CD74HCT4060MTG4 [TI]
High-Speed CMOS Logic 14-Stage Binary Counter with Oscillator; 高速CMOS逻辑14级二进制计数器与振荡器
| 型号： | CD74HCT4060MTG4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | High-Speed CMOS Logic 14-Stage Binary Counter with Oscillator |
| 文件： | 总17页 (文件大小：449K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
CD54HC4060, CD74HC4060,
CD54HCT4060, CD74HCT4060
Data sheet acquired from Harris Semiconductor
SCHS207G
High-Speed CMOS Logic
14-Stage Binary Counter with Oscillator
February 1998 - Revised October 2003
the negative transition of φI (and φO). All inputs and outputs
are buffered. Schmitt trigger action on the input-pulse-line
permits unlimited rise and fall times.
Features
• Onboard Oscillator
• Common Reset
• Negative-Edge Clocking
[ /Title
(CD74
HC406
0,
CD74
HCT40
60)
/Sub-
ject
(High
Speed
CMOS
In order to achieve a symmetrical waveform in the oscillator
section the HCT4060 input pulse switch points are the same
as in the HC4060; only the MR input in the HCT4060 has
TTL switching levels.
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
Ordering Information
o
o
• Wide Operating Temperature Range . . . -55 C to 125 C
• Balanced Propagation Delay and Transition Times
TEMP. RANGE
o
PART NUMBER
CD54HC4060F3A
CD54HCT4060F3A
CD74HC4060E
( C)
PACKAGE
16 Ld CERDIP
16 Ld CERDIP
16 Ld PDIP
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
CD74HC4060M
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
16 Ld TSSOP
16 Ld TSSOP
16 Ld TSSOP
16 Ld PDIP
- High Noise Immunity: N = 30%, N = 30% of V
IL IH CC
at V
= 5V
CC
CD74HC4060MT
CD74HC4060M96
CD74HC4060PW
CD74HC4060PWR
CD74HC4060PWT
CD74HCT4060E
CD74HCT4060M
CD74HCT4060MT
CD74HCT4060M96
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
V = 0.8V (Max), V = 2V (Min)
IL IH
- CMOS Input Compatibility, I ≤ 1µA at V , V
OL OH
l
Description
The ’HC4060 and ’HCT4060 each consist of an oscillator
section and 14 ripple-carry binary counter stages. The
oscillator configuration allows design of either RC or crystal
oscillator circuits. A Master Reset input is provided which
resets the counter to the all-0’s state and disables the
oscillator. A high level on the MR line accomplishes the reset
function. All counter stages are master-slave flip-flops. The
state of the counter is advanced one step in binary order on
16 Ld SOIC
16 Ld SOIC
16 Ld SOIC
NOTE: When ordering, use the entire part number. The suffixes 96
and R denote tape and reel. The suffix T denotes a small-quantity
reel of 250.
Pinout
CD54HC4060, CD54HCT4060 (CERDIP)
CD74HC4060 (PDIP, SOIC, TSSOP)
CD74HCT4060 (PDIP, SOIC)
TOP VIEW
Q12
Q13
Q14
Q6
1
2
3
4
5
6
7
8
16 V
CC
15 Q10
14 Q8
13 Q9
12 MR
11 φI
Q5
Q7
10 φO
Q4
9
φO
GND
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2003, Texas Instruments Incorporated
1
CD54/74HC4060, CD54/74HCT4060
Functional Diagram
7
Q4
5
Q5
4
12
Q6
MR
6
Q7
14
13
15
1
14-STAGE
RIPPLE
COUNTER
AND
Q8
11
Q9
φI
OSCILLATOR
Q10
Q12
Q13
Q14
2
3
9
φO
φO
GND = 8
= 16
10
V
CC
9
øO
ø4 Q4
ø5
Q13
ø14 Q14
FF14
ø1 Q1
10
øO
FF1
FF4
FF5 - FF13
Q13
11
ø1
ø1 Q1
R
ø4 Q4
R
ø5
ø14 Q14
R
R
12
MR
7
2
3
Q13
Q4 5, 4, 6, 14, 13, 15, 1
Q5 - Q10, Q12
Q14
FIGURE 1. LOGIC BLOCK DIAGRAM
TRUTH TABLE
øI
↑
MR
L
OUTPUT STATE
No Change
↓
L
Advance to Next State
All Outputs are Low
X
H
2
CD54/74HC4060, CD54/74HCT4060
Absolute Maximum Ratings
Thermal Information
o
DC Supply Voltage, V
. . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
Thermal Resistance (Typical, Note 1)
θ
( C/W)
CC
DC Input Diode Current, I
JA
IK
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . .
M (SOIC) Package. . . . . . . . . . . . . . . . . . . . . . . . . .
PW (TSSOP) Package . . . . . . . . . . . . . . . . . . . . . .
67
73
For V < -0.5V or V > V
+ 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
OK
For V < -0.5V or V > V
I
I
CC
DC Output Diode Current, I
108
o
+ 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
O
O
CC
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . 150 C
Maximum Storage Temperature Range . . . . . . . . . .-65 C to 150 C
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . . 300 C
o
o
DC Drain Current, per Output, I
O
o
For -0.5V < V < V
+ 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±25mA
O
CC
DC V
CC
or Ground Current, I
. . . . . . . . . . . . . . . . . . . . . . . . .±50mA
CC
(SOIC - Lead Tips Only)
Operating Conditions
o
o
Temperature Range, T . . . . . . . . . . . . . . . . . . . . . . -55 C to 125 C
A
Supply Voltage Range, V
CC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, V , V . . . . . . . . . . . . . . . . . 0V to V
I
O
CC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
HC TYPES
SYMBOL
V (V)
I
I
(mA)
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
O
High Level Input
Voltage
V
-
-
-
2
4.5
6
1.5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
1.5
-
1.5
3.15
4.2
-
-
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
V
IH
3.15
-
3.15
-
-
4.2
-
4.2
-
-
Low Level Input
Voltage
V
-
2
-
0.5
-
0.5
0.5
IL
4.5
6
-
-
1.35
-
-
1.35
-
1.35
1.8
1.8
-
1.8
High Level Output
Voltage Q Outputs
CMOS Loads
V
V
or V
IH IL
-0.02
2
1.9
4.4
5.9
-
-
1.9
4.4
5.9
-
-
1.9
4.4
5.9
-
-
OH
-0.02
-0.02
-
4.5
6
-
-
-
-
-
-
-
High Level Output
Voltage Q Outputs
TTL Loads
-
-
-
-4
4.5
6
3.98
5.48
-
-
-
3.84
5.34
-
-
-
3.7
5.2
-
-
-5.2
0.02
0.02
0.02
-
-
Low Level Output
Voltage Q Outputs
CMOS Loads
V
V
or V
IH IL
2
0.1
0.1
0.1
-
0.1
0.1
0.1
-
0.1
0.1
0.1
-
OL
4.5
6
-
-
-
-
-
-
Low Level Output
Voltage Q Outputs
TTL Loads
-
-
-
-
4
4.5
6
-
0.26
0.26
-
-
0.33
0.33
-
-
0.4
0.4
-
5.2
-
-
-
High-Level Output
Voltage φO Output
(Pin 10)
V
V
or
-0.02
-0.02
-0.02
2
1.9
4.4
5.9
1.9
4.4
5.9
1.9
4.4
5.9
OH
CC
GND
4.5
6
-
-
-
-
-
-
CMOS Loads
3
CD54/74HC4060, CD54/74HCT4060
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
SYMBOL
V (V)
I
(mA)
O
(V)
4.5
6
MIN
3.98
5.48
TYP
MAX
MIN
3.84
5.34
MAX
MIN
3.7
MAX
UNITS
I
High-Level Output
Voltage φO Output
(Pin 10)
V
V
or
-2.6
-3.3
-
-
-
-
-
-
-
-
V
V
OH
CC
GND
5.2
TTL Loads
(Note 2)
Low-Level Output
Voltage φO Output
(Pin 10)
V
V
GND
or
0.02
0.02
0.02
2
4.5
6
-
-
-
-
-
-
0.1
0.1
0.1
-
-
-
0.1
0.1
0.1
-
-
-
0.1
0.1
0.1
V
V
V
OL
CC
CMOS Loads
Low-Level Output
Voltage φO Output
(Pin 10)
V
V
GND
or
2.6
3.3
4.5
6
-
-
-
-
0.26
0.26
-
-
0.33
0.33
-
-
0.4
0.4
V
V
OL
CC
TTL Loads
High-Level Output
Voltage φO Output
(Pin 9)
V
V
V
or V
or V
-3.2
-4.2
4.5
6
3.98
5.48
-
-
-
-
3.84
5.34
-
-
3.7
5.2
-
-
V
V
OH
IL
IL
IH
IH
TTL Loads
Low-Level Output
Voltage φO Output
(Pin 9)
V
-2.6
-3.3
4.5
6
-
-
-
-
0.26
0.26
-
-
0.33
0.33
-
-
0.4
0.4
V
V
OL
TTL Loads
Input Leakage
Current
I
V
or
-
6
6
-
-
-
-
±0.1
-
-
±1
-
-
±1
µA
µA
I
CC
GND
Quiescent Device
Current
I
V
or
0
8
80
160
CC
CC
GND
HCT TYPES
High Level Input
Voltage
V
-
-
-
-
4.5 to
5.5
2
-
-
-
-
-
0.8
-
2
-
-
0.8
-
2
-
-
0.8
-
V
V
V
IH
Low Level Input
Voltage
V
4.5 to
5.5
IL
High Level Output
Voltage Q Outputs
CMOS Loads
V
V
or V
IL
-0.02
4.5
4.5
4.5
4.5
4.5
4.4
4.4
4.4
OH
IH
(Note 3)
High Level Output
Voltage Q Outputs
TTL Loads
-4
0.02
4
3.98
-
-
-
-
-
0.1
0.26
-
3.84
-
0.1
0.33
-
3.7
-
-
V
V
V
V
Low Level Output
Voltage Q Outputs
CMOS Loads
V
V
or V
IL
-
-
-
-
0.1
0.4
-
OL
IH
(Note 3)
Low Level Output
Voltage Q Outputs
TTL Loads
-
High-Level Output
Voltage φO Output
(Pin 10)
V
V
or
-0.02
4.4
4.4
4.4
OH
CC
GND
CMOS Loads
High-Level Output
Voltage φO Output
(Pin 10)
V
V
GND
or
-2.6
4.5
4.5
3.98
-
-
-
3.84
-
3.7
-
-
V
V
OH
CC
TTL Loads (Note 2)
Low-Level Output
Voltage φO Output
(Pin 10)
V
V
or
0.02
-
0.1
-
0.1
0.1
OL
CC
GND
CMOS Loads
4
CD54/74HC4060, CD54/74HCT4060
DC Electrical Specifications (Continued)
TEST
CONDITIONS
o
o
o
o
o
25 C
-40 C TO 85 C -55 C TO 125 C
V
CC
PARAMETER
SYMBOL
V (V)
I
(mA)
O
(V)
MIN
TYP
MAX
MIN
MAX
MIN
MAX
UNITS
I
Low-Level Output
Voltage φO Output
(Pin 10)
V
V
GND
or
2.6
4.5
-
-
0.26
-
0.33
-
0.4
V
OL
CC
TTL Loads
High-Level Output
Voltage φO Output
(Pin 9)
V
V
V
or V
IH
-3.2
3.2
-
4.5
4.5
5.5
3.98
-
-
3.84
-
3.7
-
V
V
OH
IL
TTL Loads
Low-Level Output
Voltage φO Output
(Pin 9)
V
or V
IL
-
-
0.26
±0.1
-
-
0.33
±1
-
-
0.4
±1
OL
IH
(Note 3)
TTL Loads
Input Leakage
Current
I
Any
µA
I
Voltage
Between
V
and
CC
GND
Quiescent Device
Current
I
V
GND
or
0
-
5.5
-
-
-
8
-
-
80
-
-
160
490
µA
µA
CC
CC
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆I
CC
(Note 4)
V
4.5 to
5.5
100
360
450
CC
- 2.1
NOTES:
2. Limits not valid when pin 12 (instead of pin 11) is used as control input.
3. For pin 11 V = 3.15V, V = 0.9V.
IH IL
4. For dual-supply systems theoretical worst case (V = 2.4V, V
I
= 5.5V) specification is 1.8mA.
CC
HCT Input Loading Table
INPUT
MR
UNIT LOADS
0.35
NOTE: Unit Load is ∆I
tions Table, e.g. 360µA max at 25 C.
limit specified in DC Electrical Specifica-
CC
o
Prerequisite for Switching Specifications
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
HC TYPES
SYMBOL
V
(V) MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX UNITS
CC
Maximum Input Pulse
Frequency
f
2
6
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
4
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
MHz
MHz
MHz
ns
max
4.5
6
30
35
80
16
14
100
20
17
25
20
29
23
Input Pulse Width
t
2
100
20
120
24
W
4.5
6
ns
17
20
ns
Reset Removal Time
t
2
125
25
150
30
ns
REM
4.5
6
ns
21
26
ns
5
CD54/74HC4060, CD54/74HCT4060
Prerequisite for Switching Specifications (Continued)
o
o
o
o
o
25 C
-40 C TO 85 C
-55 C TO 125 C
PARAMETER
SYMBOL
V
(V) MIN
TYP
MAX
MIN
TYP
MAX
MIN
TYP
MAX UNITS
CC
Reset Pulse Width
t
2
80
-
-
-
-
-
-
100
20
-
-
-
-
-
-
120
24
-
-
-
-
-
-
ns
ns
ns
W
4.5
6
16
14
17
20
HCT TYPES
Maximum Input,
Pulse Frequency
f
4.5
30
-
-
25
-
-
20
-
-
MHz
max
Input Pulse Width
Reset Removal Time
Reset Pulse Width
t
4.5
4.5
4.5
16
26
25
-
-
-
-
-
-
20
33
31
-
-
-
-
-
-
24
39
38
-
-
-
-
-
-
ns
ns
ns
W
t
REM
t
W
Switching Specifications Input t , t = 6ns
r
f
o
o
-40 C TO
-55 C TO
o
o
o
25 C
85 C
125 C
TEST
PARAMETER
HC TYPES
SYMBOL CONDITIONS
V
(V) MIN
TYP MAX
MIN
MAX
MIN
MAX UNITS
CC
t
, t
PLH PHL
2
-
-
-
300
60
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
375
75
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
450
90
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
Propagation Delay
C
= 50pF
L
φI to Q4
4.5
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
C
C
C
= 15pF
= 50pF
= 50pF
25
-
L
L
L
6
51
80
16
-
64
100
20
-
78
120
24
-
Q to Q
t , t
PLH PHL
2
-
n
n+1
4.5
5
-
C
C
C
= 15pF
= 50pF
= 50pF
6
-
L
L
L
6
14
175
35
-
17
220
44
-
20
265
53
-
MR to Q
t
2
-
n
PHL
4.5
5
-
C
C
C
= 15pF
= 50pF
= 50pF
14
-
L
L
L
6
30
75
15
13
37
95
19
16
45
110
22
19
Output Transition Time
Input Capacitance
t
, t
THL TLH
2
-
4.5
6
-
-
C
I
(TBD)
Propagation Dissipation
Capacitance (Notes 5, 6)
C
-
-
-
40
-
-
-
-
-
pF
PD
HCT TYPES
t
, t
2
4.5
5
PLH PHL
Propagation Delay
C
= 50pF
-
-
-
-
-
-
-
-
-
-
-
-ns
ns
L
φI to Q4
66
83
100
C
C
= 15pF
= 50pF
-
-
25
-
-
-
-
-
-
-
-
-
-
-
-ns
-ns
L
6
L
6
CD54/74HC4060, CD54/74HCT4060
Switching Specifications Input t , t = 6ns (Continued)
r
f
o
o
-40 C TO
-55 C TO
o
o
o
25 C
85 C
125 C
TEST
SYMBOL CONDITIONS
PARAMETER
Q to Q
V
(V) MIN
TYP MAX
MIN
MAX
MIN
MAX UNITS
CC
t
, t
C
= 50pF
2
-
-
-
-
16
-
-
-
-
-
24
-
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
ns
n
n+1
PLH PHL
L
4.5
5
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
20
-
-
-
-
-
-
-
-
-
-
-
C
C
C
= 15pF
= 50pF
= 50pF
6
-
L
L
L
6
-
-
-
MR to Q
t
2
-
-
-
-
n
PHL
4.5
5
-
44
-
55
-
66
-
C
C
C
= 15pF
= 50pF
= 50pF
17
-
L
L
L
6
-
-
-
Output Transition Time
Input Capacitance
t
, t
THL TLH
2
-
-
-
-
4.5
6
-
15
-
19
-
22
-
-
C
I
(TBD)
Propagation Dissipation
Capacitance (Notes 5, 6)
C
-
-
-
40
-
-
-
-
-
pF
PD
NOTES:
5. C
is used to determine the dynamic power consumption, per package.
PD
2
2
1
2
3
14
6. P = C
D
V
f ∑(C V
f /M) where M = 2 , 2 , 2 , ...2 , f = input frequency, C = output load capacitance.
PD CC
i
L
CC
i
i
L
TYPICAL LIMIT VALUES FOR R AND C
X
X
TYPICAL
MAXIMUM
LIMITS
2
10
TEST
o
T
R
= 25 C
A
X
PARAMETER
CONDITIONS VOLTAGE
= 1KΩ
10
10KΩ
100KΩ
1MΩ
R
R
C
Minimum
Maximum
Minimum
C
C
C
C
C
C
R
R
R
R
R
R
> 1000pF
> 10pF
> 10pF
> 10pF
> 10pF
> 10pF
> 10KΩ
> 10KΩ
> 10KΩ
= 1KΩ
2
4.5
6
1KΩ
20MΩ
10pF
X
X
X
X
X
X
X
X
X
X
X
X
X
X
X
1
10MΩ
-1
10
2
4.5
6
-2
10
-3
10
2
4.5
6
-4
10
10
2
1000pF
10pF
-5
5
6
3
-1
0
2
4
10
10
10
OSCILLATOR FREQUENCY (Hz)
10
10
10
10
10
= 1KΩ
4.5
6
= 1KΩ
10pF
Maximum
Astable Oscillator
Frequency
C
R
= 1000pF,
= 1KΩ
2
0.5MHz
(Note 7)
X
X
NOTE: OSC Frequency ≈ 1/2.2 R C
X X
For 1MΩ > R > 1KΩ, C > 10pF, f < 1MHz
X
X
C
R
= 100pF,
= 1KΩ
4.5
6
3MHz
(Note 7)
X
X
FIGURE 2. FREQUENCY OF ON-BOARD OSCILLATOR AS A
FUNCTION OF C AND R
X
X
C
R
= 100pF,
= 1KΩ
3MHz
(Note 7)
X
X
NOTE:
7. At very high frequencies f = 1/2.2 R C no longer gives an
X
X
accurate approximation.
7
CD54/74HC4060, CD54/74HCT4060
Typical Performance Curves
I
t
+ t =
WH
WL
I
t C = 6ns
fC
r
L
t
+ t
=
L
WL
WH
t C = 6ns
t C
f
L
fC
t C
f
L
L
r
L
3V
V
CC
90%
10%
2.7V
0.3V
CLOCK
CLOCK
50%
10%
1.3V
0.3V
50%
t
50%
1.3V
t
1.3V
GND
GND
t
t
WH
WL
WH
WL
NOTE: Outputs should be switching from 10% V
to 90% V
in
NOTE: Outputs should be switching from 10% V
to 90% V
in
CC
CC
CC
CC
accordance with device truth table. For f
, input duty cycle = 50%.
accordance with device truth table. For f
, input duty cycle = 50%.
MAX
MAX
FIGURE 3. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 4. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
t = 6ns
t = 6ns
t = 6ns
t = 6ns
r
f
r
f
V
3V
CC
90%
50%
10%
2.7V
1.3V
0.3V
INPUT
INPUT
GND
GND
t
t
t
t
THL
TLH
THL
TLH
90%
1.3V
90%
50%
10%
INVERTING
OUTPUT
INVERTING
OUTPUT
10%
t
t
PLH
PHL
t
t
PLH
PHL
FIGURE 5. HC AND HCT TRANSITION TIMES AND PROPAGA-
TION DELAY TIMES, COMBINATION LOGIC
FIGURE 6. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
8
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
CDIP
PDIP
Drawing
5962-8768001EA
5962-8977101EA
CD54HC4060F3A
CD54HCT4060F3A
CD74HC4060E
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
16
16
16
16
16
1
1
TBD
TBD
TBD
TBD
A42 SNPB
A42 SNPB
A42 SNPB
A42 SNPB
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
1
J
1
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HC4060EE4
CD74HC4060M
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
PDIP
SOIC
N
D
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
16
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4060M96
CD74HC4060M96E4
CD74HC4060M96G4
CD74HC4060ME4
CD74HC4060MG4
CD74HC4060MT
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4060MTE4
CD74HC4060MTG4
CD74HC4060PW
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
PW
PW
PW
PW
PW
PW
PW
PW
PW
N
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HC4060PWE4
CD74HC4060PWG4
CD74HC4060PWR
CD74HC4060PWRE4
CD74HC4060PWRG4
CD74HC4060PWT
CD74HC4060PWTE4
CD74HC4060PWTG4
CD74HCT4060E
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD74HCT4060EE4
CD74HCT4060M
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
SOIC
D
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
24-May-2007
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
no Sb/Br)
CD74HCT4060M96
CD74HCT4060M96E4
CD74HCT4060M96G4
CD74HCT4060ME4
CD74HCT4060MG4
CD74HCT4060MT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
D
D
D
D
D
D
D
D
16
16
16
16
16
16
16
16
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
40 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD74HCT4060MTE4
CD74HCT4060MTG4
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
TAPE AND REEL BOX INFORMATION
Device
Package Pins
Site
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) (mm) Quadrant
(mm)
330
(mm)
16
CD74HC4060M96
CD74HC4060PWR
CD74HCT4060M96
D
PW
D
16
16
16
SITE 27
SITE 41
SITE 27
6.5
7.0
6.5
10.3
5.6
2.1
1.6
2.1
8
8
8
16
12
16
Q1
Q1
Q1
330
12
330
16
10.3
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
22-Sep-2007
Device
Package
Pins
Site
Length (mm) Width (mm) Height (mm)
CD74HC4060M96
CD74HC4060PWR
CD74HCT4060M96
D
PW
D
16
16
16
SITE 27
SITE 41
SITE 27
342.9
346.0
342.9
336.6
346.0
336.6
0.0
0.0
0.0
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
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