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CD4081BPWE4 [TI]

CMOS AND Gates; CMOS和盖茨
CD4081BPWE4
型号： CD4081BPWE4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

CMOS AND Gates
CMOS和盖茨

栅极 触发器 逻辑集成电路 光电二极管
文件： 总31页 (文件大小：1441K)
中文：  中文翻译
下载：  下载PDF数据表文档文件
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The CD4073B, CD4081B, and CD4082B types  
are supplied in 14-lead hermetic dual-in-line  
ceramic packages (F3A suffix), 14-lead  
dual-in-lineplasticpackages(Esuffix),14-lead  
small-outline packages (M, MT, M96, and NSR  
suffixes), and 14-lead thin shrink small-outline  
packages (PW and PWR suffixes).  
Copyright 2003, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
PDIP  
Drawing  
7702402CA  
7705102CA  
7705902CA  
CD4073BE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
J
1
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4073BEE4  
ACTIVE  
PDIP  
N
14  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4073BF  
CD4073BF3A  
CD4073BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4073BM96  
CD4073BM96E4  
CD4073BM96G4  
CD4073BME4  
CD4073BMG4  
CD4073BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4073BMTE4  
CD4073BMTG4  
CD4073BNSR  
CD4073BNSRE4  
CD4073BNSRG4  
CD4073BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4073BPWE4  
CD4073BPWG4  
CD4073BPWR  
CD4073BPWRE4  
CD4073BPWRG4  
CD4081BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4081BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
CDIP  
SOIC  
Drawing  
CD4081BF  
CD4081BF3A  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
CD4081BF3AS2534  
CD4081BM  
OBSOLETE  
ACTIVE  
J
Call TI  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4081BM96  
CD4081BM96E4  
CD4081BM96G4  
CD4081BME4  
CD4081BMG4  
CD4081BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4081BMTE4  
CD4081BMTG4  
CD4081BNSR  
CD4081BNSRE4  
CD4081BNSRG4  
CD4081BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4081BPWE4  
CD4081BPWG4  
CD4081BPWR  
CD4081BPWRE4  
CD4081BPWRG4  
CD4082BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4082BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4082BF  
CD4082BF3A  
CD4082BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4082BM96  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
D
D
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4082BM96E4  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
CD4082BM96G4  
CD4082BME4  
CD4082BMG4  
CD4082BMT  
SOIC  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4082BMTE4  
CD4082BMTG4  
CD4082BNSR  
CD4082BNSRE4  
CD4082BNSRG4  
CD4082BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4082BPWE4  
CD4082BPWG4  
CD4082BPWR  
CD4082BPWRE4  
CD4082BPWRG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
JM38510/17001BCA  
JM38510/17002BCA  
JM38510/17003BCA  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
J
J
J
14  
14  
14  
1
1
1
TBD  
TBD  
TBD  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
CD4073BM96  
CD4073BNSR  
CD4073BPWR  
CD4081BM96  
CD4081BNSR  
CD4081BPWR  
CD4082BM96  
CD4082BNSR  
CD4082BPWR  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
2000  
2000  
2500  
2000  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
6.5  
8.2  
7.0  
6.5  
8.2  
7.0  
6.5  
8.2  
7.0  
9.0  
10.5  
5.6  
2.1  
2.5  
1.6  
2.1  
2.5  
1.6  
2.1  
2.5  
1.6  
8.0  
12.0  
8.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
NS  
PW  
D
TSSOP  
SOIC  
SO  
9.0  
8.0  
NS  
PW  
D
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SO  
9.0  
8.0  
NS  
PW  
10.5  
5.6  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4073BM96  
CD4073BNSR  
CD4073BPWR  
CD4081BM96  
CD4081BNSR  
CD4081BPWR  
CD4082BM96  
CD4082BNSR  
CD4082BPWR  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
2000  
2000  
2500  
2000  
2000  
2500  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
29.0  
33.0  
33.0  
29.0  
33.0  
33.0  
29.0  
NS  
PW  
D
TSSOP  
SOIC  
SO  
NS  
PW  
D
TSSOP  
SOIC  
SO  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
PACKAGING INFORMATION  
Orderable Device  
7702402CA  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
ACTIVE  
CDIP  
CDIP  
CDIP  
PDIP  
PDIP  
J
14  
14  
14  
14  
14  
1
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
7702402CA  
CD4081BF3A  
7705102CA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
1
1
7705102CA  
CD4073BF3A  
7705902CA  
A42  
7705902CA  
CD4082BF3A  
CD4073BE  
N
N
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
CU NIPDAU  
CD4073BE  
CD4073BE  
CD4073BF  
CD4073BEE4  
Pb-Free  
(RoHS)  
CD4073BF  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4073BF3A  
TBD  
7705102CA  
CD4073BF3A  
CD4073BM  
CD4073BM96  
CD4073BM96E4  
CD4073BM96G4  
CD4073BME4  
CD4073BMG4  
CD4073BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
50  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073BM  
CD4073B  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
D
50  
Green (RoHS  
& no Sb/Br)  
D
250  
250  
250  
2000  
Green (RoHS  
& no Sb/Br)  
CD4073BMTE4  
CD4073BMTG4  
CD4073BNSR  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
CD4073BNSRE4  
CD4073BNSRG4  
CD4073BPW  
ACTIVE  
SO  
NS  
14  
14  
14  
14  
14  
14  
14  
14  
2000  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
CD4073B  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SO  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CD4073B  
CM073B  
CM073B  
CM073B  
CM073B  
CM073B  
CM073B  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
Green (RoHS  
& no Sb/Br)  
CD4073BPWE4  
CD4073BPWG4  
CD4073BPWR  
CD4073BPWRE4  
CD4073BPWRG4  
90  
Green (RoHS  
& no Sb/Br)  
90  
Green (RoHS  
& no Sb/Br)  
2000  
2000  
2000  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
CD4081B-W  
CD4081BE  
ACTIVE WAFERSALE  
YS  
N
0
TBD  
Call TI  
Call TI  
ACTIVE  
ACTIVE  
PDIP  
PDIP  
14  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4081BE  
CD4081BE  
CD4081BF  
CD4081BEE4  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU  
N / A for Pkg Type  
CD4081BF  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4081BF3A  
TBD  
7702402CA  
CD4081BF3A  
CD4081BF3AS2534  
CD4081BM  
OBSOLETE  
ACTIVE  
CDIP  
SOIC  
J
14  
14  
TBD  
Call TI  
Call TI  
D
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
CD4081BM  
CD4081BM  
CD4081BM  
CD4081BM  
CD4081BM  
CD4081BM96  
CD4081BM96E4  
CD4081BM96G4  
CD4081BME4  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
D
D
D
D
14  
14  
14  
14  
2500  
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Green (RoHS  
& no Sb/Br)  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
CD4081BMG4  
CD4081BMT  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
CD4081BM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
250  
250  
250  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CD4081BM  
CD4081BM  
CD4081BM  
CD4081B  
CD4081B  
CD4081B  
CM081B  
CD4081BMTE4  
CD4081BMTG4  
CD4081BNSR  
CD4081BNSRE4  
CD4081BNSRG4  
CD4081BPW  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
Green (RoHS  
& no Sb/Br)  
CD4081BPWE4  
CD4081BPWG4  
CD4081BPWR  
CD4081BPWRE4  
CD4081BPWRG4  
CD4082BE  
90  
Green (RoHS  
& no Sb/Br)  
CM081B  
90  
Green (RoHS  
& no Sb/Br)  
CM081B  
2000  
2000  
2000  
25  
Green (RoHS  
& no Sb/Br)  
CM081B  
Green (RoHS  
& no Sb/Br)  
CM081B  
Green (RoHS  
& no Sb/Br)  
CM081B  
Pb-Free  
(RoHS)  
CD4082BE  
CD4082BE  
CD4082BF  
CD4082BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
N / A for Pkg Type  
CD4082BF  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
-55 to 125  
-55 to 125  
CD4082BF3A  
TBD  
7705902CA  
CD4082BF3A  
CD4082BM  
ACTIVE  
SOIC  
D
14  
50  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
Level-1-260C-UNLIM  
-55 to 125  
CD4082BM  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
CD4082BM96  
CD4082BM96E4  
CD4082BM96G4  
CD4082BME4  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
Green (RoHS  
& no Sb/Br)  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
CU NIPDAU  
A42  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
Level-1-260C-UNLIM  
N / A for Pkg Type  
CD4082BM  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
D
D
2500  
2500  
50  
Green (RoHS  
& no Sb/Br)  
CD4082BM  
CD4082BM  
CD4082BM  
CD4082BM  
CD4082BM  
CD4082BM  
CD4082BM  
CD4082B  
CD4082B  
CD4082B  
CM082B  
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
CD4082BMG4  
D
50  
Green (RoHS  
& no Sb/Br)  
CD4082BMT  
D
250  
250  
250  
2000  
2000  
2000  
90  
Green (RoHS  
& no Sb/Br)  
CD4082BMTE4  
CD4082BMTG4  
CD4082BNSR  
D
Green (RoHS  
& no Sb/Br)  
D
Green (RoHS  
& no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
J
Green (RoHS  
& no Sb/Br)  
CD4082BNSRE4  
CD4082BNSRG4  
CD4082BPW  
SO  
Green (RoHS  
& no Sb/Br)  
SO  
Green (RoHS  
& no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
CDIP  
Green (RoHS  
& no Sb/Br)  
CD4082BPWE4  
CD4082BPWG4  
CD4082BPWR  
CD4082BPWRE4  
CD4082BPWRG4  
JM38510/17001BCA  
90  
Green (RoHS  
& no Sb/Br)  
CM082B  
90  
Green (RoHS  
& no Sb/Br)  
CM082B  
2000  
2000  
2000  
1
Green (RoHS  
& no Sb/Br)  
CM082B  
Green (RoHS  
& no Sb/Br)  
CM082B  
Green (RoHS  
& no Sb/Br)  
CM082B  
TBD  
JM38510/  
17001BCA  
Addendum-Page 4  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
Orderable Device  
Status Package Type Package Pins Package  
Eco Plan Lead/Ball Finish  
MSL Peak Temp  
Op Temp (°C)  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
-55 to 125  
Device Marking  
Samples  
Drawing  
Qty  
(1)  
(2)  
(3)  
(4/5)  
JM38510/17002BCA  
JM38510/17003BCA  
M38510/17001BCA  
M38510/17002BCA  
M38510/17003BCA  
ACTIVE  
CDIP  
CDIP  
CDIP  
CDIP  
CDIP  
J
14  
14  
14  
14  
14  
1
TBD  
TBD  
TBD  
TBD  
TBD  
A42  
A42  
A42  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
N / A for Pkg Type  
JM38510/  
17002BCA  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
J
J
1
1
1
1
JM38510/  
17003BCA  
JM38510/  
17001BCA  
JM38510/  
17002BCA  
JM38510/  
17003BCA  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability  
information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that  
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between  
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight  
in homogeneous material)  
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.  
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.  
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation  
of the previous line and the two combined represent the entire Device Marking for that device.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information  
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and  
Addendum-Page 5  
PACKAGE OPTION ADDENDUM  
www.ti.com  
25-Sep-2013  
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.  
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF CD4073B, CD4073B-MIL, CD4081B, CD4081B-MIL, CD4082B, CD4082B-MIL :  
Catalog: CD4073B, CD4081B, CD4082B  
•
Military: CD4073B-MIL, CD4081B-MIL, CD4082B-MIL  
•
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
•
Military - QML certified for Military and Defense Applications  
•
Addendum-Page 6  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0  
B0  
K0  
P1  
W
Pin1  
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant  
(mm) W1 (mm)  
CD4073BM96  
CD4073BMT  
CD4073BNSR  
CD4073BPWR  
CD4081BM96  
CD4081BMT  
CD4081BNSR  
CD4081BPWR  
CD4082BM96  
CD4082BMT  
CD4082BNSR  
CD4082BPWR  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
250  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
16.4  
12.4  
16.4  
16.4  
16.4  
12.4  
6.5  
6.5  
8.2  
6.9  
6.5  
6.5  
8.2  
6.9  
6.5  
6.5  
8.2  
6.9  
9.0  
9.0  
2.1  
2.1  
2.5  
1.6  
2.1  
2.1  
2.5  
1.6  
2.1  
2.1  
2.5  
1.6  
8.0  
8.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
16.0  
12.0  
16.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
NS  
PW  
D
2000  
2000  
2500  
250  
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SOIC  
SO  
9.0  
8.0  
D
9.0  
8.0  
NS  
PW  
D
2000  
2000  
2500  
250  
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SOIC  
SO  
9.0  
8.0  
D
9.0  
8.0  
NS  
PW  
2000  
2000  
10.5  
5.6  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
14-Jul-2012  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4073BM96  
CD4073BMT  
CD4073BNSR  
CD4073BPWR  
CD4081BM96  
CD4081BMT  
CD4081BNSR  
CD4081BPWR  
CD4082BM96  
CD4082BMT  
CD4082BNSR  
CD4082BPWR  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
250  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
367.0  
38.0  
38.0  
38.0  
35.0  
38.0  
38.0  
38.0  
35.0  
38.0  
38.0  
38.0  
35.0  
NS  
PW  
D
2000  
2000  
2500  
250  
TSSOP  
SOIC  
SOIC  
SO  
D
NS  
PW  
D
2000  
2000  
2500  
250  
TSSOP  
SOIC  
SOIC  
SO  
D
NS  
PW  
2000  
2000  
TSSOP  
Pack Materials-Page 2  
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