CD4081BPWRG4 [TI]
CMOS AND Gates; CMOS和盖茨型号: | CD4081BPWRG4 |
厂家: | TEXAS INSTRUMENTS |
描述: | CMOS AND Gates |
文件: | 总31页 (文件大小:1441K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
The CD4073B, CD4081B, and CD4082B types
are supplied in 14-lead hermetic dual-in-line
ceramic packages (F3A suffix), 14-lead
dual-in-lineplasticpackages(Esuffix),14-lead
small-outline packages (M, MT, M96, and NSR
suffixes), and 14-lead thin shrink small-outline
packages (PW and PWR suffixes).
Copyright 2003, Texas Instruments Incorporated
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
PDIP
Drawing
7702402CA
7705102CA
7705902CA
CD4073BE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
14
14
14
14
1
1
TBD
TBD
TBD
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
J
1
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4073BEE4
ACTIVE
PDIP
N
14
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4073BF
CD4073BF3A
CD4073BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BM96
CD4073BM96E4
CD4073BM96G4
CD4073BME4
CD4073BMG4
CD4073BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BMTE4
CD4073BMTG4
CD4073BNSR
CD4073BNSRE4
CD4073BNSRG4
CD4073BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4073BPWE4
CD4073BPWG4
CD4073BPWR
CD4073BPWRE4
CD4073BPWRG4
CD4081BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4081BEE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
CDIP
CDIP
CDIP
SOIC
Drawing
CD4081BF
CD4081BF3A
ACTIVE
ACTIVE
J
J
14
14
14
14
1
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
Call TI
CD4081BF3AS2534
CD4081BM
OBSOLETE
ACTIVE
J
Call TI
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BM96
CD4081BM96E4
CD4081BM96G4
CD4081BME4
CD4081BMG4
CD4081BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BMTE4
CD4081BMTG4
CD4081BNSR
CD4081BNSRE4
CD4081BNSRG4
CD4081BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4081BPWE4
CD4081BPWG4
CD4081BPWR
CD4081BPWRE4
CD4081BPWRG4
CD4082BE
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4082BEE4
PDIP
N
25
Pb-Free
(RoHS)
CU NIPDAU N / A for Pkg Type
CD4082BF
CD4082BF3A
CD4082BM
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
SOIC
J
J
14
14
14
1
1
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BM96
ACTIVE
ACTIVE
SOIC
SOIC
D
D
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BM96E4
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
Orderable Device
Status (1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
CD4082BM96G4
CD4082BME4
CD4082BMG4
CD4082BMT
SOIC
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BMTE4
CD4082BMTG4
CD4082BNSR
CD4082BNSRE4
CD4082BNSRG4
CD4082BPW
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SO
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
CD4082BPWE4
CD4082BPWG4
CD4082BPWR
CD4082BPWRE4
CD4082BPWRG4
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
JM38510/17001BCA
JM38510/17002BCA
JM38510/17003BCA
ACTIVE
ACTIVE
ACTIVE
CDIP
CDIP
CDIP
J
J
J
14
14
14
1
1
1
TBD
TBD
TBD
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
15-Oct-2009
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 4
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD4073BM96
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BNSR
CD4082BPWR
SOIC
SO
D
14
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
12.4
16.4
16.4
12.4
6.5
8.2
7.0
6.5
8.2
7.0
6.5
8.2
7.0
9.0
10.5
5.6
2.1
2.5
1.6
2.1
2.5
1.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
TSSOP
SOIC
SO
9.0
8.0
NS
PW
D
10.5
5.6
12.0
8.0
TSSOP
SOIC
SO
9.0
8.0
NS
PW
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4073BM96
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BNSR
CD4082BPWR
SOIC
SO
D
14
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
2500
2000
2000
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
346.0
33.0
33.0
29.0
33.0
33.0
29.0
33.0
33.0
29.0
NS
PW
D
TSSOP
SOIC
SO
NS
PW
D
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
PW (R-PDSO-G**)
PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,30
0,19
M
0,10
0,65
14
8
0,15 NOM
4,50
4,30
6,60
6,20
Gage Plane
0,25
1
7
0°–8°
A
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
8
14
16
20
24
28
DIM
3,10
2,90
5,10
4,90
5,10
4,90
6,60
6,40
7,90
9,80
9,60
A MAX
A MIN
7,70
4040064/F 01/97
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
PACKAGING INFORMATION
Orderable Device
7702402CA
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
ACTIVE
CDIP
CDIP
CDIP
PDIP
PDIP
J
14
14
14
14
14
1
TBD
TBD
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
7702402CA
CD4081BF3A
7705102CA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
1
1
7705102CA
CD4073BF3A
7705902CA
A42
7705902CA
CD4082BF3A
CD4073BE
N
N
25
25
Pb-Free
(RoHS)
CU NIPDAU
CU NIPDAU
CD4073BE
CD4073BE
CD4073BF
CD4073BEE4
Pb-Free
(RoHS)
CD4073BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4073BF3A
TBD
7705102CA
CD4073BF3A
CD4073BM
CD4073BM96
CD4073BM96E4
CD4073BM96G4
CD4073BME4
CD4073BMG4
CD4073BMT
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
50
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073BM
CD4073B
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
D
50
Green (RoHS
& no Sb/Br)
D
250
250
250
2000
Green (RoHS
& no Sb/Br)
CD4073BMTE4
CD4073BMTG4
CD4073BNSR
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
Green (RoHS
& no Sb/Br)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4073BNSRE4
CD4073BNSRG4
CD4073BPW
ACTIVE
SO
NS
14
14
14
14
14
14
14
14
2000
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
CD4073B
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SO
NS
PW
PW
PW
PW
PW
PW
2000
90
Green (RoHS
& no Sb/Br)
CD4073B
CM073B
CM073B
CM073B
CM073B
CM073B
CM073B
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
Green (RoHS
& no Sb/Br)
CD4073BPWE4
CD4073BPWG4
CD4073BPWR
CD4073BPWRE4
CD4073BPWRG4
90
Green (RoHS
& no Sb/Br)
90
Green (RoHS
& no Sb/Br)
2000
2000
2000
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
CD4081B-W
CD4081BE
ACTIVE WAFERSALE
YS
N
0
TBD
Call TI
Call TI
ACTIVE
ACTIVE
PDIP
PDIP
14
25
25
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
-55 to 125
-55 to 125
CD4081BE
CD4081BE
CD4081BF
CD4081BEE4
N
14
Pb-Free
(RoHS)
CU NIPDAU
N / A for Pkg Type
CD4081BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4081BF3A
TBD
7702402CA
CD4081BF3A
CD4081BF3AS2534
CD4081BM
OBSOLETE
ACTIVE
CDIP
SOIC
J
14
14
TBD
Call TI
Call TI
D
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
CD4081BM
CD4081BM
CD4081BM
CD4081BM
CD4081BM
CD4081BM96
CD4081BM96E4
CD4081BM96G4
CD4081BME4
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SOIC
SOIC
SOIC
SOIC
D
D
D
D
14
14
14
14
2500
2500
2500
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Green (RoHS
& no Sb/Br)
Addendum-Page 2
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4081BMG4
CD4081BMT
ACTIVE
SOIC
SOIC
SOIC
SOIC
SO
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
CD4081BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4081BM
CD4081BM
CD4081BM
CD4081B
CD4081B
CD4081B
CM081B
CD4081BMTE4
CD4081BMTG4
CD4081BNSR
CD4081BNSRE4
CD4081BNSRG4
CD4081BPW
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
N
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
PDIP
Green (RoHS
& no Sb/Br)
CD4081BPWE4
CD4081BPWG4
CD4081BPWR
CD4081BPWRE4
CD4081BPWRG4
CD4082BE
90
Green (RoHS
& no Sb/Br)
CM081B
90
Green (RoHS
& no Sb/Br)
CM081B
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CM081B
Green (RoHS
& no Sb/Br)
CM081B
Green (RoHS
& no Sb/Br)
CM081B
Pb-Free
(RoHS)
CD4082BE
CD4082BE
CD4082BF
CD4082BEE4
PDIP
N
25
Pb-Free
(RoHS)
N / A for Pkg Type
CD4082BF
ACTIVE
ACTIVE
CDIP
CDIP
J
J
14
14
1
1
TBD
A42
A42
N / A for Pkg Type
N / A for Pkg Type
-55 to 125
-55 to 125
CD4082BF3A
TBD
7705902CA
CD4082BF3A
CD4082BM
ACTIVE
SOIC
D
14
50
Green (RoHS
& no Sb/Br)
CU NIPDAU
Level-1-260C-UNLIM
-55 to 125
CD4082BM
Addendum-Page 3
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
CD4082BM96
CD4082BM96E4
CD4082BM96G4
CD4082BME4
ACTIVE
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SOIC
SO
D
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
14
2500
Green (RoHS
& no Sb/Br)
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
A42
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
CD4082BM
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
2500
2500
50
Green (RoHS
& no Sb/Br)
CD4082BM
CD4082BM
CD4082BM
CD4082BM
CD4082BM
CD4082BM
CD4082BM
CD4082B
CD4082B
CD4082B
CM082B
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
CD4082BMG4
D
50
Green (RoHS
& no Sb/Br)
CD4082BMT
D
250
250
250
2000
2000
2000
90
Green (RoHS
& no Sb/Br)
CD4082BMTE4
CD4082BMTG4
CD4082BNSR
D
Green (RoHS
& no Sb/Br)
D
Green (RoHS
& no Sb/Br)
NS
NS
NS
PW
PW
PW
PW
PW
PW
J
Green (RoHS
& no Sb/Br)
CD4082BNSRE4
CD4082BNSRG4
CD4082BPW
SO
Green (RoHS
& no Sb/Br)
SO
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
TSSOP
CDIP
Green (RoHS
& no Sb/Br)
CD4082BPWE4
CD4082BPWG4
CD4082BPWR
CD4082BPWRE4
CD4082BPWRG4
JM38510/17001BCA
90
Green (RoHS
& no Sb/Br)
CM082B
90
Green (RoHS
& no Sb/Br)
CM082B
2000
2000
2000
1
Green (RoHS
& no Sb/Br)
CM082B
Green (RoHS
& no Sb/Br)
CM082B
Green (RoHS
& no Sb/Br)
CM082B
TBD
JM38510/
17001BCA
Addendum-Page 4
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-55 to 125
-55 to 125
-55 to 125
-55 to 125
-55 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
JM38510/17002BCA
JM38510/17003BCA
M38510/17001BCA
M38510/17002BCA
M38510/17003BCA
ACTIVE
CDIP
CDIP
CDIP
CDIP
CDIP
J
14
14
14
14
14
1
TBD
TBD
TBD
TBD
TBD
A42
A42
A42
A42
A42
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
JM38510/
17002BCA
ACTIVE
ACTIVE
ACTIVE
ACTIVE
J
J
J
J
1
1
1
1
JM38510/
17003BCA
JM38510/
17001BCA
JM38510/
17002BCA
JM38510/
17003BCA
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
Addendum-Page 5
PACKAGE OPTION ADDENDUM
www.ti.com
25-Sep-2013
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF CD4073B, CD4073B-MIL, CD4081B, CD4081B-MIL, CD4082B, CD4082B-MIL :
Catalog: CD4073B, CD4081B, CD4082B
•
Military: CD4073B-MIL, CD4081B-MIL, CD4082B-MIL
•
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
•
Military - QML certified for Military and Defense Applications
•
Addendum-Page 6
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4073BM96
CD4073BMT
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BMT
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BMT
CD4082BNSR
CD4082BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
2500
250
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
16.4
16.4
16.4
12.4
6.5
6.5
8.2
6.9
6.5
6.5
8.2
6.9
6.5
6.5
8.2
6.9
9.0
9.0
2.1
2.1
2.5
1.6
2.1
2.1
2.5
1.6
2.1
2.1
2.5
1.6
8.0
8.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
16.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
PW
D
2000
2000
2500
250
10.5
5.6
12.0
8.0
TSSOP
SOIC
SOIC
SO
9.0
8.0
D
9.0
8.0
NS
PW
2000
2000
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4073BM96
CD4073BMT
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BMT
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BMT
CD4082BNSR
CD4082BPWR
SOIC
SOIC
SO
D
D
14
14
14
14
14
14
14
14
14
14
14
14
2500
250
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
35.0
38.0
38.0
38.0
35.0
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
PW
D
2000
2000
2500
250
TSSOP
SOIC
SOIC
SO
D
NS
PW
2000
2000
TSSOP
Pack Materials-Page 2
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相关型号:
CD4082BD
4000/14000/40000 SERIES, DUAL 4-INPUT AND GATE, CDIP14, HERMETIC SEALED, CERAMIC, DIP-14
RENESAS
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