DAC161P997-DIE_15 [TI]
Single-Wire 16-Bit DAC;
| 型号： | DAC161P997-DIE_15 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | Single-Wire 16-Bit DAC |
| 文件： | 总5页 (文件大小：103K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
DAC161P997-DIE
www.ti.com
SLAS940 –MARCH 2013
Single-Wire 16-Bit DAC
Check for Samples: DAC161P997-DIE
1
FEATURES
2
•
•
•
•
•
•
•
•
•
16-Bit Linearity
APPLICATIONS
Single-Wire Interface (SWIF) With Handshake
Digital Data Transmission (No Loss of Fidelity)
Pin Programmable Power-Up Condition
Self Adjusting to Input Data Rate
•
•
•
•
•
•
•
•
Current Loop Transmitter
Industrial Process Control
Actuator Control
Factory Automation
Building Automation
Precision Instruments
Data Acquisition Systems
Test Systems
Loop Error Detection and Reporting
Programmable Output Current Error Level
No External Precision Components
Simple Interface to HART Modulator
DESCRIPTION
The DAC161P997-DIE is a 16- bit ∑Δ digital-to-analog converter (DAC) for transmitting an analog output current.
The data link to the DAC161P997-DIE is a single wire interface (SWIF) which allows sensor data to be
transferred in digital format over an isolation boundary using
a single isolation component. The
DAC161P997-DIE’s digital input is compatible with standard isolation transformers and optocouplers. Error
detection and handshaking features within the SWIF protocol ensure error free communication across the
isolation boundary. For applications where isolation is not required, the DAC161P997-DIE interfaces directly to a
microcontroller.
The loop drive of the DAC161P997-DIE interfaces to a highway addressable remote transducer (HART)
modulator, allowing injection of FSK modulated digital data into the current loop. This combination of
specifications and features makes the DAC161P997-DIE ideal for 2- and 4-wire industrial transmitters.
ORDERING INFORMATION(1)
PACKAGE
DESIGNATOR
PRODUCT
PACKAGE
ORDERABLE PART NUMBER
PACKAGE QUANTITY
DAC161P997TDA1
DAC161P997TDA2
324
10
DAC161P997
TD
Bare die in waffle pack(2)
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
(2) Processing is per the Texas Instruments commercial production baseline and is in compliance with the Texas Instruments Quality
Control System in effect at the time of manufacture. Electrical screening consists of DC parametric and functional testing at room
temperature only. Unless otherwise specified by Texas Instruments AC performance and performance over temperature is not
warranted. Visual Inspection is performed in accordance with MIL-STD-883 Test Method 2010 Condition B at 75X minimum.
1
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2
All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 2013, Texas Instruments Incorporated
DAC161P997-DIE
SLAS940 –MARCH 2013
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
BARE DIE INFORMATION
BACKSIDE
POTENTIAL
BOND PAD
METALLIZATION COMPOSITION
BOND PAD
THICKNESS
DIE THICKNESS
BACKSIDE FINISH
10.5 mils.
Silicon with backgrind
Floating
AlCu (0.5%)
850 nm
2
Submit Documentation Feedback
Copyright © 2013, Texas Instruments Incorporated
Product Folder Links: DAC161P997-DIE
DAC161P997-DIE
www.ti.com
SLAS940 –MARCH 2013
Table 1. Bond Pad Coordinates in Microns
DESCRIPTION
PAD NUMBER
X MIN
-811
Y MIN
719
X MAX
-719
Y MAX
811
COMA
COMA
COMD
VD
1
2
-715.5
-715.5
-715.5
-715.5
-715.5
-254.2
177.15
524
527
-651.5
-651.5
-651.5
-651.5
-651.5
-190.2
241.15
588
591
3
266.25
-196.95
-406.95
-583.55
-710.5
651.6
651.6
319
330.25
-132.95
-342.95
-519.55
-646.5
715.6
715.6
383
4
DIN
5
DBACK
ACKB
C1
6
7
8
C2
9
C3
10
11
12
13
14
15
16
17
650.95
650.95
650.95
719
714.95
714.95
714.95
811
NC
-3.15
60.85
-372.2
-719
LOW
OUT
ERRLVL
ERRB
VA
-436.2
-811
371.9
49.6
-710.5
-710.5
651.6
651.6
435.9
113.6
-44.65
-379.1
-646.5
-646.5
715.6
715.6
-108.65
-443.1
BASE
Copyright © 2013, Texas Instruments Incorporated
Submit Documentation Feedback
3
Product Folder Links: DAC161P997-DIE
PACKAGE OPTION ADDENDUM
www.ti.com
10-Oct-2013
PACKAGING INFORMATION
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
DAC161P997TDA1
DAC161P997TDA2
ACTIVE
0
0
324
TBD
TBD
Call TI
Call TI
N / A for Pkg Type
N / A for Pkg Type
0 to 0
0 to 0
ACTIVE
10
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
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provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 1
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