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CD4025BPWRE4 [TI]

4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, PDSO14, GREEN, PLASTIC. TSSOP-14;
CD4025BPWRE4
型号： CD4025BPWRE4
厂家： TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述：

4000/14000/40000 SERIES, TRIPLE 3-INPUT NOR GATE, PDSO14, GREEN, PLASTIC. TSSOP-14

输入元件 光电二极管 逻辑集成电路
文件： 总16页 (文件大小：695K)
中文：  中文翻译
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The CD4001B, CD4002B, and CD4025B  
types are supplied in 14-lead hermetic  
dual-in-line ceramic packages (F3A  
suffix), 14-lead dual-in-line plastic  
packages (E suffix), 14-lead small-outline  
packages (M, MT, M96, and NSR suffixes),  
and 14-lead thin shrink small-outline  
packages (PW and PWR suffixes).  
Copyright 2003, Texas Instruments Incorporated  
IMPORTANT NOTICE  
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Customers should obtain the latest relevant information before placing orders and should verify that such information is current and  
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TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s  
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Copyright © 2007, Texas Instruments Incorporated  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CFP  
Drawing  
7704403CA  
89263AKB3T  
CD4001BE  
ACTIVE  
OBSOLETE  
ACTIVE  
J
WR  
N
14  
16  
14  
1
TBD  
TBD  
A42  
N / A for Pkg Type  
Call TI  
Call TI  
PDIP  
25  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4001BEE4  
ACTIVE  
PDIP  
N
14  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4001BF  
CD4001BF3A  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
14  
1
1
TBD  
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
Call TI  
CD4001BF3AS2534  
CD4001BM  
OBSOLETE  
ACTIVE  
J
Call TI  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001BM96  
CD4001BM96E4  
CD4001BM96G4  
CD4001BME4  
CD4001BMG4  
CD4001BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001BMTE4  
CD4001BMTG4  
CD4001BNSR  
CD4001BNSRE4  
CD4001BNSRG4  
CD4001BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4001BPWE4  
CD4001BPWG4  
CD4001BPWR  
CD4001BPWRE4  
CD4001BPWRG4  
CD4002BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4002BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
CDIP  
CDIP  
SOIC  
Drawing  
CD4002BF  
CD4002BF3A  
CD4002BM  
ACTIVE  
ACTIVE  
ACTIVE  
J
J
14  
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4002BM96  
CD4002BM96E4  
CD4002BM96G4  
CD4002BME4  
CD4002BMG4  
CD4002BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4002BMTE4  
CD4002BMTG4  
CD4002BNSR  
CD4002BNSRE4  
CD4002BNSRG4  
CD4002BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
N
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PDIP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4002BPWE4  
CD4002BPWG4  
CD4002BPWR  
CD4002BPWRE4  
CD4002BPWRG4  
CD4025BE  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4025BEE4  
PDIP  
N
25  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
CD4025BF  
CD4025BF3A  
CD4025BM  
ACTIVE  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
SOIC  
J
J
14  
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
D
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4025BM96  
CD4025BM96E4  
CD4025BM96G4  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
D
D
D
14  
14  
14  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2500 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
Addendum-Page 2  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
no Sb/Br)  
CD4025BME4  
CD4025BMG4  
CD4025BMT  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SOIC  
SOIC  
SOIC  
SOIC  
SOIC  
SO  
D
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
14  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
50 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4025BMTE4  
CD4025BMTG4  
CD4025BNSR  
CD4025BNSRE4  
CD4025BNSRG4  
CD4025BPW  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
D
250 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
NS  
NS  
NS  
PW  
PW  
PW  
PW  
PW  
PW  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SO  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
CD4025BPWE4  
CD4025BPWG4  
CD4025BPWR  
CD4025BPWRE4  
CD4025BPWRG4  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
90 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
JM38510/05252BCA  
JM38510/05254BCA  
ACTIVE  
ACTIVE  
CDIP  
CDIP  
J
J
14  
14  
1
1
TBD  
TBD  
A42  
A42  
N / A for Pkg Type  
N / A for Pkg Type  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Addendum-Page 3  
PACKAGE OPTION ADDENDUM  
www.ti.com  
15-Oct-2009  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 4  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
CD4001BM96  
CD4001BNSR  
CD4001BPWR  
CD4002BM96  
CD4002BNSR  
CD4002BPWR  
CD4025BM96  
CD4025BNSR  
CD4025BPWR  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
2000  
2000  
2500  
2000  
2000  
2500  
2000  
2000  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
330.0  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
16.4  
16.4  
12.4  
6.5  
8.2  
7.0  
6.5  
8.2  
7.0  
6.5  
8.2  
7.0  
9.0  
10.5  
5.6  
2.1  
2.5  
1.6  
2.1  
2.5  
1.6  
2.1  
2.5  
1.6  
8.0  
12.0  
8.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
16.0  
16.0  
12.0  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
Q1  
NS  
PW  
D
TSSOP  
SOIC  
SO  
9.0  
8.0  
NS  
PW  
D
10.5  
5.6  
12.0  
8.0  
TSSOP  
SOIC  
SO  
9.0  
8.0  
NS  
PW  
10.5  
5.6  
12.0  
8.0  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
CD4001BM96  
CD4001BNSR  
CD4001BPWR  
CD4002BM96  
CD4002BNSR  
CD4002BPWR  
CD4025BM96  
CD4025BNSR  
CD4025BPWR  
SOIC  
SO  
D
14  
14  
14  
14  
14  
14  
14  
14  
14  
2500  
2000  
2000  
2500  
2000  
2000  
2500  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
33.0  
29.0  
33.0  
33.0  
29.0  
33.0  
33.0  
29.0  
NS  
PW  
D
TSSOP  
SOIC  
SO  
NS  
PW  
D
TSSOP  
SOIC  
SO  
NS  
PW  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°–8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265  

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