LM336BLP-2.5 [TI]

1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.49V, PBCY3, ROHS COMPLIANT, PLASTIC, TO-226, TO-92, 3 PIN;
LM336BLP-2.5
型号: LM336BLP-2.5
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

1-OUTPUT TWO TERM VOLTAGE REFERENCE, 2.49V, PBCY3, ROHS COMPLIANT, PLASTIC, TO-226, TO-92, 3 PIN

输出元件
文件: 总6页 (文件大小:95K)
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LM236-2.5, LM336-2.5, LM336B-2.5  
2.5-V INTEGRATED REFERENCE CIRCUITS  
SLVS063C – NOVEMBER 1988 – REVISED AUGUST 2000  
Low Temperature Coefficient  
D PACKAGE  
(TOP VIEW)  
Wide Operating Current . . . 400 µA  
to 10 mA  
NC  
NC  
NC  
CATHODE  
NC  
NC  
1
2
3
4
8
7
6
5
0.27-Dynamic Impedance  
±1% Tolerance Available  
Specified Temperature Stability  
ANODE  
ADJ  
Easily Trimmed for Minimum Temperature  
Drift  
NC-No internal connection  
Fast Turnon  
LP PACKAGE  
(TOP VIEW)  
Three-Lead Transistor Package  
description  
ANODE  
CATHODE  
ADJ  
The LM236-2.5, LM336-2.5, and LM336B-2.5  
integrated circuits are precision 2.5-V shunt  
regulator diodes. These  
reference circuits  
symbol  
operate as low-temperature-coefficient 2.5-V  
zeners with a 0.2-dynamic impedance. A third  
terminal provided on the circuit allows the  
reference voltage and temperature coefficient to  
be trimmed easily.  
ANODE  
CATHODE  
ADJ  
The series is useful asprecision2.5-Vlow-voltage  
references (V ) for digital voltmeters, power  
Z
supplies, or operational-amplifier circuitry. The 2.5-V voltage reference makes it convenient to obtain a stable  
reference from 5-V logic supplies. Devices in this series operate as shunt regulators, and can be used as either  
positive or negative voltage references.  
The LM236-2.5 is characterized for operation from –25°C to 85°C. The LM336-2.5 and LM336B-2.5 are  
characterized for operation from 0°C to 70°C.  
AVAILABLE OPTIONS  
PACKAGED DEVICES  
T
A
SMALL OUTLINE  
(D)  
PLASTIC  
(LP)  
LM336D-2.5  
LM336BD-2.5  
LM236D-2.5  
LM336LP-2.5  
LM336BLP-2.5  
LM236LP-2.5  
0°C to 70°C  
–25°C to 85°C  
The D and LP packages also are available taped and reeled. Add the  
suffix R to the device type (e.g., LM336DR-2.5). Chip forms are tested  
at 25°C.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Copyright 2000, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
LM236-2.5, LM336-2.5, LM336B-2.5  
2.5-V INTEGRATED REFERENCE CIRCUITS  
SLVS063C – NOVEMBER 1988 – REVISED AUGUST 2000  
schematic diagram  
CATHODE  
Q14  
Q11  
24 24  
kkΩ  
6.6 kΩ  
Q8  
Q7  
20 pF  
10 kΩ  
Q2  
30 pF  
Q10  
Q1  
Q4  
Q5  
500 Ω  
30 kΩ  
Q9  
ADJ  
Q3  
Q6  
6.6 kΩ  
Q12  
Q13  
720 Ω  
ANODE  
All component values are nominal  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Reverse current, I  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 mA  
R
Forward current, I . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 mA  
F
Package thermal impedance, θ (see Notes 1 and 2): D package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 97°C/W  
JA  
LP package . . . . . . . . . . . . . . . . . . . . . . . . . . 156°C/W  
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds: D or LP package . . . . . . . . . . . . . . . 260°C  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. Maximum power dissipation is a function of T (max), θ , and T . The maximum allowable power dissipation at any allowable  
J
JA  
A
ambient temperature is P = (T (max) – T )/θ . Operating at the absolute maximum T of 150°C can impact reliability.  
D
J
A
JA  
J
2. The package thermal impedance is calculated in accordance with JESD 51-7.  
recommended operating conditions  
MIN  
–25  
0
MAX  
85  
UNIT  
LM236-2.5  
Operating free-air temperature, T  
°C  
A
LM336-2.5, LM336B-2.5  
70  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
LM236-2.5, LM336-2.5, LM336B-2.5  
2.5-V INTEGRATED REFERENCE CIRCUITS  
SLVS063C – NOVEMBER 1988 – REVISED AUGUST 2000  
electrical characteristics at specified free-air temperature (unless otherwise noted)  
LM236-2.5  
LM336-2.5  
PARAMETER  
TEST CONDITIONS  
UNIT  
T
A
MIN  
TYP  
MAX  
MIN  
2.39  
2.44  
TYP  
2.49  
2.49  
MAX  
2.59  
2.54  
LM236, LM336  
2.44  
2.49  
2.54  
V
Z
Reference voltage  
I
Z
= 1 mA  
25°C  
V
LM336B  
Change in reference  
voltage with  
temperature  
V
adjusted to 2.490 V,  
= 1 mA  
Z
V  
Full range  
3.5  
9
1.8  
6
mV  
Z(T)  
I
Z
I
Z
I
Z
I
Z
25°C  
2.6  
3
6
2.6  
3
10  
12  
Change in reference  
voltage with current  
V  
V  
= 400 µA to 10 mA  
= 1 mA  
mV  
ppm/khr  
W
Z(I)  
Full range  
10  
Long-term change  
in reference voltage  
25°C  
20  
20  
Z(t)  
25°C  
0.2  
0.4  
0.6  
1
0.2  
0.4  
1
Reference  
impedance  
z
= 1 mA, f = 1 kHz  
z
Full range  
1.4  
Full range is –25°C to 85°C for the LM236-2.5 and 0°C to 70°C for the LM336-2.5 and LM336B-2.5.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
LM236-2.5, LM336-2.5, LM336B-2.5  
2.5-V INTEGRATED REFERENCE CIRCUITS  
SLVS063C – NOVEMBER 1988 – REVISED AUGUST 2000  
TYPICAL CHARACTERISTICS  
CHANGE IN REFERENCE VOLTAGE  
NOISE VOLTAGE  
vs  
vs  
REFERENCE CURRENT  
FREQUENCY  
250  
200  
2.5  
2
I
T
= 1 mA  
Z
T
A
= 25°C  
= 25°C  
A
1.5  
150  
100  
1
0.5  
0
50  
0
2
4
6
8
10  
10  
100  
1 k  
10 k  
100 k  
I
Z
– Reference Current – mA  
f – Frequency – Hz  
Figure 1  
Figure 2  
REFERENCE IMPEDANCE  
vs  
FREQUENCY  
100  
I
T
= 1 mA  
Z
= – 55°C to 125°C  
A
10  
1
0.1  
0.01  
0.1  
1
10  
100  
f – Frequency – kHz  
Figure 3  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
LM236-2.5, LM336-2.5, LM336B-2.5  
2.5-V INTEGRATED REFERENCE CIRCUITS  
SLVS063C – NOVEMBER 1988 – REVISED AUGUST 2000  
APPLICATION INFORMATION  
5 V  
2.49 kΩ  
2.5 V  
IN457  
5 V  
LM236-2.5  
LM336-2.5  
LM336B-2.5  
10 kΩ  
2.49 kΩ  
IN457  
2.5 V  
LM236-2.5  
LM336-2.5  
LM336B-2.5  
NC  
Any silicon signal diode  
Adjust to 2.49 V  
Figure 5. 2.5-V Reference With Minimum  
Temperature Coefficient  
Figure 4. 2.5-V Reference  
V = 3.5 – 40 V  
I
V+  
R
LM334  
V–  
68.1 Ω  
V
O
= 2.5 V  
LM336-2.5  
LM336-2.5  
NC  
LM336B-2.5  
Figure 6. Wide-Input-Range Reference  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
IMPORTANT NOTICE  
Texas Instruments and its subsidiaries (TI) reserve the right to make changes to their products or to discontinue  
any product or service without notice, and advise customers to obtain the latest version of relevant information  
to verify, before placing orders, that information being relied on is current and complete. All products are sold  
subject to the terms and conditions of sale supplied at the time of order acknowledgment, including those  
pertaining to warranty, patent infringement, and limitation of liability.  
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in  
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent  
TI deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily  
performed, except those mandated by government requirements.  
Customers are responsible for their applications using TI components.  
In order to minimize risks associated with the customer’s applications, adequate design and operating  
safeguards must be provided by the customer to minimize inherent or procedural hazards.  
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent  
that any license, either express or implied, is granted under any patent right, copyright, mask work right, or other  
intellectual property right of TI covering or relating to any combination, machine, or process in which such  
semiconductor products or services might be or are used. TI’s publication of information regarding any third  
party’s products or services does not constitute TI’s approval, warranty or endorsement thereof.  
Copyright 2000, Texas Instruments Incorporated  

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