NPTB00004 [TE]

Gallium Nitride 28V, 5W RF Power Transistor;
NPTB00004
型号: NPTB00004
厂家: TE CONNECTIVITY    TE CONNECTIVITY
描述:

Gallium Nitride 28V, 5W RF Power Transistor

文件: 总10页 (文件大小:953K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
NPTB00004  
Gallium Nitride 28V, 5W RF Power Transistor  
®
Built using the SIGANTIC NRF1 process - A proprietary GaN-on-Silicon technology  
FEATURES  
Optimized for CW, pulsed, WiMAX, W-CDMA, LTE,  
and other applications from DC to 6GHz  
100% RF Tested at 2500MHz  
5W P3dB CW Power  
15.5dB Power Gain  
DC - 6000MHz  
5 Watt, 28 Volt  
GaN HEMT  
Low cost, surface mount SOIC package  
High reliability gold metallization process  
Lead-free and RoHS compliant  
Subject to EAR99 Export Control  
2-Tone Specifications: VDS = 28V, IDQ = 50mA, Frequency = 2500MHz, Tone spacing = 1MHz, TC = 25°C  
Measured in Nitronex Test Fixture  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
P1dB,PEP  
GSS  
Peak Envelope Power at 1dB Compression  
Small Signal Gain  
5.0  
14.5  
-
7.5  
15.5  
2.5  
60  
-
-
-
-
W
dB  
W
PIMD3  
h
Peak Envelope Power at -35dBc IMD3  
Drain Efficiency at 3dB Compression  
55  
%
RF Performance (CW): VDS = 28V, IDQ = 50mA, Frequency = 2500MHz, TC = 25°C, Measured in Nitronex  
Test Fixture  
Symbol  
P3dB  
P1dB  
h
Parameter  
Typ  
5.1  
2.9  
56  
Units  
W
Average Output Power at 3dB Compression  
Average Output Power at 1dB Compression  
Drain Efficiency at 3dB Compression  
W
%
OFDM Performance: VDS = 28V, IDQ = 100mA, Single carrier OFDM waveform 64-QAM 3/4, 8 burst, continuous frame  
data, 3.5 MHz channel bandwidth. Peak/Avg. = 10.3dB @ 0.01% probability on CCDF. Frequency = 3500MHz, POUT,AVG  
=
24dBm, TC = 25°C. Measured in Load Pull System  
Symbol  
Parameter  
Typ  
Units  
GP  
Power Gain  
11.2  
dB  
h
Drain Efficiency  
9
%
%
EVM  
Error Vector Magnitude  
1.0  
NPTB00004  
Page 1  
NDS-002 Rev 7, April 2013  
NPTB00004  
DC Specifications: TC=25°C  
Symbol  
Parameter  
Min  
Typ  
Max  
Units  
Off Characteristics  
Drain-Source Breakdown Voltage  
(VGS = -8V, ID = 2mA)  
VBDS  
IDLK  
100  
-
-
-
V
Drain-Source Leakage Current  
(VGS = -8V, VDS = 60V)  
0.5  
2
mA  
On Characteristics  
VT  
VGSQ  
RON  
ID  
Gate Threshold Voltage  
(VDS = 28V, ID = 2mA)  
-2.0  
-1.8  
-
-1.5  
-1.3  
2.0  
1.3  
-1.0  
-0.8  
2.2  
-
V
V
W
A
Gate Quiescent Voltage  
(VDS = 28V, ID = 50mA)  
On Resistance  
(VGS = 2V, ID = 15mA)  
Drain Current  
1.1  
(VDS = 7V pulsed, 300ms pulse width,  
0.2% duty cycle, VGS = 2V)  
Absolute Maximum Ratings: Not simultaneous, TC=25°C unless otherwise noted  
Units  
Symbol  
Parameter  
Max  
VDS  
VGS  
PT  
Drain-Source Voltage  
100  
-10 to 3  
7.6  
V
V
Gate-Source Voltage  
Total Device Power Dissipation (Derated above 25°C)  
Thermal Resistance (Junction-to-Case)  
Storage Temperature Range  
W
qJC  
23  
°C/W  
°C  
TSTG  
TJ  
-65 to 150  
200  
Operating Junction Temperature  
°C  
HBM  
Human Body Model ESD Rating (per JESD22-A114)  
Machine Model ESD Rating (per JESD22-A115)  
1A (>250V)  
M1(>50V)  
MM  
Moisture Sensitivity Level (per IPC/JEDEC J-STD-020): Rating of 3 at 260 °C Package Peak Temperature  
MSL  
NPTB00004  
Page 2  
NDS-002 Rev 7, April 2013  
NPTB00004  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, TA=25°C unless otherwise noted  
Table 1: Optimum Source and Load Impedances (VDS = 28V)  
Frequency  
ZS (W)  
ZL (W)  
I
(mA)  
Optimized Tuning Condtion  
DQ  
900  
1800  
2140  
2500  
3500  
900  
9.2 + j23.8  
5.2 + j0.5  
5.0 - j2.6  
52.6 + j22.8  
24.5 + j18.3  
17.1 + j15.0  
14.7 + j10.0  
11.2 + j4.7  
59.5 + j33.7  
34.5 + j48.8  
25.4 + j36.4  
12.2 + j25.8  
13.2 + j20.4  
6.6 + j10.5  
10.7 - j4.9  
50  
50  
CW Power and Efficiency  
CW Power and Efficiency  
50  
CW Power and Efficiency  
5.4 - j10.5  
5.0 - j21.0  
21.9 + j43.4  
13.1 + j24.3  
5.4 + j17.3  
4.0 + j6.8  
50  
CW Power and Efficiency  
50  
CW Power and Efficiency  
100  
100  
100  
100  
100  
100  
100  
100  
100  
100  
W-CDMA, POUT, Efficiency, -45dBc ACPR  
W-CDMA, POUT, Efficiency, -45dBc ACPR  
W-CDMA, POUT, Efficiency, -45dBc ACPR  
LTE, POUT, Efficiency, -45dBc ACPR  
OFDM, Maximum POUT, 1.5% EVM  
OFDM, Maximum POUT, 1.5% EVM  
OFDM, Maximum POUT, 1.5% EVM  
OFDM, Maximum POUT, 1.5% EVM  
OFDM, Maximum POUT, 1.5% EVM  
OFDM, Maximum POUT, 1.5% EVM  
1800  
2140  
2600  
2500  
3500  
5100  
5200  
5700  
5800  
5.0 + j16.2  
4.1 - j0.6  
17.8 - j16.4  
21.5 - j29.0  
10.2 - j13.2  
11.0 - j16.3  
11.9 - j4.8  
11.3 - j17.0  
12.1 - j15.3  
ZS is the source impedance  
presented to the device.  
ZL is the load impedance  
presented to the device.  
Figure 1 - Impedances for Optimum CW Power, VDS = 28V, IDQ = 50mA  
NPTB00004  
Page 3  
NDS-002 Rev 7, April 2013  
NPTB00004  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =50mA, TA=25°C unless otherwise noted.  
DQ  
Figure 3 - Typical CW Performance  
Figure 2 - Typical CW Performance  
Frequency = 2500MHz  
Frequency = 900MHz  
Figure 5 - Typical CW Performance  
Figure 4 - Typical CW Performance  
Frequency = 900 to 3500MHz  
Frequency = 3500MHz  
Figure 6 - Typical CW Performance  
Figure 7 - Typical OFDM Performance  
Over Temperature, Frequency = 2500MHz  
I
DQ = 100mA, Frequency = 2500MHz  
NPTB00004  
Page 4  
NDS-002 Rev 7, April 2013  
NPTB00004  
Load-Pull Data, Reference Plane at Device Leads  
VDS=28V, I =50mA, TA=25°C unless otherwise noted.  
DQ  
Figure 8 - Typical OFDM Performance  
Figure 9 - Typical W-CDMA Performance  
IDQ = 100mA, Frequency = 3500MHz  
IDQ = 100mA, Frequency = 900MHz  
Figure 11 - Typical W-CDMA Performance  
Figure 10 - Typical W-CDMA Performance  
IDQ = 100mA, Frequency = 2140MHz  
IDQ = 100mA, Frequency = 1800MHz  
Figure 12 - Typical LTE Performance  
I
DQ = 100mA, Frequency = 2600MHz  
NPTB00004  
Page 5  
NDS-002 Rev 7, April 2013  
NPTB00004  
Typical Device Characteristics  
VDS=28V, I =50mA, TA=25°C unless otherwise noted.  
DQ  
Figure 14 - MTTF of NRF1 Devices as a  
Function of Junction Temperature  
Figure 13 - Power Derating Curve  
Figure 15 - Quiescient Gate Voltage (VGSQ  
)
Required to Reach IDQ = 50mA as a  
Function of Ambient Temperature  
NPTB00004  
Page 6  
NDS-002 Rev 7, April 2013  
NPTB00004  
Figure 16 - APP-NPTB00004-25 2500MHz Demonstration Board  
Figure 17 - APP-NPTB00004-25 2500MHz Demonstration Board Equivalent Circuit  
NPTB00004  
Page 7  
NDS-002 Rev 7, April 2013  
NPTB00004  
Table 2: APP-NPTB00004-25 2500MHz Demonstration Board Bill of Materials  
Name  
Value  
10uF  
Tolerance  
20%  
10%  
10%  
10%  
10%  
5%  
Vendor  
AVX  
Vendor Number  
TAJA106M016R  
12101C105KAT2A  
GRM188R72A104KA35D  
06031C103KAT2A  
06031C102KAT2A  
ATC600F330B  
C1  
C2  
1uF  
AVX  
C3  
0.1uF  
Murata  
AVX  
C4  
0.01uF  
0.001uF  
33pF  
C5  
AVX  
C6  
ATC  
C7  
100uF  
1uF  
20%  
10%  
10%  
10%  
10%  
5%  
Panasonic  
AVX  
ECE-V1JA101P  
C8  
C9  
12101C105KAT2A  
GRM188R72A104KA35D  
06031C103KAT2A  
06031C102KAT2A  
ATC600F330B  
0.1uF  
Murata  
AVX  
C10  
0.01uF  
0.001uF  
33pF  
C11  
AVX  
C12  
ATC  
C13  
2.7pF  
10pF  
+/- 0.1pF  
1%  
ATC  
ATC600F2R7B  
C14  
ATC  
ATC600F100B  
C15  
0.8pF  
3.3pF  
200 ohm  
0 ohm  
0.033 ohm  
--  
+/-0.1pF  
+/-0.1pF  
1%  
ATC  
ATC600F0R8B  
C16  
ATC  
ATC600F3R3B  
R1  
Panasonic  
Panasonic  
Panasonic  
Alberta Printed Circuits  
Rogers  
ERJ-2GEJ201X  
R3, R5  
R4  
--  
ERJ-2GE0R00X  
ERJ-6BWJR033W  
NBD-012_Rev1  
1%  
NBD-012_Rev1  
Substrate  
--  
R04350, t = 30mil er = 3.5  
NPTB00004  
Page 8  
NDS-002 Rev 7, April 2013  
NPTB00004  
1
Ordering Information  
Part Number  
Order Multiple Description  
NPTB00004DT  
NPTB00004DR  
97  
Tube; NPTB00004 in D (PSOP2) Package  
1500  
Tape and Reel; NPTB00004 in D (PSOP2) Package  
1: To find a Nitronex contact in your area, visit our website at http://www.nitronex.com  
D Package Dimensions and Pinout  
Inches  
Min  
Millimeters  
Dim  
Max  
0.196  
0.157  
0.123  
0.087  
0.244  
Min  
Max  
4.98  
3.99  
3.12  
2.21  
6.19  
A
A
B
0.189  
0.150  
0.107  
0.071  
0.230  
4.80  
3.81  
2.72  
1.80  
5.84  
C
1. NC  
C
D
E
8
1
7
6
3
5
4
2. Gate  
3. Gate  
4. NC  
5. NC  
D
B
E
9
6. Drain  
f
0.050 BSC  
1.270 BSC  
D/2  
7. Drain  
F
0.0138  
0.055  
0.000  
0.0075  
0.016  
0°  
0.0192  
0.061  
0.004  
0.0098  
0.035  
8°  
0.35  
1.40  
0.00  
0.19  
0.41  
0°  
0.49  
1.55  
0.10  
0.25  
0.89  
8°  
8. NC  
2
9. Source Pad  
G
G1  
H
L
(Bottom)  
A/2  
Chamfer  
H
G
m
G1  
SEATING  
PLANE  
m
L
SEATING PLANE  
F
(8X)  
f
(6X)  
Mounting Footprints  
.150  
.055  
.105  
.100  
Solder Paste  
.020" X .040"  
(8X Typ)  
R.016 (4X Typ)  
.140 .145 .176  
.180  
Solder Paste  
.080" X .120"  
(Typ)  
Heat Sink  
.030  
Pedestal  
Solder Mask  
.005" Relief  
(Typ)  
PWB Pad  
(8X Typ)  
PWB Cutout  
NPTB00004  
Page 9  
NDS-002 Rev 7, April 2013  
NPTB00004  
Nitronex, LLC  
2305 Presidential Drive  
Durham, NC 27703 USA  
+1.919.807.9100 (telephone)  
+1.919.807.9200 (fax)  
info@nitronex.com  
www.nitronex.com  
Additional Information  
This part is lead-free and is compliant with the RoHS directive  
(Restrictions on the Use of Certain Hazardous Substances in Electrical and Electronic Equipment).  
Important Notice  
Nitronex, LLC reserves the right to make corrections, modifications, enhancements, improvements and other changes to  
its products and services at any time and to discontinue any product or service without notice. Customers should obtain  
the latest relevant information before placing orders and should verify that such information is current and complete. All  
products are sold subject to Nitronex terms and conditions of sale supplied at the time of order acknowledgment. The latest  
information from Nitronex can be found either by calling Nitronex at 1-919-807-9100 or visiting our website at  
www.nitronex.com.  
Nitronex warrants performance of its packaged semiconductor or die to the specifications applicable at the time of sale in  
accordance with Nitronex standard warranty. Testing and other quality control techniques are used to the extent Nitronex  
deems necessary to support the warranty. Except where mandated by government requirements, testing of all parameters  
of each product is not necessarily performed.  
Nitronex assumes no liability for applications assistance or customer product design. Customers are responsible for their  
product and applications using Nitronex semiconductor products or services. To minimize the risks associated with  
customer products and applications, customers should provide adequate design and operating safeguards.  
Nitronex does not warrant or represent that any license, either express or implied, is granted under any Nitronex patent right,  
copyright, mask work right, or other Nitronex intellectual property right relating to any combination, machine or process in  
which Nitronex products or services are used.  
Reproduction of information in Nitronex data sheets is permitted if and only if said reproduction does not alter any of the  
information and is accompanied by all associated warranties, conditions, limitations and notices. Any alteration of the  
contained information invalidates all warranties and Nitronex is not responsible or liable for any such statements.  
Nitronex products are not intended or authorized for use in life support systems, including but not limited to surgical  
implants into the body or any other application intended to support or sustain life. Should Buyer purchase or use Nitronex,  
LLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold Nitronex, LLC, its  
ofcers, employees, subsidiaries, affiliates, distributors, and its successors harmless against all claims, costs, damages,  
and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death  
associated with such unintended or unauthorized use, notwithstanding if such claim alleges that Nitronex was negligent  
regarding the design or manufacture of said products.  
Nitronex and the Nitronex logo are registered trademarks of Nitronex, LLC.  
All other product or service names are the property of their respective owners.  
©Nitronex, LLC 2012. All rights reserved.  
NPTB00004  
Page 10  
NDS-002 Rev 7, April 2013  

相关型号:

NPTB00004A

Next generation high power RF semiconductor technology
TE

NPTB00004A_15

DC-6 GHz HEMT
TE

NPTB00004D

Next generation high power RF semiconductor technology
TE

NPTB00004_15

5W RF Power Transistor
TE

NPTB00025

Gallium Nitride 28V, 25W RF Power Transistor
TE

NPTB00025AB

Next generation high power RF semiconductor technology
TE

NPTB00025B

Next generation high power RF semiconductor technology
TE

NPTB00025_15

25W RF Power Transistor
TE

NPTB00050

Gallium Nitride 28V, 50W RF Power Transistor
TE

NPTB00050_15

50W RF Power Transistor
TE

NPTC021KFXD-RC

CONN HEADER .100" 2POS
ETC

NPTC022KFMP-RC

CONN HEADER .100" 4POS
ETC