74AC11240PWE4 [TI]

Octal Buffers/Drivers 24-TSSOP -40 to 85;
74AC11240PWE4
型号: 74AC11240PWE4
厂家: TEXAS INSTRUMENTS    TEXAS INSTRUMENTS
描述:

Octal Buffers/Drivers 24-TSSOP -40 to 85

驱动 光电二极管 逻辑集成电路
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74AC11240  
OCTAL BUFFER/LINE DRIVER  
WITH 3-STATE OUTPUTS  
SCAS448A – MAY 1987 – REVISED APRIL 1996  
DB, DW, OR NT PACKAGE  
(TOP VIEW)  
Flow-Through Architecture Optimizes  
PCB Layout  
Center-Pin V  
Minimize High-Speed Switching Noise  
and GND Configurations  
CC  
1
24  
23  
22  
21  
20  
19  
18  
17  
16  
15  
14  
13  
1Y1  
1Y2  
1Y3  
1OE  
1A1  
1A2  
1A3  
1A4  
2
EPIC (Enhanced-Performance Implanted  
CMOS) 1- m Process  
3
4
1Y4  
500-mA Typical Latch-Up Immunity at  
125°C  
5
GND  
GND  
GND  
GND  
2Y1  
2Y2  
2Y3  
2Y4  
6
V
V
CC  
CC  
7
Package Options Include Plastic  
Small-Outline (DW) and Shrink  
Small-Outline (DB) Packages, and Standard  
Plastic 300-mil DIPs (NT)  
8
2A1  
2A2  
2A3  
2A4  
2OE  
9
10  
11  
12  
description  
Thisoctalbuffer/linedriverisdesignedspecifically  
to improve both the performance and density of  
3-state memory address drivers, clock drivers,  
and bus-oriented receivers and transmitters. This  
device  
provides  
inverting  
outputs  
and  
symmetrical active-low output-enable (OE)  
inputs. This device features high fan-out and  
improved fan-in.  
The 74AC11240 is organized as two 4-bit buffers/line drivers with separate OE inputs. When OE is low, the  
device passes inverted data from the A inputs to the Y outputs. When OE is high, the outputs are in the  
high-impedance state.  
The 74AC11240 is characterized for operation from –40°C to 85°C.  
FUNCTION TABLE  
(each buffer)  
INPUTS  
OUTPUT  
Y
OE  
L
A
H
L
L
L
H
Z
H
X
logic symbol  
24  
13  
1OE  
EN  
2OE  
EN  
23  
1A1  
22  
1
2
3
4
17  
16  
15  
14  
9
10  
11  
12  
1
1
1Y1  
2Y1  
2Y2  
2Y3  
2Y4  
2A1  
2A2  
2A3  
2A4  
1Y2  
1Y3  
1Y4  
1A2  
21  
1A3  
20  
1A4  
This symbol is in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12.  
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of  
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.  
EPIC is a trademark of Texas Instruments Incorporated.  
Copyright 1996, Texas Instruments Incorporated  
PRODUCTION DATA information is current as of publication date.  
Products conform to specifications per the terms of Texas Instruments  
standard warranty. Production processing does not necessarily include  
testing of all parameters.  
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
74AC11240  
OCTAL BUFFER/LINE DRIVER  
WITH 3-STATE OUTPUTS  
SCAS448A – MAY 1987 – REVISED APRIL 1996  
logic diagram (positive logic)  
13  
24  
1OE  
2OE  
2A1  
2A2  
2A3  
2A4  
23  
1
2
3
17  
16  
15  
9
10  
11  
1Y1  
1Y2  
1Y3  
1Y4  
2Y1  
1A1  
22  
1A2  
2Y2  
2Y3  
2Y4  
21  
1A3  
20  
4
14  
12  
1A4  
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)  
Supply voltage range, V  
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to 6 V  
CC  
Input voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
+ 0.5 V  
+ 0.5 V  
I
CC  
CC  
Output voltage range, V (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.5 V to V  
O
Input clamp current, I (V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±20 mA  
IK  
I
I
CC  
Output clamp current, I  
(V < 0 or V > V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
OK  
O O CC  
Continuous output current, I (V = 0 to V ) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±50 mA  
Continuous current through V  
Maximum power dissipation at T = 55°C (in still air) (see Note 2): DB package . . . . . . . . . . . . . . . . . . 0.65 W  
O
O
CC  
CC  
or GND . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . ±200 mA  
A
DW package . . . . . . . . . . . . . . . . . . 1.7 W  
NT package . . . . . . . . . . . . . . . . . . . 1.3 W  
Storage temperature range, T . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . –65°C to 150°C  
stg  
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and  
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not  
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.  
NOTES: 1. The input and output voltage ratings may be exceeded if the input and output current ratings are observed.  
2. The maximum package power dissipation is calculated using a junction temperature of 150 C and a board trace length of 750 mils,  
except for the NT package, which has a trace length of zero.  
2
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
74AC11240  
OCTAL BUFFER/LINE DRIVER  
WITH 3-STATE OUTPUTS  
SCAS448A – MAY 1987 – REVISED APRIL 1996  
recommended operating conditions  
MIN NOM  
MAX  
UNIT  
V
Supply voltage  
3
2.1  
5
5.5  
V
CC  
IH  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
V
CC  
= 3 V  
V
High-level input voltage  
= 4.5 V  
= 5.5 V  
= 3 V  
3.15  
3.85  
V
V
0.9  
1.35  
1.65  
V
IL  
Low-level input voltage  
= 4.5 V  
= 5.5 V  
V
V
Input voltage  
0
0
V
V
V
I
CC  
Output voltage  
V
CC  
–4  
O
V
V
V
V
V
V
= 3 V  
CC  
CC  
CC  
CC  
CC  
CC  
I
High-level output current  
Low-level output current  
= 4.5 V  
= 5.5 V  
= 3 V  
–24  
–24  
12  
24  
24  
5
mA  
mA  
OH  
OL  
I
= 4.5 V  
= 5.5 V  
0
0
OE  
t/∆v  
Input transition rise or fall rate  
Operating free-air temperature  
ns/V  
Data  
10  
85  
T
A
–40  
°C  
electrical characteristics over recommended operating free-air temperature range (unless  
otherwise noted)  
T
A
= 25°C  
PARAMETER  
TEST CONDITIONS  
V
MIN  
MAX  
UNIT  
CC  
MIN  
2.9  
TYP  
MAX  
3 V  
2.9  
4.4  
I
= –50  
A
4.5 V  
5.5 V  
3 V  
4.4  
OH  
5.4  
5.4  
V
OH  
I
I
I
= –4 mA  
= –24 mA  
= –75 mA  
2.58  
3.94  
4.94  
2.48  
3.8  
V
OH  
OH  
OH  
4.5 V  
5.5 V  
5.5 V  
3 V  
4.8  
3.85  
0.1  
0.1  
0.1  
0.1  
I
= 50  
A
4.5 V  
5.5 V  
3 V  
OL  
0.1  
0.1  
V
OL  
I
I
I
= 12 mA  
= 24 mA  
= 75 mA  
0.36  
0.36  
0.36  
0.44  
0.44  
0.44  
1.65  
±5  
V
OL  
OL  
OL  
4.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5.5 V  
5 V  
I
I
I
V
= V or GND  
CC  
±0.5  
±0.1  
8
A
A
OZ  
O
V = V  
or GND  
or GND,  
or GND  
±1  
I
I
CC  
CC  
CC  
V = V  
I = 0  
O
80  
A
CC  
I
C
C
V = V  
4
pF  
pF  
i
I
V
= V or GND  
CC  
5 V  
10  
O
O
Not more than one output should be tested at a time, and the duration of the test should not exceed 10 ms.  
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
74AC11240  
OCTAL BUFFER/LINE DRIVER  
WITH 3-STATE OUTPUTS  
SCAS448A – MAY 1987 – REVISED APRIL 1996  
switching characteristics over recommended operating free-air temperature range,  
V
= 3.3 V ± 0.3 V (unless otherwise noted) (see Figure 1)  
CC  
T
A
= 25°C  
TYP  
7.6  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
10.5  
8.6  
t
t
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
11.7  
9.5  
12.7  
12  
PLH  
PHL  
PZH  
A
Y
Y
Y
6.3  
t
8.2  
11.6  
10.8  
7.5  
ns  
OE  
OE  
t
7.6  
PZL  
t
5.5  
7.8  
9.8  
PHZ  
ns  
t
6.7  
9.4  
PLZ  
switching characteristics over recommended operating free-air temperature range,  
= 5 V ± 0.5 V (unless otherwise noted) (see Figure 1)  
V
CC  
T
A
= 25°C  
TYP  
5.4  
FROM  
(INPUT)  
TO  
(OUTPUT)  
PARAMETER  
MIN  
MAX  
UNIT  
ns  
MIN  
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
MAX  
7.5  
6.6  
8.2  
7.7  
6.3  
7.3  
t
t
1.5  
1.5  
1.5  
1.5  
1.5  
1.5  
8.4  
7.2  
9.2  
8.7  
6.6  
7.7  
PLH  
PHL  
PZH  
A
Y
Y
Y
4.6  
t
5.7  
ns  
OE  
OE  
t
5.3  
PZL  
t
4.7  
PHZ  
ns  
t
5.2  
PLZ  
operating characteristics, V  
= 5 V, T = 25°C  
A
CC  
PARAMETER  
TEST CONDITIONS  
= 50 pF, f = 1 MHz  
L
TYP  
39  
UNIT  
Outputs enabled  
Outputs disabled  
C
Power dissipation capacitance per buffer  
C
pF  
pd  
12  
4
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
74AC11240  
OCTAL BUFFER/LINE DRIVER  
WITH 3-STATE OUTPUTS  
SCAS448A – MAY 1987 – REVISED APRIL 1996  
PARAMETER MEASUREMENT INFORMATION  
2 × V  
CC  
Open  
GND  
TEST  
S1  
S1  
t
/t  
Open  
500 Ω  
PLH PHL  
From Output  
Under Test  
t
/t  
2 × V  
CC  
GND  
PLZ PZL  
t
/t  
PHZ PZH  
C
= 50 pF  
L
500 Ω  
(see Note A)  
LOAD CIRCUIT  
Output  
V
CC  
Control  
(low-level  
enabling)  
50% V  
50% V  
CC  
CC  
0 V  
t
PZL  
V
t
PLZ  
CC  
Output  
Waveform 1  
V
CC  
Input  
50% V  
50% V  
CC  
50% V  
CC  
CC  
0 V  
20% V  
80% V  
S1 at 2 × V  
(see Note B)  
CC  
CC  
V
V
OL  
t
PHL  
t
PHZ  
t
PLH  
t
PZH  
Output  
Waveform 2  
S1 at GND  
V
OH  
OH  
0 V  
CC  
50% V  
50% V  
Output  
CC  
CC  
V
50% V  
CC  
OL  
(see Note B)  
VOLTAGE WAVEFORMS  
VOLTAGE WAVEFORMS  
NOTES: A.  
C
L includes probe and jig capacitance.  
B. Waveform 1 is for an output with internal conditions such that the output is low except when disabled by the output control.  
Waveform 2 is for an output with internal conditions such that the output is high except when disabled by the output control.  
C. All input pulses are supplied by generators having the following characteristics: PRR 1 MHz, Z = 50 , t = 3 ns, t = 3 ns.  
O
r
f
D. The outputs are measured one at a time with one input transition per measurement.  
Figure 1. Load Circuit and Voltage Waveforms  
5
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-May-2007  
PACKAGING INFORMATION  
Orderable Device  
Status (1)  
Package Package  
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)  
Qty  
Type  
SSOP  
SSOP  
Drawing  
74AC11240DBLE  
74AC11240DBR  
OBSOLETE  
ACTIVE  
DB  
24  
24  
TBD  
Call TI  
Call TI  
DB  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74AC11240DBRE4  
74AC11240DBRG4  
74AC11240DW  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
ACTIVE  
SSOP  
SSOP  
SOIC  
DB  
DB  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
24  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
DW  
DW  
DW  
DW  
DW  
DW  
NT  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74AC11240DWE4  
74AC11240DWG4  
74AC11240DWR  
74AC11240DWRE4  
74AC11240DWRG4  
74AC11240NT  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
SOIC  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
PDIP  
15  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
74AC11240NTE4  
74AC11240PW  
PDIP  
NT  
15  
Pb-Free  
(RoHS)  
CU NIPDAU N / A for Pkg Type  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
TSSOP  
PW  
PW  
PW  
PW  
PW  
PW  
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
74AC11240PWE4  
74AC11240PWG4  
74AC11240PWR  
74AC11240PWRE4  
74AC11240PWRG4  
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
60 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM  
no Sb/Br)  
(1) The marketing status values are defined as follows:  
ACTIVE: Product device recommended for new designs.  
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.  
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in  
a new design.  
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.  
OBSOLETE: TI has discontinued the production of the device.  
(2)  
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check  
http://www.ti.com/productcontent for the latest availability information and additional product content details.  
TBD: The Pb-Free/Green conversion plan has not been defined.  
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements  
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered  
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.  
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and  
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS  
Addendum-Page 1  
PACKAGE OPTION ADDENDUM  
www.ti.com  
28-May-2007  
compatible) as defined above.  
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame  
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)  
(3)  
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder  
temperature.  
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is  
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the  
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take  
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on  
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited  
information may not be available for release.  
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI  
to Customer on an annual basis.  
Addendum-Page 2  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
TAPE AND REEL INFORMATION  
*All dimensions are nominal  
Device  
Package Package Pins  
Type Drawing  
SPQ  
Reel  
Reel  
A0 (mm)  
B0 (mm)  
K0 (mm)  
P1  
W
Pin1  
Diameter Width  
(mm) W1 (mm)  
(mm) (mm) Quadrant  
74AC11240DBR  
74AC11240DWR  
74AC11240PWR  
SSOP  
SOIC  
DB  
DW  
PW  
24  
24  
24  
2000  
2000  
2000  
330.0  
330.0  
330.0  
16.4  
24.4  
16.4  
8.2  
10.75  
6.95  
8.8  
15.7  
8.3  
2.5  
2.7  
1.6  
12.0  
12.0  
8.0  
16.0  
24.0  
16.0  
Q1  
Q1  
Q1  
TSSOP  
Pack Materials-Page 1  
PACKAGE MATERIALS INFORMATION  
www.ti.com  
11-Mar-2008  
*All dimensions are nominal  
Device  
Package Type Package Drawing Pins  
SPQ  
Length (mm) Width (mm) Height (mm)  
74AC11240DBR  
74AC11240DWR  
74AC11240PWR  
SSOP  
SOIC  
DB  
DW  
PW  
24  
24  
24  
2000  
2000  
2000  
346.0  
346.0  
346.0  
346.0  
346.0  
346.0  
33.0  
41.0  
33.0  
TSSOP  
Pack Materials-Page 2  
MECHANICAL DATA  
MSSO002E – JANUARY 1995 – REVISED DECEMBER 2001  
DB (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE  
28 PINS SHOWN  
0,38  
0,22  
0,65  
28  
M
0,15  
15  
0,25  
0,09  
5,60  
5,00  
8,20  
7,40  
Gage Plane  
1
14  
0,25  
A
0°ā8°  
0,95  
0,55  
Seating Plane  
0,10  
2,00 MAX  
0,05 MIN  
PINS **  
14  
16  
20  
24  
28  
30  
38  
DIM  
6,50  
5,90  
6,50  
5,90  
7,50  
8,50  
7,90  
10,50  
9,90  
10,50 12,90  
A MAX  
A MIN  
6,90  
9,90  
12,30  
4040065 /E 12/01  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-150  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
MECHANICAL DATA  
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999  
PW (R-PDSO-G**)  
PLASTIC SMALL-OUTLINE PACKAGE  
14 PINS SHOWN  
0,30  
0,19  
M
0,10  
0,65  
14  
8
0,15 NOM  
4,50  
4,30  
6,60  
6,20  
Gage Plane  
0,25  
1
7
0°8°  
A
0,75  
0,50  
Seating Plane  
0,10  
0,15  
0,05  
1,20 MAX  
PINS **  
8
14  
16  
20  
24  
28  
DIM  
3,10  
2,90  
5,10  
4,90  
5,10  
4,90  
6,60  
6,40  
7,90  
9,80  
9,60  
A MAX  
A MIN  
7,70  
4040064/F 01/97  
NOTES: A. All linear dimensions are in millimeters.  
B. This drawing is subject to change without notice.  
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.  
D. Falls within JEDEC MO-153  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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