LM285
Z-2.5
TBD
LM385
BM2.5
LM385BM-2.5/NOPB
LM385BMX-2.5
D
95
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
LM385
BM2.5
D
2500
TBD
LM385
BM2.5
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
0 to 70
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM385BMX-2.5/NOPB
LM385BXM-2.5
ACTIVE
SOIC
SOIC
SOIC
SOIC
TO-92
SOIC
SOIC
TO-92
TO-92
TO-92
SOIC
D
8
8
8
8
3
8
8
3
3
3
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
CU SN
SNCU
CU SN
CU SN
SNCU
SNCU
SNCU
CU SN
Level-1-260C-UNLIM
LM385
BM2.5
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
95
95
TBD
Call TI
0 to 70
385BX
M2.5
LM385BXM-2.5/NOPB
LM385BXMX-2.5/NOPB
LM385BXZ-2.5/NOPB
LM385BYM-2.5/NOPB
LM385BYMX-2.5/NOPB
LM385BYZ-2.5/NOPB
LM385BZ-2.5/LFT7
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-260C-UNLIM
0 to 70
385BX
M2.5
D
2500
1800
95
Green (RoHS
& no Sb/Br)
0 to 70
385BX
M2.5
LP
D
Green (RoHS
& no Sb/Br)
0 to 70
385BX
Z-2.5
Green (RoHS
& no Sb/Br)
0 to 70
385BY
M2.5
D
2500
1800
2000
1800
95
Green (RoHS
& no Sb/Br)
0 to 70
385BY
M2.5
LP
LP
LP
D
Green (RoHS
& no Sb/Br)
0 to 70
385BY
Z-2.5
Green (RoHS
& no Sb/Br)
LM385
BZ2.5
LM385BZ-2.5/NOPB
LM385M-2.5/NOPB
Green (RoHS
& no Sb/Br)
0 to 70
0 to 70
LM385
BZ2.5
Green (RoHS
& no Sb/Br)
LM385
M2.5
LM385M3-2.5
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
1000
1000
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
R12
LM385M3-2.5/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
R12
LM385M3X-2.5
ACTIVE
ACTIVE
SOT-23
SOT-23
DBZ
DBZ
3
3
3000
3000
TBD
Call TI
CU SN
Call TI
0 to 70
0 to 70
R12
R12
LM385M3X-2.5/NOPB
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
LM385MX-2.5
LM385MX-2.5/NOPB
LM385Z-2.5/LFT1
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
TO-92
D
D
8
8
3
2500
2500
2000
TBD
Call TI
CU SN
SNCU
Call TI
0 to 70
0 to 70
LM385
M2.5
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Level-1-NA-UNLIM
LM385
M2.5
LP
Green (RoHS
& no Sb/Br)
LM385
Z2.5
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM385Z-2.5/LFT2
LM385Z-2.5/LFT3
LM385Z-2.5/LFT7
LM385Z-2.5/NOPB
ACTIVE
TO-92
TO-92
TO-92
TO-92
LP
3
3
3
3
2000
Green (RoHS
& no Sb/Br)
SNCU
SNCU
SNCU
SNCU
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
Level-1-NA-UNLIM
LM385
Z2.5
ACTIVE
ACTIVE
ACTIVE
LP
LP
LP
2000
2000
1800
Green (RoHS
& no Sb/Br)
LM385
Z2.5
Green (RoHS
& no Sb/Br)
LM385
Z2.5
Green (RoHS
& no Sb/Br)
0 to 70
LM385
Z2.5
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
21-May-2013
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LM285BXMX-2.5/NOPB
LM285BYMX-2.5/NOPB
LM285MX-2.5/NOPB
LM385BMX-2.5
SOIC
SOIC
D
D
8
8
8
8
8
8
8
3
3
3
3
8
8
2500
2500
2500
2500
2500
2500
2500
1000
1000
3000
3000
2500
2500
330.0
330.0
330.0
330.0
330.0
330.0
330.0
178.0
178.0
178.0
178.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
12.4
12.4
8.4
6.5
6.5
6.5
6.5
6.5
6.5
6.5
3.3
3.3
3.3
3.3
6.5
6.5
5.4
5.4
5.4
5.4
5.4
5.4
5.4
2.9
2.9
2.9
2.9
5.4
5.4
2.0
2.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
4.0
4.0
4.0
8.0
8.0
12.0
12.0
12.0
12.0
12.0
12.0
12.0
8.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q3
Q3
Q3
Q3
Q1
Q1
SOIC
D
2.0
SOIC
D
2.0
LM385BMX-2.5/NOPB
LM385BXMX-2.5/NOPB
LM385BYMX-2.5/NOPB
LM385M3-2.5
SOIC
D
2.0
SOIC
D
2.0
SOIC
D
2.0
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBZ
DBZ
DBZ
DBZ
D
1.22
1.22
1.22
1.22
2.0
LM385M3-2.5/NOPB
LM385M3X-2.5
8.4
8.0
8.4
8.0
LM385M3X-2.5/NOPB
LM385MX-2.5
8.4
8.0
12.4
12.4
12.0
12.0
LM385MX-2.5/NOPB
SOIC
D
2.0
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
8-Apr-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM285BXMX-2.5/NOPB
LM285BYMX-2.5/NOPB
LM285MX-2.5/NOPB
LM385BMX-2.5
SOIC
SOIC
D
D
8
8
8
8
8
8
8
3
3
3
3
8
8
2500
2500
2500
2500
2500
2500
2500
1000
1000
3000
3000
2500
2500
367.0
367.0
367.0
367.0
367.0
367.0
367.0
210.0
210.0
210.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
185.0
185.0
185.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
SOIC
D
SOIC
D
LM385BMX-2.5/NOPB
LM385BXMX-2.5/NOPB
LM385BYMX-2.5/NOPB
LM385M3-2.5
SOIC
D
SOIC
D
SOIC
D
SOT-23
SOT-23
SOT-23
SOT-23
SOIC
DBZ
DBZ
DBZ
DBZ
D
LM385M3-2.5/NOPB
LM385M3X-2.5
LM385M3X-2.5/NOPB
LM385MX-2.5
LM385MX-2.5/NOPB
SOIC
D
Pack Materials-Page 2
MECHANICAL DATA
NDU0002A
H02A (Rev F)
www.ti.com
IMPORTANT NOTICE
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相关型号：
LM385BYZ-1.2/NOPB
IC 1-OUTPUT TWO TERM VOLTAGE REFERENCE, 1.235 V, PBCY3, PLASTIC, TO-92, 3 PIN, Voltage Reference
NSC
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