INA210_15 [TI]
INA21x Voltage Output, Low- or High-Side Measurement, Bidirectional, Zero-Drift Series, Current-Shunt Monitors;
| 型号： | INA210_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | INA21x Voltage Output, Low- or High-Side Measurement, Bidirectional, Zero-Drift Series, Current-Shunt Monitors |
| 文件： | 总37页 (文件大小：1302K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
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INA210, INA211, INA212, INA213, INA214, INA215
SBOS437G –MAY 2008–REVISED JULY 2014
INA21x Voltage Output, Low- or High-Side Measurement, Bidirectional,
Zero-Drift Series, Current-Shunt Monitors
1 Features
3 Description
The INA210, INA211, INA212, INA213, INA214, and
INA215 are voltage-output, current-shunt monitors
that can sense drops across shunts at common-mode
voltages from –0.3 V to 26 V, independent of the
supply voltage. Five fixed gains are available: 50 V/V,
75 V/V, 100 V/V, 200 V/V, 500 V/V, or 1000 V/V. The
low offset of the zero-drift architecture enables
current sensing with maximum drops across the
shunt as low as 10-mV full-scale.
1
•
Wide Common-Mode Range: –0.3 V to 26 V
•
Offset Voltage: ±35 μV (Max, INA210)
(Enables Shunt Drops of 10-mV Full-Scale)
•
Accuracy:
–
–
–
±1% Gain Error (Max over Temperature)
0.5-μV/°C Offset Drift (Max)
10-ppm/°C Gain Drift (Max)
•
Choice of Gains:
These devices operate from a single 2.7-V to 26-V
power supply, drawing a maximum of 100 μA of
supply current. All versions are specified over the
extended operating temperature range (–40°C to
125°C), and offered in an SC70 package. The
INA210, INA213, and INA214 are also offered in a
thin UQFN package.
–
–
–
–
–
–
INA210: 200 V/V
INA211: 500 V/V
INA212: 1000 V/V
INA213: 50 V/V
INA214: 100 V/V
INA215: 75 V/V
Device Information(1)
•
•
•
Quiescent Current: 100 μA (max)
SC70 Package: All Models
PART NUMBER
INA210
PACKAGE
BODY SIZE (NOM)
2.00 mm × 1.25 mm
1.80 mm × 1.40 mm
2.00 mm × 1.25 mm
2.00 mm × 1.25 mm
2.00 mm × 1.25 mm
1.80 mm × 1.40 mm
2.00 mm × 1.25 mm
1.80 mm × 1.40 mm
2.00 mm × 1.25 mm
SC70 (6)
Thin UQFN Package: INA210, INA213, INA214
UQFN (10)
SC70 (6)
SC70 (6)
SC70 (6)
UQFN (10)
SC70 (6)
UQFN (10)
SC70 (6)
INA211
INA212
2 Applications
•
•
•
•
•
•
Notebook Computers
Cell Phones
INA213
Telecom Equipment
Power Management
Battery Chargers
Welding Equipment
INA214
INA215
(1) For all available packages, see the orderable addendum at
the end of the datasheet.
Simplified Schematic
RSHUNT
Supply
Load
Reference
Voltage
Output
INA21x
OUT
REF
R1
R3
IN-
GND
2.7 V to 26 V
IN+
V+
PRODUCT
GAIN
R3 and R4
R1 and R2
R2
R4
INA210
INA211
INA212
INA213
INA214
INA215
200
500
1000
50
5 kW
2 kW
1 kW
1 MW
1 MW
1 MW
1 MW
1 MW
1 MW
CBYPASS
0.01 mF
to
SC70
20 kW
10 kW
13.3 kW
0.1 mF
100
75
VOUT = (ILOAD ´ RSHUNT) Gain + VREF
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
INA210, INA211, INA212, INA213, INA214, INA215
SBOS437G –MAY 2008–REVISED JULY 2014
www.ti.com
Table of Contents
8.3 Feature Description................................................. 13
8.4 Device Functional Modes........................................ 14
Application and Implementation ........................ 20
9.1 Application Information............................................ 20
9.2 Typical Applications ................................................ 20
1
2
3
4
5
6
7
Features.................................................................. 1
Applications ........................................................... 1
Description ............................................................. 1
Revision History..................................................... 2
Device Options....................................................... 4
Pin Configurations and Functions....................... 4
Specifications......................................................... 5
7.1 Absolute Maximum Ratings ...................................... 5
7.2 Handling Ratings....................................................... 5
7.3 Recommended Operating Conditions....................... 6
7.4 Thermal Information.................................................. 6
7.5 Electrical Characteristics........................................... 6
7.6 Typical Characteristics.............................................. 8
Detailed Description ............................................ 12
8.1 Overview ................................................................. 12
8.2 Functional Block Diagram ....................................... 12
9
10 Power Supply Recommendations ..................... 23
11 Layout................................................................... 23
11.1 Layout Guidelines ................................................. 23
11.2 Layout Example .................................................... 23
12 Device and Documentation Support ................. 24
12.1 Documentation Support ........................................ 24
12.2 Related Links ........................................................ 24
12.3 Trademarks........................................................... 24
12.4 Electrostatic Discharge Caution............................ 24
12.5 Glossary................................................................ 24
8
13 Mechanical, Packaging, and Orderable
Information ........................................................... 24
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision F (June 2014) to Revision G
Page
•
•
Changed Simplified Schematic: added equation below gain table......................................................................................... 1
Changed V(ESD) HBM specifications for version A in Handling Ratings table ........................................................................ 5
Changes from Revision E (June 2013) to Revision F
Page
•
Changed format to meet latest data sheet standards; added Pin Functions, Recommended Operating Conditions,
and Thermal Information tables, Overview, Functional Block Diagram, Application Information, Power Supply
Recommendations, and Layout sections, and moved existing sections ................................................................................ 1
Added INA215 to document .................................................................................................................................................. 1
Added INA215 sub-bullet to fourth Features bullet ............................................................................................................... 1
Added INA215 to simplified schematic table ......................................................................................................................... 1
Changed title of Device Options table ................................................................................................................................... 4
Added Thermal Information table .......................................................................................................................................... 5
Added INA215 to Figure 7...................................................................................................................................................... 8
Added INA215 to Figure 15.................................................................................................................................................... 9
Added INA215 to Figure 25.................................................................................................................................................. 16
•
•
•
•
•
•
•
•
Changes from Revision D (November 2012) to Revision E
Page
•
Deleted Package Marking column from Package/Ordering Information table........................................................................ 4
Changes from Revision C (August 2012) to Revision D
Page
•
Changed Frequency Response, Bandwidth parameter in Electrical Characteristics table .................................................... 5
2
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INA210, INA211, INA212, INA213, INA214, INA215
www.ti.com
SBOS437G –MAY 2008–REVISED JULY 2014
Changes from Revision B (June 2009) to Revision C
Page
•
•
•
•
•
•
•
Changed Package/Ordering table to show both silicon versions A and B ............................................................................. 4
Added silicon version B ESD ratings to Abs Max table.......................................................................................................... 5
Added silicon version B row to Input, Common-Mode Input Range parameter in Electrical Characteristics table................ 5
Corrected typo in Figure 9 ..................................................................................................................................................... 8
Updated Figure 12 ................................................................................................................................................................. 8
Changed Input Filtering section............................................................................................................................................ 14
Added Improving Transient Robustness section.................................................................................................................. 19
Changes from Revision A (June 2008) to Revision B
Page
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Added RSW package to device photo.................................................................................................................................... 1
Added UQFN package to Features list................................................................................................................................... 1
Updated front page graphic.................................................................................................................................................... 1
Added RSW ordering information to Package/Ordering Information table............................................................................. 4
Added RSW package pin out drawing.................................................................................................................................... 4
Added footnote 3 to Electrical Characteristics table............................................................................................................... 5
Added UQFN package information to Temperature Range section of Electrical Characteristics table ................................. 5
Changed Figure 2 to reflect operating temperature range ..................................................................................................... 8
Changed Figure 4 to reflect operating temperature range ..................................................................................................... 8
Changed Figure 6 to reflect operating temperature range ..................................................................................................... 8
Changed Figure 13 to reflect operating temperature range ................................................................................................... 9
Changed Figure 14 to reflect operating temperature range ................................................................................................... 9
Added RSW description to the Basic Connections section.................................................................................................. 13
Changed 60μV to 100μV in last sentence of the Selecting RS section ............................................................................... 13
Changes from Original (May 2008) to Revision A
Page
•
•
•
•
Changed availability of INA211 and INA212 to currently available in Package/Ordering Information table .......................... 4
Deleted first footnote of Electrical Characteristics table......................................................................................................... 5
Changed Figure 7 .................................................................................................................................................................. 8
Changed Figure 15 ................................................................................................................................................................ 9
Copyright © 2008–2014, Texas Instruments Incorporated
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INA210, INA211, INA212, INA213, INA214, INA215
SBOS437G –MAY 2008–REVISED JULY 2014
www.ti.com
5 Device Options
PACKAGE
PRODUCT
GAIN (V/V)
PACKAGE
SC70-6
DESIGNATOR
200
200
200
200
500
500
1000
1000
50
DCK
INA210A
Thin UQFN-10
SC70-6
RSW
DCK
INA210B
Thin UQFN-10
SC70-6
RSW
DCK
INA211A
INA211B
INA212A
INA212B
SC70-6
DCK
SC70-6
DCK
SC70-6
DCK
SC70-6
DCK
INA213A
INA213B
INA214A
50
Thin UQFN-10
SC70-6
RSW
DCK
50
50
Thin UQFN-10
SC70-6
RSW
DCK
100
100
100
100
75
Thin UQFN-10
SC70-6
RSW
DCK
INA214B
INA215A
Thin UQFN-10
SC70-6
RSW
DCK
6 Pin Configurations and Functions
DCK Package
SC70-6
(Top View)
RSW Package
Thin UQFN-10
(Top View)
NC(1) V+
REF
GND
V+
1
2
3
6
5
4
OUT
IN-
7
6
REF
GND
OUT
8
9
5
IN-
IN+
4
3
IN-
10
IN+
1
2
NC(1) IN+
(1) NC denotes no internal connection. These pins can be left floating or connected to any voltage between V– and V+.
4
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www.ti.com
SBOS437G –MAY 2008–REVISED JULY 2014
Pin Functions
PIN
NO.
I/O
DESCRIPTION
NAME
DCK
RSW
GND
IN–
2
9
Analog
Ground
Analog
input
5
4, 5
Connect to load side of shunt resistor.
Analog
input
IN+
NC
4
—
6
2, 3
1, 7
10
Connect to supply side of shunt resistor
Not internally connected. Leave floating or connect to ground.
Output voltage
—
Analog
output
OUT
Analog
input
REF
V+
1
3
8
6
Reference voltage, 0 V to V+
Power supply, 2.7 V to 26 V
Analog
7 Specifications
7.1 Absolute Maximum Ratings(1)
over operating free-air temperature range (unless otherwise noted)
MIN
MAX
UNIT
V
Supply voltage, VS
26
26
Differential (VIN+) – (VIN–
)
–26
V
(2)
Analog inputs, VIN+, VIN–
(3)
Common-mode
GND – 0.3
GND – 0.3
GND – 0.3
26
V
REF input
Output(3)
Input current into any terminal(3)
(VS) + 0.3
(VS) + 0.3
5
V
V
mA
°C
°C
Operating temperature
–55
150
Junction temperature
150
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
(2) VIN+ and VIN– are the voltages at the IN+ and IN– terminals, respectively.
(3) Input voltage at any terminal may exceed the voltage shown if the current at that terminal is limited to 5 mA.
7.2 Handling Ratings
MIN
–65
MAX
150
UNIT
Tstg
Storage temperature range
°C
Human body model (HBM) ESD stress voltage(1)
Charged-device model (CDM) ESD stress voltage(2)
Machine model (MM) ESD stress voltage
Human body model (HBM) ESD stress voltage(1)
Charged-device model (CDM) ESD stress voltage(2)
Machine model (MM) ESD stress voltage
–2000
–1000
–200
–1500
–1000
–100
2000
1000
200
Electrostatic discharge
(version A)
V(ESD)
V
V
1500
1000
100
Electrostatic discharge
(version B)
V(ESD)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Copyright © 2008–2014, Texas Instruments Incorporated
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SBOS437G –MAY 2008–REVISED JULY 2014
www.ti.com
7.3 Recommended Operating Conditions
over operating free-air temperature range (unless otherwise noted)
MIN
NOM
12
MAX
UNIT
V
VCM
VS
Common-mode input voltage
Operating supply voltage
5
V
TA
Operating free-air temperature
–40
125
°C
7.4 Thermal Information
INA210-INA215
THERMAL METRIC(1)
DCK (SC70)
6 PINS
227.3
79.5
RSW (UQFN)
10 PINS
107.3
56.5
UNIT
RθJA
Junction-to-ambient thermal resistance
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
RθJC(top)
RθJB
72.1
18.7
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
3.6
1.1
ψJB
70.4
18.7
RθJC(bot)
n/a
n/a
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
7.5 Electrical Characteristics
At TA = 25°C, VSENSE = VIN+ – VIN–
.
INA210, INA213, INA214, and INA215: VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
INA211 and INA212: VS = 12 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
INPUT
Version A, TA = –40°C to 125°C
Version B, TA = –40°C to 125°C
–0.3
–0.1
26
26
V
V
VCM
Common-mode input range
INA210, INA211,
INA212, INA214,
INA215
VIN+ = 0 V to 26 V, VSENSE = 0 mV,
TA = –40°C to 125°C
105
100
140
dB
Common-mode
rejection ratio
CMRR
VIN+ = 0 V to 26 V, VSENSE = 0 mV,
TA = –40°C to 125°C
INA213
120
dB
INA210, INA211,
INA212
VSENSE = 0 mV
±0.55
±35
μV
VO
Offset voltage, RTI(1)
RTI vs temperature
INA213
VSENSE = 0 mV
±5
±1
±100
±60
0.5
μV
μV
INA214, INA215
VSENSE = 0 mV
dVOS/dT
PSRR
VSENSE = 0 mV, TA = –40°C to 125°C
0.1
μV/°C
VS = 2.7 V to 18 V, VIN+ = 18 V,
VSENSE = 0 mV
RTI vs power supply ratio
±0.1
±10
35
μV/V
IIB
Input bias current
Input offset current
VSENSE = 0 mV
VSENSE = 0 mV
15
28
μA
μA
IIO
±0.02
OUTPUT
INA210
200
500
1000
50
V/V
V/V
V/V
V/V
V/V
V/V
INA211
INA212
INA213
INA214
INA215
G
Gain
100
75
VSENSE = –5 mV to 5 mV,
TA = –40°C to 125°C
EG
Gain error
±0.02%
±1%
10
Gain error vs temperature
Nonlinearity error
TA = –40°C to 125°C
3
±0.01%
1
ppm/°C
nF
VSENSE = –5 mV to 5 mV
No sustained oscillation
Maximum capacitive load
(1) RTI = referred-to-input.
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INA210, INA211, INA212, INA213, INA214, INA215
www.ti.com
SBOS437G –MAY 2008–REVISED JULY 2014
Electrical Characteristics (continued)
At TA = 25°C, VSENSE = VIN+ – VIN–
.
INA210, INA213, INA214, and INA215: VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
INA211 and INA212: VS = 12 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
PARAMETER
VOLTAGE OUTPUT(2)
CONDITIONS
MIN
TYP
MAX
UNIT
RL = 10 kΩ to GND, TA = –40°C to
125°C
Swing to V+ power-supply rail
Swing to GND
(V+) – 0.05
(V+) – 0.2
V
V
RL = 10 kΩ to GND, TA = –40°C to
125°C
(VGND) + 0.005 (VGND) + 0.05
FREQUENCY RESPONSE
CLOAD = 10 pF, INA210
CLOAD = 10 pF, INA211
CLOAD = 10 pF, INA212
CLOAD = 10 pF, INA213
CLOAD = 10 pF, INA214
CLOAD = 10 pF, INA215
14
7
kHz
kHz
kHz
kHz
kHz
kHz
V/μs
4
BW
SR
Bandwidth
Slew rate
80
30
40
0.4
NOISE, RTI(1)
Voltage noise density
POWER SUPPLY
25
nV/√Hz
VS
IQ
Operating voltage range
TA = –40°C to 125°C
VSENSE = 0 mV
2.7
26
V
Quiescent current
65
100
115
μA
μA
IQ over temperature
TA = –40°C to 125°C
TEMPERATURE RANGE
Specified range
–40
–55
125
150
°C
°C
Operating range
SC70
250
80
°C/W
°C/W
θJA
Thermal resistance
Thin UQFN
(2) See Typical Characteristic curve, Output Voltage Swing vs Output Current (Figure 10).
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7.6 Typical Characteristics
The INA210 is used for typical characteristics at TA = 25°C, VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
100
80
60
40
20
0
-20
-40
-60
-80
-100
-50
-25
0
25
50
75
100
125
150
Offset Voltage (mV)
Temperature (°C)
Figure 2. Offset Voltage vs Temperature
Figure 1. Input Offset Voltage Production Distribution
5
4
3
2
1
0
-1
-2
-3
-4
-5
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Common-Mode Rejection Ratio (mV/V)
Figure 4. Common-Mode Rejection Ratio vs Temperature
Figure 3. Common-Mode Rejection Production Distribution
1.0
20 Typical Units Shown
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
-1.0
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Gain Error (%)
Figure 6. Gain Error vs Temperature
Figure 5. Gain Error Production Distribution
8
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SBOS437G –MAY 2008–REVISED JULY 2014
Typical Characteristics (continued)
The INA210 is used for typical characteristics at TA = 25°C, VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
70
60
50
40
30
20
10
0
160
140
120
100
80
INA211
INA212
INA213
INA210
INA215
INA214
60
VS = +5V + 250mV Sine Disturbance
VCM = 0V
40
VCM = 0V
20
VDIF = Shorted
VDIF = 15mVPP Sine
VREF = 2.5V
0
-10
1
10
100
1k
10k
100k
10
100
1k
10k
100k
1M
10M
Frequency (Hz)
Frequency (Hz)
Figure 7. Gain vs Frequency
Figure 8. Power-Supply Rejection Ratio vs Frequency
160
140
120
100
80
V+
(V+) - 0.5
VS = 5V to 26V
(V+) - 1
(V+) - 1.5
(V+) - 2
VS = 2.7V
to 26V
(V+) - 2.5
(V+) - 3
VS = 2.7V
GND + 3
GND + 2.5
GND + 2
GND + 1.5
GND + 1
GND + 0.5
GND
60
VS = +5V
40
TA = -40C
VCM = 1V Sine
VDIF = Shorted
VREF = 2.5V
TA = +25C
20
VS = 2.7V to 26V
TA = +125C
0
1
10
100
1k
10k
100k
1M
0
5
10
15
20
25
30
35
40
Frequency (Hz)
Output Current (mA)
Figure 9. Common-Mode Rejection Ratio vs Frequency
Figure 10. Output Voltage Swing vs Output Current
30
50
25
20
15
10
5
IB+, IB-, VREF = 0V
and
40
IB+, IB-, VREF = 0V
IB-, VREF = 2.5V
30
20
IB+, IB-, VREF = 2.5V
10
IB+, VREF = 2.5V
0
0
-10
-5
0
5
10
15
20
25
30
0
5
10
15
20
25
30
Common-Mode Voltage (V)
Common-Mode Voltage (V)
Figure 12. Input Bias Current vs Common-Mode Voltage
with Supply Voltage = 0 V (Shutdown)
Figure 11. Input Bias Current vs Common-Mode Voltage
with Supply Voltage = 5 V
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Typical Characteristics (continued)
The INA210 is used for typical characteristics at TA = 25°C, VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
35
30
25
20
15
10
5
100
90
80
70
60
50
40
30
20
10
0
0
-50
-25
0
25
50
75
100
125
150
-50
-25
0
25
50
75
100
125
150
Temperature (°C)
Temperature (°C)
Figure 13. Input Bias Current vs Temperature
Figure 14. Quiescent Current vs Temperature
100
10
1
INA212
INA215
INA213
INA214
INA210
INA211
VS = ±2.5V
VCM = 0V
VDIF = 0V
VREF = 0V
VS = ±2.5V
VREF = 0V
VIN-, VIN+ = 0V
Time (1s/div)
10
100
1k
Frequency (Hz)
10k
100k
Figure 15. Input-Referred Voltage Noise vs Frequency
Figure 16. 0.1-Hz to 10-Hz Voltage Noise (Referred-To-Input)
Common Voltage Step
2VPP Output Signal
0V
10mVPP Input Signal
Output Voltage
0V
Time (50ms/div)
Time (100ms/div)
Figure 18. Common-Mode Voltage Transient Response
Figure 17. Step Response (10-mVPP Input Step)
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Typical Characteristics (continued)
The INA210 is used for typical characteristics at TA = 25°C, VS = 5 V, VIN+ = 12 V, and VREF = VS / 2, unless otherwise noted.
Inverting Input Overload
Noninverting Input Overload
Output
Output
0V
0V
VS = 5V, VCM = 12V, VREF = 2.5V
VS = 5V, VCM = 12V, VREF = 2.5V
Time (250ms/div)
Time (250ms/div)
Figure 19. Inverting Differential Input Overload
Figure 20. Noninverting Differential Input Overload
Supply Voltage
Supply Voltage
Output Voltage
Output Voltage
0V
VS = 5V, 1kHz Step with VDIFF = 0V, VREF = 2.5V
VS = 5V, 1kHz Step with VDIFF = 0V, VREF = 2.5V
0V
Time (100ms/div)
Time (100ms/div)
Figure 21. Start-Up Response
Figure 22. Brownout Recovery
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8 Detailed Description
8.1 Overview
The INA210-INA215 are 26-V, common-mode, zero-drift topology, current-sensing amplifiers that can be used in
both low-side and high-side configurations. These specially-designed, current-sensing amplifiers are able to
accurately measure voltages developed across current-sensing resistors on common-mode voltages that far
exceed the supply voltage powering the device. Current can be measured on input voltage rails as high as 26 V
while the device can be powered from supply voltages as low as 2.7 V.
The zero-drift topology enables high-precision measurements with maximum input offset voltages as low as
35 µV with a maximum temperature contribution of 0.5 µV/°C over the full temperature range of –40°C to 125°C.
8.2 Functional Block Diagram
V+
IN-
-
OUT
IN+
+
REF
GND
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8.3 Feature Description
8.3.1 Basic Connections
Figure 23 shows the basic connections of the INA210-INA215. The input pins, IN+ and IN–, should be connected
as closely as possible to the shunt resistor to minimize any resistance in series with the shunt resistor.
RSHUNT
Power
Supply
Load
5V Supply
CBYPASS
0.1µF
V+
IN-
-
OUT
Micro-
controller
ADC
+
IN+
REF
GND
Figure 23. Typical Application
Power-supply bypass capacitors are required for stability. Applications with noisy or high-impedance power
supplies may require additional decoupling capacitors to reject power-supply noise. Connect bypass capacitors
close to the device pins.
On the RSW package options, two pins are provided for each input. These pins should be tied together (that is,
tie IN+ to IN+ and tie IN– to IN–).
8.3.2 Selecting RS
The zero-drift offset performance of the INA210-INA215 offers several benefits. Most often, the primary
advantage of the low offset characteristic enables lower full-scale drops across the shunt. For example, non-
zero-drift current shunt monitors typically require a full-scale range of 100 mV.
The INA210-INA215 series gives equivalent accuracy at a full-scale range on the order of 10 mV. This accuracy
reduces shunt dissipation by an order of magnitude with many additional benefits.
Alternatively, there are applications that must measure current over a wide dynamic range that can take
advantage of the low offset on the low end of the measurement. Most often, these applications can use the lower
gains of the INA213, INA214 or INA215 to accommodate larger shunt drops on the upper end of the scale. For
instance, an INA213 operating on a 3.3-V supply could easily handle a full-scale shunt drop of 60 mV, with only
100 μV of offset.
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8.4 Device Functional Modes
8.4.1 Input Filtering
An obvious and straightforward filtering location is at the device output. However, this location negates the
advantage of the low output impedance of the internal buffer. The only other filtering option is at the device input
pins. This location, though, does require consideration of the ±30% tolerance of the internal resistances.
Figure 24 shows a filter placed at the inputs pins.
V+
VCM
RS < 10W
RINT
VOUT
RSHUNT
Bias
CF
RS < 10W
VREF
RINT
Load
Figure 24. Filter at Input Pins
The addition of external series resistance, however, creates an additional error in the measurement so the value
of these series resistors should be kept to 10Ω or less if possible to reduce impact to accuracy. The internal bias
network shown in Figure 24 present at the input pins creates a mismatch in input bias currents when a
differential voltage is applied between the input pins. If additional external series filter resistors are added to the
circuit, the mismatch in bias currents results in a mismatch of voltage drops across the filter resistors. This
mismatch creates a differential error voltage that subtracts from the voltage developed at the shunt resistor. This
error results in a voltage at the device input pins that is different than the voltage developed across the shunt
resistor. Without the additional series resistance, the mismatch in input bias currents has little effect on device
operation. The amount of error these external filter resistor add to the measurement can be calculated using
Equation 2 where the gain error factor is calculated using Equation 1.
The amount of variance in the differential voltage present at the device input relative to the voltage developed at
the shunt resistor is based both on the external series resistance value as well as the internal input resistors, R3
and R4 (or RINT as shown in Figure 24). The reduction of the shunt voltage reaching the device input pins
appears as a gain error when comparing the output voltage relative to the voltage across the shunt resistor. A
factor can be calculated to determine the amount of gain error that is introduced by the addition of external series
resistance. The equation used to calculate the expected deviation from the shunt voltage to what is seen at the
device input pins is given in Equation 1:
(1250 ´ RINT
)
Gain Error Factor =
(1250 ´ RS) + (1250 ´ RINT) + (RS ´ RINT
)
where:
•
•
RINT is the internal input resistor (R3 and R4), and
RS is the external series resistance.
(1)
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Device Functional Modes (continued)
With the adjustment factor equation including the device internal input resistance, this factor varies with each
gain version, as shown in Table 1. Each individual device gain error factor is shown in Table 2.
Table 1. Input Resistance
PRODUCT
INA210
INA211
INA212
INA213
INA214
INA215
GAIN
200
500
1000
50
RINT (kΩ)
5
2
1
20
10
13.3
100
75
Table 2. Device Gain Error Factor
PRODUCT
SIMPLIFIED GAIN ERROR FACTOR
1000
INA210
RS + 1000
10,000
INA211
INA212
INA213
INA214
INA215
(13 ´ RS) + 10,000
5000
(9 ´ RS) + 5000
20,000
(17 ´ RS) + 20,000
10,000
(9 ´ RS) + 10,000
8,000
x
(7 RS) + 8,000
The gain error that can be expected from the addition of the external series resistors can then be calculated
based on Equation 2:
Gain Error (%) = 100 - (100 ´ Gain Error Factor)
(2)
For example, using an INA212 and the corresponding gain error equation from Table 2, a series resistance of
10 Ω results in a gain error factor of 0.982. The corresponding gain error is then calculated using Equation 2,
resulting in a gain error of approximately 1.77% solely because of the external 10-Ω series resistors. Using an
INA213 with the same 10-Ω series resistor results in a gain error factor of 0.991 and a gain error of 0.84% again
solely because of these external resistors.
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8.4.2 Shutting Down the INA210-INA215 Series
While the INA210-INA215 series does not have a shutdown pin, its low power consumption allows powering from
the output of a logic gate or transistor switch that can turn on and turn off the INA210-INA215 power-supply
quiescent current.
However, in current shunt monitoring applications. there is also a concern for how much current is drained from
the shunt circuit in shutdown conditions. Evaluating this current drain involves considering the simplified
schematic of the INA210-INA215 in shutdown mode shown in Figure 25.
RSHUNT
Supply
Load
Reference
Voltage
INA21x
Output
OUT
REF
R3
1 MW
IN-
GND
Shutdown
Control
IN+
V+
PRODUCT
R3 and R4
R4
1 MW
INA210
INA211
INA212
INA213
INA214
INA215
5 kW
2 kW
1 kW
CBYPASS
20 kW
10 kW
13.3 kW
NOTE: 1-MΩ paths from shunt inputs to reference and INA21x outputs.
Figure 25. Basic Circuit for Shutting Down the INA210-INA215 with a Grounded Reference
Note that there is typically slightly more than 1-MΩ impedance (from the combination of 1-MΩ feedback and
5-kΩ input resistors) from each input of the INA210-INA215 to the OUT pin and to the REF pin. The amount of
current flowing through these pins depends on the respective ultimate connection. For example, if the REF pin is
grounded, the calculation of the effect of the 1-MΩ impedance from the shunt to ground is straightforward.
However, if the reference or op amp is powered while the INA210-INA215 is shut down, the calculation is direct;
instead of assuming 1 MΩ to ground, however, assume 1 MΩ to the reference voltage. If the reference or op
amp is also shut down, some knowledge of the reference or op amp output impedance under shutdown
conditions is required. For instance, if the reference source behaves as an open circuit when is not powered, little
or no current flows through the 1-MΩ path.
Regarding the 1-MΩ path to the output pin, the output stage of a disabled INA210-INA215 does constitute a
good path to ground; consequently, this current is directly proportional to a shunt common-mode voltage
impressed across a 1-MΩ resistor.
As a final note, when the device is powered up, there is an additional, nearly constant, and well-matched 25 μA
that flows in each of the inputs as long as the shunt common-mode voltage is 3 V or higher. Below 2-V common-
mode, the only current effects are the result of the 1-MΩ resistors.
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8.4.3 REF Input Impedance Effects
As with any difference amplifier, the INA210-INA215 series common-mode rejection ratio is affected by any
impedance present at the REF input. This concern is not a problem when the REF pin is connected directly to
most references or power supplies. When using resistive dividers from the power supply or a reference voltage,
the REF pin should be buffered by an op amp.
In systems where the INA210-INA215 output can be sensed differentially, such as by a differential input analog-
to-digital converter (ADC) or by using two separate ADC inputs, the effects of external impedance on the REF
input can be cancelled. Figure 26 depicts a method of taking the output from the INA210-INA215 by using the
REF pin as a reference.
RSHUNT
Load
Supply
ADC
INA21x
Output
OUT
REF
R1
R3
IN-
GND
+2.7V to +26V
IN+
V+
R2
R4
CBYPASS
0.01mF
to
0.1mF
Figure 26. Sensing the INA210-INA215 to Cancel the Effects of Impedance on the REF Input
8.4.4 Using The INA210-INA215 with Common-Mode Transients Above 26 V
With a small amount of additional circuitry, the INA210-INA215 series can be used in circuits subject to transients
higher than 26 V, such as automotive applications. Use only zener diode or zener-type transient absorbers
(sometimes referred to as Transzorbs)—any other type of transient absorber has an unacceptable time delay.
Start by adding a pair of resistors as a working impedance for the zener; see Figure 27. Keeping these resistors
as small as possible is preferable, most often around 10 Ω. Larger values can be used with an effect on gain that
is discussed in the Input Filtering section. Because this circuit is limiting only short-term transients, many
applications are satisfied with a 10-Ω resistor along with conventional zener diodes of the lowest power rating
that can be found. This combination uses the least amount of board space. These diodes can be found in
packages as small as SOT-523 or SOD-523.
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RSHUNT
Supply
Load
RPROTECT
10W
RPROTECT
10W
Reference
Voltage
Output
INA21x
OUT
REF
R3
1MW
IN-
GND
V+
IN+
Shutdown
Control
1MW
R4
CBYPASS
Figure 27. INA210-INA215 Transient Protection using Dual Zener Diodes
In the event that low-power zeners do not have sufficient transient absorption capability and a higher power
transzorb must be used, the most package-efficient solution then involves using a single transzorb and back-to-
back diodes between the device inputs. The most space-efficient solutions are dual series-connected diodes in a
single SOT-523 or SOD-523 package. This method is shown in Figure 28. In either of these examples, the total
board area required by the INA210-INA215 with all protective components is less than that of an SO-8 package,
and only slightly greater than that of an MSOP-8 package.
RSHUNT
Supply
Load
RPROTECT
10W
RPROTECT
10W
Reference
Voltage
Output
INA21x
OUT
REF
R3
1MW
1MW
IN-
GND
V+
IN+
Shutdown
Control
R4
CBYPASS
Figure 28. INA210-INA215 Transient Protection using a Single Transzorb and Input Clamps
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8.4.5 Improving Transient Robustness
Applications involving large input transients with excessive dV/dt above 2 kV per microsecond present at the
device input pins may cause damage to the internal ESD structures on version A devices. This potential damage
is a result of the internal latching of the ESD structure to ground when this transient occurs at the input. With
significant current available in most current-sensing applications, the large current flowing through the input
transient-triggered, ground-shorted ESD structure quickly results in damage to the silicon. External filtering can
be used to attenuate the transient signal prior to reaching the inputs to avoid the latching condition. Care must be
taken to ensure that external series input resistance does not significantly impact gain error accuracy. For
accuracy purposes, these resistances should be kept under 10 Ω if possible. Ferrite beads are recommended for
this filter because of their inherently low dc ohmic value. Ferrite beads with less than 10 Ω of resistance at dc
and over 600 Ω of resistance at 100 MHz to 200 MHz are recommended. The recommended capacitor values for
this filter are between 0.01 µF and 0.1 µF to ensure adequate attenuation in the high-frequency region. This
protection scheme is shown in Figure 29.
Shunt
Reference
Voltage
Load
Supply
Output
Device
OUT
REF
1MW
R3
R4
IN-
GND
-
MMZ1608B601C
IN+
V+
+2.7V to +26V
1MW
0.01mF
to 0.1mF
0.01mF
to 0.1mF
Figure 29. Transient Protection
To minimize the cost of adding these external components to protect the device in applications where large
transient signals may be present, version B devices are now available with new ESD structures that are not
susceptible to this latching condition. Version B devices are incapable of sustaining these damage causing
latched conditions so they do not have the same sensitivity to the transients that the version A devices have,
thus making the version B devices a better fit for these applications.
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9 Application and Implementation
9.1 Application Information
The INA210-INA215 measure the voltage developed across a current-sensing resistor when current passes
through it. The ability to drive the reference pin to adjust the functionality of the output signal offers multiple
configurations, as discussed throughout this section.
9.2 Typical Applications
9.2.1 Unidirectional Operation
Load
5V Supply
CBYPASS
0.1µF
V+
IN-
-
Output
OUT
REF
+
IN+
GND
Figure 30. Unidirectional Application Schematic
9.2.1.1 Design Requirements
The device can be configured to monitor current flowing in one direction (unidirectional) or in both directions
(bidirectional) depending on how the REF pin is configured. The most common case is unidirectional where the
output is set to ground when no current is flowing by connecting the REF pin to ground, as shown in Figure 30.
When the input signal increases, the output voltage at the OUT pin increases.
9.2.1.2 Detailed Design Procedure
The linear range of the output stage is limited in how close the output voltage can approach ground under zero
input conditions. In unidirectional applications where measuring very low input currents is desirable, bias the REF
pin to a convenient value above 50 mV to get the output into the linear range of the device. To limit common-
mode rejection errors, TI recommends buffering the reference voltage connected to the REF pin.
A less frequently-used output biasing method is to connect the REF pin to the supply voltage, V+. This method
results in the output voltage saturating at 200 mV below the supply voltage when no differential input signal is
present. This method is similar to the output saturated low condition with no input signal when the REF pin is
connected to ground. The output voltage in this configuration only responds to negative currents that develop
negative differential input voltage relative to the device IN– pin. Under these conditions, when the differential
input signal increases negatively, the output voltage moves downward from the saturated supply voltage. The
voltage applied to the REF pin must not exceed the device supply voltage.
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Typical Applications (continued)
9.2.1.3 Application Curve
An example output response of a unidirectional configuration is shown in Figure 31. With the REF pin connected
directly to ground, the output voltage is biased to this zero output level. The output rises above the reference
voltage for positive differential input signals but cannot fall below the reference voltage for negative differential
input signals because of the grounded reference voltage.
0V
Output
VREF
Time(500 µs /div)
C001
Figure 31. Unidirectional Application Output Response
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Typical Applications (continued)
9.2.2 Bidirectional Operation
Load
5V Supply
V+
CBYPASS
0.1µF
IN-
Reference
Voltage
-
Output
OUT
+
+
IN+
REF
-
GND
Figure 32. Bidirectional Application Schematic
9.2.2.1 Design Requirements
The device is a bidirectional, current-sense amplifier capable of measuring currents through a resistive shunt in
two directions. This bidirectional monitoring is common in applications that include charging and discharging
operations where the current flow-through resistor can change directions.
9.2.2.2 Detailed Design Procedure
The ability to measure this current flowing in both directions is enabled by applying a voltage to the REF pin, as
shown in Figure 32. The voltage applied to REF (VREF) sets the output state that corresponds to the zero-input
level state. The output then responds by increasing above VREF for positive differential signals (relative to the IN–
pin) and responds by decreasing below VREF for negative differential signals. This reference voltage applied to
the REF pin can be set anywhere between 0 V to V+. For bidirectional applications, VREF is typically set at mid-
scale for equal signal range in both current directions. In some cases, however, VREF is set at a voltage other
than mid-scale when the bidirectional current and corresponding output signal do not need to be symmetrical.
9.2.2.3 Application Curve
An example output response of a bidirectional configuration is shown in Figure 33. With the REF pin connected
to a reference voltage, 2.5 V in this case, the output voltage is biased upwards by this reference level. The
output rises above the reference voltage for positive differential input signals and falls below the reference
voltage for negative differential input signals.
VOUT
VREF
0V
Time (500 µs/div)
C002
Figure 33. Bidirectional Application Output Response
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10 Power Supply Recommendations
The input circuitry of the INA210-INA215 can accurately measure beyond its power-supply voltage, V+. For
example, the V+ power supply can be 5 V, whereas the load power-supply voltage can be as high as 26 V.
However, the output voltage range of the OUT pin is limited by the voltages on the power-supply pin. Note also
that the INA210-INA215 can withstand the full input signal range up to 26 V at the input pins, regardless of
whether the device has power applied or not.
11 Layout
11.1 Layout Guidelines
•
Connect the input pins to the sensing resistor using a Kelvin or 4-wire connection. This connection technique
ensures that only the current-sensing resistor impedance is detected between the input pins. Poor routing of
the current-sensing resistor commonly results in additional resistance present between the input pins. Given
the very low ohmic value of the current resistor, any additional high-current carrying impedance can cause
significant measurement errors.
•
The power-supply bypass capacitor should be placed as closely as possible to the supply and ground pins.
The recommended value of this bypass capacitor is 0.1 μF. Additional decoupling capacitance can be added
to compensate for noisy or high-impedance power supplies.
11.2 Layout Example
Output Signal
Trace
VIA to Power or
Ground Plane
VIA to Ground
Plane
Supply
Voltage
Supply Bypass
Capacitor
Figure 34. Recommended Layout
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12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
For related documentation see the following:
•
INA210-215EVM User's Guide, SBOU065
12.2 Related Links
The table below lists quick access links. Categories include technical documents, support and community
resources, tools and software, and quick access to sample or buy.
Table 3. Related Links
TECHNICAL
DOCUMENTS
TOOLS &
SOFTWARE
SUPPORT &
COMMUNITY
PARTS
PRODUCT FOLDER
SAMPLE & BUY
INA210
INA211
INA212
INA213
INA214
INA215
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
Click here
12.3 Trademarks
All trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
12.5 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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24-Jul-2014
PACKAGING INFORMATION
Orderable Device
INA210AIDCKR
INA210AIDCKRG4
INA210AIDCKT
INA210AIDCKTG4
INA210AIRSWR
INA210AIRSWT
INA210BIDCKR
INA210BIDCKT
INA210BIRSWR
INA210BIRSWT
INA211AIDCKR
INA211AIDCKRG4
INA211AIDCKT
INA211AIDCKTG4
INA211BIDCKR
INA211BIDCKT
INA212AIDCKR
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
ACTIVE
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
SC70
SC70
SC70
SC70
DCK
6
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
CET
CET
CET
CET
KNJ
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
DCK
DCK
DCK
DCK
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
250
Green (RoHS
& no Sb/Br)
10
10
6
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
(KNJ ~ NSJ)
SED
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
SED
10
10
6
3000
250
Green (RoHS
& no Sb/Br)
SHQ
SHQ
CEU
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
CEU
6
Green (RoHS
& no Sb/Br)
CEU
6
250
Green (RoHS
& no Sb/Br)
CEU
6
3000
250
Green (RoHS
& no Sb/Br)
SEE
6
Green (RoHS
& no Sb/Br)
SEE
6
3000
Green (RoHS
& no Sb/Br)
CEV
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
INA212AIDCKRG4
INA212AIDCKT
INA212AIDCKTG4
INA212BIDCKR
INA212BIDCKT
INA213AIDCKR
INA213AIDCKRG4
INA213AIDCKT
INA213AIDCKTG4
INA213AIRSWR
INA213AIRSWT
INA213BIDCKR
INA213BIDCKT
INA213BIRSWR
INA213BIRSWT
INA214AIDCKR
INA214AIDCKRG4
INA214AIDCKT
ACTIVE
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
DCK
6
6
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
CEV
CEV
CEV
SEC
SEC
CFT
CFT
CFT
CFT
KPJ
KPJ
SEF
SEF
SHT
SHT
CFV
CFV
CFV
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
250
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
3000
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
250
Green (RoHS
& no Sb/Br)
10
10
6
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
10
10
6
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2014
Orderable Device
Status Package Type Package Pins Package
Eco Plan
Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(6)
(3)
(4/5)
INA214AIDCKTG4
INA214AIRSWR
INA214AIRSWT
INA214BIDCKR
INA214BIDCKT
INA214BIRSWR
INA214BIRSWT
INA215AIDCKR
INA215AIDCKT
ACTIVE
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
DCK
6
10
10
6
250
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
CFV
KRJ
KRJ
SEA
SEA
SHU
SHU
SME
SME
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
10
10
6
3000
250
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
3000
250
Green (RoHS
& no Sb/Br)
6
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
24-Jul-2014
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF INA212, INA214 :
Automotive: INA212-Q1, INA214-Q1
•
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
•
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2015
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
INA210AIDCKR
INA210AIDCKR
INA210AIDCKT
INA210AIDCKT
INA210AIRSWR
INA210AIRSWT
INA210BIDCKR
INA210BIDCKT
INA210BIRSWR
INA210BIRSWT
INA211AIDCKR
INA211AIDCKT
INA211AIDCKT
INA211BIDCKR
INA211BIDCKT
INA212AIDCKR
INA212BIDCKR
INA212BIDCKT
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
6
6
3000
3000
250
179.0
178.0
179.0
178.0
179.0
179.0
178.0
178.0
179.0
179.0
180.0
180.0
179.0
178.0
178.0
180.0
178.0
178.0
8.4
9.0
8.4
9.0
8.4
8.4
9.0
9.0
8.4
8.4
8.4
8.4
8.4
9.0
9.0
8.4
9.0
9.0
2.2
2.4
2.2
2.4
1.7
1.7
2.4
2.4
1.7
1.7
2.47
2.47
2.2
2.4
2.4
2.47
2.4
2.4
2.5
2.5
2.5
2.5
2.1
2.1
2.5
2.5
2.1
2.1
2.3
2.3
2.5
2.5
2.5
2.3
2.5
2.5
1.2
1.2
1.2
1.2
0.7
0.7
1.2
1.2
0.7
0.7
1.25
1.25
1.2
1.2
1.2
1.25
1.2
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
Q1
Q1
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
6
6
250
10
10
6
3000
250
3000
250
6
10
10
6
3000
250
3000
250
6
6
250
6
3000
250
6
6
3000
3000
250
6
6
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2015
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
INA213AIDCKR
INA213AIDCKR
INA213AIDCKT
INA213AIDCKT
INA213AIRSWR
INA213AIRSWT
INA213BIDCKR
INA213BIDCKT
INA213BIRSWR
INA213BIRSWT
INA214AIDCKR
INA214AIDCKR
INA214AIDCKT
INA214AIDCKT
INA214AIRSWR
INA214AIRSWT
INA214BIDCKR
INA214BIDCKT
INA214BIRSWR
INA214BIRSWT
INA215AIDCKR
INA215AIDCKT
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
6
6
3000
3000
250
179.0
178.0
178.0
179.0
179.0
179.0
178.0
178.0
179.0
179.0
178.0
179.0
179.0
178.0
179.0
179.0
178.0
178.0
179.0
179.0
178.0
178.0
8.4
9.0
9.0
8.4
8.4
8.4
9.0
9.0
8.4
8.4
9.0
8.4
8.4
9.0
8.4
8.4
9.0
9.0
8.4
8.4
8.4
9.0
2.2
2.4
2.4
2.2
1.7
1.7
2.4
2.4
1.7
1.7
2.4
2.2
2.2
2.4
1.7
1.7
2.4
2.4
1.7
1.7
2.4
2.4
2.5
2.5
2.5
2.5
2.1
2.1
2.5
2.5
2.1
2.1
2.5
2.5
2.5
2.5
2.1
2.1
2.5
2.5
2.1
2.1
2.5
2.5
1.2
1.2
1.2
1.2
0.7
0.7
1.2
1.2
0.7
0.7
1.2
1.2
1.2
1.2
0.7
0.7
1.2
1.2
0.7
0.7
1.2
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
Q1
Q1
Q3
Q3
Q3
Q3
Q1
Q1
Q3
Q3
Q1
Q1
Q3
Q3
6
6
250
10
10
6
3000
250
3000
250
6
10
10
6
3000
250
3000
3000
250
6
6
6
250
10
10
6
3000
250
3000
250
6
10
10
6
3000
250
3000
250
6
Pack Materials-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2015
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
INA210AIDCKR
INA210AIDCKR
INA210AIDCKT
INA210AIDCKT
INA210AIRSWR
INA210AIRSWT
INA210BIDCKR
INA210BIDCKT
INA210BIRSWR
INA210BIRSWT
INA211AIDCKR
INA211AIDCKT
INA211AIDCKT
INA211BIDCKR
INA211BIDCKT
INA212AIDCKR
INA212BIDCKR
INA212BIDCKT
INA213AIDCKR
INA213AIDCKR
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
SC70
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
DCK
6
6
3000
3000
250
195.0
180.0
195.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
223.0
223.0
195.0
180.0
180.0
223.0
180.0
180.0
195.0
180.0
200.0
180.0
200.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
270.0
270.0
200.0
180.0
180.0
270.0
180.0
180.0
200.0
180.0
45.0
18.0
45.0
18.0
35.0
35.0
18.0
18.0
35.0
35.0
35.0
35.0
45.0
18.0
18.0
35.0
18.0
18.0
45.0
18.0
6
6
250
10
10
6
3000
250
3000
250
6
10
10
6
3000
250
3000
250
6
6
250
6
3000
250
6
6
3000
3000
250
6
6
6
3000
3000
6
Pack Materials-Page 3
PACKAGE MATERIALS INFORMATION
www.ti.com
5-Nov-2015
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
INA213AIDCKT
INA213AIDCKT
INA213AIRSWR
INA213AIRSWT
INA213BIDCKR
INA213BIDCKT
INA213BIRSWR
INA213BIRSWT
INA214AIDCKR
INA214AIDCKR
INA214AIDCKT
INA214AIDCKT
INA214AIRSWR
INA214AIRSWT
INA214BIDCKR
INA214BIDCKT
INA214BIRSWR
INA214BIRSWT
INA215AIDCKR
INA215AIDCKT
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
SC70
SC70
UQFN
UQFN
SC70
SC70
UQFN
UQFN
SC70
SC70
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
DCK
DCK
RSW
RSW
DCK
DCK
RSW
RSW
DCK
DCK
6
6
250
250
180.0
195.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
195.0
195.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
340.0
340.0
180.0
200.0
203.0
203.0
180.0
180.0
203.0
203.0
180.0
200.0
200.0
180.0
203.0
203.0
180.0
180.0
203.0
203.0
340.0
340.0
18.0
45.0
35.0
35.0
18.0
18.0
35.0
35.0
18.0
45.0
45.0
18.0
35.0
35.0
18.0
18.0
35.0
35.0
38.0
38.0
10
10
6
3000
250
3000
250
6
10
10
6
3000
250
3000
3000
250
6
6
6
250
10
10
6
3000
250
3000
250
6
10
10
6
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