DLL-113R-0.88G [MERRIMAC]
DELAY LINE; 延迟线
| 型号： | DLL-113R-0.88G |
| 厂家： | 
MERRIMAC INDUSTRIES, INC. |
| 描述： | DELAY LINE |
| 文件： | 总1页 (文件大小：116K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DLL-113R-0.88G
DELAY LINE
PRELIMINARY REV: 006, 12/02/04
TECHNICAL DESCRIPTION
MULTI-MIX® DELAY LINES
APPLICATIONS
• AMPS
FEATURES
• 869 - 894 MHz
• LOW LOSS
• BASE STATION POWER AMPLIFIER
• LOW VSWR
• SURFACE MOUNT
• LOW COST
LINEARIZATION NETWORKS
• FEED FORWARD
• PRE-DISTORTION
• ADAPTIVE INTERFERENCE CANCELLATION
The DLL-113R-0.88G, a member of the Multi-Mix® DLL family of delay lines, provides a mean delay of
11.25 nS in the AMPS band and features low insertion loss and low VSWR. The DLL-113R-0.88G exhibits
excellent phase linearity and amplitude flatness over the 869 - 894 MHz frequency range. The Multi-Mix®
DLL-113R-0.88G is intended for use in power amplifier linearization networks such as feedforward and
predistortion.
DLL delay lines are fusion bonded multilayer stripline structures. The DLL series offers an excellent alter-
native to expensive coaxial and delay filter structures. The fusion bonding process yields a homgeneous
monolithic dielectric structure with reliability, ruggedness and electrical and thermal performance that is
superior to conventional adhesive bonding techniques.
GENERAL SPECIFICATIONS
FREQUENCY RANGE
MHz
MEAN DELAY*
PHASE DEVIATION
(DEGREES MAX)
AMPLITUDE FLATNESS
(nS)
(dB p-p)
869 - 894
11.25 ± 0.2
± 0.5
0.15
RF INTERFACE
RETURN LOSS
INSERTION LOSS
POWER HANDLING
SIZE/OUTLINE
(dB MIN)
(dB MIN)
(WATTS)
(Inches - l,w,h)
20
4.6
15
Surface Mount
1.0 x 1.0 x 0.18
Specifications are based upon unit mounted on printed circuit board with 50 Ohm nominal impedance.
*Mean delay refers to the group delay of the applied input signal through the network. The specified tolerance relates to unit-unit group delay variation.
PACKAGE OUTLINE / MOUNTING CONFIGURATION
2X 0.389 [9.87]
0.109 [2.76]
HOT VIA
2X 0.057 [1.45]
GROUND PLANE OF UNIT SHOULD
BE SOLDERED TO GROUND PLANE
OF CIRCUIT BOARD FOR OPTIMUM
PERFORMANCE.
2X 0.889 [22.58]
0.400 [10.16]
0.021 [0.52]
0.089 [2.26]
1.000 [25.40]
HOT VIA
3X HOT VIA
HOT VIA
GND
50 OHM LINE
.032 DIELECTRIC THICKNESS
ER
2X 0.037 [0.94]
1
2
= 3.38
PIN 2
2X 0.076 [1.93] SQ
5X 0.037 [0.94]
0.848 [21.54]
GROUND PLANE
0.848 [21.54]
ORIENTATION MARKER
DENOTES PIN LOCATION
PIN 1
GND
0.168 [4.28]
THE MULTI-MIX MICROTECHNOLOGY® GROUP IS ISO 9001:2000 REGISTERED
U.S. Patent 6,099,677 and other Patents Pending.
Merrimac Industries / 41 Fairfield Place, West Caldwell, NJ 07006
Tel: 1.888.434.MMFM / Fax: 973.882.5990 / Email: MMFM@merrimacind.com / www.Multi-Mix.com
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