74AC11240DBE4 [TI]
AC SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO24, SSOP-24;
| 型号： | 74AC11240DBE4 |
| 厂家： | 
TEXAS INSTRUMENTS |
| 描述： | AC SERIES, DUAL 4-BIT DRIVER, INVERTED OUTPUT, PDSO24, SSOP-24 驱动 光电二极管 输出元件 逻辑集成电路 |
| 文件： | 总14页 (文件大小：574K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
74AC11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS448A – MAY 1987 – REVISED APRIL 1996
DB, DW, OR NT PACKAGE
(TOP VIEW)
Flow-Through Architecture Optimizes
PCB Layout
Center-Pin V
Minimize High-Speed Switching Noise
and GND Configurations
CC
1
24
23
22
21
20
19
18
17
16
15
14
13
1Y1
1Y2
1Y3
1OE
1A1
1A2
1A3
1A4
2
EPIC (Enhanced-Performance Implanted
CMOS) 1- m Process
3
4
1Y4
500-mA Typical Latch-Up Immunity at
125°C
5
GND
GND
GND
GND
2Y1
2Y2
2Y3
2Y4
6
V
V
CC
CC
7
Package Options Include Plastic
Small-Outline (DW) and Shrink
Small-Outline (DB) Packages, and Standard
Plastic 300-mil DIPs (NT)
8
2A1
2A2
2A3
2A4
2OE
9
10
11
12
description
Thisoctalbuffer/linedriverisdesignedspecifically
to improve both the performance and density of
3-state memory address drivers, clock drivers,
and bus-oriented receivers and transmitters. This
device
provides
inverting
outputs
and
symmetrical active-low output-enable (OE)
inputs. This device features high fan-out and
improved fan-in.
The 74AC11240 is organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the
device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the
high-impedance state.
The 74AC11240 is characterized for operation from –40°C to 85°C.
FUNCTION TABLE
(each buffer)
INPUTS
OUTPUT
Y
OE
L
A
H
L
L
L
H
Z
H
X
†
logic symbol
24
13
1OE
EN
2OE
EN
23
1A1
22
1
2
3
4
17
16
15
14
9
10
11
12
1
1
1Y1
2Y1
2Y2
2Y3
2Y4
2A1
2A2
2A3
2A4
1Y2
1Y3
1Y4
1A2
21
1A3
20
1A4
†
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
EPIC is a trademark of Texas Instruments Incorporated.
Copyright 1996, Texas Instruments Incorporated
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
1
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74AC11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS448A – MAY 1987 – REVISED APRIL 1996
logic diagram (positive logic)
13
24
1OE
2OE
2A1
2A2
2A3
2A4
23
1
2
3
17
16
15
9
10
11
1Y1
1Y2
1Y3
1Y4
2Y1
1A1
22
1A2
2Y2
2Y3
2Y4
21
1A3
20
4
14
12
1A4
†
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Supply voltage range, V
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V
CC
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
+ 0.5 V
+ 0.5 V
I
CC
CC
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA
IK
I
I
CC
Output clamp current, I
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
OK
O O CC
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA
Continuous current through V
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W
O
O
CC
CC
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA
A
DW package . . . . . . . . . . . . . . . . . . 1.7 W
NT package . . . . . . . . . . . . . . . . . . . 1.3 W
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C
stg
†
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.
2. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils,
except for the NT package, which has a trace length of zero.
2
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74AC11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS448A – MAY 1987 – REVISED APRIL 1996
recommended operating conditions
MIN NOM
MAX
UNIT
V
Supply voltage
3
2.1
5
5.5
V
CC
IH
V
CC
V
CC
V
CC
V
CC
V
CC
V
CC
= 3 V
V
High-level input voltage
= 4.5 V
= 5.5 V
= 3 V
3.15
3.85
V
V
0.9
1.35
1.65
V
IL
Low-level input voltage
= 4.5 V
= 5.5 V
V
V
Input voltage
0
0
V
V
V
I
CC
Output voltage
V
CC
–4
O
V
V
V
V
V
V
= 3 V
CC
CC
CC
CC
CC
CC
I
High-level output current
Low-level output current
= 4.5 V
= 5.5 V
= 3 V
–24
–24
12
24
24
5
mA
mA
OH
OL
I
= 4.5 V
= 5.5 V
0
0
OE
∆t/∆v
Input transition rise or fall rate
Operating free-air temperature
ns/V
Data
10
85
T
A
–40
°C
electrical characteristics over recommended operating free-air temperature range (unless
otherwise noted)
T
A
= 25°C
PARAMETER
TEST CONDITIONS
V
MIN
MAX
UNIT
CC
MIN
2.9
TYP
MAX
3 V
2.9
4.4
I
= –50
A
4.5 V
5.5 V
3 V
4.4
OH
5.4
5.4
V
OH
I
I
I
= –4 mA
= –24 mA
= –75 mA
2.58
3.94
4.94
2.48
3.8
V
OH
OH
OH
4.5 V
5.5 V
5.5 V
3 V
4.8
3.85
0.1
0.1
0.1
0.1
I
= 50
A
4.5 V
5.5 V
3 V
OL
0.1
0.1
V
OL
I
I
I
= 12 mA
= 24 mA
= 75 mA
0.36
0.36
0.36
0.44
0.44
0.44
1.65
±5
V
OL
OL
OL
4.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5.5 V
5 V
I
I
I
V
= V or GND
CC
±0.5
±0.1
8
A
A
OZ
O
V = V
or GND
or GND,
or GND
±1
I
I
CC
CC
CC
V = V
I = 0
O
80
A
CC
I
C
C
V = V
4
pF
pF
i
I
V
= V or GND
CC
5 V
10
O
O
†
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.
3
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74AC11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS448A – MAY 1987 – REVISED APRIL 1996
switching characteristics over recommended operating free-air temperature range,
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)
CC
T
A
= 25°C
TYP
7.6
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
10.5
8.6
t
t
1.5
1.5
1.5
1.5
1.5
1.5
11.7
9.5
12.7
12
PLH
PHL
PZH
A
Y
Y
Y
6.3
t
8.2
11.6
10.8
7.5
ns
OE
OE
t
7.6
PZL
t
5.5
7.8
9.8
PHZ
ns
t
6.7
9.4
PLZ
switching characteristics over recommended operating free-air temperature range,
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)
V
CC
T
A
= 25°C
TYP
5.4
FROM
(INPUT)
TO
(OUTPUT)
PARAMETER
MIN
MAX
UNIT
ns
MIN
1.5
1.5
1.5
1.5
1.5
1.5
MAX
7.5
6.6
8.2
7.7
6.3
7.3
t
t
1.5
1.5
1.5
1.5
1.5
1.5
8.4
7.2
9.2
8.7
6.6
7.7
PLH
PHL
PZH
A
Y
Y
Y
4.6
t
5.7
ns
OE
OE
t
5.3
PZL
t
4.7
PHZ
ns
t
5.2
PLZ
operating characteristics, V
= 5 V, T = 25°C
A
CC
PARAMETER
TEST CONDITIONS
= 50 pF, f = 1 MHz
L
TYP
39
UNIT
Outputs enabled
Outputs disabled
C
Power dissipation capacitance per buffer
C
pF
pd
12
4
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
74AC11240
OCTAL BUFFER/LINE DRIVER
WITH 3-STATE OUTPUTS
SCAS448A – MAY 1987 – REVISED APRIL 1996
PARAMETER MEASUREMENT INFORMATION
2 × V
CC
Open
GND
TEST
S1
S1
t
/t
Open
500 Ω
PLH PHL
From Output
Under Test
t
/t
2 × V
CC
GND
PLZ PZL
t
/t
PHZ PZH
C
= 50 pF
L
500 Ω
(see Note A)
LOAD CIRCUIT
Output
V
CC
Control
(low-level
enabling)
50% V
50% V
CC
CC
0 V
t
PZL
V
t
PLZ
CC
Output
Waveform 1
V
CC
Input
50% V
50% V
CC
50% V
CC
CC
0 V
20% V
80% V
S1 at 2 × V
(see Note B)
CC
CC
V
V
OL
t
PHL
t
PHZ
t
PLH
t
PZH
Output
Waveform 2
S1 at GND
V
OH
OH
0 V
CC
50% V
50% V
Output
CC
CC
V
50% V
CC
OL
(see Note B)
VOLTAGE WAVEFORMS
VOLTAGE WAVEFORMS
NOTES: A.
C
L includes probe and jig capacitance.
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.
C. All input pulses are supplied by generators having the following characteristics: PRR ≤ 1 MHz, Z = 50 Ω, t = 3 ns, t = 3 ns.
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.
Figure 1. Load Circuit and Voltage Waveforms
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
PACKAGING INFORMATION
Status (1)
Eco Plan (2)
MSL Peak Temp (3)
Samples
Orderable Device
Package Type Package
Drawing
Pins
Package Qty
Lead/
Ball Finish
(Requires Login)
74AC11240DBLE
74AC11240DBR
OBSOLETE
ACTIVE
SSOP
SSOP
DB
DB
24
24
TBD
Call TI
Call TI
Samples Not Available
2000
2000
2000
25
Green (RoHS
& no Sb/Br)
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
CU NIPDAU Level-1-260C-UNLIM
Contact TI Distributor
or Sales Office
74AC11240DBRE4
74AC11240DBRG4
74AC11240DW
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
SSOP
SOIC
DB
DB
24
24
24
24
24
24
24
24
Green (RoHS
& no Sb/Br)
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Purchase Samples
Green (RoHS
& no Sb/Br)
DW
DW
DW
PW
PW
PW
Green (RoHS
& no Sb/Br)
74AC11240DWE4
74AC11240DWG4
74AC11240PW
SOIC
25
Green (RoHS
& no Sb/Br)
SOIC
25
Green (RoHS
& no Sb/Br)
TSSOP
TSSOP
TSSOP
60
Green (RoHS
& no Sb/Br)
74AC11240PWE4
74AC11240PWG4
60
Green (RoHS
& no Sb/Br)
60
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
PACKAGE OPTION ADDENDUM
www.ti.com
28-Aug-2010
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
74AC11240DBR
SSOP
DB
24
2000
330.0
16.4
8.2
8.8
2.5
12.0
16.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
14-Jul-2012
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SSOP DB 24
SPQ
Length (mm) Width (mm) Height (mm)
367.0 367.0 38.0
74AC11240DBR
2000
Pack Materials-Page 2
MECHANICAL DATA
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001
DB (R-PDSO-G**)
PLASTIC SMALL-OUTLINE
28 PINS SHOWN
0,38
0,22
0,65
28
M
0,15
15
0,25
0,09
5,60
5,00
8,20
7,40
Gage Plane
1
14
0,25
A
0°–ā8°
0,95
0,55
Seating Plane
0,10
2,00 MAX
0,05 MIN
PINS **
14
16
20
24
28
30
38
DIM
6,50
5,90
6,50
5,90
7,50
8,50
7,90
10,50
9,90
10,50 12,90
A MAX
A MIN
6,90
9,90
12,30
4040065 /E 12/01
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-150
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46C and to discontinue any product or service per JESD48B. Buyers should
obtain the latest relevant information before placing orders and should verify that such information is current and complete. All
semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale supplied at the time
of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products
Audio
Applications
www.ti.com/audio
amplifier.ti.com
dataconverter.ti.com
www.dlp.com
Automotive and Transportation www.ti.com/automotive
Communications and Telecom www.ti.com/communications
Amplifiers
Data Converters
DLP® Products
DSP
Computers and Peripherals
Consumer Electronics
Energy and Lighting
Industrial
www.ti.com/computers
www.ti.com/consumer-apps
www.ti.com/energy
dsp.ti.com
Clocks and Timers
Interface
www.ti.com/clocks
interface.ti.com
logic.ti.com
www.ti.com/industrial
www.ti.com/medical
www.ti.com/security
Medical
Logic
Security
Power Mgmt
Microcontrollers
RFID
power.ti.com
Space, Avionics and Defense www.ti.com/space-avionics-defense
microcontroller.ti.com
www.ti-rfid.com
Video and Imaging
www.ti.com/video
OMAP Mobile Processors www.ti.com/omap
Wireless Connectivity www.ti.com/wirelessconnectivity
TI E2E Community
e2e.ti.com
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated
相关型号：
©2020 ICPDF网 联系我们和版权申明