8V182512IDGGREP [TI]

具有 18 位通用总线收发器的增强型产品 3.3V Abt 扫描测试设备 | DGG | 64 | -40 to 85;
8V182512IDGGREP
型号: 8V182512IDGGREP
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

具有 18 位通用总线收发器的增强型产品 3.3V Abt 扫描测试设备 | DGG | 64 | -40 to 85

驱动 信息通信管理 测试 光电二极管 逻辑集成电路 触发器 总线驱动器 总线收发器
文件: 总11页 (文件大小:311K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
ꢙ ꢔꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚ ꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
D
D
D
D
D
Controlled Baseline  
− One Assembly/Test Site, One Fabrication  
Site  
D
D
ESD Protection Exceeds 2000 V Per  
MIL-STD-883, Method 3015; Exceeds 200 V  
Using Machine Model (C = 200 pF, R = 0)  
Enhanced Diminishing Manufacturing  
Sources (DMS) Support  
Thin Shrink Small-Outline (DGG) Package  
DGG PACKAGE  
(TOP VIEW)  
Enhanced Product-Change Notification  
Qualification Pedigree  
1
56  
55  
54  
53  
52  
51  
50  
49  
48  
47  
46  
45  
44  
43  
42  
41  
40  
39  
38  
37  
36  
35  
34  
33  
32  
31  
30  
29  
1OEAB  
1CLKAB  
1CLKENAB  
GND  
1OEBA  
1CLKBA  
1CLKENBA  
GND  
1B1  
1B2  
Member of the Texas Instruments  
WidebusFamily  
State-of-the-Art Advanced BiCMOS  
Technology (ABT) Design for 3.3-V  
Operation and Low Static-Power  
Dissipation  
2
3
D
4
5
1A1  
1A2  
6
7
V
V
CC  
CC  
D
Supports Mixed-Mode Signal Operation  
(5-V Input and Output Voltages With  
8
1A3  
1A4  
1A5  
GND  
1A6  
1A7  
1A8  
2A1  
2A2  
2A3  
GND  
2A4  
2A5  
2A6  
1B3  
1B4  
1B5  
GND  
1B6  
1B7  
1B8  
2B1  
2B2  
2B3  
GND  
2B4  
2B5  
2B6  
9
3.3-V V  
)
CC  
10  
11  
12  
13  
14  
15  
16  
17  
18  
19  
20  
21  
22  
23  
24  
25  
26  
27  
28  
D
D
D
D
Supports Unregulated Battery Operation  
Down To 2.7 V  
Typical V  
<0.8 V at V  
(Output Ground Bounce)  
= 3.3 V, T = 25°C  
OLP  
CC  
A
I
and Power-Up 3-State Support Hot  
off  
Insertion  
Bus Hold on Data Inputs Eliminates the  
Need for External Pullup/Pulldown  
Resistors  
D
D
D
Distributed V  
High-Speed Switching Noise  
and GND Pins Minimize  
CC  
V
V
CC  
CC  
Flow-Through Architecture Optimizes PCB  
Layout  
2A7  
2A8  
GND  
2B7  
2B8  
GND  
2CLKENBA  
2CLKBA  
2OEBA  
Latch-Up Performance Exceeds 500 mA Per  
JESD 17  
2CLKENAB  
2CLKAB  
2OEAB  
Component qualification in accordance with JEDEC and industry  
standards to ensure reliable operation over an extended  
temperature range. This includes, but is not limited to, Highly  
Accelerated Stress Test (HAST) or biased 85/85, temperature  
cycle, autoclave or unbiased HAST, electromigration, bond  
intermetallic life, and mold compound life. Such qualification  
testing should not be viewed as justifying use of this component  
beyond specified performance and environmental limits.  
description/ordering information  
The SN74LVTH16952 is a 16-bit registered transceiver designed for low-voltage (3.3-V) V  
the capability to provide a TTL interface to a 5-V system environment.  
operation, but with  
CC  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
Widebus is a trademark of Texas Instruments.  
ꢆꢧ  
Copyright 2003, Texas Instruments Incorporated  
ꢣ ꢧ ꢤ ꢣꢜ ꢝꢰ ꢟꢞ ꢢ ꢪꢪ ꢨꢢ ꢠ ꢢ ꢡ ꢧ ꢣ ꢧ ꢠ ꢤ ꢑ  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢐꢑ ꢐꢍꢅ ꢒ ꢓꢆ ꢈ ꢉꢍ ꢓꢔ ꢆ ꢕꢎ ꢖ ꢔꢀ ꢆꢎ ꢕꢎ ꢗ ꢆꢕ ꢒꢁ ꢀꢘꢎ ꢔꢅꢎ ꢕ  
ꢙꢔ ꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
description/ordering information (continued)  
This device can be used as two 8-bit transceivers or one 16-bit transceiver. Data on the A or B bus is stored  
in the registers on the low-to-high transition of the clock (CLKAB or CLKBA) input, provided that the clock-enable  
(CLKENAB or CLKENBA) input is low. Taking the output-enable (OEAB or OEBA) input low accesses the data  
on either port.  
Active bus-hold circuitry is provided to hold unused or floating data inputs at a valid logic level.  
When V  
is between 0 and 1.5 V, the device is in the high-impedance state during power up or power down.  
CC  
However, to ensure the high-impedance state above 1.5 V, OE should be tied to V  
the minimum value of the resistor is determined by the current-sinking capability of the driver.  
through a pullup resistor;  
CC  
This device is fully specified for hot-insertion applications using I and power-up 3-state. The I circuitry  
off  
off  
disables the outputs, preventing damaging current backflow through the device when it is powered down. The  
power-up 3-state circuitry places the outputs in the high-impedance state during power up and power down,  
which prevents driver conflict.  
ORDERING INFORMATION  
ORDERABLE  
PART NUMBER  
TOP-SIDE  
MARKING  
T
A
PACKAGE  
−40°C to 85°C  
TSSOP − DGG  
Tape and reel  
CLVTH16952IDGGREP  
LH16952EP  
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available  
at www.ti.com/sc/package.  
FUNCTION TABLE  
INPUTS  
OUTPUT  
B
CLKENAB CLKAB  
OEAB  
A
H
X
L
X
L
L
L
L
L
H
X
X
L
B
B
0
0
X
L
H
Z
L
H
X
X
A-to-B data flow is shown; B-to-A data flow is similar, but  
uses CLKENBA, CLKBA, and OEBA.  
Level of B before the indicated steady-state input  
conditions were established  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢐ ꢑꢐ ꢍꢅ ꢒꢓꢆ ꢈ ꢉ ꢍꢓꢔ ꢆ ꢕꢎ ꢖꢔ ꢀꢆ ꢎꢕꢎꢗ ꢆ ꢕꢒꢁꢀ ꢘꢎ ꢔ ꢅꢎ ꢕ  
ꢙ ꢔꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚ ꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
logic diagram (positive logic)  
3
54  
1CLKENAB  
1CLKENBA  
2
55  
1CLKAB  
1CLKBA  
1
56  
1OEBA  
1OEAB  
One of Eight  
Channels  
C1  
CE  
1D  
52  
5
1B1  
1A1  
C1  
CE  
1D  
To Seven Other Channels  
26  
31  
2CLKENBA  
2CLKENAB  
27  
30  
2CLKBA  
2CLKAB  
28  
29  
2OEBA  
2OEAB  
One of Eight  
Channels  
C1  
CE  
1D  
42  
15  
2B1  
2A1  
C1  
CE  
1D  
To Seven Other Channels  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢙꢔ ꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 4.6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
I
Voltage range applied to any output in the high-impedance  
or power-off state, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5 V to 7 V  
O
Voltage range applied to any output in the high state, V (see Note 1) . . . . . . . . . . . . . −0.5 V to V  
+ 0.5 V  
O
CC  
Current into any output in the low state, I  
Current into any output in the high state, I (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64 mA  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 128 mA  
O
O
Input clamp current, I (V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
IK  
OK  
I
Output clamp current, I  
(V < 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −50 mA  
O
Package thermal impedance, θ (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64°C/W  
JA  
stg  
Storage temperature range, T  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −65°C to 150°C  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output negative-voltage ratings may be exceeded if the input and output clamp-current ratings are observed.  
2. This current flows only when the output is in the high state and V > V  
.
CC  
O
3. The package thermal impedance is calculated in accordance with JESD 51.  
recommended operating conditions (see Note 4)  
MIN  
2.7  
2
MAX  
UNIT  
V
V
V
V
V
Supply voltage  
3.6  
CC  
High-level input voltage  
Low-level input voltage  
Input voltage  
V
IH  
0.8  
5.5  
−32  
64  
V
IL  
V
I
I
I
High-level output current  
Low-level output current  
Input transition rise or fall rate  
Power-up ramp rate  
mA  
mA  
ns/V  
µs/V  
°C  
OH  
OL  
t/v  
t/V  
Outputs enabled  
10  
200  
−40  
CC  
T
A
Operating free-air temperature  
85  
NOTE 4: All unused control inputs of the device must be held at V  
or GND to ensure proper device operation. Refer to the TI application report,  
CC  
Implications of Slow or Floating CMOS Inputs, literature number SCBA004.  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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ꢐ ꢑꢐ ꢍꢅ ꢒꢓꢆ ꢈ ꢉ ꢍꢓꢔ ꢆ ꢕꢎ ꢖꢔ ꢀꢆ ꢎꢕꢎꢗ ꢆ ꢕꢒꢁꢀ ꢘꢎ ꢔ ꢅꢎ ꢕ  
ꢙ ꢔꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚ ꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
TYP  
PARAMETER  
TEST CONDITIONS  
MIN  
MAX  
UNIT  
V
V
V
V
V
= 2.7 V,  
I = −18 mA  
−1.2  
V
IK  
CC  
CC  
CC  
CC  
I
= 2.7 V to 3.6 V,  
= 2.7 V,  
I
I
I
I
I
I
I
I
= −100 µA  
= −8 mA  
= −32 mA  
= 100 µA  
= 24 mA  
= 16 mA  
= 32 mA  
= 64 mA  
V
−0.2  
OH  
OH  
OH  
OL  
OL  
OL  
OL  
OL  
CC  
2.4  
2
V
OH  
V
V
= 3 V,  
0.2  
0.5  
0.4  
0.5  
0.55  
1
V
= 2.7 V  
CC  
CC  
V
OL  
V
= 3 V  
V
V
= 3.6 V,  
V = V or GND  
I CC  
Control  
inputs  
CC  
= 0 or 3.6 V,  
V = 5.5 V  
I
10  
CC  
V = 5.5 V  
I
20  
I
I
µA  
A or B  
ports  
V = V  
1
V
CC  
= 3.6 V  
I
CC  
V = 0  
I
−5  
I
I
V
V
= 0,  
V or V = 0 to 4.5 V  
100  
µA  
µA  
off  
CC  
I
O
V = 0.8 V  
I
75  
= 3 V  
CC  
V = 2 V  
I
−75  
A or B ports  
I(hold)  
§
V
V
V
= 3.6 V ,  
V = 0 to 3.6 V  
I
500  
100  
CC  
CC  
CC  
= 0 to 1.5 V, V = 0.5 V to 3 V, OE = don’t care  
O
µA  
µA  
I
I
OZPU  
= 1.5 V to 0, V = 0.5 V to 3 V, OE = don’t care  
O
100  
0.19  
5
OZPD  
Outputs high  
Outputs low  
I
V
= 3.6 V, I = 0, V = V  
CC  
or GND  
mA  
CC  
CC  
CC  
O
I
Outputs disabled  
0.19  
0.2  
V
= 3 V to 3.6 V, One input at V  
CC  
− 0.6 V, Other inputs at V  
or GND  
mA  
pF  
pF  
I  
CC  
CC  
C
C
V = 3 V or 0  
4
i
I
V
O
= 3 V or 0  
10  
io  
§
All typical values are at V  
= 3.3 V, T = 25°C.  
A
CC  
Unused pins at V  
or GND  
CC  
This is the bus-hold maximum dynamic current. It is the minimum overdrive current required to switch the input from one state to another.  
This is the increase in supply current for each input that is at the specified TTL voltage level, rather than V or GND.  
CC  
timing requirements over recommended operating free-air temperature range (unless otherwise  
noted) (see Figure 1)  
V = 3.3 V  
CC  
0.3 V  
V
CC  
= 2.7 V  
UNIT  
MIN MAX  
150  
MIN  
MAX  
f
t
Clock frequency  
Pulse duration  
150  
MHz  
ns  
clock  
CLK high or low  
3.3  
1.7  
2
3.3  
2.5  
2.8  
0
w
A or B before CLK  
CLKEN before CLK  
A or B after CLK  
CLKEN after CLK  
t
Setup time  
Hold time  
ns  
ns  
su  
h
0.8  
0.4  
t
0
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀ ꢁꢂ ꢃꢄꢅꢆ ꢇ ꢈ ꢉ ꢊꢋ ꢌꢍ ꢎꢏ  
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ꢙꢔ ꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
switching characteristics over recommended operating free-air temperature range, C = 50 pF  
L
(unless otherwise noted) (see Figure 1)  
V
= 3.3 V  
CC  
0.3 V  
V
= 2.7 V  
MAX  
CC  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
UNIT  
MIN TYP  
MAX  
MIN  
f
t
t
t
t
t
t
150  
150  
MHz  
ns  
max  
PLH  
PHL  
PZH  
PZL  
PHZ  
PLZ  
1.3  
1.3  
1
2.7  
2.7  
2.3  
2.4  
3.9  
3.5  
4
4
4.4  
4.4  
4.9  
4.9  
6.2  
5.3  
CLKBA or CLKAB  
OEBA or OEAB  
OEBA or OEAB  
A or B  
A or B  
A or B  
4
ns  
ns  
1
4
2.1  
2.1  
5.7  
5.1  
All typical values are at V  
CC  
= 3.3 V, T = 25°C.  
A
6
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
ꢀꢁꢂ ꢃ ꢄꢅꢆ ꢇ ꢈꢉ ꢊꢋ ꢌꢍ ꢎꢏ  
ꢐ ꢑꢐ ꢍꢅ ꢒꢓꢆ ꢈ ꢉ ꢍꢓꢔ ꢆ ꢕꢎ ꢖꢔ ꢀꢆ ꢎꢕꢎꢗ ꢆ ꢕꢒꢁꢀ ꢘꢎ ꢔ ꢅꢎ ꢕ  
ꢙ ꢔꢆ ꢇ ꢐ ꢍꢀꢆꢒꢆ ꢎ ꢚ ꢛꢆ ꢏ ꢛꢆꢀ  
SCBS789− NOVEMBER 2003  
PARAMETER MEASUREMENT INFORMATION  
6 V  
TEST  
S1  
S1  
Open  
500 Ω  
From Output  
Under Test  
t
/t  
PLH PHL  
Open  
GND  
t
/t  
6 V  
PLZ PZL  
C
= 50 pF  
t
/t  
GND  
L
PHZ PZH  
500 Ω  
(see Note A)  
2.7 V  
0 V  
Timing Input  
Data Input  
1.5 V  
LOAD CIRCUIT  
t
w
t
t
su  
h
2.7 V  
2.7 V  
0 V  
Input  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
0 V  
VOLTAGE WAVEFORMS  
PULSE DURATION  
VOLTAGE WAVEFORMS  
SETUP AND HOLD TIMES  
2.7 V  
0 V  
2.7 V  
0 V  
Output  
Control  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Input  
t
t
t
PHL  
t
t
PLZ  
PLH  
PHL  
PZL  
Output  
Waveform 1  
S1 at 6 V  
V
3 V  
OH  
1.5 V  
1.5 V  
1.5 V  
1.5 V  
Output  
V
+ 0.3 V  
OL  
V
OL  
(see Note B)  
V
OL  
t
t
t
PZH  
PHZ  
PLH  
Output  
Waveform 2  
S1 at GND  
V
OH  
V
OH  
V
− 0.3 V  
OH  
1.5 V  
1.5 V  
Output  
0 V  
V
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
PROPAGATION DELAY TIMES  
INVERTING AND NONINVERTING OUTPUTS  
VOLTAGE WAVEFORMS  
ENABLE AND DISABLE TIMES  
LOW- AND HIGH-LEVEL ENABLING  
NOTES: A.  
C includes probe and jig capacitance.  
L
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, Z = 50 , t 2.5 ns, t 2.5 ns.  
O
r
f
D. The outputs are measured one at a time with one transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
7
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
18-Sep-2008  
PACKAGING INFORMATION  
Orderable Device  
CLVTH16952IDGGREP  
V62/04719-01XE  
Status (1)  
ACTIVE  
ACTIVE  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
Drawing  
TSSOP  
DGG  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
TSSOP  
DGG  
56  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
OTHER QUALIFIED VERSIONS OF SN74LVTH16952-EP :  
Catalog: SN74LVTH16952  
Military: SN54LVTH16952  
NOTE: Qualified Version Definitions:  
Catalog - TI's standard catalog product  
Military - QML certified for Military and Defense Applications  
Addendum-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Aug-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
CLVTH16952IDGGREP TSSOP  
DGG  
56  
2000  
330.0  
24.4  
8.6  
15.6  
1.8  
12.0  
24.0  
Q1  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
5-Aug-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
TSSOP DGG 56  
SPQ  
Length (mm) Width (mm) Height (mm)  
346.0 346.0 41.0  
CLVTH16952IDGGREP  
2000  
Pack Materials-Page 2  
IMPORTANT NOTICE  
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, modifications, enhancements, improvements,  
and other changes to its products and services at any time and to discontinue any product or service without notice. Customers should  
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sold subject to TI’s terms and conditions of sale supplied at the time of order acknowledgment.  
TI warrants performance of its hardware products to the specifications applicable at the time of sale in accordance with TI’s standard  
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mandated by government requirements, testing of all parameters of each product is not necessarily performed.  
TI assumes no liability for applications assistance or customer product design. Customers are responsible for their products and  
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