MA4SPS552-T [TE]
Surface Mount Monolithic PIN Diode Chip; 表面贴装单片PIN二极管芯片
| 型号： | MA4SPS552-T |
| 厂家： | 
TE CONNECTIVITY |
| 描述： | Surface Mount Monolithic PIN Diode Chip |
| 文件： | 总6页 (文件大小：155K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
Surface Mount Monolithic
PIN Diode Chip
V 1.00
Features
Case Style ODS-1281
n
n
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n
n
n
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Surface Mount Device
No Wirebonds Required
Rugged Silicon-Glass Construction
Silicon Nitride Passivation
Polymer Scratch Protection
A
Low Parasitic Capacitance and Inductance
High Power Handling (Efficient Heatsinking)
B
Description
This device is a silicon-glass PIN diode chip fabricated with
M/A-COM’s patented HMIC process. This device features
two silicon pedestals embedded in a low loss glass. The diode
is formed on the top of one pedestal and connections to the
backside of the device are facilitated by making the pedestal
sidewalls conductive. Selective backside metalization is
applied producing a surface mount device. The topside is fully
encapsulated with silicon nitride and has an additional polymer
layer for scratch protection. These protective coatings prevent
damage to the junction and the anode air-bridge during
handling and assembly.
C
D
E
F
Applications
These packageless devices are suitable for usage in moderate
incident power (5 W C.W.) or higher incident peak power
(200 W) series, shunt, or series-shunt switches. Small parasitic
inductance, 0.7 nH, and excellent RC time constant, 0.20 pS,
make the devices ideal for wireless TR switch and accessory
switch circuits, where higher P1dB and IP3 values are required.
G
These diodes can also be used in p, T, tapered resistance, and
switched-pad attenuator control circuits for 50W or 75W
systems.
Absolute Maximum Ratings1
@ TA = +25°C (unless otherwise specified)
Millimeters
Dim
Inches
Parameter
Forward Current
Absolute Maximum
Min.
Max.
Min.
Max.
A
B
C
D
E
F
0.0207
0.0108
0.0040
0.0069
0.0018
0.0061
0.0069
0.0226
0.0128
0.0080
0.0089
0.0037
0.0081
0.0089
0.525
0.275
0.102
0.175
0.045
0.155
0.175
0.575
100 mA
-200 V
0.325
0.203
0.225
0.095
0.205
0.225
Reverse Voltage
-65 °C to +150 °C
-65 °C to +150 °C
Operating Temperature
Storage Temperature
Junction Temperature
Dissipated RF & DC Power
Mounting Temperature
G
+175 °C
1 W
1. Backside metal: 0.1 micron thk.
2. Hatched areas indicate bond pads.
+235 °C for 10 seconds
1. Exceeding these limits may cause permanent damage.
MA4SPS552 SurMount TM Series
Surface Mount PIN Diode Chip
Electrical Specifications: @ +25 °C
V 1.00
Symbol
Parameter
Conditions
Units
Min.
Typ.
Max.
CT
Total
-40 V, 1 MHz
pF
0.08
0.14
Capacitance
CT
RS
RS
Total
Capacitance
-40 V, 1 GHz
100 mA, 100 MHz
20 mA, 100 MHz
pF
W
W
0.06
1.7
Series
Resistance
Series
2.4
Resistance
VF
VF
VR
IR
Forward Voltage
Forward Voltage
Reverse Voltage
100 mA
10 mA
V
V
1.00
0.86
1.25
1.00
V
l -200 l
l -275 l
l -10 l
-10 mA
Reverse Leakage
Current
-40 V
nA
Thermal
Resistance
Steady State
°C/W
µs
30
RqJL
TL
Minority Carrier
Lifetime
(50% - 90% V)
+10 mA / -6 mA
2.5
Handling Procedures
When soldering these devices to a hard substrate, hot gas
die bonding is preferred. We recommend utilizing a
vacuum tip and a force of 60 to 100 grams applied
normal to the top surface of the device. When soldering
to soft substrates, it is recommended to use a lead-tin
interface at the circuit board mounting pads. Position
the die so that its mounting pads are aligned with the
circuit board’s mounting pads and reflow the solder by
heating the circuit trace near the mounting pad while
applying 60 to 100 grams of force perpendicular to the
top surface of the die.
All semiconductor chips should be handled with care to avoid
damage or contamination from perspiration and skin oils.
The use of plastic tipped tweezers or vacuum pickups is
strongly recommended for individual components. Bulk
handling should insure that abrasion and mechanical shock
are minimized.
Bonding Techniques
Attachment to a circuit board is made simple through the use
of surface mount technology.
Mounting pads are
conveniently located on the bottom surface of these diodes
and are removed from the active junction locations. These
devices are well suited for solder attachment onto hard and
soft substrates. The use of 80/20 Au/Sn and 60/40 Sn/Pb
solder is recommended, with an equal temperature profile
across the contacts. Conductive epoxy paste for attachment
may also be used.
Since the HMIC™ glass is transparent, the edges of the
mounting pads closest to each other can be visually
inspected through the die after attach is completed.
2
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
MA4SPS552 SurMount TM Series
Surface Mount PIN Diode Chip
V 1.00
Capacitance vs Frequency
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
0V
-5V
-40V
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
1.00
Frequency ( GHz )
Capacitance vs Voltage
0.20
0.18
0.16
0.14
0.12
0.10
0.08
0.06
0.04
100 MHz
1 GHz
0.0
5.0
10.0
15.0
20.0
25.0
30.0
35.0
40.0
Voltage ( V )
3
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
MA4SPS552 SurMount TM Series
Surface Mount PIN Diode Chip
V 1.00
Rs vs I
100.0
1GHz
10.0
100MHz
1.0
0.01
0.10
1.00
10.00
100.00
I ( mA )
Rs vs Frequency
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0.0
10mA
20mA
50mA
100mA
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
Frequency (GHz)
4
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
MA4SPS552 SurMount TM Series
Surface Mount PIN Diode Chip
V 1.00
Parallel Resistance vs V
1.0E+06
100MHz
1.0E+05
1.0E+04
1.0E+03
1GHz
0.0
-5.0
-10.0
-15.0
-20.0
-25.0
-30.0
-35.0
-40.0
Reverse Bias ( -V )
5
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
MA4SPS552 SurMount TM Series
Surface Mount PIN Diode Chip
SURMOUNT PIN Diode Model
V 1.00
Cp
Rp
W
Rvia = 0.05
W
Rvia = 0.05
_
Rs = Rp + 2 * Rvia
+
Ordering Information
Part Number
Package
MA4SPS552
Die in Carrier
Tape/Reel
Wafer on Frame
MA4SPS552-T
MA4SPS552-W
6
n North America: Tel. (800) 366-2266
n Asia/Pacific: Tel.+81-44-844-8296, Fax +81-44-844-8298
n Europe: Tel. +44 (1908) 574 200, Fax+44 (1908) 574 300
M/A-COM Inc. and its affiliates reserve the right to make changes to the product(s)
or information contained herein without notice.
Visit www.macom.com for additional data sheets and product information.
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