8V19N478BDGI [IDT]
FemtoClock NG Jit ter At tenuator and Clock Synthesizer;型号: | 8V19N478BDGI |
厂家: | INTEGRATED DEVICE TECHNOLOGY |
描述: | FemtoClock NG Jit ter At tenuator and Clock Synthesizer |
文件: | 总70页 (文件大小:1217K) |
中文: | 中文翻译 | 下载: | 下载PDF数据表文档文件 |
®
FemtoClock NG Jitter Attenuator
8V19N478
Datasheet
and Clock Synthesizer
Description
Features
▪ High-performance clock RF-PLL:
The 8V19N478 is a fully integrated FemtoClock NG jitter
attenuator and clock synthesizer designed as a high-performance
clock solution for conditioning and frequency/phase management
of 10/40/100/400 Gigabit-Ethernet line cards. The device is
optimized to deliver excellent phase noise performance as
required to drive physical layer devices, and provides the clean
clock frequencies of 625MHz, 500MHz, 312.5MHz, 250MHz,
156.25MHz, and 125MHz.
ꢀ Optimized for low phase noise: -157.7dBc/Hz (1MHz offset;
156.25MHz clock), design target
ꢀ Integrated phase noise, RMS (12kHz–20MHz): 73fs
(typical), design target
▪ Dual-PLL architecture:
ꢀ 1st-PLL stage with external VCXO for clock jitter attenuation
ꢀ 2nd-PLL stage with internal FemtoClock NG PLL at
A two-stage PLL architecture supports both jitter attenuation and
frequency multiplication. The first stage PLL is the jitter attenuator,
and uses an external VCXO for best possible phase noise
characteristics. The second stage PLL locks on the VCXO-PLL
output signal, and synthesizes the target frequency. This PLL has
a VCO circuit at 2500MHz.
2500MHz
▪ Four output banks with a total of 18 outputs, organized in:
ꢀ Three clock banks with one integer frequency divider and
four differential outputs
ꢀ One clock bank with one fractional divider and six
differential outputs
The 8V19N478 generates the output clock signals from the VCO
by frequency division. Four independent frequency dividers are
available; three support integer-divider ratios, and one integer as
well as fractional-divider ratios. Delay circuits can be used for
achieving alignment and controlled phase delay between clock
signals. The two redundant inputs are monitored for activity. Four
selectable clock switching modes are provided to handle clock
input failure scenarios. Auto-lock, individually programmable
output frequency dividers, and phase adjustment capabilities are
added for flexibility.
ꢀ One VCXO-PLL output bank with one selectable LVDS and
two LVCMOS outputs
▪ Four output banks contain a phase delay circuit with steps of
the VCO clock period (400ps)
▪ Supported clock output frequencies include:
ꢀ From the integer dividers: 2500MHz, 1250MHz, 625MHz,
500MHz, 312.5MHz, 250MHz, 156.25MHz, and 125MHz
ꢀ From the fractional divider: 80–300MHz
▪ Low-power LVPECL and LVDS outputs support configurable
signal amplitude, DC and AC coupling, and LVPECL, LVDS,
and line termination techniques
The device is configured through an I2C interface and reports lock
and signal loss status in internal registers and via a lock detect
(LOCK) output. Internal status bit changes can also be reported
via the nINT output. The device is ideal for driving converter
circuits in wireless infrastructure, radar/imaging, and
▪ Redundant input clock architecture:
ꢀ Two inputs
ꢀ Individual input signal monitor
ꢀ Digital holdover
instrumentation/medical applications. The device is a member of
the high-performance clock family from IDT.
ꢀ Manual and automatic clock selection
ꢀ Hitless switching
▪ Status monitoring and fault reporting:
Typical Applications
▪ Sub 70fs – low phase noise clock generation
▪ 10/40/100 Gigabit-Ethernet line cards
▪ Wireless Infrastructure
ꢀ Input signal status
ꢀ Hold-over and reference loss status
ꢀ Lock status with one status pin
ꢀ Mask-able status interrupt pin
▪ Voltage supply:
▪ Reference clock for ADC and DAC circuits
▪ Radar and Imaging
▪ Instrumentation and Medical
ꢀ Device core supply voltage: 3.3V
ꢀ Output supply voltage: 3.3V, 2.5V, or 1.8V
ꢀ I/O voltage: 1.8V or 3.3V (selectable), and 3.3V tolerant
inputs when set to 1.8V
▪ Package: 11 11 1 mm ball pitch 100-FPBGA
▪ Temperature range: -40°C to +85°C
©2018 Integrated Device Technology, Inc
1
May 15, 2018
8V19N478 Datasheet
Contents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Typical Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin Assignments. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Pin Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Principles of Operation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Phase-Locked Loop Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Frequency Generation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
VCXO-PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
FemtoClock NG PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Channel Frequency Divider . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Redundant Inputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Input Re-Validation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Clock Selection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Holdover . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Manual Holdover Control (nHO_EN = 0) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Automatic with Holdover (nHO_EN = 1, nM/A[1:0] = 11) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Hold-off Counter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Revertive Switching . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
VCXO-PLL Lock Detect (LOLV) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
FemtoClock NG Loss-of-lock (LOLF) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Differential Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
Output Phase-Delay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Status Conditions and Interrupts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
Serial Control Port . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Serial Control Port Configuration Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
I2C Mode Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Register Descriptions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
Device Configuration Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28
PLL Frequency Divider Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
PLL Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31
Input Selection Mode Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33
Channel Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Output Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 40
Status Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 42
General Control Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 44
Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 45
Pin Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 46
AC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50
Clock Phase Noise Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53
Applications Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
VCXO-PLL Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
©2018 Integrated Device Technology, Inc
2
May 15, 2018
8V19N478 Datasheet
Step-by-step Calculation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58
FemtoClock NG PLL Loop Filter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60
Output Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
LVPECL-style Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 61
LVDS-Style Outputs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64
Power Supply Filtering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65
Temperature Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Package Outline Drawings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 66
Marking Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Glossary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 68
©2018 Integrated Device Technology, Inc
3
May 15, 2018
8V19N478 Datasheet
Block Diagram
VCXO-PLL
Loop Filter
VDD_LCF
RZ
CZ
4.7µF
CP
CLK_0
nCLK_0
8V19N478
Clock
Monitor
and
Selector
CR
÷PV
÷MV
BYPV
CLK_1
nCLK_1
FDF
OSC
nOSC
÷PF
x2
PFD
CP
LFV
PFD
CP
EXT_SEL
fVCO
2400-2500MHz
LFF
CPF
Dual FemtoClockNG
CZF
RZF
FemtoClock NG
PLL Loop Filter
÷MF
Holdover
SRC
0
1
LFFR
QCLK_V
nQCLK_V
VCXO-PLL Channel
QCLK_A[0:3]
nQCLK_A[0:3]
÷NA
(int)
CLKA
QCLK_B[0:3]
nQCLK_B[0:3]
÷NB
(int)
CLKB
CLKC
CLKD
RES_CAL
2.8k
QCLK_C[0:3]
nQCLK_C[0:3]
÷NC
(int)
QCLK_D[0:5]
nQCLK_D[0:5]
÷ND
(frac)
ADR0
ADR1
ADR2
ADR3
SCL
nINT
I2C
1.8V/3.3V
LOCK
Register
File
SDAT
I2C_A
©2018 Integrated Device Technology, Inc
4
May 15, 2018
8V19N478 Datasheet
Pin Assignments
Figure 1. Pin Assignments for 11 11 1 mm, 100-FPBGA Package (Bottom View )
nQCLK
_A0
QCLK
_A0
QCLK
_D0
QCLK
_D1
QCLK
_D2
A
B
C
D
E
F
RES-CAL
EXT_SEL
GND
VDD_CPV
LFV
nOSC
OSC
nQCLK_V
QCLK_V
nINT
VDD_OSC
I2C_A
VDD_I2C
SDAT
SCL
nQCLK
_A1
nQCLK
_D0
nQCLK
_D1
nQCLK
_D2
QCLK_A1
nQCLK
_A2
QCLK
_A2
QCLK
_D3
QCLK
_D4
VDD_INP
CLK_0
nCLK_0
GND
LOCK
CLK_1
nCLK_1
GND
GND
GND
GND
GND
nQCLK
_A3
QCLK
_A3
nQCLK
_D3
nQCLK
_D4
GND
ADR3
VDDO
_QCLKA
VDD
_QCLKA
nQCLK
_D5
QCLK
_D5
GND
ADR2
VDD
_QCLKD
VDDO
_QCLKD
GND
GND
GND
ADR1
ADR0
GND
nQCLK
_B0
QCLK
_B0
VDD
_QCLKB
VDD
_QCLKC
G
H
J
VDD_CPF
GND
GND
GND
GND
GND
nQCLK
_B1
QCLK
_B1
VDDO
_QCLKB
VDDO
_QCLKC
QCLK
_C0
nQCLK
_C0
CLDO
CR
CBIAS
VDD_LCV
GND
nQCLK
_B2
QCLK
_B2
nQCLK
_C3
QCLK
_C1
nQCLK
_C1
GND
GND
GND
nQCLK
_B3
QCLK
_B3
QCLK
_C3
QCLK
_C2
nQCLK
_C2
K
GND
LFF
LFFR
VDD_LCF
GND
10
9
8
7
6
5
4
3
2
1
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8V19N478 Datasheet
Pin Descriptions
[a]
Table 1. Pin Descriptions
[b]
Ball
Name
Type
Description
A10
A9
A8
A7
A6
nQCLK_A0
QCLK_A0
RES_CAL
Output
Output
Analog
Power
Differential clock output A0 (Channel A). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKA
Connect a 2.8k (1%) resistor to GND for output current calibration.
V
Positive supply voltage (3.3V) for internal VCXO_PLL circuits.
DD_CPV
nOSC
Input (PD/ PU)
VCXO non-inverting and inverting differential clock input. Compatible with LVPECL,
LVDS and LVCMOS signals.
A5
nQCLK_V
Output
Differential VCXO-PLL clock outputs. Selectable LVPECL, LVDS (2x LVCMOS 1.8V)
style.
A4
A3
V
Power
Output
Positive supply voltage (3.3V) for the VCXO input.
DD_OSC
QCLK_D0
QCLK_D1
QCLK_D2
Differential clock output D0 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKD
A2
A1
Output
Output
Differential clock output D1 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
Differential clock output D2 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
B10
B9
B8
B7
B6
nQCLK_A1
QCLK_A1
EXT_SEL
LFV
Output
Output
Differential clock output A1 (Channel A). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKA
Input (PD)
Output
Clock reference select. 1.8V interface levels with hysteresis and 3.3V tolerance.
VCXO-PLL charge-pump output. Connect to the loop filter for the external VCXO.
OSC
Input (PD)
VCXO non-inverting and inverting differential clock input. Compatible with LVPECL,
LVDS and LVCMOS signals.
B5
QCLK_V
Output
Differential VCXO-PLL clock outputs. Selectable LVPECL, LVDS/(2x LVCMOS 1.8V)
style.
2
B4
B3
I2C_A
Input (PD/ PU)
Output
Serial Interface I C addresses. Three-level signals (see Table 15).
nQCLK_D0
Differential clock output D0 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKD
B2
B1
nQCLK_D1
nQCLK_D2
Output
Output
Differential clock output D1 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
Differential clock output D2 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
C10
C9
C8
C7
C6
nQCLK_A2
QCLK_A2
GND
Output
Output
Power
Power
Output
Differential clock output A2 (Channel A). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKA
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Positive supply voltage (3.3V) for the differential inputs (CLK[1:0]).
V
DD_INP
LOCK
PLL lock detect status output for both PLLs. Selectable 1.8V/3.3V LVCMOS/LVTTL
interface levels.
C5
nINT
Output
Status output pin for signaling internal changed conditions. Selectable 1.8V/3.3V
LVCMOS/LVTTL interface levels.
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8V19N478 Datasheet
Table 1. Pin Descriptions (Cont.)[a]
[b]
Ball
Name
Type
Description
Positive supply voltage (3.3V) for I2C_A.
C4
C3
C2
V
Power
Power
Output
DD_I2C
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Differential clock output D3 (Channel D). Configurable LVPECL, LVDS style and
QCLK_D3
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKD
C1
QCLK_D4
Output
Differential clock output D4 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
D10
D9
nQCLK_A3
QCLK_A3
GND
Output
Output
Differential clock output A3 (Channel A). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKA
D8
Power
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Device clock 0 inverting and non-inverting differential clock input. Inverting input is
D7
CLK_0
Input (PD)
biased to V
/2 by default when left floating. Compatible with LVPECL, LVDS and
DD_V
LVCMOS signals.
D6
CLK_1
Input (PD)
Device clock 1 inverting and non-inverting differential clock input. Inverting input is
biased to V
/2 by default when left floating. Compatible with LVPECL, LVDS and
DD_V
LVCMOS signals.
D5
D4
D3
D2
ADR3
SDAT
Input (PU/PD)
I/O (PU)
Power
Device mode selection (see Table 12).
2
I C data input/output. 1.8V interface levels with hysteresis and 3.3V tolerance
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
nQCLK_D3
Output
Differential clock output D3 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKD
D1
nQCLK_D4
Output
Differential clock output D4 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKD
E10
E9
V
Power
Power
Output power supply voltage (3.3V, 2.5V or 1.8V) for the QCLK_A[3:0] outputs.
Positive supply voltage (3.3V) for Channel A.
DDO_QCLKA
V
DD_QCLKA
E8
GND
Power
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Device clock 0 inverting and non-inverting differential clock input. Inverting input is
E7
nCLK_0
nCLK_1
Input (PD/ PU)
biased to V
/2 by default when left floating. Compatible with LVPECL, LVDS and
DD_V
LVCMOS signals.
E6
Input (PD/ PU)
Device clock 1 inverting and non-inverting differential clock input. Inverting input is
biased to V
/2 by default when left floating. Compatible with LVPECL, LVDS and
DD_V
LVCMOS signals.
E5
E4
E3
E2
E1
F10
F9
ADR2
SCL
Input (PD/ PU)
Input (PU)
Power
Control input for output Bank D. 3-level signal (see Table 12 and Table 14).
2
I C clock input. 1.8V interface levels with hysteresis and 3.3V tolerance.
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
nQCLK_D5
QCLK_D5
GND
Output
Differential clock output D5 (Channel D). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKD
Output
Power
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
GND
Power
F8
GND
Power
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8V19N478 Datasheet
Table 1. Pin Descriptions (Cont.)[a]
[b]
Ball
Name
Type
Description
F7
F6
F5
F4
GND
GND
Power
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Control input for output Bank B. 3-level signal (see Table 12 and Table 14).
Power
ADR1
ADR0
Input (PD/ PU)
Input (PD/ PU)
Control input for output Bank A and Bank C. Three-level signal (see Table 12 and
Table 14).
F3
F2
GND
Power
Power
Power
Output
Output
Power
Power
Power
Power
Power
Power
Power
Power
Output
Output
Power
Power
Analog
Analog
Power
Power
Output
Output
Output
Output
Power
Power
Analog
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Positive supply voltage (3.3V) for Channel D.
V
DD_QCLKD
F1
V
Output power supply voltage (3.3V, 2.5V or 1.8V) for the QCLK_D[5:0] outputs.
DDO_QCLKD
G10
G9
G8
G7
G6
G5
G4
G3
G2
G1
H10
H9
H8
H7
H6
H5
H4
H3
H2
H1
J10
J9
nQCLK_B0
QCLK_B0
Differential clock output B0 (Channel B). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKB
V
Positive supply voltage (3.3V) for Channel B.
DD_QCLKB
V
Positive supply voltage (3.3V) for internal FemtoClock NG circuits.
DD_CPF
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Positive supply voltage (3.3V) for Channel C.
GND
GND
V
DD_QCLKC
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
GND
nQCLK_B1
QCLK_B1
Differential clock output B1 (Channel B). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKB
V
Output power supply voltage (3.3V, 2.5V or 1.8V) for the QCLK_B[3:0] outputs.
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Analog internal LDO bypass for VCO. Connect a 10µF capacitor to GND.
Internal bias circuit for VCO. Connect a 4.7µF capacitor to GND.
DDO_QCLKB
GND
CLDO
CBIAS
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Output power supply voltage (3.3V, 2.5V or 1.8V) for the QCLK_C[3:0] outputs.
V
DDO_QCLKC
QCLK_C0
nQCLK_C0
nQCLK_B2
QCLK_B2
GND
Differential clock output C0 (Channel C). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKC
Differential clock output B2 (Channel B). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKB
J8
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
Internal VCO regulator bypass capacitor. Use a 4.7µF capacitor between the CR and
J7
GND
J6
CR
the V
terminals.
DD_LCF
J5
J4
V
Power
Power
Positive supply voltage (3.3V) for the VCXO-PLL.
DD_LCV
GND
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
©2018 Integrated Device Technology, Inc
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8V19N478 Datasheet
Table 1. Pin Descriptions (Cont.)[a]
[b]
Ball
Name
Type
Description
Differential clock output C3 (Channel C). Configurable LVPECL, LVDS style and
J3
nQCLK_C3
Output
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKC
J2
J1
QCLK_C1
nQCLK_C1
nQCLK_B3
QCLK_B3
GND
Output
Output
Output
Output
Power
Output
Differential clock output C1 (Channel C). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKC
K10
K9
K8
K7
Differential clock output B3 (Channel B). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKB
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
LFF
Loop filter/charge-pump output for the FemtoClock NG PLL. Connect to the external
loop filter.
K6
K5
LFFR
Analog
Power
Ground return path pin for the VCO loop filter.
V
Positive supply voltage (3.3V) for the internal oscillator of the FemtoClock NG PLL.
For essential information on power supply filtering, see Power Supply Filtering.
DD_LCF
K4
K3
GND
Power
Output
Ground supply voltage (GND) and ground return path. Connect to board GND (0V).
nQCLK_C3
Differential clock output C3 (Channel C). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V
supply voltage.
DDO_QCLKC
K2
K1
QCLK_C2
Output
Output
Differential clock output C2 (Channel C). Configurable LVPECL, LVDS style and
amplitude. Output levels are determined by the V supply voltage.
DDO_QCLKC
nQCLK_C2
[a] For essential information on power supply filtering, see Power Supply Filtering.
[b] Pull-up (PU) and pull-down (PD) internal input resistors are indicated in parentheses. For typical values, see Input Characteristics, Table 41.
Principles of Operation
Overview
The device generates low-phase noise, synchronized clock output signals locked to an input reference frequency. The device contains
two PLLs with configurable frequency dividers. The first PLL (VCXO-PLL, suffix V) uses an external VCXO as the oscillator and provides
jitter attenuation. The external loop filter is used to set the VCXO-PLL bandwidth frequency in conjunction with internal parameters. The
second, low-phase noise PLL (FemtoClock NG, suffix F) multiplies the VCXO-PLL frequency to the VCO frequency of 2500MHz. The
FemtoClock NG PLL is completely internal and provides a central reference timing reference point for all output signals. From this point,
fully synchronous dividers generate the output frequencies.
The device has four output channels A – D, four channels with one integer output divider A – C and one channel with a fractional output
divider (D). The clock outputs are configurable with support for LVPECL and LVDS formats, and a variable output amplitude. In channels
A – D, the clock phase can be adjusted in phase. Individual outputs, channels, and unused circuit blocks support powered-down states
for operation at reduced power consumption. The register map, accessible through a selectable I2C interface with read-back capability
controls the main device settings and delivers device status information. For redundancy purpose, there are two selectable reference
frequency inputs and a configurable switch logic with manual, auto-selection, and holdover support.
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8V19N478 Datasheet
Phase-Locked Loop Operation
Frequency Generation
The 8V19N478 supports four operation modes: Dual-PLL and VCXO-PLL with jitter attenuation, frequency synthesis, and the buffer/
divider mode. Frequencies higher than the input frequency can be generated by the device by utilizing one or both PLLs. Using the
PLL(s) require(s) the user to set the frequency dividers to match input, VCXO and VCO frequency and to achieve frequency and phase
lock on the used PLLs. The frequency of the external VCXO is chosen by the user. The internal VCO frequency range is 2400–2500MHz.
Available frequency dividers for each of the four modes are displayed in Table 2. Example divider configurations are shown in Table 3 and
Table 4.
Dual-PLL Jitter Attenuation Mode: Input clock jitter is attenuated by the VCXO-PLL (1st stage PLL). The 2nd stage PLL (FemtoClock NG)
is locked to the 1st stage PLL and synthesizes a frequency in the range of 2400–2500MHz. Output dividers scale the frequency down to
the target frequency. Dividers PV, MV, PF, MF, Nx, and (optionally) ND require a user configuration. This is the main operation mode of the
device with the highest flexibility in frequency generation. Best phase noise is achieved with internal frequency doubler turned on.
VCXO-PLL Jitter Attenuation Mode: Input clock jitter is attenuated by the VCXO-PLL (1st stage PLL). The VCXO-output signal is divided
by the output dividers to the target frequency. Dividers PV, MV, and Nx require a user configuration. The VCXO sets the highest frequency
the device can achieve. The output phase noise is equivalent to the phase noise of the VCXO scaled by the output divider.
Frequency Synthesis Mode: The 1st stage PLL is bypassed. The 2nd stage PLL (FemtoClock NG) is directly locked to the input source
and synthesizes a frequency in the range of 2400–2500MHz. output dividers scale the frequency down to the target frequency. Dividers
PV, PF, MF, Nx, and (optionally) ND require a user configuration. This mode is recommend for applications with a low-jitter input source.
Divider/Buffer Mode: Both PLLs are bypassed. Output dividers scale the input frequency to the target frequency. Dividers PV and Nx
require a user configuration. In this mode, the PLL frequency specifications do not apply.
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8V19N478 Datasheet
Table 2. PLL Divider Values
Operation
Frequency
Synthesis
Jitter Attenuation
VCXO-PLL
Divider/Buffer
Dual-PLL
(BYPV 0, SRC 0)
(BYPV 0,
SRC 1)
VCXO-PLL bypassed Both PLLs bypassed
(BYPV 1, SRC 0) (BYPV 1, SRC 1)
Divider
Range
VCXO-PLL
1…32767:
Input clock frequency
[a]
Pre-Divider P
(15 bit)
V
fVCXO
-------------------
MV
No external VCXO required
fCLK
=
PV
VCXO-PLL
Feedback Divider
1…32767:
(15 bit)
M
V
FemtoClock NG
Pre-Divider P
1…63: (6 bit)
Input clock
frequency:
VCXO frequency:
F
PF
---------
FemtoClock NG
Feedback
8 …511: (9 bit)
PF
fVCXO = fVCO
---------
fCLK = fVCO
MF
MF
—
Output frequency
Dividers M
F
[b]
f
: Note
fCLK
VCO
[b]
fOUT
=
-------------------------
f
: Note
[c]
VCO
P : Note
NX PV
F
[c]
P : Note
F
Output Divider Nx 1…160:
Output frequency
Output frequency
Output frequency
[d]
(x [A:C])
(Integer)
fVCO
fVCXO
fVCO
fOUT
=
fOUT
=
fOUT
=
--------------
-------------------
--------------
NX
NX
NX
Output Divider ND Fractional
Output frequency
[e]
Divider :
fVCO
4
fOUT
=
--------------
N
: 4…2 – 1:
INT
NE
(Integer part)
24
—
N
: 1…2 – 1:
FRAC
NFRAC
---------------------
224
(Fractional part)
NE = 2 NINT
+
[a] PV divider settings are in the PV0 register (for CLK_0), and in the PV1 register (for CLK_1). The PV divider is automatically loaded from PV0 or
PV1 according to the input selection (Clock Selection Settings, Table 11).
[b] fVCO 2400–2500MHz.
[c] Set PF to 0.5 in the equation if the frequency doubler is engaged (FDF 1).
[d] For a list of supported integer output dividers Nx (Table 8).
[e] Greatest ND fractional divider is 2 (14 [224 – 1] / 224) ≈ 29.99999988.
©2018 Integrated Device Technology, Inc
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8V19N478 Datasheet
VCXO-PLL
The prescaler PV and the VCXO-PLLs feedback divider MV require configuration to match the input frequency to the VCXO-frequency.
With the MV and PV divider value range of 15 bit, the device support is very flexible and supports a wide range of input and VCXO-
frequencies.
In addition, the range of available inputs and feedback dividers allow to adjust the phase detector frequency independent of the used
input and VCXO frequencies (Table 3 and Table 4). The VCXO-PLL charge-pump current is controllable via internal registers, and can be
set in 50µA steps, from 50µA to 1.6mA. The VCXO-PLL can be bypassed (BYPV): when in bypass, the FemtoClock NG PLL locks to the
pre-divided input frequency.
Table 3. Example Configurations for fVCXO 125MHz
VCXO-PLL Divider Settings
Input Frequency (MHz)
PV
MV
f
(MHz)
PFD
19.44
486
1
3125
5
0.04
20
5
4
20
80
320
1
25
16
64
1
1.25
0.390625
125
5
5
25
125
25
125
5
25
125
4
5
1
31.25
3.125
0.3125
156.25
50
500
40
400
Table 4. Example Configurations for fVCXO 156.25MHz
VCXO- PLL Divider Settings
Input Frequency (MHz)
PV
MV
f
(MHz)
PFD
19.44
20
1944
400
4
15625
3125
25
0.01
0.05
6.25
25
125
40
250
2500
5
0.625
0.0625
31.25
3.125
0.3125
156.25
15.625
1.5625
400
4
40
50
400
1
500
1
156.25
10
10
100
100
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8V19N478 Datasheet
Table 5. VCXO-PLL Bypass Settings
BYPV
Operation
0
1
VCXO-PLL operation.
VCXO-PLL bypassed and disabled. The reference clock for the FemtoClock NG PLL is the selected input
clock. The input clock selection must be set to manual by the user. Clock switching and holdover are not
defined. The device synthesizes an output frequency, but will not attenuate input jitter. An external VCXO
component and loop filter is not required.
FemtoClock NG PLL
The FemtoClock NG PLL is the second stage PLL, and locks to the output signal of the VCXO-PLL (BYPV 0). It requires configuration from
the frequency doubler FDF, or the pre-divider PF and the feedback divider MF to match the VCXO-PLL frequency to the VCO frequency of
2500MHz. Best phase noise is typically achieved by engaging the internal frequency doubler (FDF 1, 2). If engaged, the signal from the first
PLL stage is doubled in frequency, increasing the phase detector frequency of the FemtoClock NG PLL. When the frequency doubler is
enabled, the frequency pre-divider PF is disabled. If the frequency doubler is not used (FDF 0), the PF pre-divider has to be configured.
Typically, the PF is set to 1 to keep the phase detector frequency as high as possible. Set the PF to other divider values to achieve specific
frequency ratios between the first and second PLL stage. This PLL is internally configured to high-bandwidth.
Table 6. Frequency Doubler
FDF
Operation
0
1
Frequency doubler off. The PF divides the clock signal from the VCXO-PLL or input (in bypass).
Frequency doubler on (2). A signal from the VCXO-PLL or input (in bypass) is doubled in frequency. The
PF divider has no effect.
Table 7. Example PLL Configurations
FemtoClock NG Divider Settings for VCO 2500MHz
VCXO-Frequency (MHz)
FDF
PF
MF
25
2
2
–
–
–
1
–
1
50
10
20
8
125
2
–
156.25
16
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8V19N478 Datasheet
Channel Frequency Divider
The device supports four independent output channels A–D. The channels A–C have one configurable integer frequency divider Nx
(x A – C), that divides the VCO frequency to the desired output frequency with very low phase noise. The integer divider values can be
selected from the range of 1 to 160 (Table 8). Channel D supports fractional divider ratios (Table 9).
Table 8. Integer Frequency Divider Settings
[a]
Channel Divider Nx
Output Clock Frequency (MHz) for VCO 2500MHz
1
2
2500
1250
3
833.333
625
4
5
500
8
312.5
250
10
16
20
30
32
40
50
60
64
80
100
120
128
160
156.25
125
83.333
78.125
62.5
50
41.667
39.0625
31.25
25
20.833
19.53125
15.625
[a] x A – D.
Table 9. Typical Fractional Frequency Divider Settings
[a]
Channel Divider ND
Output Clock Frequency (MHz) for VCO 2500MHz
15.51
161.1328125
133.333
18.75
[a] Greatest ND fractional divider is 2 (14 [224 – 1] / 224) ≈ 29.99999988.
Table 10. PLL Feedback Path Settings
SRC
Operation
0
1
The output divider input signal is the FemtoClock NG PLL.
The output divider input signal is the VCXO-PLL output signal. FemtoClock NG PLL is bypassed.
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8V19N478 Datasheet
Redundant Inputs
The two inputs are compatible with LVDS and LVPECL signal formats, and also support single-ended LVCMOS signals. For applicable
input interface circuits, see Applications Information.
Definitions
▪ Primary clock – The CLK_n input selected by the selection logic.
▪ Secondary clock – The CLK_n input not selected by the selection logic.
▪ PLL reference clock – The CLK_n input selected as the PLL reference signal by the selection logic. In automatic switching mode, the
selection can be overwritten by a state machine.
Monitoring
Loss of Input Signal (LOS)
In operation, a clock input is declared invalid (LOS) with the corresponding ST_CLK_n and LS_CLK_n indicator bits set after a specified
number of consecutive clock edges. If differential input signals are applied, the input will also detect an LOS condition in case of a zero
differential input voltage.
The device supports LOS detect circuits, one for each input. The signal detect circuits compare the signals at the CLK_0 and CLK_1
inputs to the internal frequency-divided signals from the VCXO-PLL (Figure 2). The loss-of-signal fault condition is declared upon three or
more missing clock input edges. LOS requires configuration of the N_MON[4:0] frequency divider setting to individually match the input
frequencies CLK_n to the VCXO frequency: fVCXO N_MON[4:0] fCLK_n. For instance, if one of the input frequencies is 25MHz and a
125MHz VCXO is used, set N_MON[4:0] 5. For configuration details see Table 11. Then, LOS is declared after three consecutive
missing clock edges. LOS is signaled through the ST_CLK_n (momentary) and LS_CLK_n (sticky, resettable) status bits. and can be
reported as an interrupt signal on the nINT output. The LOS circuit requires the jitter attenuation mode of the device (BYPV 0). LOS
does not detect frequency errors.
Figure 2. LOS Detect Circuit
fCLK_0
CLK_0
nCLK_0
fCLK_1
÷PV
CLK_1
nCLK_1
Input Select
LOS
Detector 0
ST_CLK_0, LS_CLK_0
N_MON[4:0]
÷1, ÷2, ..., ÷40
fVCXO
LOS
Detector 1
ST_CLK_1, LS_CLK_1
VCXO
Input Re-Validation
A clock input is declared valid and the corresponding LOS bit is reset after the clock input signal returned for user-configurable number of
consecutive input periods. This re-validation of the selected input clock is controlled by the CNTV setting (verification pulse counter).
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Clock Selection
The device supports five input selection modes: manual with and without holdover, short-term holdover, and two automatic switch modes.
Table 11. Clock Selection Settings
Mode
Flags
Name
Description
Application
Input selection follows user-configuration of the EXT_SEL pin or INT_SEL register bit as set by nEXT_INT with
holdover. Input selection is never changed by the internal state machine.
LOS on the primary reference clock:
Selected
Active reference stays selected, and the PLLs
may stall. The device will not go into holdover.
1
0[a]
input
Manual
Holdover
Control
Manual change of the reference clock:
The device will go into holdover, and the
hold-off down-counter (CNTH) starts. The
device initiates a clock switch after expiration
of the hold-off counter. Duration of holdover is
set by CNTH CNTR / fVCXO. Holdover is
terminated even if the secondary clock input is
bad (LOS), (Manual Holdover Control
(nHO_EN = 0).
Startup and
external
selection
control with
holdover
0
X
X
LOS
status
(default)
LOS status
of selected
input
Selected
input[c]
0[b]
Input selection follows user-configuration of the EXT_SEL pin or INT_SEL register bit as set by nEXT_INT.
Input selection is never changed by the internal state machine.
LOS on the primary reference clock:
Selected
Active reference stays selected and the PLLs
may stall. Device will not go into holdover.
1
0
Manual
Control
input
1
0
0
External
selection
control
LOS
status
Manual change of the reference clock:
The device will not go into holdover and will
attempt to lock to the newly selected
reference.
Actual LOS
status of
selected
input
Selected
input
1
Input selection follows LOS status. A failing input clock will cause an LOS event for that clock input. If the
selected clock has an LOS event, the device will immediately initiate a clock fail-over switch.
LOS on the primary reference clock:
The device will switch to the secondary clock
without holdover. Input selection is
determined by a state machine and may differ
from the user’s clock selection.
Actual LOS
status of
selected
input
determined
by state
machine
Selected
input
determined
by state
machine
No valid clock scenario: If no valid input
1
1
Multiple
inputs with
qualified
clock
1
0
1
Automatic clocks exist, the device will not attempt to
switch, and will not enter the holdover state.
The PLL is not locked. Re-validation of all
LOS
status
input clocks will result in the PLL to attempt to
lock on that input clock (Revertive Switching).
signals
Manual change of the reference clock:
The device will switch to the newly selected
clock without holdover. If the newly selected
clock is not valid, the PLL may stall.
Actual LOS
status of
selected
input
Selected
input
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Table 11. Clock Selection Settings (Cont.)
Mode
Flags
Name
Description
Application
Input selection follows user-configuration of EXT_SEL pin or INT_SEL register bit as set by nEXT_INT.
Selection is never changed by the internal state machine (see Holdover).
LOS on the primary reference clock:
A failing reference clock will cause an LOS
0
Use if a
single
reference is
occasionally
interrupted
Short-term
Holdover
event. If the selected reference fails, the
device will enter holdover immediately.
Re-validation of the selected input clock is
controlled by the CNTV setting. A successful
re-validation will result in the PLL to re-lock on
that input clock.
LOS status
for duration
of LOS until
revalidation
1
1
0
LOS
status
Selected
input
For
holdover
duration
Input selection follows LOS status. A failing input clock will cause an LOS event for that clock input. If the
selected clock has an LOS event, the device will go into holdover and switches input clocks after the hold-off
counter expires.
LOS on the primary reference clock, or
Manual change of the reference clock:
The device will go into holdover and the
hold-off down-counter (CNTH) starts. The
device initiates a clock fail-over switch to a
valid secondary clock input after expiration of
the hold-off counter. Duration of holdover is
set by CNTH CNTR/ fVCXO. The holdover is
terminated prior hold-off count-down if the
primary clock revalidates or is terminated by a
manual change of the reference clock. See
Automatic with Holdover (nHO_EN = 1,
Automatic
with
Holdover
0
Selected
input
1
1
1
Actual LOS
status of
selected
input
LOS
status
Multiple
inputs
determined
by state
machine
For
holdover
duration
nM/A[1:0] = 11), and Revertive Switching.
No valid clock scenario: The device remains
in holdover if the secondary input clock is
invalid.
[a] For the duration of an invalid input signal (LOS).
[b] For the duration of holdover.
[c] Delayed by holdover period.
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Holdover
In holdover state, the output frequency and phase is derived from an internal, digital value based on previous frequency and phase
information. Holdover characteristics are defined in Table 48.
Manual Holdover Control (nHO_EN 0)
This is the default switching mode of the device. The switch control is manual: The EXT_SEL pin or the INT_SEL bit as set by nEXT_INT
determines the selected reference clock input. If the selection is changed by the user, the device will enter holdover until the CNTH[7:0]
counter expires. Then, the new reference is selected (input switch). Application for this mode is startup and external selection control.
▪ ST_REF – Status of selected reference clock
▪ ST_CLK_n – Both will reflect the status of the corresponding input
▪ ST_SEL – The new selection
▪ nST_HOLD 0 for the duration of holdover
Automatic w ith Holdover (nHO_EN 1, nM/A[1:0] 11)
If an LOS event is detected on the active reference clock:
1. Holdover begins immediately
2. Corresponding ST_REF and LS_REF go low immediately
3. Hold-off countdown begins immediately
During this time, both input clocks continue to be monitored and their respective ST_CLK, LS_CLK flags are active. LOS events will be
indicated on ST_CLK, LS_CLK when they occur.
If the active reference clock resumes and is validated during the hold-off countdown:
1. Its ST_CLK status flag will return high and the LS_CLK is available to be cleared by an I2C write of 1 to that register bit
2. No transitions will occur of the active REF clock; ST_SEL does not change
3. Revertive bit has no effect during this time (whether 0 or 1)
When the hold-off countdown reaches zero:
If the active reference has resumed and has been validated during the countdown, it will maintain being the active reference clock:
1. ST_SEL does not change
2. ST_REF returns to 1
3. LS_REF can be cleared by an I2C write of 1 to that register
4. Holdover turns off and the VCXO-PLL attempts to lock to the active reference clock
If the active reference has not resumed, but the other clock input CLK_n is validated, then:
1. ST_SEL1:0 changes to the new active reference
2. ST_REF returns to 1
3. LS_REF can be cleared by an I2C write of 1 to that register
4. Holdover turns off
If there is no validated CLK:
1. ST_SEL does not change
2. ST_REF remains low
3. LS_REF cannot be cleared by an I2C write of 1 to that register
4. Holdover remains active
Revertive capability returns if REVS 1.
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Hold-off Counter
A configurable down-counter applicable to the Automatic with Holdover and Manual with Holdover selection modes. The purpose of this
counter is a deferred, user-configurable input switch. The counter expires when a zero-transition occurs; this triggers a new reference
clock selection. The counter is clocked by the frequency-divided VCXO-PLL signal. The CNTR setting determines the hold-off counter
frequency divider and the CNTH setting the start value of the hold-off counter. For instance, set CNTR to a value of 131072 to achieve
953.67Hz (or a period of 1.048ms at fVCXO 125MHz): the 8-bit CNTH counter is clocked by 953.67Hz and the user-configurable hold-off
period range is:
0ms (CNTR 0x00) to 267ms (CNTR 0xFF). After the counter expires, it reloads automatically from the CNTH I2C register. After the
LOS status bit (LS_CLK_n) for the corresponding input CLK_n has been cleared by the user, the input is enabled for generating a new
LOS event.
The CNTR counter is only clocked if the device is configured in the clock selection modes, Automatic with Holdover and the selected
reference clock experiences an LOS event, or in the Manual with Holdover mode with manual switching. Otherwise, the counter is
automatically disabled (not clocked).
Revertive Switching
Revertive switching is only applicable to the two automatic switch modes shown in Table 11. Revertive switching enabled: Re-validation
of any non-selected input clock(s) will cause a new input selection according to the user-preset input priorities (revertive switch). An input
switch is only done if the re-validated input has a higher priority than the currently selected reference clock. Revertive switching disabled:
Re-validation of a non-selected input clock has no impact on the clock selection. The default setting is revertive switching disabled.
VCXO-PLL Lock Detect (LOLV)
The VCXO-PLL lock detect circuit uses the signal phase difference at the phase detector as Loss-of-lock criteria. Loss-of-lock is reported
if the actual phase difference is larger than a configurable phase detector window set by the LOCK_TH[14:0] configuration bits. A
Loss-of-lock state is reported through the nST_LOLV and nLS_LOLV status bits (Table 21). The VCXO-PLL lock detect function requires
to set FVCV 0.
Table 12. ADR3 Selection Table
ADR3
Device Mode
Low
Default modes:
Outputs – disabled
Inputs – unused
Middle
High
Default frequency profile with 25MHz input
Default frequency profile with 20MHz input
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Table 13. Input Path Pin Configuration Table
SEL_BITS_MASTER(REG20,
D0)
X
L
X
0
M
0
1
X
X
ADR3
REFin
H
REF = 25MHZ
REF = 20MHZ
PV Divide
REG16[7:0], 17[6:0]
REF/ PV
160
156.25kHz
1000
156.25kHz
128
160
125kHz
1250
125kHz
128
REG16[7:0], 17[6:0]
REF/ PV
REF into PD
MV Divide
FB into PD
lock_th
REG18[7:0], 19[6:0]
FB/ MV
REG18[7:0], 19[6:0]
FB/ MV
REG21[7:0], 22[6:0]
REG25[5:0]
REG25[7]
0
REG21[7:0], 22[6:0]
REG25[5:0]
REG25[7]
0
PF
X
X
PF Doubler
REF into PD
MF
on
on
312.5MHz
8
312.5MHz
8
REG26[7:0], 27[0]
0
REG26[7:0], 27[0]
0
FB into PD
BYPV
312.5MHz
off
312.5MHz
off
REG23[0]
REG24[0]
REG28[7]
REG28[6]
REG28[4:0]
REG30[4:0]
REG32[7:3]
0
REG23[0]
REG24[0]
REG28[7]
REG28[6]
REG28[4:0]
REG30[4:0]
REG32[7:3]
0
SRC
on
on
Polarity
positive
off
positive
off
FVCV
CPV
750µA
5.8mA
8
750µA
5.8mA
8
CPF
N_MON
LOS Monitoring Frequency
MODE_BLOCK
nHO_EN
nEXT_INT
nMA[1:0]
CNTV
19.5MHz
on
19.5MHz
on
REG32[2]
REG32[1]
REG32[0]
REG33[3:2]
REG35[1:0]
REG32[2]
REG32[1]
REG32[0]
REG33[3:2]
REG35[1:0]
off
off
external
manual
2
external
manual
2
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Table 14. Output Frequency Pin Configuration Table
Output Bank A and C
ADR0
Output Type
Divide Ratio
FOUT (MHz)
Swing Level
Low
Middle
High
LVPECL
LVDS
20
16
16
125
750mV
500mV
750mV
Total outputs per
bank: 4, with 1 integer
divider
156.25
156.25
LVPECL
Output Bank B
ADR1
Output Type
Divide Ratio
FOUT (MHz)
Swing Level
Low
Middle
High
LVPECL
LVDS
20
16
16
125
750mV
500mV
750mV
Total of 4 outputs with
1 integer divider
156.25
156.25
LVPECL
Output Bank D
ADR2
Output Type
Divide Ratio
FOUT (MHz)
Swing Level
Total of 6 outputs with
1 fractional divider
Low
Middle
High
LVPECL
LVDS
20
16
16
125
750mV
500mV
750mV
156.25
156.25
LVPECL
Table 15. I2C Address Selection Table
I2C_A
Output Type
I2C_A[1]
I2C_A[0]
Low
Middle
High
Address 1
Address 2
Address 3
0
0
1
0
1
1
The 8V19N478 can be configured via pin or I2C. ADR3/2/1/0 provides a specific set of configuration options for input and output paths. In
addition, the initialization sequence of the device is controlled by the ADR3 pin and the synchronization of the outputs by transition from
Low to Middle or High.
Table 16. Initialization Sequence Control
Initialization
In Pin Mode, Triggered by:
init_clk
pb_cal
relock
OE
(Pin I2C_A3 = M or H) + IBM die powered up
(Pin I2C_A3 = M or H) + IBM die powered up
Completion of init_clk sequence (above)
Completion of init_clk sequence (above)
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The pin configuration is overridden by I2C programming of the register map. The I2C_A pin set the Address as shown in following table.
Table 17. I2C Address
1
I2C_A1
I2C_A0
R
W
I2C_A
D8, D9
DA, DB
DE, DF
1101
1101
1101
1
1
1
0
0
1
0
1
1
1
1
1
0
0
0
L
M
H
Address 1
Address 2
Address 3
The default values of the register map are Read back by the I2C in the Pin-Strap configuration mode.
FemtoClock NG Loss-of-lock (LOLF)
FemtoClock NG-PLL loss-of-lock is signaled through the nST_LOLF (momentary), and nLS_LOLF (sticky, resettable) status bits, and can
reported as hardware signal on the LOCK_V output as well as an interrupt signal on the nINT output.
Differential Outputs
Table 18. Output Features
[a]
Output
Style
Amplitude
Disable
Power Down
Termination
[b]
LVPECL
LVDS
50 to VTT
350 – 850mV
4 steps
QCLK_y
Yes
Yes
100 differential
—
50 to VTT
100 differential
—
LVPECL
LVDS
LVCMOS[c]
350 – 850mV
4 steps
Yes
Yes
Yes
Yes
QCLK_V
1.8V
[a] Amplitudes are measured single-ended.
[b] For VTT (Termination voltage) values (see Table 50).
[c] LVCMOS style: nQCLK_V and QCLK_V are complementary.
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Table 19. Individual Clock Output Settings
[b]
Output Power
Termination
State
Amplitude (mV)
1
0
Off
On
X
0
100 differential or no termination
100 differential (LVDS)
X
0
1
Off
Disable[c]
X
X
XX
00
01
10
11
XX
00
01
10
11
X
Enable
350
500
700
850
X
1
50 to VTT[d] (LVPECL)
0
1
Disable
Enable
350
500
700
850
[a] Power-down modes are available for the individual channels A – D and the outputs QCLK_y (A0 – D3).
[b] Output amplitudes of 700mV and 850mV require a 3.3V output supply (VDDO_V). 350mV and 500mV output amplitudes support
DDO_V 2.5V and 1.8V.
V
[c] Differential output is disabled in static low/high state.
[d] For VTT (Termination voltage) values, see Table 50.
Output Phase-Delay
Output phase delay is supported in each channel. The selected VCO frequency sets the delay unit to 1/fVCO
.
Table 20. Delay Circuit Settings
Delay Circuit
Unit
Steps
Range
1
--------------
fVCO
Clock Phase
256
0–102ns
CLK_x
fVCO 2500MHz:
400ps
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Status Conditions and Interrupts
The 8V19N478 has an interrupt output to signal changes in status conditions. Settings for status conditions may be accessed in the
Status registers. The device has several conditions that can indicate faults and status changes in the operation of the device. These are
shown in Table 21 and can be monitored directly in the status registers. Status bits (named: ST_condition) are read-only and reflect the
momentary device status at the time of read-access. Several status bits are also copied into latched bit positions (named: LS_condition).
The latched version is controlled by the corresponding fault and status conditions and remains set (“sticky”) until reset by the user by
writing “1” to the status register bit. The reset of the status condition has only an effect if the corresponding fault condition is removed,
otherwise, the status bit will set again. Setting a status bit on several latched registers can be programmed to generate an interrupt signal
(nINT) via settings in the Interrupt Enable bits (named: IE_condition). A setting of “0” in any of these bits will mask the corresponding
latched status bits from affecting the interrupt status pin. Setting all IE bits to 0 has the effect of disabling interrupts from the device.
Table 21. Status Bit Functions
Status Bit
Function
Status if Bit is:
Interrupt
Enable Bit
Momentary
Latched
Description
CLK 0 input status
1
0
ST_CLK_0
ST_CLK_1
nST_LOLV
nST_LOLF
nST_HOLD
ST_VCOF
ST_SEL
LS_CLK_0
LS_CLK_1
nLS_LOLV
nLS_LOLF
nLS_HOLD
—
Active
Active
LOS
LOS
IE_CLK_0
IE_CLK_1
IE_LOLV
IE_LOLF
IE_HOLD
—
CLK 1 input status
VCXO-PLL loss of lock
FemtoClock NG-PLL loss of lock
Holdover
Locked
Loss-of-lock
Loss-of-lock
Locked
Not in holdover
Not completed
Device in holdover
Completed
FemtoClock NG VCO calibration
Clock input selection
—
0 CLK_0
1 CLK_1
Valid reference[a]
Reference lost
—
ST_REF
LS_REF
PLL reference status
IE_REF
[a] Manual and short-term holdover mode: 0 indicates if the selected reference is lost, 1 if not lost.
Automatic mode: will transition to 0 while the input clock is lost and during input selection by priority.
Will transition to 1 once a new reference is selected.
Automatic with holdover mode: 0 indicates the reference is lost and still in holdover.
Interrupts are cleared by resetting the appropriate bit(s) in the latched register after the underlying fault condition has been resolved.
When all valid interrupt sources have been cleared in this manner, this will release the nINT output until the next unmasked fault.
Table 22. LOCK Function
Status Bit (PLL)
[a]
[b]
nLS_LOLV (VCXO-PLL)
nLS_LOLF (FemtoClock NG)
Status Reported on LOCK Output
Locked
Locked
Locked
Not locked
Locked
1
0
0
0
Not locked
Not locked
Not locked
[a] Hardware interrupts on nINT required to set the IE_LOLV, IE_LOLF bits to “enable interrupt”.
[b] SELSV1 controls the logic level 1.8V/3.3V of LOCK and nINT outputs.
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Serial Control Port
Serial Control Port Configuration Description
The 8V19N478 has a serial control port that can respond as a slave in an I2C compatible configuration at a base address of
11011[I2C_A1, I2C_A0]b, to allow access to any of the internal registers for device programming or examination of internal status. The
I2C_A[1:0] bits of the I2C interface address are set by the logic state of the three-level pin, I2C_A (see Table 17). If more than one
8V19N478 is connected to the same I2C bus, set I2C_A to a different state on each device to avoid address conflicts.
All registers are configured to have default values. For details, see the specifics for each register. Default values for registers are set after
reset by the configuration pins.
I2C Mode Operation
The I2C interface fully supports v1.2 of the I2C Specification for Normal and Fast mode operation. The interface acts as a slave device on
the I2C bus at 100kHz or 400kHz using a fixed base address of 11011[I2C_A1, I2C_A0]b.
The I2C interface accepts byte-oriented block write and block read operations (see Figure 3 and Figure 4). One address byte specifies
the register address of the byte position of the first register to write or read. Data bytes (registers) are accessed in sequential order from
the lowest to the highest byte (most significant bit first). Read and write block transfers can be stopped after any complete byte transfer.
During a write operation, data is moved into the registers byte by byte and before a STOP bit is received.
For full electrical I2C compliance, it is recommended to use external pull-up resistors for SDATA and SCLK. The internal pull-up resistors
have a size of 51k typical.
Figure 3. I2C Write Data (Master Transmit, Slave Receive) From Any Register Address
1 1 0 1 1 I2C_A1 I2C_A0
Slav e Device Address
0
nW
A7 to A0
Register Address
D7 to D0
(Register Address)
D7 to D0
(Register Address+1)
D7 to D0
(Register Address+n)
S
A
A
A
A
...
A
A
P
SDA
Write to slave to the specified register address A[7:0]. The slave auto-increments the register address and data is written sequentially.
S
Start (Master)
P
Stop (Master)
A
Acknowledge (Slave to Master)
Master transmit, Slave Receive
Slave transmit, Master Receive
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Figure 4. I2C Read Data (Slave Transmit, Master Receive) From Any Register Address
1 1 0 1 1 I2C_A1 I2C_A0
Sl av e Devic e Address
0
nW
A7 to A0
Register Address
1 1 0 1 1 ADR1 ADR0
Sl av e Devic e Address
1
R
D7 to D0
(Register Address)
D7 to D0
(Register Address+n)
S
A
A
Sr
A
A
...
A
A
P
SDA
Read from slave from the specified register address A[7:0]. Data is transmitted to the master after a change of the transfer direction with a repeated start. The
slave auto-increments the register address and transmits register data to the master sequentially.
S
P
A
A
A
Sr
Start (Master)
Repeated start (Master)
Stop (Master)
Acknowledge (Slave to Master)
Acknowledge (Master to Slave)
Not Acknowledge (Master to Slave)
Master transmit, Slave Receive
Slave transmit, Master Receive
Register Descriptions
This section contains all addressable registers, sorted by function, followed by a detailed description of each bit field for each register.
Several functional blocks with multiple instances in this device have individual registers controlling their settings, but since the registers
have an identical format and bit meaning, they are described only once, with an additional table to indicate their addresses and default
values. All writable register fields will come up with a default values as indicated in the Factory Defaults column unless altered by values
loaded from non-volatile storage during the initialization sequence.
Fixed read-only bits will have defaults as indicated in their specific register descriptions. Read-only status bits will reflect valid status of
the conditions they are designed to monitor once the internal power-up reset has been released. Unused registers and bit positions are
Reserved. Reserved bit fields may be used for an internal debug test and debug functions.
Table 23. Configuration Registers
Register Address
Register Description
0x00
0x01
SRESET
I2C Address (I2C only)
Reserved
0x02–0x0F
0x10–0x11
0x12–0x13
0x14
PLL Frequency Divider: PV
PLL Frequency Divider: MV
SEL_BITS_MASTER
LOCK_TH
0x15–0x16
0x17
PLL Control: BYPV
0x18
PLL Control: SRC
0x19
PLL Frequency Divider: PF, FDF
PLL Frequency Divider: MF[7:0]
PLL Frequency Divider: MF[8]
PLL Control
0x1A
0x1B
0x1C–0x1E
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Table 23. Configuration Registers (Cont.)
Register Address
Register Description
0x1F
0x20–0x23
0x24–0x26
0x27
I/O Voltage Select
Input Selection
Channel A
Reserved
0x28–0x2B
0x2C–0x2E
0x2F
Output States QCLK_A0 – QCLK_A3
Channel B
Reserved
0x30–0x33
0x34–0x36
0x37
Output States QCLK_B0 – QCLK_B3
Channel C
Reserved
0x38–0x3B
0x3C–0x42
0x43
Output States QCLK_C0 – QCLK_C3
Channel D
Reserved
0x44–0x49
0x4A
Output States QCLK_D0 – QCLK_D5
Reserved
0x4B
QCLKV
0x4C
Interrupt Enable
Reserved
0x4D
0x4E–0x4F
0x50
Reserved
Status (Latched)
Status (Momentary)
Reserved
0x51
0x52
0x53
Reserved
0x54
Reserved
0x55–0x57
0x58
General Control
Channel Enable A–D, QCLKV
Reserved
0x59–0x5B
0x5C–0x5E
0x5F–0x60
0x61–0x62
0x63
Reserved
Reserved
Reserved
Reserved
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Device Configuration Registers
Table 24. Device Configuration Register Bit Field Locations
Bit Field Location
Register Address
D7
D6
D5
D4
D3
D2
D1
D0
0x00
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SRESET
0x01
0x1F
Reserved
Reserved
I2C_A[6:0]
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
SELSV
Table 25. Device Configuration Register Descriptions
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Soft Reset:
R/W
0
0 Normal operation.
SRESET
Value:
1 Register reset. The device loads the default values into the register 0x02-0xFF.
not reset
Auto-Clear
The content of the register addresses 0x00, 0x01 and the serial interface engine are
not reset.
I2C Device Address (I2C only):
This read-only register stores the binary I2C device address:
11011[I2C_A[1]][I2C_A[0]].
11011
I2C_A[6:0]
SELSV
R
[I2C_A1[1]]
[I2C_A0[0]]
Bits D1 and D0 are determined by the I2C_A pin. For I2C_A[1:0] values based on
I2C_A level, see Table 15.
Select
LOCK/nINT
voltage
Selects the voltage level of the LOCK and nINT outputs:
SELSV:
1
0 LOCK, nINT interface pins are 1.8V
1 LOCK, nINT interface pins are 3.3V (default)
level
Value: 3.3V
R/W
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PLL Frequency Divider Registers
Table 26. PLL Frequency Divider Register Bit Field Locations
Bit Field Location
Register Address
D7
D6
D5
D4
D3
D2
D1
D0
0x10
PV[7:0]
PV[14:8]
MV[7:0]
0x11
0x12
0x13
Reserved
Reserved
Reserved
MV[14:8]
Reserved
SEL_BITS_
MASTER
0x14
Reserved
Reserved
Reserved
Reserved
Reserved
0x15
0x16
0x19
0x1A
0x1B
LOCK_TH[7:0]
LOCK_TH[14:8]
PF[5:0]
Reserved
FDF
Reserved
Reserved
MF[7:0]
Reserved Reserved
Reserved
Reserved
Reserved
Reserved
MF8
Table 27. PLL Frequency Divider Register Descriptions
Register Description
Field
Type
Default
(Binary)
Bit Field Name
Description
VCXO-PLL Input Frequency Pre-Divider:
000 0100
0000 0000
The value of the frequency divider (binary coding).
Range: ÷1 to ÷32767
PV[14:0]
R/W
R/W
R/W
Value: ÷1024
000 0100
VCXO-PLL Feedback-Divider:
0000 0000
The value of the frequency divider (binary coding).
Range: ÷1 to ÷32767
MV[14:0]
Value: ÷1024
0
Input Path Configuration Control:
0 = Input path settings determined by ADR3 control pin.
1 = Input path settings determined by register settings over I2C.
SEL_BITS_MASTER
For input path configurations see Table 13.
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Table 27. PLL Frequency Divider Register Descriptions
Register Description
Field
Type
Default
(Binary)
Bit Field Name
Description
PLL Lock Detect Phase Window Threshold:
The device reports VCXO-PLL lock when the phase difference between the internal
signals fREF and fVCXO_REF are lower than or equal to the phase difference set by
LOCK_TH[14:0] for more than 1000 fVCXO_DIV clock cycles.
000 0000
1000 0000
LOCK_TH[14:0]
R/W
R/W
Requires MV ≥ 4. Set LOCK_TH[14:0] < MV.
Value: 128
(fREF fCLK ÷ PV is the internal output of the PV divider,
fVCXO_DIV fVCXO ÷ MV is the internal output of the MV divider.)
FemtoClock NG Pre-Divider:
The value of the frequency divider (binary coding)
Range: ÷1 to ÷63
00 0001
PF[5:0]
Value: ÷1
00 0000: PF is bypassed
Frequency Doubler:
The input frequency of the FemtoClock NG PLL (2nd stage) is:
0 The output signal of the BYPV multiplexer, divided by the PF divider.
1 The output signal of the BYPV multiplexer, doubled in frequency.
Use this setting to improve phase noise. The PF divider has no effect if FDF 1.
0
FDF
R/W
R/W
Value:
fVCXO ÷ PF
FemtoClock NG Feedback-Divider:
The value of the frequency divider (binary coding).
Range: ÷8 to ÷511
0 0001 1000
Value: ÷24
MF[8:0]
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PLL Control Registers
Table 28. PLL Control Bit Field Locations
Bit Field Location
D4
Register Address
D7
D6
D5
D3
D2
D1
D0
0x17
Reserved
Reserved
Reserved
Reserved
Reserved
OSVEN
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
BYPV
0x18
0x1C
0x1D
0x1E
Reserved
POLV
Reserved
FVCV
Reserved
Reserved
CPV[4:0]
SRC
Reserved
Reserved
Reserved
Reserved
OFFSET[4:0]
CPF[4:0]
Reserved
Table 29. PLL Control Register Descriptions
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
0
VCXO-PLL Bypass:
0 VCXO-PLL is enabled.
BYPV
R/W
VCXO-PLL 1 VCXO-PLL is disabled and bypassed.
enabled
0
FemtoClock NG PLL Bypass:
0 FemtoClock NG PLL is enabled.
SRC
R/W
R/W
PLL
enabled
1 FemtoClock NG PLL is disabled and bypassed. The VCXO-PLL output signal is
frequency divided by the channel dividers.
0
VCXO Polarity:
0 Positive polarity. Use for an external VCXO with a positive f(VC) characteristics
1 Negative polarity. Use for an external VCXO with a negative f(VC) characteristics
POLV
Value:
Positive
Polarity
VCXO-PLL Force VC Control Voltage:
1
0 Normal operation.
1 Forces the voltage at the LFV control pin (VCXO input) to VDD_V/2. VCXO-PLL
unlocks and the VCXO is forced to its mid-point frequency. FVCV 1 is the default
setting at startup to center the VCXO frequency. FVCV should be cleared after startup to
enable the PLL to lock to the reference frequency.
FVCV
R/W
R/W
Value:
Value: LFV
VDD_V/2
VCXO-PLL Charge-Pump Current:
0 1111
Controls the charge-pump current ICPV of the VCXO-PLL. Charge pump current is the
binary value of this register plus one multiplied by 50µA.
CPV[4:0]
ICPV 50µA (CPV[4:0] + 1)
Value:
0.8mA
CPV[4:0] 00000 sets ICPV to the min. current of 50µA. Maximum charge-pump
current is 1.6 mA. Default setting is 0.8mA: ((15 + 1) 50µA).
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Table 29. PLL Control Register Descriptions (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
VCXO-PLL Offset Enable:
0 No offset.
OSVEN
R/W
0
1 Offset enabled. A static phase offset of OFFSET[4:0] is applied to the PFD of the
VCXO-PLL.
VCXO-PLL Static Phase Offset:
Controls the static phase detector offset of the VCXO-PLL. Phase offset is the binary
value of this register multiplied by 0.9 of the PFD input signal,
0 0000
(OFFSET [4:0] fPFD ÷ 400). The maximum offset is 31 0.927.9
Setting OFFSET to 0.0 eliminates the thermal noise of an offset current. If the
VCXO-PLL input jitter period TJIT exceeds the average input period: set OFFSET to a
value larger than fPFD TJIT 400 to achieve a better charge-pump linearity and lower
in-band noise of the PLL.
OFFSET[4:0]
R/W
R/W
Value: 0
FemtoClock NG PLL Charge-Pump Current:
1 1000
Controls the charge-pump current ICPF of the FemtoClock NG PLL. The charge-pump
current is the binary value of this register plus one multiplied by 200µA.
CPF[4:0]
ICPF 200µA (CPF[4:0] + 1)
Value:
1.4mA
CPV[4:0] 00000 sets ICPF to the minimum current of 200µA. Maximum charge-pump
current is 6.4 mA. Default setting is 1.4 mA: ((6 + 1) 200µA).
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Input Selection Mode Registers
Table 30. Input Selection Mode Register Bit Field Locations
Bit Field Location
Register Address
D7
D6
D5
D4
D3
D2
D1
D0
0x20
VCXO_DIV[4:0]
MODE_BLOCK
nHO_EN
Reserved
nEXT_INT
0x21
0x22
0x23
Reserved
Reserved
Reserved
Reserved
REVS
nM/A[1:0]
INT_SEL
CNTH[7:0]
CNTR[1:0]
Reserved
Reserved
CNTV[1]
CNTV[0]
Table 31. Input Selection Mode Registers
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Clock Frequency Divider for the input activity monitor:
The clock activity monitor compares the device input frequency (fIN) to the frequency of
the VCXO divided by VCXO_DIV. For optimal operation of the activity monitor, the
frequency fVCXO ÷ VCXO_DIV should match the input frequency.
E.g. for fIN 61.44MHz and fVCXO 61.44MHz, set VCXO_DIV ÷1.
For fIN 25MHz and fVCXO 125MHz, set FCXO_DIV ÷5.
VCXO_DIV[4:0]
00000
VCXO_DIV[4:0]
R/W
0XX 00
÷1
100 00 ÷2 101 00 ÷3 110 00 ÷4 111 00 ÷5
100 01 ÷4 101 01 ÷6 110 01 ÷8 111 01 ÷10
Value: ÷1
0XX 01
÷2
100 10 ÷8 101 10
110 10
÷16
111 10 ÷20
111 11 ÷40
÷12
100 11
0XX 10
÷4
÷16
101 11
110 11
÷32
÷24
0XX 11
÷8
Inactive Input Clock Block:
0
MODE_BLOCK
nHO_EN
R/W
R/W
0 Both input clock signals CLK0 and CLK1 are routed to the input clock multiplexer.
1 The input clock that is currently not active is gated off (blocked).
Value:
Not blocked
Manual Holdover Control:
1
0 Enter holdover on a manual input reference switch.
Value:
Using the EXT_SEL control pin or the INT_SEL control bit, as defined by nEXT_INT for
manual reference switching. nMA[1:0] has no meaning.
Enter
Holdover
Disabled
1 The device switching and holdover modes are controlled by nMA[1:0].
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Table 31. Input Selection Mode Registers (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
0
Input Clock Selection:
0 The EXT_SEL pin (B3) controls the input clock selection.
nEXT_INT
R/W
Value:
1 The INT_SEL bit (register 0x21, D0) controls the input clock selection.
External
selection
Revertive Switching:
The revertive input switching setting is only applicable to the two automatic selection
modes shown in Table 11. If nM/A[1:0] X0, the REVS setting has no meaning.
0
0 Disabled: Re-validation of the non-selected input clock has no impact on the clock
REVS
R/W
selection.
Value: Off
1 Enabled: Re-validation of the non-selected input clock will cause a new input
selection according to the pre-set input priorities (revertive switch).
Default setting is revertive switching turned off.
Reference Input Selection Mode:
In any of the manual selection modes (nM/A[1:0] 00 or 10), the VCXO-PLL reference
input is selected by INT_SEL. In any of the automatic selection modes, the VCXO-PLL
reference input is selected by an internal state machine according to the input LOS states
and the priorities in the input priority registers.
00
nM/A[1:0]
R/W
Value:
Manual
selection
00 Manual selection (no holdover)
01 Automatic selection (no holdover)
10 Short-term holdover
11 Automatic selection with holdover
VCXO-PLL Input Reference Selection:
0
Controls the selection of the VCXO-PLL reference input in internal (nEXT_INT 1), and
in manual selection mode (nHO_EN 1, nM/A[1:0] 00 or 10).
In external (nEXT_INT 0) and in automatic selection modes (nM/A[1:0] X1), INT_SEL
has no meaning.
INT_SEL
R/W
R/W
Value:
CLK0
0 CLK_0 is the selected VCXO-PLL reference clock.
1 CLK_1 is the selected VCXO-PLL reference clock.
selected
Short-term Holdover: Hold-off counter period. The device initiates a clock fail-over switch
upon counter expiration (zero transition). The counters start to counts backwards after an
LOS event is detected. The hold-off counter period is determined by the binary number of
VCXO-PLL output pulses divided by CNTR[1:0]. With a VCXO frequency of 125MHz and
CNTR[1:0] 10, the counter has a period of
1000 0000
CNTH[7:0]
Value:
134ms
(1.048ms binary setting). After each zero-transition, the counter automatically re-loads
to the setting in this register.
The default setting is 134ms (VCXO 125MHz: 1/125MHz 217 128).
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Table 31. Input Selection Mode Registers (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Short-term Holdover Reference Divider
CNTR[1:0]
CNTH frequency (period; range)
125MHz VCXO
156.25MHz VCXO
10
00 fVCXO ÷ 215
01 fVCXO ÷ 216
10 fVCXO ÷ 217
Revalidation Counter:
3814Hz
(0.262ms; 0ms – 66.8ms)
4768Hz
(0.209ms; 0ms – 53.4ms)
CNTR[1:0]
R/W
Value: 217
1907Hz
(0.524ms; 0ms – 133ms)
2384Hz
(0.419ms; 0ms – 106.9ms)
953Hz
(1.048ms; 0ms – 267ms)
1192Hz
(0.838ms; 0ms – 213.9ms)
Controls the number of required consecutive, valid input reference pulses for clock
re-validation on CLK_n for the number of input periods. At an LOS event, the re-validation
counter loads this setting from the register and counts down by one with every valid,
consecutive input signal period. Missing input edges (for one input period) will cause this
counter to re-load its setting. An input is re-validated when the counter transitions to zero
and the corresponding LOS flag is reset.
10
CNTV[1:0]
R/W
Value: 32
00 2 (shortest possible)
01 16
10 32
11 64
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Channel Registers
The content of the channel registers set the channel state, the clock divider the clock phase delay and the power-down state.
Table 32. Channel Register Bit Field Locations
Bit Field Location
Register Address
D7
D6
D5
D4
D3
D2
D1
D0
0x24: Channel A
0x2C: Channel B
0x34: Channel C
0x40: Channel D
N_A[7:0]
N_B[7:0]
N_C[7:0]
N_D[7:0]
0x25: Channel A
0x2D: Channel B
0x35: Channel C
0x41: Channel D
CLK_A[7:0]
CLK_B[7:0]
CLK_C[7:0]
CLK_D[7:0]
0x26: Channel A
0x2E: Channel B
0x36: Channel C
PD_A
PD_B
PD_C
SEL_ BITS_A
SEL_ BITS_B
SEL_BITS_C
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
D_DIV_FRAC D_DIV_FRAC
0x42: Channel D
PD_D
CH_D_OUT SEL_BITS_D
[1]
[0]
0x3C: Channel D
0x3D: Channel D
0x3E: Channel D
N_D_FRAC[7:0]
N_D_FRAC[15:8]
N_D_FRAC[23:16]
0x3F: Channel D Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
N_D_INT[3:0]
EN_QCLK_
V
EN_QCLK_
C
0x58
Reserved
EN_QCLK_A EN_QCLK_B
EN_QCLK_D
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Table 33. Channel Register Descriptions[a]
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Output Frequency Divider N:
N_x[7:0] Divider Value
1000 0000
0000 0000
0000 0001
0000 0010
0000 0011
0000 0100
0000 0110
÷1
÷2
÷3
÷4
÷5
÷6
÷8
0100 0011
0100 0100
0100 0110
÷10
÷12
÷16
0100 1011
0100 1100
÷20
÷24
0100 0110
Value: ÷16
0101 0011
0100 1110
0101 0100
÷30
÷32
÷36
N_x[7:0]
R/W
0101 1011
0101 0110
÷40
÷48
0110 0011
÷50
0110 0100
0101 1110
÷60
÷64
0101 1111
0110 0110
0110 1110
0111 1011
÷72
÷80
÷96
÷100
0111 1100
0111 0110
÷120
÷128
0111 1110
÷160
Fractional Output Divider, Fractional Part:
0110 0000
0000 0000
0000 0000
Together with N_E_INT, forms the fractional output divider ND value.
NFRAC
N_D_FRAC[23:0]
R/W
NE = 2 NINT +
---------------------
224
Value:
6,291,456
The default value is ND 2 (9 + 0.4371839761732) 18.8743679523.
Greatest ND fractional divider is 2 (14 + [224 – 1] / 224) ≈ 29.99999988.
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Table 33. Channel Register Descriptions[a] (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Fractional Output Divider, Integer Part:
See N_D_FRAC[23:0]
1001
N_D_INT[3:0]
R/W
Value: 9
Greatest ND fractional divider is 2 (14 + [224 – 1] / 224) ≈ 29.99999988.
CLK_x Phase Delay:
CLK_x[7:0]
fVCO 2500MHz:
CLK_x[7:0]
Delay in ps CLK_x 400ps (256 steps)
CLK_x[7:0] Delay (fVCO 2500MHz)
R/W
0000 0000
fVCO 2500MHz
0000 0000
0000 0001
…
0ps
400ps
…
1111 1111
102ns
0
0 Channel x is powered up
1 Channel x is power down
PD_x
EN_x
R/W
R/W
R/W
Value:
Power-up
0
QCLK_x Channel Output Enable:
0 All outputs of channel x are disabled at the logic low state.
1 All outputs of channel x are enabled.
Value:
Disabled
0
QCLK_V Output Enable:
0 QCLK_V is disabled at the logic low state.
1 QCLK_V is enabled.
EN_QCLK_V
Value:
Disabled
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Table 33. Channel Register Descriptions[a] (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Bank x Configuration Control:
0 Nx[5:0], PD_X, EN_X settings determined by ADRn control pin.
1 Nx[5:0], PD_X, EN_X settings determined by register settings over I2C.
SEL_BITS_x
R/W
0
Where:
n = 0 for Channels A and C
n = 1 for Channel B
n = 2 for Channel D
D_DIV_FRAC[1:0]:
Post-divider ratio for Bank D fractional divider:
00 ÷1
D_DIV_FRAC[1:0]
R/W
R/W
0
0
01 ÷2
10 ÷4
11 Reserved
CH_D_OUT:
Controls which the divider is used to provide output frequency for Bank D:
CH_D_OUT
0 Integer divider D (ND configures this)
1 Fractional mode (ND_FINT, ND_FRAC, and ND_DIVF configure this)
[a] x A, B, C, D.
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Output Registers
The content of the output registers set the power-down state, the output style and amplitude.
Table 34. Output Register Bit Field Locations
Bit Field Location
Register Address
D7
D6
D5
D4
D3
D2
D1
D0
A_A0[0]
A_A1[0]
A_A2[0]
A_A3[0]
0x28: QCLK_A0
0x29: QCLK_A1
0x2A: QCLK_A2
0x2B: QCLK_A3
PD_A0
PD_A1
PD_A2
PD_A3
STYLE_A0
STYLE_A1
STYLE_A2
STYLE_A3
A_A0[1]
A_A1[1]
A_A2[1]
A_A3[1]
Reserved
Reserved
Reserved
Reserved
A_B0[0]
A_B1[0]
A_B2[0]
A_A3[0]
0x30: QCLK_B0
0x31: QCLK_B1
0x32: QCLK_B2
0x33: QCLK-B3
PD_B0
PD_B1
PD_B2
PD_B3
STYLE_B0
STYLE_B1
STYLE_B2
STYLE_A3
A_B0[1]
A_B1[1]
A_B2[1]
A_A3[1]
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
A_C0[0]
A_C1[0]
A_C2[0]
A_C3[0]
0x38: QCLK_A0
0x39: QCLK_A1
0x3A: QCLK_A2
0x3B: QCLK_A3
PD_C0
PD_C1
PD_C2
PD_C3
STYLE_C0
STYLE_C1
STYLE_C2
STYLE_C3
A_C0[1]
A_C1[1]
A_C2[1]
A_C3[1]
0x44: QCLK_D0
0x45: QCLK_D1
0x46: QCLK_D2
0x47: QCLK_D3
0x48: QCLK_D4
0x49: QCLK_D5
PD_D0
PD_D1
PD_D2
PD_D3
PD_D4
PD_D5
STYLE_D0
STYLE_D1
STYLE_D2
STYLE_D3
STYLE_D4
STYLE_D5
A_D0[1]
A_D1[1]
A_D2[1]
A_D3[1]
A_D4[1]
A_D5[1]
A_D0[0]
A_D1[0]
A_D2[0]
A_D3[0]
A_D4[0]
A_D5[0]
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
Reserved
0x4B: QCLK_V
PD_V
STYLE__V1 STYLE__V0
A_V[1]
A_V[0]
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Table 35. Output Register Descriptions[a]
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
0
0 Output QCLK_y is powered-up.
1 Output QCLK_y is power-down.
PD_y
R/W
Value:
Power-up
1
0 Output QCLK_V is powered-up.
1 Output QCLK_V is power-down.
PD_V
R/W
Value:
Power-dow
n
10
QCLK_y, QCLK_V Output Amplitude
Setting for STYLE 0 (LVDS)
Setting for STYLE 1 (LVPECL)
A_y[1:0]
A_V[1:0]
STYLE_y
R/W
R/W
R/W
Value:
700mV
A[1:0] 00: 350mV
A[1:0] 01: 500mV
A[1:0] 10: 700mV
A[1:0] 11: 850mV
Termination: 100 across
A[1:0] 00: 350mV
A[1:0] 01: 500mV
A[1:0] 10: 700mV
A[1:0] 11: 850mV
Termination: 50 to VTT
10
Value:
700mV
[b]
1
QCLK_y Output Format:
0 Output is LVDS (Requires LVDS 100 output termination)
Value:
1 Output is LVPECL (Requires LVPECL 50 output termination of to the specified
LVPECL
recommended termination voltage).
QCLK_V Output Format:
01
00 Output is LVDS (Requires LVDS 100 output termination).
01 Output is LVPECL (Requires LVPECL 50 termination to VTT[b]).
STYLE_V[1:0]
R/W
Value:
LVPECL
1x Both QCLK_V and nQCLK_V are single-ended LVCMOS 1.8V outputs, QCLK_V
and nQCLK_V are complementary (180º phase difference).
[a] y A0,A1,A2,A3,B0,B1,B2,B3,C0,C1,C2,C3,D0,D1,D2,D3,D4,D5.
[b] For VTT (Termination voltage) values (Table 50).
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8V19N478 Datasheet
Status Registers
Table 36. Status Register Bit Field Locations
Bit Field Location
D4
Register Address
D7
D6
D5
D3
D2
D1
IE_CLK_1
D0
0x4C
Reserved
Reserved
IE_LOLF
IE_LOLV
IE_REF
IE_HOLD
IE_CLK_0
0x50
0x51
0x53
Reserved
Reserved
Reserved
Reserved
ST_SEL
nLS_LOLF
nLS_LOLV
LS_REF
ST_REF
Reserved
nLS_HOLD LS_CLK_1
nST_HOLD ST_CLK_1
LS_CLK_0
ST_CLK_0
Reserved
nST_LOLF nST_LOLV
Reserved
Reserved
Reserved
ST_CAL
Reserved
Table 37. Status Register Descriptions[a]
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Interrupt Enable for FemtoClock NG PLL Loss-of-lock:
0 Disabled: Setting nLS_LOLF will not cause an interrupt on nINT.
IE_LOLF
R/W
0
1 Enabled: Setting nLS_LOLF will assert the nINT output (nINT 0, interrupt).
Interrupt Enable for VCXO-PLL Loss-of-lock:
IE_LOLV
IE_CLK_n
IE_REF
R/W
R/W
R/W
R/W
0
0
0
0
0 Disabled: Setting nLS_LOLV will not cause an interrupt on nINT.
1 Enabled: Setting nLS_LOLV will assert the nINT output (nINT 0, interrupt).
Interrupt Enable for CLKn input Loss-of-signal:
0 Disabled: Setting LS_CLK_n will not cause an interrupt on nINT.
1 Enabled: Setting LS_CLK_n will assert the nINT output (nINT 0, interrupt).
Interrupt Enable for LS_REF:
0 Disabled: Any changes to LS_REF will not cause an interrupt on nINT.
1 Enabled: Any changes to LS_REF will assert the nINT output (nINT 0, interrupt).
Interrupt Enable for Holdover:
IE_HOLD
0 Disabled: Setting nLS_HOLD will not cause an interrupt on nINT.
1 Enabled: Setting nLS_HOLD will assert the nINT output (nINT 0, interrupt).
FemtoClock NG PLL Loss-of-lock (latched status of nST_LOLF):
Read 0 1 Loss-of-lock events detected after the last status latch clear.
Read 1 No Loss-of-lock detected after the last status latch clear.
Write 1 Clear status latch (clears pending nLS_LOLF interrupt).
nLS_LOLF
nLS_LOLV
R/W
R/W
—
—
VCXO-PLL Loss-of-lock (latched status of nST_LOLV):
Read 0 1 Loss-of-lock events detected after the last status latch clear.
Read 1 No Loss-of-lock detected after the last nLS_LOLV clear.
Write 1 Clear status latch (clears pending nLS_LOLV interrupt).
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8V19N478 Datasheet
Table 37. Status Register Descriptions[a] (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Input CLK_n Status (latched status of ST_CLK_n):
Read 0 1 LOS events detected on CLK_n after the last LS_CLK_n clear.
Read 1 No loss-of-signal detected on CLK_n input after the last LS_CLK_n clear.
Write 1 Clear LS_CLK_n status latch (clears pending LS_CLK_n interrupts on nINT).
LS_CLK_n
R/W
—
—
Input Selection (momentary):
Reference input selection status of the state machine. In any input selection mode,
reflects the input selected by the state machine.
ST_SEL
R
0 CLK_0
1 CLK_1
FemtoClock NG PLL Loss-of-lock (momentary):
Read 0 1 Loss-of-lock events detected
Read 1 No Loss-of-lock detected
nST_LOLF
nST_LOLV
ST_CLK_n
LS_REF
R
R
—
—
—
—
—
A latched version of this status bit is available (nLS_LOLF).
VCXO-PLL Loss-of-lock (momentary):
Read 0 1 Loss-of-lock events detected
Read 1 No Loss-of-lock detected
A latched version of this status bits is available (nLS_LOLV).
Input CLK_n Status (momentary):
0 LOS detected on CLK_n.
R
1 No LOS detected, CLK_n input is active.
A latched version of this status bits are available (LS_CLK_n).
PLL Reference Status (latched status of ST_REF):
Read 0 Reference is lost since last reset of this status bit.
Read 1 Reference is valid since last reset of this status bit.
Write 1 Clear LS_REF status latch (clears pending LS_REF interrupts on nINT).
R/W
R/W
Holdover Status Indicator (latched status of ST_HOLD):
Read 0 VCXO-PLL has entered holdover state 1 times after reset of this status bit.
Read 1 VCXO-PLL is (or attempts to) lock(ed) to an input clock.
Write 1 Clear status latch (clears pending nLS_HOLD interrupt).
nLS_HOLD
FemtoClock NG PLL Calibration Status (momentary):
ST_VCOF
ST_REF
R
R
—
—
Read 0 FemtoClock NG PLL auto-calibration is completed.
Read 1 FemtoClock NG PLL calibration is active (not completed).
Input Reference Status.
0 No input reference present.
1 Input reference is present at the clock selected input clock.
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8V19N478 Datasheet
Table 37. Status Register Descriptions[a] (Cont.)
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
Holdover Status Indicator (momentary):
0 VCXO-PLL in holdover state, not locked to any input clock.
1 VCXO-PLL is (or attempts to) lock(ed) to input clock.
A latched version of this status bit is available (nLS_HOLD).
nST_HOLD
R
—
—
FemtoClock NG PLL Calibration Status (momentary):
ST_CAL
R
Read 0 FemtoClock NG PLL auto-calibration is completed.
Read 1 FemtoClock NG PLL calibration is active (not completed).
[a] CLKn CLK0, CLK1.
General Control Registers
Table 38. General Control Register Bit Field Locations
Bit Field Location
D4
Register Address
D7
D6
D5
D3
D2
D1
D0
0x55
INIT_CLK
0x56
0x57
RELOCK
PB_CAL
Table 39. General Control Register Descriptions
Register Description
Default
(Binary)
Bit Field Name
Field Type
Description
W only
Set INIT_CLK 1 to initialize divider functions. Required as part of the startup
procedure.
INIT_CLK
X
X
Auto-Clear
W only
Setting this bit to 1 will force the FemtoClock NG PLL to re-lock.
RELOCK
PB_CAL
Auto-Clear
Precision Bias Calibration:
Setting this bit to 1 will start the calibration of an internal precision bias current source.
The bias current is used as reference for outputs configured as LVDS, and as reference
for the charge-pump currents. This bit will auto-clear after the calibration completed. Set
as part of the startup procedure.
W only
X
Auto-Clear
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8V19N478 Datasheet
Electrical Characteristics
Absolute Maximum Ratings
The absolute maximum ratings are stress ratings only. Stresses greater than those listed below can cause permanent damage to the
device. Functional operation of the 8V19N478 at absolute maximum ratings is not implied. Exposure to absolute maximum rating
conditions may affect device reliability.
Table 40. Absolute Maximum Ratings
Item
Rating
Supply Voltage, VDD_V and VDDO_V
Inputs
3.6V
-0.5V to VDD_V 0.5V
-0.5V to VDDO_V 0.5V
Outputs, VO (LVCMOS)
Outputs, IO (LVPECL)
Continuous Current
Surge Current
50mA
100mA
Outputs, IO (LVDS)
Continuous Current
Surge Current
50mA
100mA
Operating Junction Temperature, TJ
Storage Temperature, TSTG
ESD – Human Body Model[a]
125C
-65C to 150C
2000V
ESD – Charged Device Model[a]
500V
[a] According to JEDEC JS-001-2012/JESD22-C101.
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8V19N478 Datasheet
Pin Characteristics
Table 41. Input Characteristics, VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V or 1.8V) ±5%, TA = -40°C to +85°C
Symbol
Parameter
Test Conditions
OSC, nOSC
Minimum
Typical
Maximum
Units
Input Capacitance
2
2
4
4
pF
pF
[a]
CIN
Other inputs
RPU
RPD
Input Pull-Up Resistor
nCLK_0, nCLK_1
51
51
k
k
Input Pull-Down Resistor
CLK_0, nCLK_0, CLK_1, nCLK_1,
EXT_SEL, ADR1/MISO, I2C
ROUT
LVCMOS Output Impedance nINT, LOCK
25[b]
W
[a] Guaranteed by design.
[b] Design target specifications.
DC Characteristics
The device is configured to the maximum values of register settings, all outputs enabled in LVDS mode, and amplitude of 850mV.
Process variation is included for the maximum current consumption.
Table 42. Pow er Supply DC Characteristics, VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V, or 1.8V) ±5%,
TA = -40°C to +85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VDD_V
Core Supply Voltage
3.135
1.71
3.3
1.8, 2.5, 3.3
580
3.465
3.465
1024
V
V
VDDO_V Output Supply Voltage
IDD_V Power Supply Current
mA
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8V19N478 Datasheet
Table 43. Typical Pow er Supply DC Current Characteristics, VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V, or
1.8V) ±5%, TA = -40°C to +85°C[a]
Test Case
[b]
[b]
[c]
[c]
[c]
[c]
Symbol
Supply Pin Current
VDDO_QCLKA _QCLKB
1
2
3
4
5
6
Units
,
3.3
3.3
3.3
LVPECL
On
3.3
LVPECL
On
1.8
LVPECL
On
1.8
LVPECL
On
V
–
Style
LVDS
On
LVDS
On
QCLK_A[3:0],
QCLK_B[3:0]
–
State
–
Amplitude
700
850
850
700
500
350
mV
V
VDDO_QCLKC _QCLKD
,
3.3
3.3
3.3
3.3
1.8
1.8
Style
LVDS
On
LVDS
On
LVPECL
On
LVPECL
On
LVDS
On
LVDS
On
–
QCLK_C[3:0],
QCLK_D[5:0]
–
State
–
Amplitude
700
850
850
700
500
350
mV
A
IDD_COA Current through VDDO_QCLKA pin
IDD_CA Current through VDD_QCLKA pin
IDD_COB Current through VDDO_QCLKB pin
IDD_CB Current through VDD_QCLKB pin
IDD_COC Current through VDDO_QCLKC pin
IDD_CC Current through VDD_QCLKC pin
IDD_COD Current through VDDO_QCLKD pin
0.088
0.039
0.088
0.034
0.088
0.039
0.132
0.044
0.009
0.013
0.077
0.060
0.014
0.056
0.006
0.787
2.596
2.596
0.109
0.039
0.109
0.034
0.109
0.039
0.164
0.044
0.009
0.013
0.081
0.060
0.014
0.056
0.006
0.887
2.928
2.928
0.135
0.037
0.131
0.038
0.135
0.036
0.188
0.045
0.009
0.013
0.080
0.060
0.014
0.055
0.006
0.982
3.242
2.165
0.123
0.037
0.118
0.038
0.122
0.036
0.170
0.045
0.009
0.013
0.080
0.060
0.014
0.055
0.006
0.927
3.058
2.051
0.104
0.037
0.099
0.038
0.139
0.036
0.196
0.045
0.009
0.013
0.080
0.060
0.014
0.055
0.006
0.931
2.267
2.025
0.090
0.037
0.087
0.038
0.119
0.036
0.167
0.045
0.009
0.013
0.080
0.060
0.014
0.055
0.006
0.857
2.132
1.881
A
A
A
A
A
A
IDD_CD
IDD_SPI
IDD_INP
Current through VDD_QCLKD pin
Current through VDD_I2C pin
Current through VDD_INP pin
A
A
A
IDD_LCV Current through VDD_LCV pin
IDD_LCF Current through VDD_LCF pin
IDD_CPV Current through VDD_CPV pin
IDD_CPF Current through VDD_CPF pin
IDD_OSC Current through VDD_OSC pin
IDD_TOT Total Device Current Consumption
PTOT, SYS Total System Power Consumption[d]
A
A
A
A
A
A
W
W
PTOT
Total Device Power Consumption
[a] Design target specifications.
[b] fCLK (input) 40MHz, fVCXO 156.25MHz, fVCO 2500MHz, PV 160, MV 625, MF 8, FDF 1. Supply current is independent of the output
frequency configuration used for this table: QCLKA[3:0] 41.66MHz, QCLKB[3:0] 500MHz, QCLKC[3:0] 31.25MHz, QCLKD[5:0] 500MHz.
QCLK_y outputs terminated according to amplitude settings: LVPECL outputs terminated to VTT
.
[c] fCLK (input) 125MHz, fVCXO 156.25MHz, fVCO 2500MHz, PV 1024, MV 1280, MF 8, FDF 1. Supply current is independent of the
output frequency configuration used for this table: QCLKA[3:0] 125MHz, QCLKB[3:0] 156.25MHz, QCLKC[3:0] 250MHz,
QCLKD[5:0] 312.5MHz. QCLK_y outputs terminated according to amplitude settings: LVPECL outputs terminated to VTT
.
[d] Includes total device power consumption and the power dissipated in external output termination components.
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8V19N478 Datasheet
Table 44. LVCMOS DC Characteristics, VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V, or 1.8V) ±5%,
TA = -40°C to +85°C[a]
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
Control inputs, (1.8V/JESD7A-8 logic, input hysteresis and 3.3V tolerance)
-0.3
VI
VT
VT-
VH
Input Voltage
VDD_V
1.365
1.170
0.780
150
V
V
Positive-going Input Threshold Voltage
Negative-going Input Threshold Voltage
Hysteresis Voltage
0.660
0.495
0.165
V
VT – VT-
V
Input High Current
Input (PD)[b] and
Input (PD/PU)[c]
VDD_V 3.3V, VIN 3.3V
µA
IIH
Input (PU)[d]
Input (PD)[b]
5
Input Low Current
VDD_V 3.465V, VIN 0V
-5
µA
Input (PU)[d] and
Input (PD/PU)[c]
-150
IIL
Control outputs ADR1/MISO (when output), nINT, LOCK configured to 3.3V (SELSV0 0, SELSV1 0)
VOH
VOL
Output High Voltage ADR1/MISO (when
output), nINT,
Output Low Voltage
LOCK
IOH -4mA
IOL 4mA
2.0
V
V
0.55
Control outputs ADR1/MISO (when output), nINT, LOCK configured to 1.8V (SELSV0 1, SELSV1 1)
VOH
VOL
Output High Voltage
Output Low Voltage
IOH -4mA
IOL 4mA
1.35
1.8
V
V
0.45
Clock outputs QCLK_V, nQCLK_V configured to LVCMOS (STYLE_V[1:0] 1)
VOH
VOL
Output High Voltage
Output Low Voltage
IOH -8mA
IOL 8mA
1.35
1.8
V
V
0.45
[a] Design target specifications.
[b] EXT_SEL.
[c] I2C_A, ADR3, ADR2, ADR1, ADR0.
[d] SDAT, SCL.
Table 45. Differential Input DC Characteristics, VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V, or 1.8V) ±5%,
TA = -40°C to +85°C
Symbol
Parameter
Pull-down inputs[a]
Test Conditions
Minimum
Typical
Maximum Units
VDD_V VIN 3.465V
150
150
µA
µA
Input
High Current
IIH
Pull-down/pull-up
inputs[b]
Pull-down inputs[a]
VDD_V 3.465V, VIN 0V
-150
-150
µA
µA
Input
Low Current
IIL
Pull-down/pull-up
inputs[b]
[a] Non-Inverting inputs: CLK_0, CLK_1, OSC.
[b] Inverting inputs: nCLK_0, nCLK_1, nOSC.
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8V19N478 Datasheet
Table 46. LVPECL DC Characteristics (QCLK_y, STYLE 1), VDD_V 3.3V ±5%, VDDO_V (3.3V, 2.5V, or
1.8V) ±5%, TA = -40°C to +85°C[a]
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VDDO_V - 1.034 VDDO_V - 0.892 VDDO_V - 0.750
VDDO_V - 1.057 VDDO_V - 0.912 VDDO_V - 0.768
VDDO_V - 1.092 VDDO_V - 0.950 VDDO_V - 0.808
VDDO_V - 1.087 VDDO_V - 0.960 VDDO_V - 0.833
VDDO_V - 1.413 VDDO_V - 1.265 VDDO_V - 1.117
VDDO_V - 1.574 VDDO_V - 1.420 VDDO_V - 1.266
VDDO_V - 1.782 VDDO_V - 1.633 VDDO_V - 1.485
VDDO_V - 1.918 VDDO_V - 1.778 VDDO_V - 1.638
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
V
V
V
V
V
V
V
V
VOH
Output High Voltage[b][c]
VOL
Output Low Voltage[b][c]
[a] Design target specifications.
[b] Outputs terminated with 50 to VTT. For termination voltage VTT values (Table 50).
[c] 700mV and 850mV amplitude settings are only available at VDDO_V ≥ 2.5V.
Table 47. LVDS DC Characteristics (QCLK_y, STYLE = 0), VDD_V = 3.3V ± 5%, VDDO_V = (3.3V, 2.5V, or
1.8V) ±5%, TA = -40°C to +85°C[a]
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
VDDO_V - 1.034 VDDO_V - 0.947 VDDO_V - 0.862
VDDO_V - 1.133 VDDO_V - 1.045 VDDO_V - 0.961
VDDO_V - 1.229 VDDO_V - 1.142 VDDO_V - 1.056
VDDO_V - 1.316 VDDO_V - 1.226 VDDO_V - 1.138
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
V
V
VOS
Offset Voltage[b][c]
V
V
25
50
VOS
VOS Magnitude Change
mV
[a] Design target specifications.
[b] VOS changes with VDD
[c] 700mV and 850mV amplitude settings are only available at VDDO_V ≥ 2.5V.
.
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8V19N478 Datasheet
AC Characteristics
Table 48. AC Characteristics, VDD_V = 3.3V ±5%, VDDO_V = (3.3V, 2.5V, or 1.8V) ±5%,
TA = -40°C to +85°C[a][b]
Symbol
Parameter
Input Frequency
Test Conditions
Minimum
Typical
Maximum
Units
fIN
CLK_n
0.008
10
250
250
250
MHz
MHz
MHz
fVCXO
VCXO Frequency
156.25
Phase-Frequency Detector
Frequency
FemtoClock NG
fPFD, F
fVCO
VCO Frequency Range
2400
2400
1200
600
300
240
150
120
80
2500
2500
1250
625
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
MHz
QCLK_y, N 1
QCLK_y, N 2
QCLK_y, N 4
QCLK_y, N 8
QCLK_y, N 10
QCLK_y, N 16
QCLK_y, N 20
Integer
Divider
312.5
250
Output
fOUT
Frequency
156.25
125
Fractional QCLK_D, ND range: 29.99 to 8.33
Divider
300
Integer output divider N[A:C]
0
ppb
ppb
fOUT
Output Frequency Accuracy
Fractional output divider ND,
10
fOUT 156.25MHz
Input Voltage
Amplitude[c]
CLK_n
CLK_n
0.15
0.3
1.2
2.4
V
V
VIN
Differential
VDIFF_IN Input Voltage
Amplitude[c] [d]
Common Mode Input Voltage
Output Duty Cycle
1.0
45
VDD_V – (VIN /
V
VCMR
odc
)
2
QCLK_y
50
55
%
Output Rise/Fall Time,
Differential
QCLK_y (LVPECL), 20% to 80%
QCLK_y (LVDS), 20% to 80%
LVCMOS outputs, 20%-80%
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
200
300
1.2
ps
tR / tF
ps
Output Rise/Fall Time
ns
351
477
388
528
mV
mV
mV
mV
mV
mV
mV
mV
LVPECL
Output Voltage Swing,
Peak-to-peak, 156.25MHz
645
711
770
850
[e]
VO(PP)
702
776
LVPECL
954
1055
1422
1700
Differential Output Voltage
Swing, Peak-to-peak,
156.25MHz
1290
1540
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Table 48. AC Characteristics, VDD_V = 3.3V ±5%, VDDO_V = (3.3V, 2.5V, or 1.8V) ±5%,
TA = -40°C to +85°C[a][b] (Cont.)
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
350mV amplitude setting
500mV amplitude setting
700mV amplitude setting
850mV amplitude setting
QCLK_y (same N divider)
265
362
340
465
mV
mV
mV
mV
mV
mV
mV
mV
ps
LVDS
Output Voltage Swing,
Peak-to-peak, 156.25MHz
611
676
746
818
[f]
VOD
530
680
LVDS
724
929
Differential Output Voltage
Swing, Peak-to-peak,
156.25MHz
1222
1492
1351
1635
60
50
Output Skew[g] [h]
All delays set to 0
tsk(o)
QCLK_y (any N divider, incident rising
edge)
ps
LOS State Detected
(measured in input reference
periods)
fIN 125MHz
fIN 125MHz
2
3
TIN
ms
tD, LOS
PLL re-lock time after a short-term
holdover scenario. Measured from LOS
to both PLLs lock-detect asserted;
hold-off timer 200,
VCXO-PLL bandwidth 30Hz, 100Hz
initial frequency error <200ppm
300
30Hz -
30.2
tD, LOCK PLL Lock Detect
100Hz -
22.6
Refer to PLL lock detect tD,LOCK
.
30Hz -
0.049
20
ns
Reference point: final value of clock
output phase after all phase transitions
settled.
PLL Lock Residual Time
Error
tD, RES
100Hz -
0.191
Max. frequency deviation during a
holdover duration of 200ms and after the
clock re-validate event
30Hz -
1.57
±5.0
ppm
fHOLD Holdover Accuracy
100Hz -
3.34
[a] Design target specifications.
[b] Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted
in a test socket with maintained transverse airflow greater than 500lfpm. The device will meet specifications after thermal equilibrium has been
reached under these conditions.
[c] VIL should not be less than -0.3V and VIH should not be greater than VDD_V
[d] Common Mode Input Voltage is defined as the cross-point voltage.
.
[e] LVPECL outputs terminated with 50 to VDDO_V – 1.6V (350mV amplitude setting), VDDO_V – 1.75V (500mV amplitude setting),
VDDO_V – 1.95V (700mV amplitude setting), VDDO_V – 2.1V (850mV amplitude setting).
[f] LVDS outputs terminated 100 across terminals.
[g] This parameter is defined in accordance with JEDEC standard 65.
[h] Defined as skew between outputs at the same supply voltage and with equal load conditions. Measured at the differential cross points.
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Table 49. Clock Phase Noise Characteristics (fVCXO 156.25MHz), VDD_V 3.3V ±5%,
[a][b][c]
VDDO_V (3.3V, 2.5V, or 1.8V) ±5%, TA = -40°C to +85°C
Symbol
Parameter
Test Conditions
Minimum
Typical
Maximum
Units
Clock RMS
Phase Jitter
(Random)
156.25MHz Integration Range: 12kHz – 20MHz
65
58
fs
fs
tjit(Ø)
250MHz
500MHz
Integration Range: 12kHz – 20MHz
(10)
Clock
10Hz offset (determined by VCXO)
100Hz offset (determined by VCXO)
1kHz offset from carrier
-66.8
-85.7
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
N
Single-side
Band Phase
Noise
(100)
N
(1k)
-116.3
-133
-110
-120
N
(integer divider)
(10k)
10kHz offset from carrier
N
(100k)
100kHz offset from carrier
1MHz offset from carrier
-137.6
-145.4
-157.5
N
(1M)
-142
-150
N
10MHz offset from carrier and
noise floor
(10M)
N
(10)
Clock
250MHz
10Hz offset (determined by VCXO)
100Hz offset (determined by VCXO)
1kHz offset from carrier
-73.8
-91.4
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
N
Single-side
Band Phase
Noise
(100)
N
(1k)
-122.0
-138.9
-143.8
-151.3
-160.9
N
(integer divider)
(10k)
10kHz offset from carrier
-130
-135
-150
-155
N
(100k)
100kHz offset from carrier
1MHz offset from carrier
N
(1M)
N
10MHz offset from carrier and
noise floor
(10M)
N
(10)
Clock
156.25MHz 10Hz offset (determined by VCXO)
100Hz offset (determined by VCXO)
1kHz offset from carrier
-77.8
-95.8
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
N
Single-side
Band Phase
Noise
(100)
N
(1k)
-126.9
-142.9
-148
N
(integer divider)
(10k)
10kHz offset from carrier
N
(100k)
100kHz offset from carrier
N
(1M)
1MHz offset from carrier
-155.3
-162.8
N
10MHz offset from carrier and
noise floor
(10M)
N
(10)
Clock
125MHz
10Hz offset (determined by VCXO)
100Hz offset (determined by VCXO)
1kHz offset from carrier
-80.8
-97.9
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
dBc/Hz
N
Single-side
Band Phase
Noise
(100)
N
(1k)
-128.5
-144.7
-149.9
-156.8
-162.2
-120
-130
-135
-150
-155
N
(10k)
10kHz offset from carrier
N
(100k)
100kHz offset from carrier
1MHz offset from carrier
N
(1M)
N
10MHz offset from carrier and
noise floor
(10M)
N
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[a] Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted
in a test socket with maintained transverse airflow greater than 500lfpm. The device will meet specifications after thermal equilibrium has been
reached under these conditions.
[b] Phase noise specifications are applicable for all outputs active, Nx not equal.
[c] VCXO characteristics: 156.25MHz and phase noise -67.9dBc/Hz at 10Hz, -97.9dBc/Hz at 100Hz, -121.9dBc/Hz at 1kHz, -141.9dBc/Hz at 10kHz,
-152.9dBc/Hz at 100kHz.
Clock Phase Noise Characteristics
VCXO characteristics: 156.25MHz and phase noise -67.9dBc/Hz at 10Hz, -97.9dBc/Hz at 100Hz, -121.9dBc/Hz at 1kHz, -141.9dBc/Hz at
10kHz, -152.9dBc/Hz at 100kHz.
▪ Input reference frequency: 20MHz
▪ VCXO-PLL bandwidth: 30Hz
▪ VCXO-PLL charge pump current: 0.75mA
▪ FemtoClock-NG PLL bandwidth: 342kHz
▪ VDD_V 3.3V, TA 25°C
Figure 5. 312.5MHz Output Phase Noise
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Figure 6. 125MHz Output Phase Noise
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Figure 7. 156.25MHz Output Phase Noise
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Figure 8. 250MHz Output Phase Noise
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Figure 9. 500MHz Output Phase Noise
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Applications Information
VCXO-PLL Loop Filter
Each of the two PLLs uses a loop filter with external components. The value of the external components depends on the desired loop
bandwidth for each PLL, the input clock frequency, and in the case of the VCXO-PLL on the external VCXO component. For the
VCXO-PLL (first PLL stage), a 2nd or 3rd order loop filter may be used. The loop filter of the VCXO-PLL is connected to the device
through the LFV charge-pump input. The filter output is connected to the control voltage input of the external VCXO. The FemtoClock NG
PLL (second PLL stage) may use a 2nd order loop filter. The LFF output of the device connects to filter input and LFFR to the filter output.
Typical loop filters are shown in Figure 10 (2nd order) in Figure 11 (3rd order) and are discussed below. Step by step calculations to
determine the value of the loop filter components values are shown.
Figure 10. Second-Order Loop Filter
VCXO
LFV Output
Control Input
(charge pump)
CZ
CP
RZ
Step-by-step Calculation
Step 1: Determine the desired loop bandwidth fC. fC must satisfy the following condition:
f
PD
---------- » 20
f
C
Where fPD is the input frequency of the VCXO-PLL phase detector frequency.
Step 2: Calculate RZ by:
2 f M
C
V
R
= ---------------------------------------------------
Z
I
K
CP
VCXO
Where ICP is the VCXO-PLL charge-pump current and KVCXO is the gain of the VCXO component (consult the datasheet of the external
VCXO for its gain parameter). MV is the effective feedback divider:
f
VCXO
M
=
------------------------
V
f
PD
f
VCXO is the frequency of the external VCXO component.
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Step 3: Calculate CZ by:
f
C
=
------
f
Z
C
Z
=
--------------------------------------------
2 f R
C
Z
α is ratio between the loop bandwidth and the filter zero. fZ is the filter zero. α should be greater than 3.
Step 4: Calculate CP by:
C
Z
C
=
--------------
P
f
P
=
------
f
C
fP is the pole and β is ratio between the pole and the loop bandwidth. β should be greater than 3.
Step 5: Verify that the phase margin PM is greater than 50°.
b – 1
PM = atan
--------------------
2
b
C
Z
C
P
b =
+ 1
--------
Example calculation: The Block Diagram shows a 2nd order loop filter for the VCXO-PLL. In this example, the VCXO-PLL reference
frequency is 122.88MHz, and an external VCXO component of 122.88MHz is used. The desired VCXO-PLL loop bandwidth fC is 40Hz. To
achieve the desired loop bandwidth with small size loop filter components, set the PLL frequency pre-divider PV, and the PLL feedback
divider MV to 1024. According to the step 1 instruction, fPD is 120kHz. This satisfies the condition fPD/fC >> 20. RZ is calculated 32.2k.
The VCXO gain KVCXO used for the device reference circuit is 10kHz/V. The charge-pump current of the VCXO-PLL is configurable from
50µA to 1200µA. The charge-pump current is programmed to ICP 800uA. For α 8, CZ is calculated to be 0.99µF. CZ greater than this
value assures α > 12. For example, the actual chosen value is the standard capacitor value of 1µF. For β 5, CP is calculated 24.7nF.
The standard capacitor value of CP 27ps ensures β > 7.
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Figure 11. Third-Order Loop Filter
VCXO
LFV Output
Control Input
(charge pump)
RP2
CP2
CZ
CP
RZ
Figure 11 shows a third-order loop filter. The filter is equivalent to the 2nd order filter in Figure 12 with the addition components RP2 and
C
P2. The additional components RP2 and CP2 should be calculated as shown:
R
C
Z
P
C
=
-------------------------
P2
R
P2
R
1.5 R
P2
Z
is the ratio between the 1st pole and the 2nd pole. should be greater than 3.
Example calculation for the 3rd order loop filter shown in Figure 11: Equivalent to the 2nd order loop filter calculation, RZ 33k, CZ
1µF, and CP 27nF. RP2 should be in the range of 0.5·RZ < RP2 < 2.5·RZ, for instance 51k With 4, CP2 is 4.37nF (select 4.7µF).
FemtoClock NG PLL Loop Filter
Figure 12 shows a 2nd order loop filter for the FemtoClock NG PLL. This loop filter is equivalent to Figure 10 and uses the loop filter
components RZF (RZ), CZF (CZ), and CPZ (CP). The VCO frequency of the FemtoClock NG PLL is 2500MHz.
Figure 12. 2nd Order Loop Filer for FemtoClock NG PLL
LFFR
CZF
CPF
RZF
LFF
Example calculation for the 2nd order loop filter shown in Figure 12: the FemtoClock NG receives its reference frequency from the
VCXO output. With the PF pre-divider set to 1, the phase detector frequency is also 122.88MHz. The PLL feedback divider must be set to
MF 24 in order to locate the VCO frequencies in its center range. A target PLL loop bandwidth fC is 80kHz satisfies the condition in step
1. The gain of the internal VCO is 30MHz/V and the charge-pump current ICP is set to 3.6mA. Using the formula for RZ in step 2, RZF is
calculated 103 (chose the standard value of 100; using the formula for CZ in step 3, CZF is calculated 88nF for α 4. A capacitor
larger than 88nF should be used for CZF to assure that the α is greater than 4, for instance the standard component capacitor value
100nF.
With β 6, CPZ is calculated to be 3.6nF as shown in step 4. A capacitor less than 3.6nF should be used for CPZ to assure that β remains
greater than 6, for instance the standard capacitor value of 1nF is selected for CPZ. The selected 2nd order loop filter components are
R
ZF 100CZF 100nF and CPZ 1nF.
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Output Termination
LVPECL-style Outputs
Differential outputs configured to LVPECL-style are an open-emitter type, and require a termination with a DC current path to GND. This
section displays parallel and thevenin termination, Y-termination and source termination for various output supply (VDDO_V), and
amplitude settings. VTT is the termination voltage.
Figure 13. LVPECL Parallel Termination 1
VDD_v
Zo = 50
Zo = 50
+
-
R2
50
R1
50
LVPECL Driv er
High Impedance Input
N o Built- in T er mination
VTT
Table 50. Termination Voltage VTT (Figure 13)[a]
LVPECL Amplitude (mV)
V (V)
TT
350
500
700
850
VDDO_V – 1.60
VDDO_V – 1.75
V
V
DDO_V – 1.95
DDO_V – 2.10
[a] Output power supplies supporting 3.3V, 2.5V and 1.8V are VDDO_QCLKA, VDDO_QCLKB, VDDO_QCLKC and
VDDO_QCLKD
.
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Figure 14. LVPECL Parallel Termination 2
VD D_v
VDD_v
R1
R3
+
-
Zo = 50
Zo = 50
R2
R4
LVPECL Driv er
High Impedance Input
N o Built-in Termination
Table 51. Termination Resistor Values (Figure 14)
[a]
V
(V)
LVPECL Amplitude (mV)
R1, R3 ()
R2, R4 ()
DDO_V
350
500
700
850
350
500
700
850
350
500
97.1
106.5
122
103.1
94.3
84.6
78.6
78.1
71.4
64.1
59.5
56.3
50
3.3
137.5
138.8
166.7
227.3
312.5
450
2.5
1.8
–
[a] Output power supplies supporting 3.3V, 2.5V, and 1.8V are VDDO_QCLKA, VDDO_QCLKB, VDDO_QCLKC and VDDO_QCLKD
.
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Figure 15. LVPECL Y-Termination
VDD_v
Zo = 50
Zo = 50
+
-
R2
50
R1
50
LVPECL Driv er
High Impedance Input
N o Built-in Termination
C1
0. 1uF(opt ional)
R3
Table 52. Termination Resistor Values (Figure 15)
[a]
V
(V)
LVPECL Amplitude (mV)
R3 ()
DDO_V
3.3
350, 500, 700, 850
350, 500, 700, 850
350, 500
50
18
0
2.5
1.8
[a] Output power supplies supporting 3.3V, 2.5V, and 1.8V are VDDO_QCLKA, VDDO_QCLKB, VDDO_QCLKC and VDDO_QCLKD
.
Figure 16. LVPECL Source Termination
VDD_v
LVPECL Driv er
Zo = 50
Zo = 50
+
-
R3
100
R2
R1
High Impedance Input
No Built-in Termination
Table 53. Termination Resistor Values (Figure 16)
[a]
V
(V)
LVPECL Amplitude (mV)
R1, R2 ()
DDO_V
3.3
350, 500, 700, 850
350, 500, 700, 850
350
100 – 200
80 – 150
50 – 100
2.5
1.8
[a] Output power supplies supporting 3.3V, 2.5V, and 1.8V are VDDO_QCLKA, VDDO_QCLKB, VDDO_QCLKC and VDDO_QCLKD
.
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LVDS-Style Outputs
LVDS style outputs support fully differential terminations. LVDS does not require board level pull-down resistors for DC termination.
Figure 17 and Figure 18 show typical termination examples with DC coupling for the LVDS style driver. In these examples, the receiver is
high input impedance without built-in termination. LVDS-style with a differential termination is preferred for best common-mode rejection
and lowest device power consumption.
Figure 17. LVDS Termination
VCC=3.3V
Zo = 50
Zo = 50
+
-
R1
100
LVDS Style Driver
High Impedance Input
No Built-in Termination
Figure 18. LVDS Termination (Alternative)
VDD_v
Zo = 50
Zo = 50
+
-
R2
50
R1
50
LVDS St yle Driver
High Impedance Input
N o Built- in T er mination
C1
0. 1uF (opt ional )
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Power Supply Filtering
Please refer to the document 8V19N470 Hardware Design Guide for comprehensive information about power supply and isolation, loop
filter design for VCXO and VCO, schematics, input and output interfaces/terminations and an example schematics. This document shows
a recommended power supply filter schematic in which the device is operated at VDD_V = 3.3V (the output supply voltages of VDDO_V
=
3.3V, 2.5V, and 1.8V are supported). This example focuses on power supply connections and is not configuration specific. Refer to the
pin description and functional tables in the datasheet to ensure that the logic control inputs are properly set for the application.
As with any high-speed analog circuitry, the power supply pins are vulnerable to the board supply or device generated noise. This device
requires an external voltage regulator for the VDD_V pins for isolation of board supply noise. This regulator (example component:
PS7A8300RGT) is indicated in the schematic by the power supply, VREG_3.3V. Consult the voltage regulator specification for details for
the required performance. To achieve optimum jitter performance, power supply isolation is required to minimize device generated noise.
The VDD_LCF terminal requires the cleanest power supply. The device provides separate power supplies to isolate any high switching
noise from coupling into the internal PLLs and into other outputs as shown. In order to achieve the best possible filtering, it is
recommended that the placement of the filter components be on the device side of the PCB as close to the power pins as possible. If
space is limited, the 0.1µF and 0.01µF capacitors in each power pin filter should be placed on the device side. The other components
can be on the opposite side of the PCB. To set configuration pins, pull-up and pull-down resistors can all be placed on the PCB side,
opposite the device side, to free up device side area if necessary.
Power supply filter recommendations are a general guideline to be used for reducing external noise from coupling into the devices. The
filter performance is designed for a wide range of noise frequencies. This low-pass filter starts to attenuate noise at approximately 10kHz.
If a specific frequency noise component is known, such as switching power supplies frequencies, it is recommended that component
values be adjusted and if required, additional filtering be added. Additionally, good general design practices for power plane voltage
stability suggests adding bulk capacitance in the local area of all devices.
Thermal Characteristics
Table 54. Thermal Characteristics for the 100-FPBGA Package[a]
Multi-Layer PCB, JEDEC Standard Test Board
[b]
Symbol
Thermal Parameter
Junction-to-ambient
Condition
Value
Unit
0m/s air flow
1m/s air flow
2m/s air flow
3m/s air flow
4m/s air flow
5m/s air flow
24.06
20.89
19.07
18.05
17.46
17.03
8.54
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
JA
Junction-to-case
JC
JB
JB
Junction-to-board[c]
Junction-to-board[d]
6.43
4.15
[a] Standard JEDEC 2S2P multilayer PCB.
[b] Estimated thermal values.
[c] Thermal model where the majority (>90%) of the heat dissipated in the component is conducted through the package bottom (balls).
TB is measured on or near the component lead.
[d] Thermal model where the heat dissipated to the ambient from all directions. TB is measured on or near the component lead.
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Temperature Considerations
The device supports applications in a natural convection environment as long as the junction temperature does not exceed the specified
junction temperature TJ. In applications where the heat dissipates through the PCB, JB is the correct metric to calculate the junction
temperature. The following calculation uses the junction-to-board thermal characterization parameter JB to calculate the junction
temperature (TJ). Care must be taken to not exceed the maximum allowed junction temperature TJ of 125 °C.
The junction temperature TJ is calculated using the following equation: T = T + P
TOT JB
J
B
where:
▪ TJ is the junction temperature at steady state conditions in °C.
▪ TB is the board temperature at steady state condition in °C, measured on or near the component lead.
▪ JB is the thermal characterization parameter to report the difference between TJ and TB.
▪ PTOT is the total device power dissipation.
Maximum power dissipation scenario: With the maximum allowed junction temperature and the maximum device power consumption and
at the maximum supply voltage of 3.3V + 5%, the maximum supported board temperature can be determined. In the device configuration
for the maximum power consumption, IDD_V is 1.024A. In this configuration, all outputs are active and configured to LVDS, the output
amplitude is set to 850mV and outputs use a 100 Ohm termination:
▪ Total system power dissipation (incl. termination resistor power): PTOT = VDD_V, MAX · IDD_V, MAX = 3.465V · 1.024A = 3.548W
In this scenario and with the Theta_JB thermal model, the maximum supported board temperature is as follows:
TB, MAX = TJ_MAX - Theta_JB · PTOT
TB, MAX = 125°C - 6.43°C/W · 3.548W = 102.2°C
Table 55. Typical Power Consumption
Device
Theta JB Thermal model
[a]
[b]
IDD_TOT
A
PTOT
W
T
T
J
B, MAX
Test Case
C
C
1b
2b
3c
4c
5c
6c
0.787
0.887
0.982
0.927
0.931
0.857
2.596
2.928
2.165
2.051
2.025
1.881
101.7
103.8
98.9
98.2
98.0
97.1
108.3
106.2
111.1
111.8
112.0
112.9
[a] Junction temperature at board temperature TB = 85°C
[b] Maximum board temperature for junction temperature < 125°C: TB, MAX = TJ, MAX - JB x PTOT
.
Package Outline Draw ings
The package outline drawings are appended at the end of this document and are accessible from the link below. The package information
is the most current data available.
www.idt.com/document/psc/bdbdg100-package-outline-110-mm-sq-body-10-mm-pitch-cabga
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Marking Diagram
1. Line 1 and Line 2 is the part number.
2. “#” denotes stepping.
3. “YYWW” denotes: “YY” is the last two digits of the year, and “WW” is a work week number
that the part was assembled.
4. “$” denotes the mark code.
Ordering Information
Part/Order Number
Marking
Package
Shipping Packaging
Temperature
8V19N478BDGI
8V19N478BDGI8
IDT8V19N478BDGI
IDT8V19N478BDG
11 11 1 mm 100-FPBGA
11 11 1 mm 100-FPBGA
Tray
-40°C to +85°C
-40°C to +85°C
Tape and Reel
Glossary
Abbreviation
Description
Index n
Index x
Index y
VDD_v
Denominates an clock input. Range: 0 to 1.
Denominates a channel, channel frequency divider and the associated configuration bits. Range: A, B, C, D.
Denominates a QCLK output and associated configuration bits. Range: A0, A1, A2, B0, B1, B2, C0, C1, D0, D1.
Denominates core voltage supply pins. Range: VDD_QCLKA, VDD_QCLKB, VDD_QCLKC, VDD_QCLKD, VDD_I2C, VDD_INP
,
VDD_LCV, VDD_LCF, VDD_CPV, VDD_CPF and VDD_OSC
.
VDDO_v
Denominates output voltage supply pins. Range: VDDO_QCLKA, VDDO_QCLKB, VDDO_QCLKC and VDDO_QCLKD
.
status_condition
Status conditions are: LOLV (Loss of VCXO-PLL lock), LOLF (Loss of FemtoClock NG-PLL lock) and LOS (Loss of
input signal).
[...]
Index brackets describe a group associated with a logical function or a bank of outputs.
List of discrete values.
{…}
Suffix V
Suffix F
Denominates a function associated with the VCXO-PLL.
Denominates a function associated with the 2nd stage PLL (FemtoClock NG).
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Revision History
Revision Date
Description of Change
Added Figure 5 (312.5MHz Output Phase Noise)
Initial release.
May 15, 2018
May 2, 2018
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DISCLAIMER Integrated Device Technology, Inc. (IDT) and its affiliated companies (herein referred to as “IDT”) reserve the right to modify the products and/or specifications described herein at any time,
without notice, at IDT’s sole discretion. Performance specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same
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