DLKPC192S [TI]
10-Gbps ETHERNET LAN PHYSICAL CODING SUBLAYER (PCS) WITH SSTL XGMII INTERFACE; ?? 10 - Gbps以太网LAN物理编码子层（ PCS ）与SSTL接口XGMII
| 型号： | DLKPC192S |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | 10-Gbps ETHERNET LAN PHYSICAL CODING SUBLAYER (PCS) WITH SSTL XGMII INTERFACE |
| 文件： | 总25页 (文件大小：339K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
ꢀꢁ ꢂ ꢃꢄ ꢅꢆ ꢇꢈ
ꢅ ꢉ ꢊꢋꢌ ꢍꢎ ꢏꢐ ꢑꢏ ꢒꢓꢏꢐ ꢁ ꢔꢓ ꢃꢑꢕ ꢈꢖ ꢄꢔꢁ ꢄꢗ ꢀꢖ ꢓꢋ ꢈꢘꢙ ꢁꢔꢕ ꢏꢒ ꢚ ꢃꢄ ꢈꢛ
ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
SLLS536 − AUGUST 2002
D
D
10-Gbps Ethernet LAN PCS With 64b/66b
ENDEC
D
D
D
D
IEEE 802.3 Management Data Interface
(MDIO)
10-Gbps Media-Independent Interface
(XGMII) Using 2.5-V SSTL Class 2
Technology
Advanced 0.18-µm CMOS Technology
Less Than 1.5 W Power Consumption
Low-Cost 289-Ball PBGA Package
D
10-Gbps 16-Bit Interface (XSBI) Using LVDS
Technology
description
The DLKPC192S performs all physical coding sublayer (PCS) functions for proposed IEEE 802.3ae/D2.0
10-Gbps Ethernet serial network (LAN) connections.
The DLKPC192S connects to the media access control (MAC) and all higher layers of the OSI protocol stack
via the 10-Gbps media independent interface (XGMII). The XGMII consists of two unidirectional buses, each
with 36 information bits (32 data bits, 4 control bits) plus a clock. The XGMII interface is implemented using
2.5-V, SSTL Class 2 technology. The DLKPC192S connects to physical media via the 10-Gbps 16-bit interface
(XSBI). The XSBI bus consists of two unidirectional buses, each with 16 data bits plus a clock. The XSBI
interface is implemented utilizing low-voltage differential signaling (LVDS) technology. The DLKPC192S
encodes and decodes data using the 64b/66b coding algorithm and provides clock tolerance compensation
when needed.
XGMII
Clk
32
XSBI
TC
DLKPC192S
Clk
16
TXCP/N
TD[0:31]
KG[0:3]
16:1
4
E/O
O/E
TXD[0:15]P/N
TX MUX
MAC
ASIC
10-Gbps Ethernet
Physical
Clk
32
4
RC
Coding Sublayer
Clk
16
1:16
CDR/
RXCP/N
RD[0:31]
KF[0:3]
RXD[0:15]P/N
Deserializer
RFCP/N MDIO MDC XBICP/N
6”
3”
OSC.
OSC.
Management
Figure 1. 10-Gbps Ethernet Short-PCB-Distance Implementation
The DLKPC192S can be used in systems where printed-circuit board (PCB) traces between the media access
control device and the serializer/deserializer device are sufficiently short, as shown in Figure 1.
Systems requiring PCB traces longer than 6 inches can be implemented by using the TLK3114SA XGMII
external sublayer device to increase the allowable PCB trace length to greater than 20 inches, as shown in
Figure 2.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
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Copyright 2002, Texas Instruments Incorporated
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1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢇꢈ
ꢅꢉ ꢊꢋ ꢌ ꢍ ꢎ ꢏꢐ ꢑ ꢏ ꢒꢓ ꢏꢐ ꢁꢔ ꢓ ꢃ ꢑꢕ ꢈꢖ ꢄꢔ ꢁ ꢄꢗꢀ ꢖꢓꢋ ꢈꢘ ꢙꢁꢔꢕꢏ ꢒ ꢚꢃꢄ ꢈꢛ
ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
description (continued)
XGMII
Clk
XAUI
4
XGMII
Clk
XSBI
32
4
Clk
16
32
4
16:1
E/O
O/E
TX MUX
MAC
TLK3114SA
XGXS
TLK3114SA
XGXS
DLKPC192S
PCS
ASIC
Clk
Clk
32
1:16
CDR/
Clk
16
4
32
4
4
Deserializer
MDIO MDC
MDIO MDC
MDIO MDC
6”
20”
6”
3”
Management
Figure 2. 10-Gbps Ethernet Long-PCB-Distance Implementation
The DLKPC192S supports the IEEE 802.3 defined management interface (MDIO) to allow ease in configuration
and status monitoring of the link.
The DLKPC192S is implemented in 0.18-µm CMOS technology. The DLKPC192S operates with core and I/O
supplies of 1.8 V, 2.5 V, and 3.3 V while dissipating less than 1.5 W. The device is packaged in a 19×19-mm,
289-terminal plastic ball grid array (PBGA) package and is characterized for operation from 0°C to 70°C.
Figure 3 is a high-level block diagram of the DLKPC192S. The basic operation of the DLKPC192S is described
in the following paragraphs, with the transmit path being described first, followed by the receive path.
TC
TXP[0:15]
TD[0:31]
TXN[0:15]
TXCP
TXCN
KG[0:3]
RFCP
RFCN
XBICN
XBICP
RXCP
RXCN
RD[0:31]
RXP[0:15]
RXN[0:15]
KF[0:3]
RC
MDIO
Interface
MDIO
Registers
MDC
MDIO
Figure 3. The DLKPC192S Block Diagram
2
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SLLS536 − AUGUST 2002
terminal locations (top view)
A
B
C
D
E
F
G
H
J
K
L
M
N
P
R
T
U
DVAD
[1]
DVAD
[0]
TXP
[0]
TXP
[1]
TXP
[4]
TXP
[10]
TXN
[15]
XBIOR
_IREF
17
16
15
14
13
GND
GND
VDDS
GND
TXCP
TXCN
GND
VDDS
VDD
GND
GND
GND
GND
VDD
GND
MDIO
17
16
15
14
13
DVAD
[2]
TXN
[10]
TXP
[11]
TXP
[15]
XBIOR
_VREF
VDDO
VDD
GND
TD[0]
TD[6]
TXN[0] TXN[1]
TXN[4]
VDD
TXP[7]
VDDS
MDC
GND
DVAD
[3]
DVAD
[4]
TXN
[11]
TXP
[13]
TXP
[14]
GND
TD[3]
VDD
VDD
TXN[2]
TD[4]
TXN[7] TXP[8]
TXP[6] TXN[8]
GND
VDD
TXN
[12]
TXN
[13]
TXN
[14]
AKR_
NI
TD[2]
TD[5]
TD[1]
GND
TXP[2]
TXN[3]
VDDS
TXP[3]
TXP[5]
TXP[9]
TXN[9]
XBICP
RXN[1]
XBICN
RXP[1]
TXP
[12]
RXN
[0]
TXN[5] TXN[6]
VDDS
VDDS
RXP[0]
12
11
TD[9]
GND
TD[10]
VDD
TD[8]
GND
TD[7]
TD[11]
TD[12]
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
RXN[2] RXP[2]
RXN[4] RXP[4]
VDDS
GND
RXN[3]
RFCP
RXP[3]
RFCN
12
11
VDDO
RXN
VDDS
[6]
RXN
[5]
RXP
[5]
10
9
TD[16]
VDDO
GND
TD[17]
TD[19]
VDD
TD[15]
TD[20]
GND
TD[14]
TD[18]
VDDO
TD[26]
VDD
TD[13]
TC
GND
GND
GND
GND
GND
RD[8]
VDDO
GND
GND
GND
GND
GND
RD[11]
GND
GND
GND
GND
GND
GND
GND
RC
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
GND
10
9
RXN
[7]
RXP
[7]
RXP[6]
VDD
RXN
[8]
RXP
[9]
RXN
[9]
8
TD[21]
TD[22]
TD[27]
RD[5]
RD[6]
GND
RXP[8]
VDDS
GND
8
RXN
[10]
RXP
[10]
7
TD[25]
TD[29]
KG[0]
KG[3]
TD[24]
GND
TD[23]
TD[28]
TD[30]
GND
GND
RXCN
RXCP
GND
GND
7
RXN
[11]
RXP
[11]
RXN
[12]
6
GND
VDDS
VDDS
6
RXP
[13]
RXN
[13]
RXP
[12]
5
TD[31]
KG[2]
KG[1]
GND
RD[15]
RD[20] RD[25] RD[30]
5
RXP
[15]
RXN
[15]
RXP
[14]
RXN
[14]
4
RD[12] RD[16]
RD[13] RD[17]
VDDO RD[21] RD[26]
VDDO
RD[31]
4
SSTL
_REF
XBIIR
_IREF
XBIIR
_VREF
3
2
1
VDDO
GND
VDD
RD[2]
RD[3]
RD[7]
GND
GND
RD[22] RD[27]
GND
KF[2]
KF[1]
VDD
GND
3
2
1
GND
RD[0]
VDDO
RD[9]
VDD
VDDO
RD[18] RD[24]
RD[19] RD[23]
VDDO
RD[28]
VDDO
GND
VDD
TEST
SSTL
MODE
GND
A
VDDO
B
RD[1]
C
RD[4]
D
GND
E
RD[10] RD[14]
GND
H
GND
L
RD[29]
M
KF[0]
N
KF[3]
P
GND
T
RSTN
U
F
G
J
K
R
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢇꢈ
ꢅꢉ ꢊꢋ ꢌ ꢍ ꢎ ꢏꢐ ꢑ ꢏ ꢒꢓ ꢏꢐ ꢁꢔ ꢓ ꢃ ꢑꢕ ꢈꢖ ꢄꢔ ꢁ ꢄꢗꢀ ꢖꢓꢋ ꢈꢘ ꢙꢁꢔꢕꢏ ꢒ ꢚꢃꢄ ꢈꢛ
ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
Signal Terminal Functions
XGMII interface terminals
SIGNAL
TC
LOCATION
TYPE
DESCRIPTION
E9
SSTL class 2,
2.5-V input
XGMII transmit clock. The XGMII transmit data on TD[0:31] and control word generator
signals on KG[0:3] are latched on the rising and falling edges of TC.
TD[0:31]
C14, B14, A14, D14, SSTL class 2,
E13, A13, C13, D12, 2.5-V input
C12, A12, B12, E12,
E11, E10, D10, C10,
A10, B10, D9, B9,
XGMII transmit data. The data on this bus is latched on the rising and falling edges of
TC.
C9, E8, E7, C7,
B7, A7, D7, E6,
C6, A6, C5, B5
KG[0:3]
A5, D5, B4, A4
SSTL class 2,
2.5-V input
XGMII transmit control word. The control signals on these terminals are used to
designate whether the data on the TD bus is data characters or protocol control
characters. When high, these terminals cause the data on corresponding byte of the
TD bus to be interpreted as control characters by the PCS. The assignment of control
bits on this bus to corresponding bytes of the TD bus is as follows:
KG0
KG1
KG2
KG3
−
−
−
−
TD[0:7]
TD[8:15]
TD[16:23]
TD[24:31]
The value of these signals is latched on the rising and falling edge of TC.
RC
J5
SSTL class 2,
2.5-V output
XGMII receive clock. The received data and the control word generator signals are
transferred across the XGMII bus on RD[0:31] and KF[0:3], respectively, on the rising
and falling edges of RC. RC is generated from the input reference clock RFCP/RFCN.
RD[0:31]
C2, C1, D3, D2,
D1, E5, E4, E3,
F5, F2, F1, G5,
G4, G3, G1, H5,
H4, H3, J2, J1,
K5, K4, K3, K1,
K2, L5, L4, L3,
M2, M1, M5, N4
SSTL class 2,
2.5-V output
XGMII receive data. Parallel data on this bus is output on the rising and falling edges
of RC.
KF[0:3]
N1, N2, N3, P1
SSTL class 2,
2.5-V output
XGMII receive control word. The control signals on these terminals are used to
designate whether the data on the RD bus is data characters or protocol control
characters. When high, these terminals indicate the data on corresponding byte of the
RD bus is protocol control characters. The assignment of control bits on this bus to
corresponding bytes of the RD bus is as follows:
KF0
KF1
KF2
KF3
−
−
−
−
RD[0:7]
RD[8:15]
RD[16:23]
RD[24:31]
Data on these terminals is valid on the rising and falling edges of RC.
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
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ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
SLLS536 − AUGUST 2002
Signal Terminal Functions (Continued)
XSBI interface terminals
SIGNAL
LOCATION
H17, H16
TYPE
DESCRIPTION
TXCP/TXCN
LVDS output XSBI transmit clock. Differential output clock. The data on TXP[0:15]/TXN[0:15] is
transferred on the rising edge of the transmit data clock. Nominal frequency of
TXCP/TXCN is 644.53125 MHz.
TX[0:15]P/N
D17, D16, E17, E16, LVDS output XSBI transmit data. Parallel data on this bus is clocked on the rising edge of TXCP.
F14, E14, G13, F13,
G17, G16, H14, H13,
J14, J13, J16, J15,
K15, K14, L14, L13,
L17, L16, M16, M15,
M13, M14, N15, N14,
P15, P14, P16, P17
RXCP/RXCN
RX[0:15]P/N
U7, T7
LVDS input
XSBI receive clock. Differential input clock. The data on RXP[0:15]/RXN[0:15] is
latched on the rising edge of this clock. Please note, the positive side of this differential
clock (RXCP) needs to rise in the middle of the data. Nominal frequency of
RXCP/RXCN is 644.53125 MHz. There is a 100-Ω on-chip termination resistor placed
differentially between the terminals of each terminal pair.
R13, P13, U13, T13, LVDS input
P12, N12, U12, T12,
P11, N11, T10, R10,
N9, N10, T9, R9,
XSBI receive data. Parallel data on this bus is valid on the rising edge of RXCP/RXCN.
There is a 100-Ω on-chip termination resistor placed differentially between the
terminals of each terminal pair.
P8, N8, T8, U8,
P7, N7, P6, N6,
T5, T6, N5, P5,
T4, U4, P4, R4
management data interface
SIGNAL
MDIO
LOCATION
TYPE
LVTTL
DESCRIPTION
U17
U16
Management data input/output. MDIO is the bidirectional serial data path for the
input/output transfer of management data to and from the DLKPC192S device.
MDC
LVTTL input Management data clock. MDC is the clock for the transfer of management data to and
from the protocol device.
DVAD[0:4]
B17, A17, A16, A15, LVTTL input Management address. These terminals determine the device address on the MDIO
B15
interface to which the DLKPC192S responds. The DLKPC192S only responds to valid
commands that contain a device address equal to the value seen on these terminals.
reference clock terminals
SIGNAL
LOCATION
T11, U11
TYPE
DESCRIPTION
RFCP/RFCN
LVDS input
XGMII receive reference clock. Differential reference clock for generation of XGMII
receive interface functions. Nominal frequency of RFCP/RFCN is 156.25 MHz. There
is a 100-Ω on-chip termination resistor placed differentially between the two terminals.
XBICP/XBICN T14, U14
LVDS input
XSBI transmit reference clock. Differential reference clock for generation of XSBI
transmit interface functions. Nominal frequency of XBICP/XBICN is 644.53125 MHz.
There is a 100-Ω on-chip termination resistor placed differentially between the two
terminals
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢇꢈ
ꢅꢉ ꢊꢋ ꢌ ꢍ ꢎ ꢏꢐ ꢑ ꢏ ꢒꢓ ꢏꢐ ꢁꢔ ꢓ ꢃ ꢑꢕ ꢈꢖ ꢄꢔ ꢁ ꢄꢗꢀ ꢖꢓꢋ ꢈꢘ ꢙꢁꢔꢕꢏ ꢒ ꢚꢃꢄ ꢈꢛ
ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
Signal Terminal Functions (Continued)
miscellaneous terminals
SIGNAL
RSTN
LOCATION
TYPE
DESCRIPTION
U1
U2
LVTTL input Chip reset. Low-true device reset. When low, the DLKPC192S is held in a reset state.
(with pullup)
TEST
LVTTL input Test. When this terminal is held high, the device is placed in test mode. This terminal
(with pullup) is used for device test during manufacturing. Some terminals of the device may change
functionality while TEST is high. The use of this terminal is reserved for Texas
Instruments and may provide for capabilities such as IDDQ testing. When TEST is low
the device operates normally.
AKR_NI
R14
LVTTL input XGMII IPG mode. Controls the behavior of the transmit and receive FIFO circuits on
the XGMII input and output interface. See section on IPG modes.
voltage supply and reference terminals
SIGNAL
SSTL_REF
XBIOR_IREF
LOCATION
TYPE
Input
DESCRIPTION
A3
SSTL input voltage reference. 1.25 V relative to VSS
LVDS reference current for LVDS drivers. 1 kΩ to VSS
LVDS reference voltage for LVDS drivers. 1.2 V relative to VSS
LVDS reference current for LVDS receivers. 1 kΩ to VSS
LVDS reference voltage for LVDS receivers. 1.2 V relative to VSS
T17
Input
Input
Input
Input
XBIOR_VREF T16
XBIIR_IREF
XBIIR_VREF
R3
T3
SSTL_MODE R1
LVTTL input Mode control for SSTL output buffers. A low value sets the output drivers in SSTL-2
mode, while a high value sets the outputs to SSTL-1 mode.
VDD
C3, G2, P3, T2, P9,
T15, C16, E15, G15,
K17, R16, D6, B8,
B11, D13
Supply
1.8 V. Provides power for core and I/O cells requiring it
VDDS
VDDO
VSS
R5, R6, R8, P10,
R12 F16, G14, J17,
K13, N16, N13
Supply
Supply
Ground
3.3 V. Provides power for all LVDS and LVTTL I/Os
2.5 V. Provides power for all SSTL I/Os
Ground. Return for all supplies
B1, E2, J4, M4, P2,
F4, H2, L2, B3, A9,
B16, D8, D11
A1, B2, D4, E1, F3,
H1, J3, L1, M3, R2,
T1, U3, U5, U6, R7,
U9, U10, R11, U15,
C17, D15, F17, F15,
H15, K16, L15, M17,
N17, R17, R15, A2,
C4, B6, A8, C8, A11,
C11, B13, C15
thermal ground terminals
SIGNAL
T-GND
LOCATION
TYPE
DESCRIPTION
F6, G6, H6, J6, K6, L6, M6, F7,
G7, H7, J7, K7, L7, M7, F8,
G8, H8, J8, K8, L8, M8, F9,
G9, H9, J9, K9, L9, M9, F10,
G10, H10, J10, K10, L10, M10,
F11, G11, H11, J11, K11, L11,
M11, F12, G12, H12, J12, K12,
L12, M12
Thermal ground connections
6
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SLLS536 − AUGUST 2002
detailed description
transmission
The DLKPC192S accepts data with appropriate control coding on the 10-Gbps media-independent interface
(XGMII) as defined in the proposed IEEE P802.3ae standard. Data to be transmitted is clocked from the XGMII
interface into a register bank. The data is then transferred into the transmission FIFO. Data is pulled from the
FIFO, encoded via the 64b/66b encoder, and then disassembled into 16-bit words by the transmission gearbox
and transferred out over the XSBI interface.
XGMII transmit data bus timing
From the XGMII, the DLKPC192S latches the data on transmit data bus TD[0:31] along with the associated byte
level control terminals, KG[0:3]. Data is latched on both the rising and falling edges of the transmit data clock,
TC, as the XGMII interface is defined as a double-data-rate (DDR) interface. The basic timing is shown in
Figure 4. Detailed timing information is provided in the XGMII paragraph of the timing—reference clock section.
TC
TD[0:31]
KG[0:3]
t
t
(SETUP)
(SETUP)
t
t
(HOLD)
(HOLD)
Figure 4. XGMII Transmit Timing
transmit FIFO
The transmit FIFO provides sufficient buffer to compensate for both short-term clock-phase jitter and long-term
frequency differences between the input data rate at the XGMII interface to the output data rate at the XSBI
interface. Logic within the transmit FIFO provides the ability for the insertion or deletion of characters when the
transfer rate between the interfaces differs. If not for this ability, FIFO overruns or underruns could occur and
cause corruption of data. The logic within the transmit FIFO performs inserts or deletes, when necessary, in
such a way as to prevent corruption of Ethernet packets being transferred through the DLKPC192S.
64b/66b encode
To facilitate the transmission of data received from the media access control (MAC) layer, the DLKPC192S
encodes data received from the MAC using the 64b/66b encoding algorithm defined in the proposed IEEE
802.3ae standard. The DLKPC192S takes two consecutive transfers from the XGMII interface and encodes
them into a 66-bit code word. The information from the two XGMII transfers includes 64 bits of data and 8 bits
of control information. Not all combinations of control and data information are valid and, if the 64b/66b encoder
detects an invalid combination, the 64b/66b encoder replaces erroneous information with appropriately
encoded error information. The resulting 66-bit code word is then sent on to the transmit gearbox.
The encoding process is fully described within the proposed IEEE 802.3ae standard. It includes two steps, an
encoding step which converts the 72 bits of data received from the transmit FIFO block into a 66-bit code word
57 39
and then a scrambling step which scrambles 64 bits of encoded data using the scrambling algorithm x +x +1.
The 66 bits created by the encoder consists of 64 bits of data and a 2-bit synchronization field consisting of either
01 or 10. Only the 64 bits of data are scrambled, leaving the two synchronization bits unmodified. The two
synchronization bits allow the receive gearbox to obtain frame alignment and, in addition, ensure an edge
transition at least once in 66 bits of data. The encoding process allows a limited amount of control information
to be sent in-line with the data.
7
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SLLS536 − AUGUST 2002
transmission (continued)
transmit gearbox
The function of the transmit gearbox is to convert the 66-bit encoded data stream coming out of the 64b/66b
encoder into a 16-bit-wide data stream to be sent out on the XSBI bus to the physical media attachment (PMA)
device. While the effective bit rate of the 66 bit data stream is equal to the effective bit rate of the 16-bit XSBI
bus, the clock rates of the two buses are of different frequencies, thus the need for the gearbox.
XSBI transmit data bus
The connection to the PMA is via a 16-bit wide LVDS parallel data bus. Data is placed on the TXP[0:15]/
TXN[0:15] terminals. The LVDS clock on TXCP/TXCN clocks the data. Data is valid on the falling edge of TXC.
The data and clock signals are aligned as shown in Figure 5. A differential reference clock input is used as the
clock source to generate the output timing. The reference input clock is provided on XBICP/XBICN terminals.
A 100-Ω on-chip termination resistor is placed differentially at the LVDS input pair for the reference clock.
Detailed timing information is provided later in the XSBI paragraph of the timing—reference clock section.
TXCP/
TXCN
TXP[0:15]
TXN[0:15]
Figure 5. XSBI Transmit Output Timing Waveform
transmission latency
The data transmission latency of the DLKPC192S is defined as the delay from the edge of the XGMII transmit
clock when valid data is latched on the XGMII to the rising edge of the XSBI transmit clock, TXP/TXN, when
the last bit of the same data is output on the XSBI interface. The latency (T
) is measured in TXC clock
LATENCY
periods. The maximum latency is 99 TXC clock periods. If the latency is not an exact multiple of TXC clock
periods, then the latency value is rounded down to the next lower number of TXC clock periods for the minimum
latency and rounded up to the next higher integer number of TXC clock periods for the maximum latency.
TC
TXD[0:31]
KG[0:3]
A
B
C
T
(Latency MAX)
T
(Latency MIN)
TXCP/
TXCN
TXDP[0:15]
TXDN[0:15]
A
AB
B
BC
Figure 6. Transmitter Latency
8
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SLLS536 − AUGUST 2002
reception
XSBI receive data bus
Connection from the PMA to the DLKPC192S is via a 16-bit-wide LVDS parallel bus. Data is received on the
RXP[0:15]/RXN[0:15] terminals and is clocked in using the RXCP/RXCN clock. A 100-Ω on-chip termination
resistor is placed differentially at each LVDS input pair. The rising edge of RXCP/RSCN is used to latch the data
as shown in Figure 7. Please note, the phase relationship is such that the positive side of the differential clock
needs to rise in the middle of the data. This is in contrast to the transmit XSBI interface. At that interface, the
positive side of the clock is in phase with the data. To successfully loop the transmit path to the receive path
of this PCS device you must attach TXCP to RXCN and TXCN to RXCP. Detailed timing information is provided
later in the XSBI paragraph of the timing—reference clock section.
RXCP/
RXCN
t
t
(SETUP)
(HOLD)
RXP[0:15]
RXN[0:15]
Figure 7. XSBI Receive Input Timing Waveform
receive gearbox
While the transmit gearbox only performs the task of converting 66-bit data to be transported on the 16-bit XSBI
bus, the receive gearbox has more to do than just the reverse of this function. The receive gearbox must also
determine where within the incoming data stream the boundaries of the 66-bit code words are. The receive
gearbox has the responsibility of initially synchronizing the header field of the code words and continuously
monitoring the ongoing synchronization. After obtaining synchronization to the incoming data stream, the
gearbox assembles 66-bit code words and presents these to the 66b/64b decoder. While the effective bit rate
of the 66-bit data stream is equal to the effective bit rate of the 16-bit XSBI bus, the clock rates of the two buses
are of different frequencies, thus the need for the gearbox.
66b/64b decode
The data received from the XSBI bus is encoded data. The DLKPC192S decodes the data received using the
66b/64b decoding algorithm defined in the proposed IEEE 802.3ae standard. The DLKPC192S creates
consecutive 36-bit data words from the encoded 66-bit code words for transfer over the XGMII interface to the
MAC. The information for the two XGMII transfers includes 64 bits of data and 8 bits of control information. Not
all code words are valid. Invalid code words are handled by the 66b/64b decode block and appropriate error
handling is provided, as defined in the proposed IEEE 802.3ae standard.
The decoding algorithm is fully described within the proposed IEEE 802.3ae standard. It includes two steps,
a descrambling step which unscrambles 64 bits of the 66-bit code word, and a decoding step which converts
the 66 bits of data received to two sets of data, each consisting of 32 bits of data and 4 bits of control information.
57 39
These words are sent to the receive FIFO block. The descrambler reverses the scrambling algorithm x +x +1.
receive FIFO
The receive FIFO provides sufficient buffer to compensate for both short-term clock-phase jitter and long-term
frequency differences between the input of data from the XSBI interface and the output of data over the XGMII
interface. Logic within the receive FIFO provides the ability for the insertion or deletion of characters when the
transfer rate between the interfaces differs. If not for this ability, FIFO overruns or underruns could occur and
cause corruption of data. The logic within the receive FIFO performs inserts or deletes, when necessary, in such
a way as to prevent corruption of Ethernet packets being transferred through the DLKPC192S.
9
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ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
XGMII receive data bus timing
The receiver portion of the XGMII interface on the DLKPC192S outputs the decoded data on RD[0:31] and byte
control flags, KF[0:3]. The XGMII interface is a DDR interface, so data is transferred on both the rising and falling
edges of the XGMII receive data clock, RC. The basic timing is shown in Figure 8. Detailed timing information
is provided later in this document.
RC
RD[0:31]
KF[0:3]
t
t
(SETUP)
(SETUP)
t
t
(HOLD)
(HOLD)
Figure 8. Receive Interface Timing
data reception latency
The data reception latency of the DLKPC192S is defined as the delay from the edge of the XSBI transmit clock
when valid data is latched on the XSBI to the rising edge of the XGMII transmit clock, RC, when the last bit of
the same data is output on the XGMII interface. The latency (R
) is measured in RXC clock periods. The
LATENCY
maximum latency is 81 RXC clock periods. If the latency is not an exact multiple of RXC clock periods, then the
latency value is rounded down to the next lower number of RXC clock periods for the minimum latency and
rounded up to the next higher integer number of RXC clock periods for the maximum latency. The standard
requires a round-trip latency of less than 224 high-speed clock cycles.
RXCP/RXCN
RXDP[0:15]
A
B
C
RXDN[0:15]
R
(Latency MAX)
R
(Latency MIN)
RC
RXD[0:31]
RG[0:3]
*+A’+B’
B’+C’+*
Figure 9. Receive Latency
10
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SLLS536 − AUGUST 2002
detailed description (continued)
MDIO management interface
The DLKPC192S supports the management interface (MDIO) as defined in the IEEE 802.3-2000 Ethernet
standard. (Note: This is not the same as defined in the IEEE 802.3ae standard, clause 45.) The DLKPC192S
supports PCS registers as defined in this specification. At the time of definition of the DLKPC192S, the register
set for PCS devices was in flux so a suitable definition was selected and implemented.
The MDIO interface allows register-based management and control. Normal operation of the device is possible
without use of this interface because all of the essential signals necessary for operation are accessible via the
device terminals. However, some additional features are accessible only through the MDIO.
The MDIO interface provides a means of external access to the registers within the DLKPC192S. Access is via
two I/O signals: an input clock to the device and a bidirectional data signal. Commands and data are transferred
one bit at a time by placing a bit value on the data line and clocking that bit using the clock line. Commands
consist of two basic types: read and write. Except during a portion of a read command as described below, the
data line is configured as an input to the DLKPC192S.
The MDIO interface is a daisy-chained interface and often connects multiple devices such as the DLKPC192S
to a processor. The result is that other devices may reside on the MDIO bus that is connected to the
DLKPC192S. Each command sent over the MDIO interface includes an address field that determines the device
on the MDIO interface for which the command is intended. The DLKPC192S has five input terminals that
determine its MDIO address (DVAD0 through DVAD4).
If no commands are being transferred, the data line is held in the high state with pullups to ensure a 1 is seen
on the interface. The clock line can be continuously running or it may be idled (high or low) to conserve power
and then restarted to transfer a new command, provided minimum pulse duration timings are maintained.
The MDIO management interface consists of a bidirectional data path (MDIO) and a clock reference (MDC).
The protocol for reading from the internal registers is shown in Figure 10 The protocol for writing to the internal
registers is shown in Figure 11. Detailed timing information is provided later in this document. The following
paragraphs explain the two diagrams.
The sending device should send 32 or more consecutive 1s prior to beginning a new command. These 1s are
known as the preamble. The DLKPC192S requires only two 1s between commands as command lengths are
fixed.
A new command is indicated by sending 01 after the preamble. Code 01 is the start-of-frame indicator. After
the start-of-frame indicator is the 2-bit command field. Code 10 is the command code for a read. Code 01 is the
command code for a write. Codes 00 and 11 are invalid.
Immediately following the command code are 5 bits of device address. If the address matches the address
assigned to the DLKPC192S then the command is processed by the DLKPC192S; otherwise the command is
ignored, although it may be processed by another device on the MDIO interface.
Immediately following the address are 5 bits of register address. The register address specifies which of the
possible 32 registers within the DLKPC192S is to be accessed (i.e., read or written based upon the command
value). If the register address is that of a nonexistent DLKPC192S register, writes are ignored and reads are
answered with zeros.
The two bit times following the register address are used as turnaround bits. These bits times are used for read
operations, but exist even in write operations. During write operations, the sender sends a 10 sequence during
these two bit times. During read operations, the sender stops driving the data signals during the first bit time
and the addressed device starts driving a 0 during the second bit time. It should be noted that, while the data
from the processor is valid on the rising edge of MDC, data from the device is clocked onto the MDIO signal
using the rising edge. The timing of the data read during a read command has a different timing relationship
to MDC than data being transferred by the processor.
11
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MDIO management interface (continued)
Following the turnaround bits are 16 data bits. These are the values to be written to the addressed register during
write commands, or they are the values read from the addressed register during read commands.
During the bit time after the last data bit, the data signal may be released and the pullup on the line will bring
the data signal back to its idle state of all 1s.
Bit ordering is summarized in Table 1.
Table 1. MDIO Command Description
PRE
1...1
1...1
ST
01
01
OP
10
01
PHY AD
AAAAA
AAAAA
REG AD
RRRRR
RRRRR
TA
Z0
10
DATA
IDLE
READ
DDDDDDDDDDDDDDDD
DDDDDDDDDDDDDDDD
Z
Z
WRITE
MDC
HiZ
MDIO
0
1
1
0
A4
A0
R4
R0
0
D15
D0
32 1s
Read
Code
PHY
Address
Register
Address
Turn
Around
SFD
Data
Idle
Preamble
Figure 10. Management Interface Read Timing
MDC
MDIO
0
1
0
1
A4
A0
R4
R0
1
0
D15
D0
32 1s
Read
Code
PHY
Address
Register
Address
Turn
Around
SFD
Data
Idle
Preamble
Figure 11. Management Interface Write Timing
The MDIO management interface allows up to 32 16-bit internal registers. Sixteen registers are reserved by the
IEEE 802.3-2000 standard for definition and 16 are assigned for vendor-specific usage. The DLKPC192S
implements five registers defined by the proposed IEEE 802.3ae standard and four vendor-specific registers.
The IEEE-defined registers are listed in Table 2. The bit usage within these registers is defined in Table 3,
Table 4, Table 5, and Table 6. The vendor-specific registers are defined in Table 7. The bit usage within these
registers is defined in Table 8, Table 9, Table 10, and Table 11.
Table 2. MDIO Registers
REGISTER ADDRESS
REGISTER NAME
Control
DEFINITION
See Table 3
See Table 4
See Table 5
0
1
Status
2,3
4−14
15
PHY identifier
Not applicable
Extended status
See Table 6
12
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SLLS536 − AUGUST 2002
Table 3. Control Register Bit Definitions (Register 0)
BIT(S)
NAME
Reset
DESCRIPTION
READ/WRITE
0.15
Logically ORed with the inverse of RSTN terminal
1 = Global resets including FIFO clear
0 = Normal operation
Read/write
Self-clearing
When the reset bit is set to one, it automatically clears itself to zero upon completion of the reset
function.
0.14
Loopback
1 = Enable loopback mode
0 = Disable loopback mode (default)
Read/write
Read/write
—
When enabled, the transmit XSBI bus signals are internally routed to the receive XSBI bus
signals. The transmit XSBI output terminals are held at zero and the receive XSBI input terminals
are ignored when loopback is enabled. This mode requires the TXCP/N output clock to be
connected to the RXCP/N input clock. The first few transitions of the RXCP/N clock are required
for the device to come out of reset.
0.13
Power Down
1 = Power-down mode is enabled.
0 = Normal operation (default)
When enabled, all sections of the DLKPC192S, with the exception of the MDIO interface logic,
are held reset and the internal clock distribution is disabled to minimize power usage. All inputs
to the DLKPC192, except for those related to the MDIO interface, are ignored. All outputs remain
driven, but are held at steady states. A reset is required after the part is subsequently powered
back up.
0.12:0
Reserved
Write as 0. Ignore on read
Table 4. Status Register Bit Definitions (Register 1)
BIT(S)
1.15:11
1.10
NAME
DESCRIPTION
READ/WRITE
Read-only
Read returns 10000b.
PCS link status
PCS high BER
1 = Link up when both the transmit path and receive path are functional
0 = Link down
Read-only
1.9
1 = High BER. When 64b/66b receiver is detecting a BER > 10E−4.
0 = Low BER. When 64b/66b receiver is detecting a BER < 10E−4.
Note, return of low indication requires 250 µs following high BER detection.
Read-only
1.8
PCS sync done
Reserved
1 = PCS synchronized to received frames
0 = PCS not synchronized to received frames
Read-only
Read-only
1.7:0
Read returns 0
Table 5. PHY Identifier Bit Defintions (Registers 2, 3)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
2.15:0
Bits 3:18 of the organizationally unique identifier (OUI) for Texas Read returns 0x8000.
Instruments
Read-only
3.15:10 Bits 19:24 of the OUI for Texas Instruments
Read returns 0x14.
Read-only
Read-only
Read-only
Read-only
3.9:4
3.3:0
Model number
Read returns 0x04.
Revision number
Read returns 0x0 (subject to change).
Read returns 0x5040 (subject to change).
(3.15:0) Complete register value (informational)
Table 6. Extended Status Register Bit Defintions (Register 15)
BIT(S)
15.15:12 Various configurations
15.11:0 Reserved
NAME
DESCRIPTION
Read returns 0
Read returns 0
READ/WRITE
Read-only
Read-only
13
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ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
Table 7. Vendor Unique Registers
REGISTER ADDRESS
REGISTER NAME
Transmitter status
16
17
Receive status
TX and RX control
Test mode control
Reserved
18
19
20−31
Table 8. Transmitter Status Bit Definitions (Register 16)
BIT(S)
16.15
NAME
DESCRIPTION
READ/WRITE
TXI_OVFL Transmit FIFO has detected an overflow error. Event is latched to ensure observability.
Read-only
Self-clearing
16.14
TXI_UNFL Transmit FIFO has detected an underflow error. Event is latched to ensure observability.
Read-only
Self-clearing
16.13
TXI_DEL
TXI_INS
Reserved
Reserved
Transmit FIFO has detected movement toward overflow which should result in an automatic Read-only
deletion. Event is latched to ensure observability. This is not an indication of an error. Self-clearing
16.12
Transmit FIFO has detected movement toward underflow which should result in an automatic Read-only
insertion. Event is latched to ensure observability. This is not an indication of an error.
Self-clearing
16.11:10
16.9:0
First read always returns 01. Subsequent reads are indeterminate.
Read-only
Self-clearing
Read returns 0.
Read-only
NOTE: Power-on reset value: 0x0400.
Table 9. Receiver Status Bit Definitioins (Register 17)
BIT(S)
17.15
NAME
DESCRIPTION
READ/WRITE
RXO_OVFL
Receive FIFO has detected an overflow error. Event is latched to ensure observability.
Read-only
Self-clearing
17.14
17.13
17.12
RXO_UNFL
RXO_DEL
RXO_INS
Receive FIFO has detected an underflow error. Event is latched to ensure observability.
Read-only
Self-clearing
Receive FIFO has detected movement toward overflow which should result in an automatic Read-only
deletion. Event is latched to ensure observability. This is not an indication of an error. Self-clearing
Receive FIFO has detected movement toward underflow which should result in an Read-only
automatic insertion. Event is latched to ensure observability. This is not an indication of an Self-clearing
error.
17.11:10 Reserved
First read always returns 01. Subsequent reads are indeterminate
Read-only
Self-clearing
17.9
RXG_HIBER_SAV 64/66b bit error rate (BER > 10E−4). The occurrence of this condition does not cause the Read-only
receive state machine to transition to the RX_INIT state and it does not output line fault Self-clearing
characters on the XGMII receive interface.
17.8:1
17.0
RXG_ERR_CNT
Frame-sync BER count. Contains the value from the most recent 250-µs count period. Read-only
Changes automatically once every 250 µs
Self-clearing
Reserved
Read returns 0.
Read-only
NOTE: Power-on reset value: 0x0400.
14
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ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
SLLS536 − AUGUST 2002
Table 10. Transmitter and Receiver Control Bit Definitions (Register 18)
BIT(S)
NAME
DESCRIPTION
READ/WRITE
18.15:10 MDIO_DEL_SPC[5:0]
Minimum number of deletable idle words that must be passed between deletion events. Read/write
Default is 16.
18.9
MDIO_RCNT_EBL
Transmission start up delay enable. Controls whether a minimum of eight idle words Read/write
must be detected on the XGMII transmit path before the transmit path is enabled.
Default is 1, enabled.
18.8
MDIO_AKR_NI
Reserved
Reads value from I/O terminal.
Read returns 0.
Read-only
Read-only
18.7:0
NOTE: Power-on reset value (IDLE MODE): 0x4200.
Power-on reset value (AKR MODE): 0x4300.
Table 11. Test Mode Bit Definitions (Register 19)
BIT(s)
NAME
DESCRIPTION
READ/WRITE
Read-only
Read/write
Read/write
Read/write
Read/write
Read/write
19.15:11 Reserved
Read returns 0.
19.10
19.9
MDIO_RXC_BYPASS
MDIO_RXS_BYPASS
MDIO_TXC_BYPASS
MDIO_TXS_BYPASS
Reserved
Bypass receive decomposer
Bypass receive descrambler
Bypass transmit composer
Bypass transmit scrambler
19.8
19.7
19.6:0
These bits must be maintained at the default value of 0.
NOTE: Power-on reset value: 0x0000.
These bits are intended for test only and should not be programmed to any value except 0x0000.
IPG modes
The XGMII interface transports information that consists of packets and interpacket gap (IPG) characters. While
the proposed IEEE 802.3ae standard defines that the IPG, when transferred over the XGMII interface, consists
of idle characters, industry practice has also defined a mode in which the IPG consists of other characters. This
alternative mode character set is that used by XAUI devices to replace the idles within the IPG. This character
set consists of alignment characters (A), control characters (K) and replacement characters (R).
The DLKPC192S can operate in one of two modes: AKR mode or idle mode. The configuration control terminal
AKR_NI selects the mode.
In AKR mode, AKR_NI = 1, the DLKPC192S converts all AKR characters to idle characters, performs insertion
or deletion on the idle characters, and transmits only encoded idle characters out the XSBI interface. The
receive channel expects encoded idle characters to enter the XSBI, and performs insertions and deletions on
idle characters only.
In idle mode, AKR_NI = 0, the DLKPC192S expects the IPG to consist of a sequence of idle characters on the
XGMII interface and encoded idle characters on the XBSI interface. Both the transmit and receive FIFOs rely
upon a valid idle stream to perform clock tolerance compensation.
In sumamry, if the system in which the DLKPC192S is placed presents AKR characters on the XGMII transmit
input interface, the AKR_NI pin must be set high. If the system presents idle characters on the XGMII input, the
AKR_NI pin must be set low. In both configurations, the device always outputs idle characters on the XGMII
receive output interface and encoded idle characters on the XSBI transmit output interface. In addition, the
device always requires encoded idle characters to be available on the XSBI receive input interface. Finally, the
DLKPC192S is not able to perform clock tolerance compensation on local fault characters (LF) or remote fault
characters (RF), so the IPG must contain some idle characters during these conditions.
15
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ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
detailed description (continued)
clocks
There are five interfaces on the DLKPC192S device: the XGMII transmit interface, the XGMII receive interface,
the XSBI transmit interface, the XSBI receive interface, and the MDIO interface (see Figure 1).
The XGMII transmit and receive interfaces operate at the same frequency and are specified identically. While
the clocks associated with the XGMII interface share specifications, the DLKPC192S places no requirement
that these clocks operate at exactly the same rate or have any phase relationship to each other. TC is the
transmit clock and is an input to the DLKPC192S. RC is the receive clock and is an output of the DLKPC192S.
RC is generated from a reference clock, RFC, which is an input to the DLKPC192S. RFC is input using LVDS
on terminals RFCP/RFCN. The two clock input signals associated with the XGMII transmit and receive
interfaces, TC and RFC, are expected to run continuously.
The XSBI transmit and receive interfaces operate at the same frequency and are specified identically. While
the clocks associated with the XSBI interface share specifications, the DLKPC192S places no requirement that
these clocks operate at exactly the same rate or have any phase relationship to each other. RX is the receive
clock and is an input to the DLKPC192S. TX is the transmit clock and is an output of the DLKPC192S. TX is
generated from a reference clock, XBIC, which is an input to the DLKPC192S. XBIC is input using LVDS on
terminals XBICP/XBICN. The two clock input signals associated with the XSBI transmit and receive interfaces,
RX and XBIC, are expected to run continuously.
The MDIO interface uses a clock (MDC) to strobe data into or out of the DLKPC192S. While there are maximum
frequency requirements for this clock, there is no minimum frequency. A system implementation, providing it
meets all of the other requirements for the MDIO interface, need not provide a continuously running MDC clock
signal.
power-on reset
The DLKPC192S uses an external power-on reset. Upon application of minimum valid power, power-on reset
may be removed as required by the system. While the DLKPC192S is being held reset: the XGMII outputs,
including the RC clock output are held low; the XSBI outputs are forced to toggle. Reset may be applied at
anytime. It is recommended that when reset is asserted that reset be held for a minimum of 1 microsecond (after
minimum valid power is applied). All clock inputs are expected to be valid at the time that reset is deasserted.
Shortly after a reset has occurred, the DLKPC192S begins outputting local fault and idle characters on the
XGMII interface and properly encoded local fault and idle characters on the XSBI interface. The local fault
characters are generated at the output of the FIFOs. For the transmit path, the local fault character must
propagate through the DLKPC192S before it can appear on the XSBI output.
For the transmit path, local faults continue to be generated until:
1. At least eight valid idle or replacement character sets are transmitted to the DLKPC192S across the XGMII
interface, at which time the XGMII data is routed to the transmit FIFO.
2. The transmit FIFO is filled to its midpoint (approximately 32 bytes or 8 XGMII transfers), at which time
transferring of data out of the FIFO is enabled.
3. The data from the FIFO propagates through the 64b/66b encoder and the transmit gearbox and appears
on the XSBI transmit bus.
For the receive path, local faults continue to be generated until:
1. Frame lock can be established using the input at the XSBI receive interface.
2. The data propagates through the 66b/64b decoder, through the receive FIFO and appears on the XGMII
receive bus.
The MDIO interface accepts valid commands immediately following the deassertion of the reset signal.
16
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ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
SLLS536 − AUGUST 2002
detailed description (continued)
error handling
There are three types of errors that can be detected within the DLKPC192S. The three types are loss of frame
synchronization, bit errors, and FIFO errors (overruns or underruns). Loss of frame synchronization can only
occur on the receive path. Some, but not all, bit errors can be detected during the 64b/66b encode or decode
process. FIFO errors can occur only if a clock on either the XGMII or XSBI is significantly out of specification
or if there are insufficient and/or improper IPGs. If the clocks are within specification and a valid packet stream
is being sent or received, FIFO errors do not occur. Reaction to each type of error is described in the following
paragraphs.
The DLKPC192S resets frame synchronization at power-up or reset. Until frame synchronization is
accomplished, the DLKPC192S outputs a local fault character on the receive XGMII bus. The link status is set
to zero (link down) whenever the local fault character is being generated. Once frame synchronization is
completed, the DLKPC192S can perform normal operations.
Bit errors typically occur on the receive path of the DLKPC192S but could also occur on the transmit path. Bit
errors can be detected on the receive side either by detection of a framing error or by detection of an error during
the 66b/64b decode process. Bit errors on the transmit path can only be detected during the 64b/66b encoding
process. While the DLKPC192S device may detect some bit errors, many of the errors will likely go undetected
as the functional definition of a PCS type device does not include a method for reliable detection. If a bit error
is detected, the response by the DLKPC192S is to replace the received data containing the error with an
encoded control value signifying that an error occurred. Basically, the corrupted data is replaced with defined
error characters. If the rate of bit errors is high enough, frame synchronization could be lost. If frame
synchronization is lost, the DLKPC192S begins generating local fault characters. Because frame
synchronization is a function of the receive path and not the transmit path, local fault character generation as
a result of bit errors can occur only on the receive path.
The FIFOs within the DLKPC192S are sufficient to handle differences in clock rates between the XGMII and
the XSBI interfaces. Differences in clock rates are likely to occur, but only within specified limits. The depth of
the DLKPC192S FIFOs, the maximum packet sizes and the minimum interpacket gaps (IPGs) specified by the
Ethernet standards, along with the algorithms implemented within the DLKPC192S ensure that the FIFOs never
underrun or overrun during normal operation. If there is a system malfunction that causes the inputs to the
DLKPC192S to go out of specification, it is possible that the DLKPC192S could experience a FIFO underrun
or overrun. If the DLKPC192S detects such a condition, it sets an error condition flag in the vendor specific
registers, resets the link status, and generates local fault on the receive XGMII bus. The DLKPC192S must be
reset (soft or hard) to clear this error condition.
17
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ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
†
absolute maximum ratings over operating free-air temperature (unless otherwise noted)
Supply voltage range, V
I/O supply voltage range:
(see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 2.4 V
VDDS (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
VDDO (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4 V
DD
Voltage on any SSTL input terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDO+0.5 V
Voltage on any SSTL output terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDO+0.5 V
Voltage on any LVDS input terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDS+0.5 V
Voltage on any LVDS output terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDS+0.5 V
Voltage on any LVTTL input terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDS+0.5 V
Voltage on any LVTTL output terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to VDDS+0.5 V
Electrostatic discharge (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Class 3, A:2 kV
Case temperature under bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 125°C
Junction temperature under bias . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −55°C to 150°C
Storage temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260°C
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. All voltage values are with respect to the GND terminals.
2. This rating is measured using MIL-STD-883C Method, 3015.7.
recommended operating conditions
MIN
1.71
3.135
2.375
0
NOM MAX
1.8 1.89
UNIT
V
Supply voltage, V
DD
I/O supply voltage, VDDS
I/O supply voltage, VDDO
3.3 3.465
2.5 2.625
70
V
V
Operating free-air temperature, T
°C
A
supply voltage power dissipation
TEST CONDITIONS
MIN
NOM MAX
UNIT
V
supply voltage power dissipation, P
D,VDD
510
400
580
DD
VDDS I/O supply voltage power dissipation, P
C
= 15 pF, a5 pattern used
mW
D,VDDS
D,VDDO
L
VDDO I/O supply voltage power dissipation, P
18
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ꢅ
ꢉ
ꢊ
ꢋ
ꢌ
ꢍꢎ
ꢏꢐ
ꢑꢏ
ꢒꢓ
ꢏꢐ
ꢁ
ꢔꢓ
ꢃ
ꢑ
ꢕ
ꢈꢖ
ꢄ
ꢔ
ꢁ
ꢄ
ꢗ
ꢀ
ꢖ
ꢓ
ꢋ
ꢈ
ꢘ
ꢙ
ꢁ
ꢔ
ꢕ
ꢏ
ꢒ
ꢚ
ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
ꢃ
ꢄ
ꢈ
ꢛ
SLLS536 − AUGUST 2002
LVDS I/O characteristics
LVDS electrical characteristics free-air temperature
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
UNIT
V
V
V
Input voltage
0
2
V
I
V
R
= 1.2 V, R = 1 kΩ,
bias
REF
L
Output voltage
0.925
1.475
V
O
= 50 Ω
Input differential voltage
0.1
V
Ω
ID
R
R
R
Current bias reference resistor
Input differential impedance
Output differential impedance
Reference voltage
1k
100
100
1.2
bias
I
On-chip termination
On-chip termination
80
80
120
120
1.26
400
−11
Ω
Ω
O
V
REF
1.14
250
V
|V
|
Differential steady-state output voltage magnitude
LVDS high-level input current
LVDS low-level input current
Input capacitance
R
= 50 Ω
mV
µA
µA
pF
pF
OD
L
I
I
V
V
= VCC
= 0 V
IH
IH
−30
IL
IL
C
C
0.34
5.17
I
Output capacitance
O
†
All typical values are at T = 25°C and with V
DDS
= 3.3 V.
A
LVDS driver switching characteristics over recommended operating conditions
PARAMETER
TEST CONDITIONS
MIN
0
TYP
MAX
0.5
UNIT
ns
t
t
Differential output signal rise time (10% to 90%)
Differential output signal fall time (90% to 10%)
r
R
= 100 Ω, = 10 pF
C
L
L
0
0.5
ns
f
19
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ꢋ
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ꢎ
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ꢏ
ꢐ
ꢑ
ꢏ
ꢒ
ꢓ
ꢏ
ꢐ
ꢁ
ꢔ
ꢓ
ꢃ
ꢑ
ꢕ
ꢈꢖ
ꢄꢔ
ꢁ
ꢄꢗ
ꢀ
ꢖꢓ
ꢋ
ꢈꢘ
ꢙꢁ
ꢔ
ꢕ
ꢏ
ꢒ
ꢚ
ꢃ
ꢄ
ꢈꢛ
SLLS536 − AUGUST 2002
SSTL I/O DC characteristics
SSTL electrical characteristics free-air temperature
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
V +0.3
DDO
UNIT
V
V
V
V
V
V
V
Input voltage for input buffers
Output voltage for output buffers
High-level output voltage
Low-level output voltage
High-level input voltage
Low-level input voltage
Input capacitance
−0.3
0
I
V
DDO
V
O
V
+0.38
REF
V
OH
OL
IH
IL
V −0.38
REF
V
V
+0.18
V
REFH
V
−0.18
1.73
V
REFH
C
pF
V
I
V
REF
Reference voltge
0.5 × V
DDO
SSTL driver switching characteristics over recommended operating conditions
PARAMETER
TEST CONDITIONS
MIN
0
TYP
MAX
0.5
UNIT
ns
t
t
Output signal rise time (10% to 90%)
Differential output signal fall time (90% to 10%)
r
R
= 50 Ω, = 10 pF,
C
L
L
40-Ω series terminator at source
0
0.5
ns
f
LVTTL I/O DC characteristics
LVTTL electrical characteristics free-air temperature
PARAMETER
TEST CONDITIONS
MIN
−0.3
0
TYP
MAX
UNIT
V
V
V
V
V
V
V
Input voltage for input buffers
Output voltage for output buffers
High-level output voltage
Low-level output voltage
High-level input voltage
Low-level input voltage
Input capacitance
V
+0.3
I
DDO
V
DDS
V
O
2.4
V
OH
OL
IH
IL
0.5
V
2
V
0.8
V
C
1.57
pF
I
LVTTL driver switching characteristics over recommended operating conditions
†
PARAMETER
TEST CONDITIONS
MIN TYP
MAX
0.5
UNIT
ns
t
t
Output signal rise time (10% to 90%)
Differential output signal fall time (90% to 10%)
7.9
7.8
r
R
= 50 Ω
L
0.5
ns
f
†
All typical values are at T = 25°C and with V
DDS
= 3.3 V.
A
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ꢀꢁ ꢂ ꢃꢄ ꢅꢆ ꢇꢈ
ꢅ ꢉ ꢊꢋꢌ ꢍꢎ ꢏꢐ ꢑꢏ ꢒꢓꢏꢐ ꢁ ꢔꢓ ꢃꢑꢕ ꢈꢖ ꢄꢔꢁ ꢄꢗ ꢀꢖ ꢓꢋ ꢈꢘ ꢙꢁꢔꢕ ꢏꢒ ꢚ ꢃꢄ ꢈꢛ
ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
SLLS536 − AUGUST 2002
timing—reference clocks
RFC clock requirements
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
ppm
f, frequency
Maximum data rate
TYP−0.01% 156.25 TYP+0.01%
Frequency tolerance
Duty cycle
−100
45%
100
55%
40
50%
Jitter, peak-to-peak
ps
XBIC clock requirements
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
MHz
ppm
f, frequency
Maximum data rate
TYP−0.01% 644.53125 TYP+0.01%
Frequency tolerance
Duty cycle
−100
45%
100
55%
40
50%
Jitter, peak-to-peak
ps
A note on timing diagrams:
The IEEE standard defines the data-valid levels between 20% and 80% of the maximum voltage. On the
XSBI interface, with realistic rise and fall times specified and met at 400 ps for both the data and clock, this
would leave no margin onT
and T
for the following variables: data-to-data matching (16
CQ_PRE
CQ_POST
lines), clock-to-data matching, process variation, temperature variation, voltage variation, jitter sources
internal and external. This specification is not possible to meet given this definition. Additionally, the ASIC
design tools currently on the market report all timing parameters at the 50% points. Also, LVDS cells
typically latch very close to the 50% points making a larger data-invalid window unnecessary. For these
reasons, timing specifications in the following four sections are interpreted for data valid at the 50% crossing
points.
XSBI
The XSBI transmit interface timings are detailed in Table 12 and shown in Figure 12.
t
(PERIOD)
50%
50%
TXC
t
t
(CQ_PRE)
Valid Data
(CQ_POST)
TXD(15:0)
Valid Data
Valid Data
Figure 12. XSBI Transmit Timing Diagram
Table 12. XSBI Transmit AC Specification
PARAMETER
MIN
TYP
MAX
UNIT
ns
t
PMA_TX_CLK period for LAN operation
Data-invalid window prior to TXC
Data-invalid window after TXC
PMA_TX_CLK duty cycle
1.551360 1.551515 1.551670
(PERIOD)
t
200
200
ps
(CQ_PRE)
t
ps
(CQ_POST)
t
40%
60%
(DUTY)
NOTE: Minimum data-invalid window with respect to TXC
21
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀ ꢁꢂꢃ ꢄꢅ ꢆ ꢇꢈ
ꢅꢉ ꢊꢋ ꢌ ꢍ ꢎ ꢏꢐ ꢑ ꢏ ꢒꢓ ꢏꢐ ꢁꢔ ꢓ ꢃ ꢑꢕ ꢈꢖ ꢄꢔ ꢁ ꢄꢗꢀ ꢖꢓꢋ ꢈꢘ ꢙꢁꢔꢕꢏ ꢒ ꢚꢃꢄ ꢈꢛ
ꢜꢖ ꢐ ꢑ ꢈꢈ ꢐ ꢁ ꢝꢋꢞꢖ ꢖ ꢖ ꢓꢐ ꢏꢒ ꢟꢔꢄ ꢏ
SLLS536 − AUGUST 2002
XSBI (continued)
The XSBI receive interface timings are detailed in Table 13, and shown in Figure 13. Note, the phase
relationship is such that the positive side of the differential clock needs to rise in the middle of the data. This
is in contrast to the transmit XSBI interface. On that interface, the positive side to the clock is in phase with the
data. To successfully loop the transmit path to the receive path of this PCS device you must attach TXCP to
RXCN and TXCN to RXCP.
t
(PERIOD)
RXC
50%
50%
t
t
(HOLD)
(SETUP)
Valid Data
Valid Data
RXD(15:0)
Figure 13. XSBI Receive Timing Diagram
Table 13. XSBI Receive Timing
PARAMETER
MIN
TYP
1.551515
MAX
UNIT
t
t
t
t
PMA_RX_CLK period
PMA_RX_CLK duty cycle
Data-setup before RXC
Data-hold after RXC
ns
(PERIOD)
45%
300
300
55%
(DUTY)
ps
ps
(SETUP)
(HOLD)
XGMII
t
(PERIOD)
50%
TC
t
t
(SETUP)
(SETUP)
t
t
(HOLD)
Valid Data
(HOLD)
Valid Data
TD(31:0)
KG(3:0)
Valid Data
50%
Figure 14. XGMII Transmit Timing Diagram
Table 14. XGMII Transmit AC Specification
PARAMETER
MIN
TYP
6.4
MAX
UNIT
ns
t
t
t
t
TC transmit clock (received by DLKPC192S)
Data-setup to rising or falling edge of TC
Data-hold from rising or falling edge of TC
TC duty cycle
(PERIOD)
(SETUP)
(HOLD)
480
ps
480
ps
40%
60%
(DUTY)
22
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
ꢀꢁ ꢂ ꢃꢄ ꢅꢆ ꢇꢈ
ꢅ
ꢉ
ꢊꢋꢌ
ꢍꢎ
ꢏꢐ
ꢑꢏ
ꢒ
ꢓ
ꢏꢐ
ꢁ
ꢔ
ꢓ
ꢃꢑ
ꢕ
ꢈꢖ
ꢄ
ꢔ
ꢁ
ꢄ
ꢗ
ꢀ
ꢖ
ꢓ
ꢋ
ꢈ
ꢘ
ꢙ
ꢁ
ꢔ
ꢕ
ꢏ
ꢒ
ꢚ
ꢜ ꢖꢐ ꢑ ꢈꢈ ꢐꢁ ꢝꢋ ꢞ ꢖꢖ ꢖꢓ ꢐꢏ ꢒꢟꢔ ꢄꢏ
ꢃ
ꢄ
ꢈ
ꢛ
SLLS536 − AUGUST 2002
XGMII (continued)
t
(PERIOD)
50%
50%
RC
t
t
(SETUP)
(SETUP)
t
t
(HOLD)
Valid Data
(HOLD)
Valid Data
RD(31:0)
KF(3:0)
Valid Data
Figure 15. XGMII Receive Timing Diagram
Table 15. XGMII Receive AC Specification
PARAMETER
MIN
TYP
6.4
MAX
UNIT
ns
t
t
t
t
RC receive clock (received by DLKPC192S)
Data-setup to rising or falling edge of RC
Data-hold from rising or falling edge of RC
RC duty cycle
(PERIOD)
(SETUP)
(HOLD)
†
650
ps
960
ps
40%
60%
(DUTY)
†
RD5, RD9, RD10, and RD11 do not meet the IEEE specification of 960 ps, RD5 being the worst channel with the least setup time. There exists
excess hold margin, the minimum hold time being 1.3 ns, to allow for board-level clock delay to meet the IEEE 960-ns setup-time requirement.
MDIO
The technology and timing for the MDIO interface was under flux within the 802.3ae task force during the
definition of the DLKPC192S. In the DLKPC192S, the MDIO interface technology was chosen to be LVTTL.
testability
Test functionality was added to the DLKPC192S to support device evaluation and test during manufacturing.
This functionality is intended for use by Texas Instruments. The TEST input signal, if set to 1, enables various
test modes. When TEST is true, some of the input and output signals of the DLKPC192S may change
functionality.
While harm to the device is not likely to occur if TEST modes are enabled, users of the DLKPC192S are advised
to tie the TEST terminal to 0 at all times.
23
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
7-Jun-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
DLKPC192SGNT
NRND
BGA
GNT
289
TBD
Call TI
Call TI
Samples Not Available
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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