DRV103U [TI]

PWM LOW-SIDE DRIVER (1.5A and 3A) for Solenoids, Coils, Valves, Heaters, and Lamps; PWM低侧驱动器( 1.5A和3A)的螺线管,线圈,阀,发热器和灯
DRV103U
型号: DRV103U
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

PWM LOW-SIDE DRIVER (1.5A and 3A) for Solenoids, Coils, Valves, Heaters, and Lamps
PWM低侧驱动器( 1.5A和3A)的螺线管,线圈,阀,发热器和灯

外围驱动器 驱动程序和接口 接口集成电路 光电二极管
文件: 总17页 (文件大小:445K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
DRV103  
D
R
V
1
0
3
D
R
V
1
0
3
SBVS029A – JUNE 2001  
PWM LOW-SIDE DRIVER (1.5A and 3A)  
for Solenoids, Coils, Valves, Heaters, and Lamps  
DESCRIPTION  
FEATURES  
The DRV103 is a low-side DMOS power switch employing  
a pulse-width modulated (PWM) output. Its rugged design is  
optimized for driving electromechanical devices such as  
valves, solenoids, relays, actuators, motors, and positioners.  
The DRV103 is also ideal for driving thermal devices such  
as heaters, coolers, and lamps. PWM operation conserves  
power and reduces heat rise, resulting in higher reliability. In  
addition, adjustable PWM allows fine control of the power  
delivered to the load. DC-to-PWM output delay time and  
oscillator frequency are also externally adjustable.  
HIGH OUTPUT DRIVE: 1.5A and 3A Versions  
WIDE SUPPLY RANGE: +8V to +32V  
COMPLETE FUNCTION  
Digitally Controlled Input  
PWM Output  
Adjustable Internal Oscillator: 500Hz to 100kHz  
Adjustable Delay and Duty Cycle  
FULLY PROTECTED  
Thermal and Current Limit Shutdown with  
Status OK Indicator Flag  
The DRV103 can be set to provide a strong initial closure,  
automatically switching to a “soft” hold mode for power  
savings. A resistor, analog voltage, or Digital-to-Analog  
(D/A) converter can control the duty cycle. An output OK flag  
indicates when thermal shutdown or over current occurs.  
PACKAGES: SO-8 and PowerPAD™ SO-8  
APPLICATIONS  
ELECTROMECHANICAL DRIVER:  
Two packages provide a choice of output current:  
1.5A (SO-8) or 3A (PowerPAD™ SO-8 with exposed metal  
heat sink).  
Solenoids, Valves, Positioners, Actuators,  
Relays, Power Contactor Coils, Heaters, Lamps  
HYDRAULIC AND PNEUMATICS SYSTEMS  
PART HANDLERS AND SORTERS  
CHEMICAL PROCESSING  
The DRV103 is specified for –40°C to +85°C.  
ENVIRONMENTAL MONITORING AND HVAC  
THERMOELECTRIC COOLERS  
Status OK  
Flag  
+VS  
DC MOTOR SPEED CONTROLS  
MEDICAL AND SCIENTIFIC ANALYZERS  
FUEL INJECTOR DRIVERS  
Flyback  
Diode  
Load  
DRV103  
ESD  
Thermal Shutdown  
Over Current  
DMOS  
OUT  
GND  
PowerPAD is a trademark of Texas Instruments.  
VREF  
Oscillator  
PWM  
DMOS  
Input  
On  
Off  
Delay  
Delay  
Osc Freq  
Duty Cycle  
Adj  
Adj  
Adj  
RFREQ  
RPWM  
CD  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
PRODUCTION DATA information is current as of publication date.  
Copyright © 2001, Texas Instruments Incorporated  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
www.ti.com  
PACKAGE/ORDERING INFORMATION  
PACKAGE  
DRAWING  
NUMBER  
SPECIFIED  
TEMPERATURE  
RANGE  
PACKAGE  
MARKING  
ORDERING  
NUMBER(1)  
TRANSPORT  
MEDIA  
PRODUCT  
PACKAGE  
DRV103U  
"
SO-8  
"
182  
"
–40°C to +85°C  
DRV103U  
"
DRV103U  
DRV103U/2K5  
Rails  
Tape and Reel  
"
DRV103H  
"
PowerPAD™ SO-8  
"
DDA  
"
–40°C to +85°C  
DRV103H  
"
DRV103H  
DRV103H/2K5  
Rails  
Tape and Reel  
"
NOTES: (1) Models with a slash (/) are available only in Tape and Reel in the quantities indicated (e.g., /2K5 indicates 2500 devices per reel). Ordering 2500  
pieces of “DRV103U/2K5” will get a single 2500-piece Tape and Reel.  
ABSOLUTE MAXIMUM RATINGS(1)  
ELECTROSTATIC  
DISCHARGE SENSITIVITY  
Supply Voltage, VS(2) ......................................................................... +40V  
Input Voltage .................................................................. –0.2V to +5.5V(3)  
PWM Adjust Input .......................................................... –0.2V to +5.5V(3)  
This integrated circuit can be damaged by ESD. Texas Instru-  
ments recommends that all integrated circuits be handled with  
appropriate precautions. Failure to observe proper handling  
and installation procedures can cause damage.  
Delay Adjust Input .......................................................... –0.2V to +5.5V(3)  
Frequency Adjust Input .................................................. –0.2V to +5.5V(3)  
Status OK Flag and OUT .................................................... –0.2V to VS  
Operating Temperature Range ......................................55°C to +125°C  
Storage Temperature Range .........................................65°C to +150°C  
Junction Temperature .................................................................... +150°C  
Lead Temperature (soldering, 10s)............................................... +300°C  
(4)  
ESD damage can range from subtle performance degradation  
to complete device failure. Precision integrated circuits may  
be more susceptible to damage because very small parametric  
changes could cause the device not to meet its published  
specifications.  
NOTES: (1) Stresses above these ratings may cause permanent damage.  
Exposure to absolute maximum conditions for extended periods may de-  
grade device reliability. (2) See Bypassing section for discussion about  
operating near maximum supply voltage. (3) Higher voltage may be applied  
if current is limited to 2mA. (4) The Status OK Flag will internally current limit  
at about 10mA.  
DRV103  
2
SBVS029A  
ELECTRICAL CHARACTERISTICS  
At TC = +25°C, VS = +24V, Load = 100, and 4.99k“OK Flag” pullup to +5V, Delay Adj Capacitor = 100pF to Ground, Freq Adj Resistor = 205kto Ground,  
Duty Cycle Adj Resistor = 137kto Ground, unless otherwise noted.  
DRV103U, H  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNITS  
OUTPUT  
Output Current(1)  
SO-8 Package (U)  
PowerPAD™ SO-8 Package (H)  
IO = 1A  
1.5  
3
A
A
Output Saturation Voltage, Source  
+0.4  
+0.05  
3.5  
+0.6  
+0.07  
4.2  
V
IO = 0.1A  
V
Current Limit(2), (10)  
Leakage Current  
3
A
DMOS Output Off, VO = +32V  
±1  
±10  
µA  
DIGITAL CONTROL INPUT(3)  
VCTR Low (output disabled)  
VCTR High (output enabled)  
ICTR Low (output disabled)  
ICTR High (output enabled)  
Propagation Delay  
0
+1.2  
+5.5  
1
V
V
+2.2  
VCTR = 0V  
VCTR = +5.5V  
0.01  
120  
1
µA  
µA  
µs  
150  
On-to-Off and Off-to-On  
DELAY TO PWM(4)  
DC to PWM Mode  
Delay Equation(5)  
See Note (6)  
s
Delay Time  
Minimum Delay Time(7)  
CD = 0.1µF  
CD = 0  
90  
110  
18  
140  
ms  
µs  
DUTY CYCLE ADJUST  
Duty Cycle Range  
Duty Cycle Accuracy  
vs Supply Voltage  
Nonlinearity(8)  
10 to 90  
%
%
50% Duty Cycle, 25kHz  
50% Duty Cycle, VS = VO = +8V to +32V  
10% to 90% Duty Cycle  
±2  
±2  
1
%
% FSR  
DYNAMIC RESPONSE  
Output Voltage Rise Time  
Output Voltage Fall Time  
Oscillator Frequency Range  
Oscillator Frequency  
VO = 10% to 90% of VS  
VO = 90% to 10% of VS  
External Adjust  
0.2  
0.2  
2
2
µs  
µs  
0.5 to 100  
25  
kHz  
kHz  
ROSC = 205kΩ  
20  
30  
OK FLAG  
Normal Operation  
Fault(90)  
20kPull-Up to +5V  
Sinking 1mA  
+4.5  
5.0  
+0.22  
2
V
V
+0.4  
Sink Current  
VOKFLAG = 0.4V  
mA  
µs  
Over-Current Flag: Set  
5
THERMAL SHUTDOWN  
Junction Temperature  
Shutdown  
+160  
+140  
°C  
°C  
Reset from Shutdown  
POWER SUPPLY  
Specified Operating Voltage  
Operating Voltage Range  
Quiescent Current  
+24  
0.4  
V
V
+8  
+32  
0.8  
IO = 0  
mA  
TEMPERATURE RANGE  
Specified Range  
–40  
–55  
–65  
+85  
+125  
+150  
°C  
°C  
°C  
Operating Range  
Storage Range  
Thermal Resistance, θJA  
SO-8 (U)  
PowerPAD™ SO-8 (H)(10)  
1in2 0.5oz. Copper on PCB  
1in2 0.5oz. Copper on PCB  
150  
68  
°C/W  
°C/W  
NOTES: (1) Output current is limited by internal current limit and by DRV103 power dissipation. (2) Output current resets to zero when current limit is reached.  
(3) Logic High enables output (normal operation). (4) Constant DC output to PWM (Pulse-Width Modulated) time. (5) Maximum delay is determined by an external  
capacitor. Pulling the Delay Adjust Pin LOW corresponds to an infinite (continuous) delay. (6) Delay to PWM  
CD •  
106 (CD in  
F • 1.1). (7) Connecting the Delay Adjust Pin to +5V reduces delay time to less than 1µs. (8) VIN at pin 3 to percent of duty cycle at pin 6. (9) OK Flag LOW indicates  
fault from over-temperature or over-current conditions. (10) PowerPAD™ SO-8 (H) package has highest continuous current (2A) because the chip operates at a  
lower junction temperature when underside metal tab is connected to a heat sink or heat spreader. θJA = 68°C/W measured on DRV103 demo board;  
θJA = 58°C/W measured on JEDEC standard test board. H package θJC = 16.7°C/W.  
DRV103  
SBVS029A  
3
PIN CONFIGURATION  
SO  
Top View  
Duty Cycle Adj  
Delay Adj  
1
2
3
4
8
7
6
5
Input  
Status OK Flag  
+VS  
Osc Freq Adj  
GND  
OUT  
PIN DESCRIPTIONS  
PIN #  
NAME  
DESCRIPTION  
Pin 1 Duty Cycle Adjust Internally, this pin connects to the input of a comparator and a (2.75 x IREF) current source from VS. The voltage at this node linearly  
sets the duty cycle. Duty cycle can be programmed with a resistor, analog voltage, or the voltage output of a D/A converter. The  
active voltage range is from 1.3V to 3.9V to facilitate the use of single-supply control electronics. At 3.56V, output duty cycle is near  
90%. At 1.5V, output duty cycle is near 10%.  
Pin 2  
Delay Adjust  
This pin sets the duration of the initial 100% duty cycle before the output goes into PWM mode. Leaving this pin floating results  
in a delay of approximately 18µs, which is internally limited by parasitic capacitance. Minimum delay may be reduced to less than  
1µs by tying the pin to 5V. This pin connects internally to a 3µA current source from VS and to a 2.6V threshold comparator. When  
the pin voltage is below 2.6V, the output device is 100% ON. The PWM oscillator is not synchronized to the Input (pin 1), so the  
duration of the first pulse may be any portion of the programmed duty cycle.  
Pin 3  
Oscillator  
PWM frequency is adjustable. A resistor to ground sets the current IREF and the internal PWM oscillator frequency. A range of 500Hz  
Frequency Adjust to 100kHz can be achieved with practical resistor values. Although oscillator frequency operation below 500Hz is possible, resistors  
higher than 10M will be required. The pin then becomes a very high impedance node and is, therefore, sensitive to noise pickup  
and PCB leakage currents.  
Pin 4  
Pin 5  
GND  
This pin must be connected to system ground for the DRV103 to function. It carries the 0.4mA quiescent current plus the full load  
current when the power DMOS transistor is switched on.  
OUT  
The output is the drain of a power DMOS transistor with its source connected to ground. Its low on-resistance (0.5typ) assures  
low power dissipation in the DRV103. Gate drive to the power device is controlled to provide a slew-rate limited rise and fall time.  
This reduces radiated RFI/EMI noise. A flyback diode is needed with inductive loads to conduct the load current during the off  
cycle. The external diode should be selected for low forward voltage and low storage time. The internal clamp diode (an ESD  
protection diode) provides some degree of back-EMF protection but it should not be used as a flyback diode.  
Pin 6  
Pin 7  
+VS  
This is the power supply pin. Operating range is +8V to +32V. +VS must be the supply voltage to the load.  
Status OK Flag  
Normally HIGH (active LOW), a Flag LOW signals either an over-temperature or over-current fault. The over-current flag (Status  
OK) is LOW only when the output is ON (constant DC output or the “ON” portion of PWM mode). A thermal fault (thermal shutdown)  
occurs when the die surface reaches approximately 160°C and latches until the die cools to 140°C. This output requires a pull-  
up resistor and it can typically sink 2mA, sufficient to drive a low-current LED. Sink current is internally limited at 10mA typical.  
Pin 8  
Input  
The input is compatible with standard TTL levels. The device output becomes enabled when the input voltage is driven above the  
typical switching threshold, 1.7V. Below this level, the output is disabled. Input current is typically 10nA when driven HIGH and 10nA  
with the input LOW. The input should not be directly connected to the power supply (VS) or damage will occur.  
LOGIC BLOCK DIAGRAM  
Status OK  
Flag  
+VS  
Flyback  
Diode  
Load  
DRV103  
ESD  
Thermal Shutdown  
Over Current  
DMOS  
OUT  
GND  
1.3V VREF  
Oscillator  
DMOS  
PWM  
Input  
On  
Off  
Delay  
2.75 IREF  
IREF  
Delay  
Adj  
Osc Freq  
Adj  
Duty Cycle  
Adj  
RFREQ  
RPWM  
CD  
DRV103  
4
SBVS029A  
TYPICAL CHARACTERISTICS  
At TC = +25°C and VS = +24V, unless otherwise noted.  
VOUT & IOUT WAVEFORMS  
SOLENOID LOAD  
VOUT & IOUT WAVEFORMS  
RESISTIVE LOAD  
PWM Mode  
PWM Mode  
+VS  
+VS  
Off  
Off  
On  
Delay  
Delay  
0
0
+VS  
RL  
On  
+VS  
3
2
1
0
3
2
1
0
RL  
IAVG  
IAVG  
0
0
Pull-In  
On  
0
50  
100  
0
50  
100  
140  
140  
Time (ms)  
Time (ms)  
QUIESCENT CURRENT  
vs JUNCTION TEMPERATURE  
CURRENT LIMIT SHUTDOWN WAVEFORMS  
5.0  
4.5  
4.0  
3.5  
3.0  
2.5  
2.0  
1.5  
1.0  
0.5  
0
FPWM = 25kHz  
DC = 50%  
Delay = 150µs  
On  
5
Reset Period = 1/FPWM  
VIN  
Off  
OK  
Off  
40V (Absolute Maximum)  
0
OK  
OK  
OK  
Status  
OK  
Flag  
24  
OK  
0
32V  
IO = 0A  
Reset Period  
24  
VOUT  
8V to 24V  
0
IO = 3.5A  
0
50  
100  
60  
10  
40  
90  
Temperature (°C)  
Time (µs)  
CURRENT LIMIT  
vs JUNCTION TEMPERATURE  
DELAY vs JUNCTION TEMPERATURE  
150  
145  
140  
135  
130  
125  
120  
115  
110  
105  
100  
3.8  
3.7  
3.6  
3.5  
3.4  
3.3  
CD = 0.1µF  
+VS = 8V  
+VS = 24V  
+VS = 30V  
+VS = 40V (Absolute Maximum)  
60  
10  
40  
90  
60  
10  
40  
90  
140  
Temperature (°C)  
Temperature (°C)  
DRV103  
SBVS029A  
5
TYPICAL CHARACTERISTICS (Cont.)  
At TC = +25°C and VS = +24V, unless otherwise noted.  
OSCILLATOR FREQUENCY  
vs JUNCTION TEMPERATURE  
MINIMUM DELAY vs JUNCTION TEMPERATURE  
50  
25.5  
25.3  
25.1  
24.9  
24.7  
CD = 0pF  
40  
30  
20  
10  
0
60  
10  
40  
90  
140  
60  
10  
40  
90  
140  
Temperature (°C)  
Temperature (°C)  
DUTY CYCLE vs JUNCTION TEMPERATURE  
V
SAT vs JUNCTION TEMPERATURE  
IO = 3A  
50.8  
1.6  
1.4  
1.2  
1.0  
0.8  
0.6  
0.4  
0.2  
0
50.6  
50.4  
50.2  
50.0  
49.8  
49.6  
49.4  
49.2  
RPWM = 137kΩ  
IO = 1.5A  
IO = 0.5A  
IO = 0.1A  
60  
10  
40  
90  
140  
60  
10  
40  
Temperature (°C)  
90  
140  
Temperature (°C)  
VFREQ vs JUNCTION TEMPERATURE  
INPUT CURRENT vs INPUT VOLTAGE  
1.287  
1.286  
1.285  
1.284  
1.283  
1.282  
1.281  
1.280  
1.279  
1.278  
1.277  
1.276  
300  
250  
200  
150  
100  
50  
0
50  
60  
10  
40  
90  
140  
4
4.5  
5
5.5  
6
Temperature (°C)  
Input Voltage (V)  
DRV103  
6
SBVS029A  
set a longer delay time. A resistor, analog voltage, or a  
voltage from a D/A converter can be used to control the duty  
cycle of the PWM output. The D/A converter must be able  
to sink a current 2.75 • IREF (IREF = 1.3V/RFREQ).  
BASIC OPERATION  
The DRV103 is a low-side, DMOS power switch employing  
a Pulse-Width Modulated (PWM) output for driving electro-  
mechanical and thermal devices. Its design is optimized for  
two types of applications: a two-state driver (open/close) for  
loads such as solenoids and actuators; and a linear driver for  
valves, positioners, heaters, and lamps. Its low 0.5“ON”  
resistance, small size, adjustable delay to PWM mode, and  
adjustable duty cycle make it suitable for a wide range of  
applications.  
Figure 2 illustrates a typical timing diagram with the Delay  
Adjust pin connected to a 3.9nF capacitor, the duty cycle set  
to 75%, and oscillator frequency set to 1kHz. See the “Delay  
Adjust” and “Duty Cycle Adjust” text for equations and  
further explanation. Ground (pin 4) must be connected to  
system ground for the DRV103 to function. This serves as  
the load current path to ground, as well as the DRV103  
signal ground. The load (relay, solenoid, valve, etc.) should  
be connected between the supply (pin 5) and output (pin 6).  
For an inductive load, an external “flyback” diode is re-  
quired, as shown in Figure 1. The diode serves to maintain  
continuous current flow in the inductive load during OFF  
periods of PWM operation. For remotely located loads, the  
external diode is ideally located next to the DRV103. The  
internal ESD clamp diode between the output and supply is  
not intended to be used as a “flyback diode.” The Status OK  
Flag (pin 7) provides fault status for over-current and  
thermal shutdown conditions. This pin is active LOW with  
output voltage of typically +0.3V during a fault condition.  
Figure 1 shows the basic circuit connections to operate the  
DRV103. A 1µF (22µF when driving high current loads) or  
larger tantalum bypass capacitor is recommended on the  
power-supply pin.  
Input (pin 8) is level-triggered and compatible with standard  
TTL levels. An input voltage between +2.2V and +5.5V  
turns the device’s output ON, while a voltage of 0V to  
+1.2V shuts the DRV103’s output OFF. Input bias current is  
typically 1pA. Delay Adjust (pin 2) and Duty Cycle Adjust  
(pin 1) allow external adjustment of the PWM output signal.  
The Delay Adjust pin can be left floating for minimum delay  
to PWM mode (typically 18µs) or a capacitor can be used to  
+VS  
RLED  
+8V to +32V  
2mA  
LED  
OK = LED on”  
3A  
Flyback  
Diode(1)  
1µF  
+
Relay  
7
6
Status  
OK  
+VS  
5
OUT  
8
DRV103  
TTL IN  
NOTE: (1) Motorola MSRS1100T3 (1A, 100V)  
Motorola MBRS360T3 (3A, 60V)  
or  
Delay  
Adj  
Osc Freq  
Adj  
Duty Cycle  
Adj  
GND  
4
Microsemi SK34MS (3A, 40V)  
2
3
1
RFREQ  
RPWM  
CD  
FIGURE 1. DRV103 Basic Circuit Connections.  
ON  
TTL HIGH  
Input (V)  
OFF  
OFF  
1
TTL LOW  
Period =  
= TON + TOFF  
FREQ  
+VS  
VO (V)  
0
Delay Time  
+VS/RL  
TOFF  
TON  
IO (A)  
0
Duty Cycle =  
TON  
TON + TOFF  
0
1
2
3
4
Time (ms)  
5
6
7
8
9
FIGURE 2. Typical DRV103 Timing Diagram, with CD = 3.9nF, OscFreq = 1kHz, and 75% Duty Cycle.  
DRV103  
SBVS029A  
7
The internal Delay Adjust circuitry is composed of a 3µA  
current source and a 2.6V comparator, as shown in Figure 3.  
Thus, when the pin voltage is less than 2.6V, the output  
device is 100% ON (DC output mode).  
APPLICATIONS INFORMATION  
POWER SUPPLY  
The DRV103 operates from a single +8V to +32V supply  
with excellent performance. Most behavior remains un-  
changed throughout the full operating voltage range. Param-  
eters that vary significantly with operating voltage are shown  
in the Typical Performance Curves. The DRV103 supply  
voltage should be the supply voltage on the load.  
OSCILLATOR FREQUENCY ADJUST  
The DRV103 PWM output frequency can be easily pro-  
grammed over a wide range by connecting a resistor (RFREQ  
)
between the Osc Freq Adj pin (pin 3) and ground. A range of  
500Hz to 100kHz can be achieved with practical resistor  
values, as shown in Table II. Refer to “PWM Frequency vs  
RFREQ” typical performance curve shown in Figure 4 for  
additional information. Although oscillator frequency opera-  
tion below 500Hz is possible, resistors higher than 10M will  
be required. The pin becomes a very high impedance node and  
is, therefore, sensitive to noise pickup and PCB leakage  
currents if very high resistor values are used. Refer to Figure  
3 for a simplified circuit of the frequency adjust input.  
ADJUSTABLE DELAY TIME (INITIAL 100% DUTY CYCLE)  
A unique feature of the DRV103 is its ability to provide an  
initial constant DC output (100% duty cycle) and then  
switch to PWM mode output to save power. This function is  
particularly useful when driving solenoids that have a much  
higher pull-in current requirement than continuous hold  
requirement.  
The duration of this constant DC output (before PWM  
output begins) can be externally controlled by a capacitor  
connected from Delay Adjust (pin 2) to ground according to  
the following equation:  
OSCILLATOR FREQUENCY  
(Hz)  
RFREQ (nearest 1% values)  
()  
100k  
50k  
25k  
10k  
5k  
47.5k  
100k  
205k  
523k  
1.07M  
11.3M  
Delay Time CD • 106  
(time in seconds, CD in Farads • 1.1)  
500  
Leaving the Delay Adjust pin open results in a constant  
output time of approximately 18µs. The duration of this  
initial output can be reduced to less than 1µs by connecting  
the pin to 5V. Table I provides examples of delay times  
(constant output before PWM mode) achieved with selected  
capacitor values.  
TABLE II. Oscillator Frequency Resistance.  
PWM FREQUENCY vs RFREQ  
1000M  
100M  
10M  
1M  
INITIAL CONSTANT  
OUTPUT DURATION  
CD  
1µs  
18µs  
110µs  
1.1ms  
11ms  
110ms  
1.1s  
Pin 2 Tied to +5V  
Pin 2 Open  
100pF  
100k  
10k  
1nF  
10nF  
100nF  
1µF  
1k  
10  
100  
1k  
10k  
100k  
1M  
Frequency (Hz)  
11s  
10µF  
FIGURE 4. Using a Resistor to Program Oscillator Frequency.  
TABLE I. Delay Adjust Times.  
R
FREQ (k) = 6808417/F(1.0288)  
+VS  
3µA  
CD  
Reset  
+2.6V  
Input  
VREF  
VFREQ  
IREF  
+1.3V  
RFREQ  
FIGURE 3. Simplified Delay Adjust and Frequency Adjust Inputs.  
8
DRV103  
SBVS029A  
A 100pF capacitor in parallel with RPWM is recommended  
when switching a high load current to maintain a clean  
output switching waveform, as shown in Figure 6.  
The DRV103’s adjustable PWM output frequency allows it  
to be optimized for driving virtually any type of load.  
ADJUSTABLE DUTY CYCLE (PWM Mode)  
The DRV103’s externally adjustable duty cycle provides an  
accurate means of controlling power delivered to a load.  
Duty cycle can be set over a range of at least 10% to 90%  
with an external resistor, analog voltage, or the voltage  
output of a D/A converter. A low duty cycle results in  
reduced power dissipation in the load. This keeps the DRV103  
and the load cooler, resulting in increased reliability for both  
devices.  
RPWM  
only on  
Pin 1  
With  
100pF in  
Parallel with  
RPWM  
Resistor Controlled Duty Cycle  
Duty cycle is easily programmed by connecting a resistor  
(RPWM) between the Duty Cycle Adjust pin (pin 1) and  
ground. High resistor values correspond to high duty cycles.  
Table III provides resistor values for typical duty cycles.  
Resistor values for additional duty cycles can be obtained  
from Figure 5. For reference purposes, the equation for  
calculating RPWM is included in Figure 5.  
Time (10µs)  
FIGURE 6. Output Waveform at High Load Current.  
Voltage Controlled Duty Cycle  
Duty cycle can also be programmed by an analog voltage,  
V
PWM. With VPWM 3.56V, duty cycle is about 90%.  
DUTY CYCLE  
(%)  
RPWM (Nearest 1% Values)  
25kHz  
Decreasing this voltage results in decreased duty cycles.  
Table IV provides VPWM values for typical duty cycles. The  
“Duty Cycle vs Voltage” typical performance curve for  
additional duty cycles is shown in Figure 7.  
5kHz  
100kHz  
5
374k  
402k  
475k  
549k  
619k  
681k  
750k  
825k  
887k  
953k  
1M  
75k  
80.6k  
95.3k  
110k  
124k  
137k  
150k  
165k  
182k  
196k  
200k  
16.9k  
19.1k  
22.6k  
26.1k  
29.4k  
33.2k  
37.4k  
40.2k  
44.2k  
47.5k  
49.9k  
10  
20  
30  
40  
50  
60  
70  
80  
90  
95  
DUTY CYCLE AND DUTY CYCLE ERROR  
vs VOLTAGE  
100  
90  
80  
70  
60  
50  
40  
30  
20  
10  
0
2
1.5  
1
TABLE III. Duty Cycle Adjust Resistance.  
0.5  
0
DUTY CYCLE vs RPWM  
1M  
0.5  
1  
1.5  
2  
5kHz  
1
2
3
4
25kHz  
100k  
VPWM (V)  
FIGURE 7. Using a Voltage to Program Duty Cycle.  
At VS = 24V and F = 25kHz: VPWM = 1.25 +  
0.026 • %DC.  
100kHz  
10k  
DUTY CYLE  
(%)  
VPWM  
(V)  
0
20  
40  
60  
80  
100  
Duty Cycle (%)  
5
1.344  
1.518  
1.763  
2.283  
2.788  
3.311  
3.561  
3.705  
10  
20  
40  
60  
80  
90  
95  
FIGURE 5. Using a Resistor to Program Duty Cycle.  
At 25kHz: RPWM (k) = 67.46 + 1.41 • %DC.  
TABLE IV. Duty Cycle Adjust Voltage.  
DRV103  
SBVS029A  
9
The Duty Cycle Adjust pin is internally driven by an  
oscillator frequency dependent current source and connects  
to the input of a comparator as shown in Figure 8. The  
DRV103’s PWM adjustment is inherently monotonic. That  
is, a decreased voltage (or resistor value) always produces  
an increased duty cycle.  
+5V  
5kΩ  
Pull-Up  
TTL or HCT  
OK  
7
Thermal Shutdown  
Over Current  
5
OUT  
3.9V  
PWM  
OSC  
4
1.3V  
DRV103  
+VS  
2.75 IREF  
FIGURE 9. Non-Latching Fault Monitoring Circuit.  
+5V  
RPWM  
74XX76A  
VS  
Q
20kΩ  
OK  
OK  
J
Q
FIGURE 8. Simplified Duty Cycle Adjust Input.  
OK Reset  
CLR  
CLK  
K
(1)  
GND  
STATUS FLAG  
The OK Flag (pin 7) provides a fault indication for over-  
current and thermal shutdown conditions. During a fault  
condition, the Status OK Flag output is driven LOW (pin  
voltage typically drops to 0.3V). A pull-up resistor, as  
shown in Figure 9, is required to interface with standard  
logic. Figure 9 also gives an example of a non-latching fault  
monitoring circuit, while Figure 10 provides a latching  
version. The OK Flag pin can sink up to 10mA, sufficient  
to drive external logic circuitry, a reed relay, or an LED, as  
shown in Figure 11, to indicate when a fault has occurred.  
In addition, the OK Flag pin can be used to turn off other  
DRV103s in a system for chain fault protection.  
7
OK  
Thermal Shutdown  
Over Current  
5
4
OUT  
PWM  
DRV103  
NOTE: (1) Small capacitor (10pF) may be required in noisy environments.  
FIGURE 10. Latching Fault Monitoring Circuit.  
Over Current Fault  
An over-current fault occurs when the PWM peak output  
current is greater than approximately 3.75A. The OK flag is  
not latched. Since current during PWM mode is switched on  
and off, the OK flag output will be modulated with PWM  
timing (see OK flag waveforms in the Typical Performance  
Curves).  
+5V  
5k  
(LED)  
HLMP-Q156  
OK  
7
Avoid adding capacitance to pin 6 (Out) as it may cause  
momentary current limiting.  
Over-Temperature Fault  
Thermal Shutdown  
Over Current  
5
4
OUT  
A thermal fault occurs when the die reaches approximately  
160°C, producing a similar effect as pulling the input low.  
Internal shutdown circuitry disables the output. The OK  
Flag is latched in the LOW state (fault condition) until the  
die has cooled to approximately 140°C.  
PWM  
DRV103  
FIGURE 11. LED to Indicate Fault Condition.  
DRV103  
10  
SBVS029A  
PACKAGE MOUNTING  
THERMAL RESISTANCE vs  
CIRCUIT BOARD COPPER AREA  
Figure 12 provides recommended PCB layouts for both the  
SO-8 (U) and the PowerPAD™ SO-8 (H) packages. Al-  
though the metal pad of the PowerPAD™ SO-8 (H) package  
is electrically connected to ground (pin 4), no current should  
flow in this pad. Do NOT use the exposed metal pad as a  
power ground connection or erratic operation will result. For  
lowest overall thermal resistance, it is best to solder the  
PowerPAD™ directly to a circuit board, as illustrated in  
Figure 13. Increasing the “heat sink” copper area improves  
heat dissipation. Figure 14 shows typical junction-to-ambi-  
ent thermal resistance as a function of the PC board copper  
area.  
80  
70  
60  
50  
40  
30  
DRV103 (H)  
Power PAD  
Surface-Mount Package  
1oz. copper  
0
1
2
3
4
5
Copper Area (inches2)  
150 (ref)  
FIGURE 14. Heat Sink Thermal Resistance vs Circuit Board  
Copper Area.  
POWER DISSIPATION  
DRV103 power dissipation depends on power supply, signal,  
and load conditions. Power dissipation (PD) is equal to the  
product of output current times the voltage across the conduct-  
ing DMOS transistor times the duty cycle. Using the lowest  
possible duty cycle necessary to assure the required hold force  
can minimize power dissipation in both the load and in the  
DRV103. For low current, the output DMOS transistor on-  
resistance is 0.5, increasing to 0.6at high output current.  
95 x 95  
DRV103(H)  
Package  
C - C  
215 (ref)  
153  
158  
273  
277  
At very high oscillator frequencies, the energy in the DRV103’s  
linear rise and fall times can become significant and cause an  
increase in PD.  
Application Bulletin SBFA002 at www.ti.com, explains how to  
calculate or measure power dissipation with unusual signals  
and loads.  
60 (ref)  
THERMAL PROTECTION  
50 nom  
18  
22  
Power dissipated in the DRV103 will cause its internal junction  
temperature to rise. The DRV103 has an on-chip thermal  
shutdown circuitry that protects the IC from damage. The  
thermal protection circuitry disables the output when the junc-  
tion temperature reaches approximately +160°C, allowing the  
device to cool. When the junction temperature cools to approxi-  
mately +140°C, the output circuitry is again enabled. Depend-  
ing on load and signal conditions, the thermal protection circuit  
may cycle on and off. This limits the dissipation of the driver  
but may have an undesirable effect on the load.  
FIGURE 12. Recommended PCB Layout.  
DRV103 Die  
Pad-to-Board  
Solder  
Signal Trace  
Any tendency to activate the thermal protection circuit indi-  
cates excessive power dissipation or an inadequate heat sink.  
For reliable operation, junction temperature should be limited  
to +125°C, maximum. To estimate the margin of safety in a  
complete design (including heat sink), increase the ambient  
temperature until the thermal protection is triggered. Use  
worst-case load and signal conditions. For good reliability,  
thermal protection should trigger more than 40°C above the  
maximum expected ambient condition of your application.  
This produces a junction temperature of 125°C at the maxi-  
mum expected ambient condition.  
Copper Pad  
Copper Traces  
Thermal Vias  
FIGURE 13. PowerPAD Heat Transfer.  
DRV103  
SBVS029A  
11  
The internal protection circuitry of the DRV103 was designed  
to protect against overload conditions. It was not intended to  
replace proper heat sinking. Continuously running the  
DRV103 into thermal shutdown will degrade reliability.  
To maintain junction temperature below 125°C, the heat  
sink selected must have a θHA less than 26.3°C/W. In other  
words, the heat sink temperature rise above ambient must be  
less than 52.6°C (26.3°C/W • 2W).  
Another variable to consider is natural convection versus  
forced convection air flow. Forced-air cooling by a small fan  
can lower θCA (θCH + θHA) dramatically.  
HEAT SINKING  
Most applications will not require a heat sink to assure that  
the maximum operating junction temperature (125°C) is not  
exceeded. However, junction temperature should be kept as  
low as possible for increased reliability. Junction tempera-  
ture can be determined according to the equation:  
As mentioned earlier, once a heat sink has been selected, the  
complete design should be tested under worst-case load and  
signal conditions to ensure proper thermal protection.  
TJ = TA + PDθJA  
(1)  
(2)  
RFI/EMI  
Any switching system can generate noise and interference  
by radiation or conduction. The DRV103 is designed with  
controlled slew rate current switching to reduce these ef-  
fects. By slowing the rise and fall times of the output to  
0.3µs, much lower switching noise is generated.  
where, θJA = θJC + θCH + θHA  
TJ = Junction Temperature (°C)  
TA = Ambient Temperature (°C)  
PD = Power Dissipated (W)  
θJC = Junction-to-Case Thermal Resistance (°C/W)  
θCH = Case-to-Heat Sink Thermal Resistance (°C/W)  
Radiation from the DRV103-to-load wiring (the “antenna”  
effect) can be minimized by using “twisted pair” cable or by  
shielding. Good PCB ground planes are recommended for  
low noise and good heat dissipation. Refer to Bypassing  
section for notes on placement of the flyback diode.  
θHA  
= Heat Sink-to-Ambient Thermal Resistance (°C/W)  
θJA = Junction-to-Air Thermal Resistance (°C/W)  
Using a heat sink significantly increases the maximum  
allowable power dissipation at a given ambient temperature.  
BYPASSING  
The answer to the question of selecting a heat sink lies in  
determining the power dissipated by the DRV103. For DC  
output into a purely resistive load, power dissipation is simply  
the load current times the voltage developed across the  
conducting output transistor times the duty cycle. Other loads  
are not as simple. For further insight on calculating power  
dissipation, refer to Application Bulletin SBFA002 at  
www.ti.com. Once power dissipation for an application is  
known, the proper heat sink can be selected.  
A 1µF tantalum bypass capacitor is adequate for uniform  
duty cycle control when switching loads of less than 0.5  
amps. Larger bypass capacitors are required when switching  
high current loads. A 22µF tantalum capacitor is recom-  
mended for heavy-duty (3A) applications. It may also be  
desirable to run the DRV103 and the load on separate power  
supplies at high load currents. Near the absolute maximum  
supply voltage of 40V, bypassing is especially critical. In the  
event of a current overload, the DRV103 current limit  
responds in microseconds, dropping the load current to zero.  
With inadequate bypass, energy stored in the supply line  
inductance can lift the supply sufficiently to exceed voltage  
breakdown with catastrophic results.  
Heat Sink Selection Example  
A PowerPAD™ SO-8 (H) package is dissipating 2W. The  
maximum expected ambient temperature is 35°C. Find the  
proper heat sink to keep the junction temperature below  
125°C.  
Place the flyback diode at the DRV103 end when driving  
long (inductive) cables to a remotely located load. This  
minimizes RFI/EMI and helps protect the output DMOS  
transistor from breakdown caused by dI/dt transients. Fast  
rectifier diodes such as epitaxial silicon or Schottky types  
are recommended as flyback diodes.  
Combining Equations 1 and 2 gives:  
TJ = TA + PD(θJC + θCH + θHA  
)
(3)  
TJ, TA, and PD are given. θJC is provided in the specification  
table, 16.7°C/W. θCH depends on heat sink size, area, and  
material used. A semiconductor’s package type and mount-  
ing can also affect θCH. A typical θCH for a soldered-in-place  
PowerPAD™ SO-8 (H) package is 2°C/W. Now we can  
solve for θHA  
:
TJ – TA  
PD  
θ HA  
=
θ +θCH  
(
JC  
)
125°C – 35°C  
θ HA  
=
– 16.7°C / W + 2°C / W  
( )  
(4)  
2W  
θ
HA= 26.3°C / W  
DRV103  
12  
SBVS029A  
APPLICATIONS CIRCUITS  
+12V  
5.6k  
22µF  
"Fault"  
HLMP-0156  
1MΩ  
Microsemi  
SK34MS  
3A 40V Schottky  
Relay  
+
7
6
OK  
+VS  
DRV103  
5
OUT  
1.7V  
8
Input  
+
47µF  
Tantalum  
CT  
316kΩ  
CT (µF)  
TON (s)  
47  
22  
10  
10  
5
2
4
GND  
Delay  
Adj  
Duty Cycle  
Adj  
Freq  
Adj  
4.7  
2.2  
1
0.5  
2
1
3
137kΩ  
205kΩ  
0.22µF  
FIGURE 15. Time Delay Relay Driver.  
+28V  
22µF  
+
Relay  
24kΩ  
6
+VS  
DRV103  
5
OUT  
8
Input  
4
GND  
Delay  
Adj  
Duty Cycle  
Adj  
Freq  
Adj  
3.9kΩ  
2
1
3
137kΩ  
205kΩ  
0.1µF  
Housing  
FIGURE 16. Remotely Operated Solenoid Valve or Relay.  
DRV103  
SBVS029A  
13  
+12V  
22µF  
+
3kΩ  
6
+VS  
IRF4905  
DRV103  
5
OUT  
8
TTLIN  
High = Load ON  
Low = Load OFF  
Input  
4
GND  
Delay  
Adj  
Duty Cycle  
Adj  
Freq  
Adj  
(1)  
12V  
70A  
LOAD  
2
1
3
RPWM  
10MΩ  
CD  
F ~ 500Hz  
NOTE: (1) Flyback diode required for inductive loads: IXYS DSE160-06A.  
FIGURE 17. High Power High Side Driver.  
+8V to +32V  
2mA  
Microsemi  
SK34MS  
3A 40V  
Linear  
Valve  
Schottky  
22µF  
+
Actuator  
HLMP-Q156  
Fault”  
7
6
Status  
OK  
+VS  
5
4
OUT  
GND  
8
DRV103  
TTL IN  
High = ON  
Low = OFF  
Delay  
Adj  
Duty Cycle  
Adj  
Freq  
Adj  
NC  
2
1
3
205kΩ  
1.3V 5% Duty Cycle  
3.7V 95% Duty Cycle  
DATA  
DAC  
FIGURE 18. Linear Valve Driver.  
DRV103  
14  
SBVS029A  
IMPORTANT NOTICE  
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