U3280M-MFB [TEMIC]

Telecom Circuit, 1-Func, PDSO16, SSO-16;
U3280M-MFB
型号: U3280M-MFB
厂家: TEMIC SEMICONDUCTORS    TEMIC SEMICONDUCTORS
描述:

Telecom Circuit, 1-Func, PDSO16, SSO-16

电信 光电二极管 电信集成电路
文件: 总17页 (文件大小:143K)
中文:  中文翻译
下载:  下载PDF数据表文档文件
Features  
Contactless power supply and communication interface  
Up to 10 kbaud data rate (R/O)  
Power management for contactless- and battery power supply  
Frequency range 100 to 150 kHz  
32 x 16-bit EEPROM  
Two wire serial interface  
Shift register supported Biphase and Manchester modulator stage  
Reset I/O line  
Field clock extractor  
Field and gap detection output for wake up and data reception  
Field modulator with energy-saving damping stage  
Transponder  
Interface for  
Microcontroller  
Applications  
Overview  
- Access control  
- Telemetry  
- Wireless sensors  
Par example:  
U3280M  
Wireless passive access and active alarm control for protection of valuables  
Contactless position sensors for alignments of machines  
Contactless status verification and/ or data readout from sensors  
Description  
The U3280M IC is a transponder interface which enables contactless ID systems,  
remote control systems, tag and sensor applications. It is able to supply a microcon-  
troller with power from an RF field via a LC-resonant circuit and it enables the  
controller for contactless bidirectional data communication via this RF field. It includes  
a power management which handles switching between magnetic field and battery  
power supply. To store permanent data like identifiercode and configuration data the  
U3280M includes a 512-bit EEPROM with an serial interface .  
Block Diagram  
Figure 1.  
VBatt  
U3280M Transponder interface  
Sensors, keys, displays, actuators  
Energy  
VField  
regulator  
Power  
management  
NRST  
VDD  
Damping  
stage  
Coil 1  
Coil 2  
512-bit  
EEPROM  
memory  
Rectifier  
Low power  
microcontroller  
SDA  
SCL  
Serial  
interface  
Field/gap  
detect  
Biphase  
modulator  
Clock  
extractor  
Data  
>_1  
VSS  
MOD  
NGAP  
FC  
Transmit data  
Receive data/ field detected  
Field clock  
Rev. A4, 11-Dec-01  
1 (17)  
Ordering Information  
Extended Type Number  
Package  
Remarks  
U3280MMFB  
SSO16  
SSO16  
Tube  
U3280MMFBG3  
Taped and reeled  
Pin Configuration  
Figure 2.  
VBatt  
1
16  
15  
14  
13  
12  
11  
10  
9
Coil 2  
VDD  
SCL  
NRST  
SDA  
VSS  
n.c.  
2
3
4
5
6
7
8
Coil 1  
n.c.  
n.c.  
n.c.  
n.c.  
NGAP  
MOD  
FC  
Pin Description  
Pin  
Symbol  
Function  
1
V
Power supply voltage input to connect a battery  
Batt  
2
V
Power supply voltage for the µC and EEPROM. At this pin a buffer capacitor (0.5... 10 µF) must be  
connected to buffer the voltage during field supply and to block the VDD of the mC.  
DD  
3
4
SCL  
NRST  
SDA  
Serial clock line  
Reset line bidirectional  
5
Serial data line  
6
V
Circuit ground  
SS  
7
n.c.  
FC  
Not connected  
8
Field clock output of the front end clock extractor  
9
MOD  
NGAP  
n.c.  
Modulation input  
10  
11  
12  
13  
14  
15  
16  
Gap and field detect output  
Not connected  
n.c.  
Not connected  
n.c.  
Not connected  
n.c.  
Not connected  
Coil 1  
Coil 2  
Coil input 1. Pin to connect a resonant circuitry for communication and field supply  
Coil input 2, see above  
2 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
Functional Description  
The Transponder  
Interface  
The U3280M is a transponder interface IC which is able to operate microcontrollers  
wireless and battery-independent. Wireless data communication and power supply are  
handled via an electromagnetic field and the coil antenna of the transponder interface.  
The U3280M consists of a rectifier stage for the antenna, a power management to han-  
dle field and battery power supply, a damping modulator and a field-gap detection stage  
for contactless data communication, further a field clock extraction and an EEPROM are  
on the chip.  
The internal rectifier stage rectifies the AC from the LC-resonant circuit at the coil inputs  
and supplies the U3280M device and an additional microcontroller device with power. It  
is also possible to supply the device via the VBatt input with DC from a battery. The  
power management handles switching between battery supply (VBatt pin) and field sup-  
ply automatically. It switches to field supply if a field is applied at the coil and it switches  
back to battery if the field is removed. The voltage from the coil or the VBatt pin is output  
at the VDD pin to supply the microcontroller or any other suited device. At the VDD pin a  
capacitor must be connected to smooth and buffer the supply voltage. This capacitor is  
also necessary to buffer the supply voltage during the communication (damping and  
gaps in the field).  
For communication, the chip contains a damping stage and a gap-detect circuitry. By  
means of the damping stage the coil voltage can be modulated to transmit data via the  
field. It can be controlled with the modulator input (MOD pin) via the microcontroller. The  
gap-detection circuitry detects gaps in the field and outputs the gap/field signal at the  
gap-detect output (Pin NGAP).  
For the storage of data like keycodes, identifiers and configuration bits a 512-bit  
EEPROM is available on the chip. It can be read and written by the microcontroller via  
an I2C compatible two-wire serial interface.  
The serial interface, the EEPROM and the microcontroller are supplied with the voltage  
at the VDD pin. That means the microcontroller can read and write the EEPROM if the  
supply voltage at VDD is in the operating range of the IC.  
The U3280M has build in operating modes to support a wide range of applications.  
These modes can be activated via the serial interface with special mode control bytes.  
To support applications with battery supply only, the power management can be  
switched off by software to disable the automatic switching to field supply.  
An on-chip Biphase and Manchester modulator can be activated and controlled by the  
serial interface. If this modulator is used it modulates the serial data stream at the serial  
inputs SDA and SCL into a Biphase or Manchester coded signal for the damping stage.  
Modulation  
The transponder interface can modulate the magnetic field by its damping stage to  
transmit data to a base station. It modulates the coil voltage by varying the coils load.  
The modulator can be controlled via the MOD pin. A high level (1) increases the cur-  
rent into the coil and damps the coil voltage. A low level (0) decreases the current and  
increases the coil voltage. The modulator generates a voltage stroke of about 2 V at  
pp  
the coil. A high level at the MOD pin makes the maximum of the field energy available at  
VDD. During a reset a high level at the MOD pin causes the optimum conditions for  
starting the device and charging the capacitor at VDD after the field is applied at the coil.  
Digital input to control the damping stage (MOD)  
MOD = 0: coil not damped  
3 (17)  
Rev. A4, 11-Dec-01  
V
= VDD x 2 + V  
= V  
CU  
coil-peak  
CMS  
MOD = 1: coil damped  
V
= VDD x 2 = V  
coil-peak  
CD  
V
= V  
: modulation voltage stroke @ coil inputs  
CID  
CMS  
Note:  
If the automatic power management is disabled, the internal front end V is limited at  
DD  
V
. In this case the value V must be used in the above formula.  
DDC DDC  
Field Clock  
Gap Detect  
The field clock extractor of the interface makes the field clock available for the microcon-  
troller. It can be used to supply timer inputs to synchronize modulation and  
demodulation with the field clock.  
The transponder interface can also receive data. The base station modulates the data  
with short gaps in the field. The gap-detection circuit detects these gaps in the magnetic  
field and outputs the NGAP/field signal at the NGAP pin. A high level indicates that a  
field is applied at the coil and a low level indicates a gap or that the field is off. The  
microcontroller must demodulate the incoming data stream at one of its inputs.  
U3280M Signals and Timing  
Figure 3. Modulation  
MOD  
V
CU  
V
V
CMS  
CD  
Coil inputs  
Figure 4. GAP and Modulation Timing  
t
t
FGAP0  
FGAP1  
Gap detection and battery to field switching  
V
FDON  
V
FDOFF  
Coil inputs  
1. edge used as wakeup signal  
NGAP  
Field clock FC  
Power management  
Battery  
supply  
Battery supply  
Coil supply if automatically power management is enabled  
t
BFS  
t
FBS  
4 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
Digital output of the gap–detection stage (NGAP)  
NGAP = 0: gap detected / no field  
V
= V  
COIL_peak  
COIL-peak  
FDoff  
NGAP = 1: field detected  
V
= V  
FDon  
Note:  
No amplifier is used in the gap-detection stage. A digital Schmitt trigger evaluates the  
rectified and smoothed coil voltage.  
Wake-up Signal  
If a field is applied at the coil of the transponder interface the microcontroller can be  
woken up with the wake signal at the NGAP pin. For that purpose the NGAP pin must be  
connected to an interrupt input of the microcontroller. A high level at the NGAP output  
indicates an applied field and can be used as wake signal for the microcontroller via an  
interrupt. The wake signal is generated if the power management switches to field sup-  
ply. The field-detection stage of the power management has lowpass characteristics to  
avoid generating of wake signals and unnecessary switching between battery and field  
supply in case of interferences at the coil inputs.  
Power Supply  
The U3280M has a power management that handles two power supply sources. Nor-  
mally the IC is supplied by a battery at the VBatt pin. If a magnetic field is applied at the  
LC-resonant circuit of the device the field detection circuit switches automatically from  
VBatt to field supply.  
The VDD pin is used to connect a capacitor to smooth the voltage from the rectifier and  
to buffer the power while the field is modulated by gaps and damping. The EEPROM  
and the connected controller always operate with the voltage at the VDD pin.  
Note:  
During field supply the maximum energy from the field is used if a high level is applied at  
the MOD input!  
Automatic Power  
Management  
There are different conditions to switch from the battery to field and back from field to  
the battery.  
The power management switches from battery to field if the rectified voltage (Vcoil) from  
the coil inputs becomes higher than the field-on-detection voltage (V  
), even if no  
FDon  
battery voltage is available (0 < VBatt < 1.8 V). It switches back to battery if the coil volt-  
age becomes lower than the field-off-detection voltage (V ).  
FDoff  
The field detection stage of the power management has lowpass characteristics to sup-  
press noise. An applied field needs a time delay t (battery-to-field switch delay) to  
BFS  
change the power supply. If the field is removed from the coil, the power management  
will generate a reset that can be connected to the microcontroller.  
Figure 5. Switch conditions for the power management  
VCoil > VFDon for t > tBFS  
Battery  
Field  
supply  
supply  
(VBatt  
)
VCoil < VFDon for t > tBFS  
Note:  
The rectified supply voltage from the coil is limited to V  
DDC  
(2.9 V). During field supply  
the battery is switched off and V  
changes to V .  
DD  
DDC  
5 (17)  
Rev. A4, 11-Dec-01  
Controlling the Power  
Management via the Serial  
Interface  
The automatic mode of the power management can be switched off and on by a com-  
mand from the microcontroller. If the automatic mode is switched off the IC is always  
supplied by the battery up to the next power-on reset or to a switch on command. The  
power management-on and -off command must be transferred via the serial interface.  
If the power managment is switched off and the device is supplied from the battery it can  
communicate via the field without load the field. This mode can be used to realize appli-  
cations with battery supply if the field is to weak to supply the IC with power.  
Buffer Capacitor C  
The buffer capacitor connected at VDD is used to buffer the supply voltage for the  
microcontroller and the EEPROM during field supply. It smoothes the rectified AC from  
the coil and buffers the supply voltage during modulation and gaps in the field. The size  
of this capacitor depends on the application. It must be of a dimension so that during  
modulation and gaps the ripple on the supply voltage is in the range of 100 mV to  
300 mV. During gaps and damping the capacitor is used to supply the device, that  
means the size of the capacitor depends on the length of the gaps and damping cycles.  
B
Example: for a supply current 350 µA, 200 mV ripple @ V  
DD  
Necessary C  
No Field Supply During  
B
250 µs  
500 µs  
470 nF  
1000 nF  
Serial Interface  
The transponder interface has an I2C like serial interface to the microcontroller for read  
and write accesses to the EEPROM. In a special mode the serial interface can also be  
used to control the Biphase/ Manchester modulator or the ower management of the  
U3280M.  
The serial interface of the U3280M device must be controlled by a master device (nor-  
mally the microcontroller) which generates the serial clock and controls the access via  
the SCL and SDA line. SCL is used to clock the data in and out of the device. SDA is a  
bidirectional line and used to transfer data into and out of the device. The following pro-  
tocol is used for the data transfers.  
Serial Protocol  
Data states on the SDA line changing only during SCL is low.  
Changes in the SDA line while SCL is high will be interpreted as START or STOP  
condition.  
A STOP condition is defined as high-to-low transition on the SDA line while the SCL  
line is high.  
Each data transfer must be initialized with a START condition and terminated with a  
STOP condition. The START condition wakes the device from standby mode and the  
STOP condition returns the device to standby mode.  
A receiving device generates an acknowledge (A) after the reception of each byte.  
For that the master device must generate an extra clock pulse. If the reception was  
successfull the receiving master or slave device pulls down the SDA line during that  
clock cycle. If in transmit mode an acknowledge is not detected (N) by the interface,  
it will terminate further data transmissions and will go into receive mode. A master  
device must finish its read operation by a not acknowledge and then issue a stop  
condition to place the device into a known state.  
6 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
Figure 6. Serial protocol  
SCL  
SDA  
Stand Start  
by condition  
Data  
valid  
Data  
Data/  
Stop Stand-  
condition by  
changeacknowledge  
valid  
13884  
Control Byte Format  
Mode control  
bits  
Read/  
NWrite  
EEPROM address  
A3 A2 A1  
Start  
A4  
A0  
C1  
C0  
R/NW  
Ackn  
The control byte follows the start condition and consists of the 5-bit row address, 2 mode  
control bits and the read/not-write bit.  
Data Transfer Sequence  
Start  
Control byte  
Ackn  
Data byte  
Ackn  
Data byte  
Ackn  
Stop  
Before the start condition and after the stop condition the device is in standby mode  
and the SDA line is switched as input with pull-up resistor.  
The start condition follows a control byte that determines the following operation. Bit  
0 of the control byte is used to control the following transfer direction. A 0defines a  
write access and a 1a read access.  
EEPROM  
The EEPROM has a size of 512 bit and is organized as 32 × 16 bit matrix. To read and  
write data to and from the EEPROM serial interface must be used. The interface sup-  
ports one and two byte write accesses and one to n-byte read accesses to the  
EEPROM.  
EEPROM - Operation  
Modes  
The operating modes of the EEPROM are defined via the control byte. The control byte  
contains the row address, the mode control bits and the read/not-write bit, that is used to  
control the direction of the following transfer. A 0defines a write access and a 1a  
read access. The five address bits select one of the 32 rows of EEPROM memory to be  
accessed. For all accesses the complete16-bit word of the selected row is loaded into a  
buffer. The buffer must be read or overwritten via the serial interface. The two mode  
control bits C1 and C2 define in which order the accesses to the buffer are performed:  
High byte low byte or low byte high byte. The EEPROM supports also autoincrement  
and autodecrement read operations. After sending the start address with the corre-  
sponding mode consecutive memory cells can be read row by row without transmission  
of the row addresses.  
Two special control bytes allow to initialize the complete EEPROM with 0or with 1.  
7 (17)  
Rev. A4, 11-Dec-01  
Write Operations  
The EEPROM permits 8-bit and 16-bit write operations. A write access starts with the  
START condition followed by writing a write control byte and one or two data bytes from  
the master. It is complete with the STOP condition from the master after the acknowl-  
edge cycle.  
If the EEPROM receives the control byte it loads the addressed memory cell into a 16-  
bit read/write buffer. The following data bytes overwrites the buffer. The internal  
EEPROM programming cycle is started by a stop condition after the first or second data  
byte. During the programming cycle the addressed EEPROM cells are cleared and the  
contents of the buffer is written back to the into the EEPROM cells. The complete erase-  
write cycle takes about 10 ms.  
Acknowledge polling  
If the EEPROM is busy with an internal write cycle all inputs are disabled and the  
EEPROM will not acknowledge until the write cycle is finished. This can be used to  
determine when the write cycle is complete. The master must perform acknowledge  
polling by sending a start condition followed by the control byte. If the device is still busy  
with the write cycle, it will not return an acknowledge and the master has to generate a  
stop condition or perform further acknowlege polling sequencies.  
If the cycle is complete, it returns an acknowledge and the master can then proceed with  
the next read or write cycle.  
Write One Data Byte  
Start  
Control byte  
Control byte  
A
A
Data byte 1  
Data byte 1  
A
A
Stop  
Write Two Data Bytes  
Start  
Data byte 2  
A
Stop  
Write Control Byte Only  
Start  
Control byte  
A
Stop  
A -> acknowledge  
Write Control Bytes  
Write low byte first  
MSB  
A4  
LSB  
R/NW  
0
A3  
A2  
A1  
A0  
C1  
0
C0  
1
Row address  
Byte order  
LB(R)  
HB(R)  
MSB  
A4  
LSB  
R/NW  
0
Write high byte first  
Byte order  
A3  
A2  
A1  
A0  
C1  
1
C0  
0
Row address  
HB(R)  
LB(R)  
HB: high byte; LB: low byte; R: row address  
8 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
Read Operations  
The EEPROM allows byte-, word- and current address read operations. The read oper-  
ations are initiated in the same way as write operations. Every read access is initiated by  
sending the start condition followed by the control byte which contains the address and  
the read mode. After the device receives a read command it returns an acknowledge,  
loads the addressed word into the read\write buffer and sends the selected data byte to  
the master. The master has to acknowledge the received byte if it wants to proceed the  
read operation. If two bytes are read out from the buffer the device increments respec-  
tively decrements the word address automatically and loads the buffer with the next  
word. The read mode bits determines if the low or high byte is read first from the buffer  
and if the word address is incremented or decremented for the next read access. If the  
memory address limit is reached, the data word address will roll overand the sequen-  
tial read will continue. The master can terminate the read operation after every byte by  
not responding with an acknowledge (N) and by issuing a stop condition.  
Read One Data Byte  
Start  
Control byte  
Control byte  
Data byte 1  
A
Data byte 1  
Data byte 1  
N
Stop  
Read Two Data Bytes  
Start  
A
A
Data byte 2  
N
Stop  
Read n Data Bytes  
Start  
Control byte  
A
A
Data byte 2  
A
- - - - - -  
Data byte n  
N
Stop  
A -> acknowledge, N -> no acknowledge  
Read Control Bytes  
MSB  
LSB  
R/NW  
1
Read low byte first,  
address increment  
A4  
A3  
A2  
A1  
A0  
C1  
0
C0  
1
Row address  
Byte order  
LB(R)  
HB(R)  
LB(R+1)  
HB(R+1)  
- - - -  
LB(R+n)  
HB(R+n)  
MSB  
A4  
LSB  
R/NW  
1
Read high byte first  
address decrement  
A3  
A2  
A1  
A0  
C1  
1
C0  
0
Row address  
Byte order  
HB(R)  
LB(R)  
HB(R-1)  
LB(R-1)  
- - - -  
HB(R-n)  
LB(R-n)  
HB: high byte; LB: low byte; R: row address  
Initilization after a Reset  
Condition  
The EEPROM with the serial interface has ist own reset circuitry. In systems with micro-  
controllers that have their own reset circuitry for power-on reset , watchdog reset or  
9 (17)  
Rev. A4, 11-Dec-01  
brown-out reset, it may be necessary to bring the U3280M into a known state indepen-  
dent on the internal reset. This is performed by reading one byte without acknowledging  
and then generating a stop condition.  
Special Modes  
Control Byte  
1100x111b  
1101x111b  
Description  
Biphase modulation  
Manchester modulation  
Switch power managment off -> disables switching from battery to field  
supply  
11xx0111b  
Switch power managment on -> enables automatical switching  
between battery and field supply  
11xx1111b  
xxxxx110b  
Reserved  
Data Transfer Sequence for Biphase and Manchester Modulation:  
Start Control byte Ackn Bit 1 Bit 2 Bit 3 - - - - - - - - - - -  
Bit n  
Stop  
With special control bytes the serial interface can be used to control the modulator stage  
or the power management. The EEPROM access and the serial interface are disabled  
in these modes until to the next stop condition. If no start or stop condition is generated  
the SCL and SDA line can be used for the modulator stage. SCL is used for the modula-  
tor clock and SDA is used for the data. In that mode the same conditions for clock and  
data changing like in the normal are valid. The SCL and SDA line can be used for con-  
tinuous bit transfers, an acknowledge cycle after 8 bits must not be generated.  
Note:  
After a reset of the microcontroller it is not sure that the transponder interface has been  
reset too. It could still be in a receive or transmit cycle. To place the serial interface of the  
device into a known state the miocrocontroller should read one byte from the device with-  
out acknowledge and then generate a stop condition.  
Power-On Reset, NRST  
The U3280M transponder front end starts working with the applied field. For the digital  
circuits like EEPROM serial interface and registers there is a reset circuitry. A reset is  
generated by a power-on condition at VDD, by switching back from field to battery sup-  
ply and if a low signal is applied at the NRST-pin.  
The NRST-pin is a bidirectional pin and can also be used as reset output to generate a  
reset for the microcontroller if the circuit switches over from field to battery supply. This  
sets the microcontroller in a well defined state after the uncertain power supply condition  
during switching.  
Antenna  
For the transponder interface a coil must be used as antenna. Air and ferrite cored coils  
can be used. For battery-less operation the working distance resp. the minimum cou-  
pling factor of an application depends on the power consumption and on the size of the  
antennas of the IC and the base station. With a power consumption of 150 µA a mini-  
mum magnetic coupling factor below 0.5% is within reach. For applications with a higher  
power consumption the coupling factor must be increased.  
The Q-factor of the antenna coil should be in the range between 30 to 80 for read only  
application and below 40 for bidirectional read-write applications.  
10 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
The antenna coil must be connected together with a capacitor as a parallel LC resonant  
circuit to the Coil 1 and Coil 2 pins of the IC. The resonance frequency f0 of the antenna  
circuit should be in the range of 100 to 150 kHz.  
The right LC combination can be calculated with the following formula:  
Coil 1  
Coil 2  
1
LA = --------------------------------------------  
CA × (2 × π × f0)2  
LA  
CA  
Example: Antenna frequency: f = 125 kHz, capacitor: C = 2.2 nF  
0
A
1
LA = ----------------------------------------------------------------------- = 737 µH  
2.2 nF × (2 × π × 125 kHz)2  
Absolute Maximum Ratings  
Voltages are given relative to V  
Parameter  
.
SS  
Symbol  
Value  
Unit  
V
Supply voltage  
V
, V  
0 V to +7.0 V with reverse protection  
DD Batt  
Max. current out of V  
SS  
pin  
pin  
I
15  
15  
mA  
mA  
V
SS  
Max. current into V  
I
Batt  
Batt  
Input voltage (on any pin)  
V
V
-0.6 V V  
+0.6  
IN  
/ I  
SS  
IN  
DD  
Input/output clamp current (V > Vi/Vo > V  
SS  
)
I
+/- 15  
+/-2  
mA  
kV  
°C  
°C  
°C  
DD  
IK OK  
Min. ESD protection (100pF through 1.5k)  
Operating-temperature range  
T
- 40 to + 85  
- 40 to + 125  
260  
AMB  
Storage-emperature range  
T
STG  
Soldering temperature (t 10 sec)  
T
SD  
Stresses greater than those listed under absolute maximum ratings may cause permanent damage to the device. This is a  
stress rating only and functional operation of the device at any condition above those indicated in the operational section of  
these specification is not implied. Exposure to absolute maximum rating condition for an extended period may affect device  
reliability. All inputs and outputs are protected against high electrostatic voltages or electric fields. However, precautions to  
minimize built-up of electrostatic charges during handling are recommended. Reliability of operation is enhanced if unused  
inputs are connected to an appropriate logic voltage level (e.g. V ).  
DD  
Thermal Resistance  
Parameter  
Symbol  
Value  
Unit  
Junction ambient  
R
180  
K/W  
thJA  
11 (17)  
Rev. A4, 11-Dec-01  
DC Characteristics  
Supply voltage V  
= 1.8 to 6.5 V, V = 0 V, T = -40°C to 85°C unless otherwise specified  
SS amb  
DD  
Parameters  
Power supply  
Test Conditions  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
Operating voltage at VBatt  
V
2.0  
6.5  
V
V
Batt  
Operatíng voltage at VDD  
V
V
DDB  
Batt  
during battery supply  
V
SD  
VDD-limiter voltage during coil  
supply  
V
2.6  
2.9  
3.2  
80  
V
DDC  
Operating current during field  
supply  
V
> 2.0 V  
I
40  
µA  
µA  
DD  
Fi  
Sleep current  
I
0.4  
Sl  
EEPROM  
Operating current during  
erase/write cycle  
V
V
= 2.0 V  
= 6.5 V  
I
I
400  
500  
1200  
µA  
µA  
DD  
DD  
WR  
WR  
Operating current during read  
cycle  
V
V
= 2.0 V  
= 6.5 V  
I
I
300  
350  
µA  
µA  
DD  
DD  
Rdp  
Rdp  
Peak current during 1/4 of read  
cycle  
Power management  
Field-on detection voltage  
Field-off detection voltage  
V
V
> 1.8 V  
> 1.8 V  
VFDon  
VFDoff  
VSD  
2.3  
2.5  
0.8  
2.9  
V
V
DD  
DD  
Voltage drop at  
IS = 0.5 mA,  
150  
mV  
power-supply switch  
V
= 2 V  
Batt  
Coil inputs Coil 1 and Coil 2  
Coil input current  
I
20  
mA  
pF  
V
CI  
Input capacitance  
C
30  
IN  
Coil voltage stroke during  
modulation  
V
> 5V  
= 3 to 20 mA  
V
1.8  
2.3  
4.0  
CU  
CMS  
I
coil  
Pin MOD  
Input LOW voltage  
V
V
0.2 ×  
V
V
IL  
IH  
V
DD  
DD  
Input LOW voltage  
V
0.8 ×  
V
IH  
V
DD  
Input leakage current  
Pin NGAP/ FC  
I
10  
nA  
Ileakage  
Output LOW current  
V
= 2.0 V  
= 0.2 × V  
I
0 . 0 8  
0 . 2  
0 . 3  
m A  
m A  
DD  
OL  
V
OL  
DD  
Output HIGH current  
V
= 2.0 V  
I
-0.06  
-0.15  
-0.25  
DD  
OH  
V
= 0.8 × V  
OH  
DD  
12 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
DC Characteristics  
Supply voltage V  
= 1.8 to 6.5 V, V = 0 V, T  
= -40°C to 85°C unless otherwise specified  
Test Conditions Pin Symbol Min.  
DD  
Parameters  
SS amb  
Typ.  
Max.  
Unit  
Serial interface I/O pins SCL and SDA  
Input LOW voltage  
V
V
0.3 ×  
V
V
IL  
IH  
V
DD  
DD  
Input HIGH voltage  
V
0.7 ×  
V
IH  
V
DD  
Input leakage current  
I
10  
nA  
Ileakage  
Output LOW current  
V
= 2.0 V  
I
0.7  
0 . 9  
1 . 1  
m A  
DD  
OL  
V
= 0.2 V  
DD  
OL  
V
= 6.0 V  
2.8  
3.5  
4.2  
mA  
m A  
DD  
Output HIGH current  
V
= 2.0 V  
= 0.8 V  
= 6.0 V  
I
-0.5  
- 0 . 6  
-0.7  
DD  
OH  
V
OH  
DD  
V
-1.8  
-2.2  
-2.6  
mA  
DD  
AC Characteristics  
Supply voltage V  
= 1.8 to 6.5 V, V = 0 V, T  
= -40°C to 85°C unless otherwise specified  
DD  
SS  
amb  
Test Conditions  
Parameters  
Serial interface timing  
SCL clock frequency  
Clock low time  
Pin  
Symbol  
Min.  
Typ.  
Max.  
Unit  
f
0
100  
kHz  
µs  
µs  
ns  
ns  
µs  
µs  
ns  
ns  
µs  
µs  
ns  
ns  
SCL  
t
4.7  
4.0  
LOW  
Clock high time  
t
HIGH  
SDA and SCL rise time  
SDA and SCL fall time  
Start condition setup time  
Start condition hold time  
Data input setup time  
Data input hold time  
Stop condition setup time  
Bus free time  
t
1000  
300  
R
t
F
t
4.7  
4.0  
250  
0
SUSTA  
HDSTA  
SUDAT  
HDDAT  
SUSTO  
t
t
t
t
4.7  
4.7  
t
BUF  
Input filter time  
t
100  
I
Data output hold time  
Coil inputs  
t
300  
100  
1000  
DH  
Coil frequency  
f
125  
150  
kHz  
COIL  
Gap detection  
Delay field off to GAP = 0  
Delay field on to GAP = 1  
Power management  
Battery to field switch delay  
Field to battery switch delay  
V
V
< 0.7 V  
DC  
T
T
10  
1
50  
50  
µs  
µs  
coilGap  
FGAP0  
FGAP1  
> 3 V  
coilGap  
DC  
t
t
1000  
30  
µs  
BFS  
VBatt = 6.5 V  
5
10  
ms  
FBS  
13 (17)  
Rev. A4, 11-Dec-01  
AC Characteristics  
Supply voltage V  
= 1.8 to 6.5 V, V = 0 V, T = -40°C to 85°C unless otherwise specified  
SS amb  
DD  
Parameters  
Test Conditions  
Pin  
Symbol  
Min.  
500000  
10  
Typ.  
Max.  
Unit  
EEPROM  
Endurance  
Erase/ write-cycles  
For 16 bits access  
Tamb = 25_C  
E
Cycles  
ms  
D
Data erase/ write cycle time  
Data retention time  
Power up to read operation  
Power up to write operation  
Reset  
t
9
12  
DEW  
t
years  
ms  
DR  
t
0.2  
0.2  
PUR  
PUw  
t
ms  
Power-on reset  
V
= 0 to 2 V  
t
10  
ms  
DDrise  
VIl < 0.2 V  
rise  
NRST  
t
1
µs  
DD  
res  
Figure 7. Typical reset delay after switching V  
on  
DD  
600  
500  
V
DD  
NRST  
400  
300  
200  
100  
0
t
RESDEL  
1.0  
2.0  
3.0  
VDD ( V )  
4.0  
5.0  
6.0  
Figure 8. Typical reset delay after switching V  
on  
DD  
5.5  
5.0  
5 ms  
VDD  
NRST  
4.5  
4.0  
3.5  
3.0  
2.5  
tRESDEL  
1.0  
2.0  
3.0  
VDD ( V )  
4.0  
5.0  
6.0  
14 (17)  
U3280M  
Rev. A4, 11-Dec-01  
U3280M  
Figure 9. V  
rise time to ensure power-on reset  
DD  
6
5
4
3
2
1
0
Not allowed  
0.0  
2.0  
4.0  
6.0  
8.0  
10.0  
12.0  
14.0  
trise ( ms )  
Package Information  
Package SSO16  
Dimensions in mm  
5.00 max  
5.00  
4.80  
6.2  
5.8  
1.40  
0.2  
0.25  
3.95 max  
0.25  
0.10  
0.635  
4.45  
5.2  
4.8  
16  
9
technical drawings  
according to DIN  
specifications  
1
8
15 (17)  
Rev. A4, 11-Dec-01  
Ozone Depleting Substances Policy Statement  
It is the policy of Atmel Germany GmbH to  
1. Meet all present and future national and international statutory requirements.  
2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems  
with respect to their impact on the health and safety of our employees and the public, as well as their impact on  
the environment.  
It is particular concern to control or eliminate releases of those substances into the atmosphere which are known as  
ozone depleting substances (ODSs).  
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs and forbid  
their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these  
substances.  
Atmel Germany GmbH has been able to use its policy of continuous improvements to eliminate the use of ODSs listed  
in the following documents.  
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively  
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental  
Protection Agency (EPA) in the USA  
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.  
Atmel Germany GmbH can certify that our semiconductors are not manufactured with ozone depleting substances and  
do not contain such substances.  
16 (17)  
U3280M  
Rev. A4, 11-Dec-01  
Atmel Sales Offices  
France  
Sweden  
Hong Kong  
3, Avenue du Centre  
78054 St.-Quentin-en-Yvelines  
Cedex  
Kavallerivaegen 24, Rissne  
17402 Sundbyberg  
Tel: +46 8 587 48 800  
Fax: +46 8 587 48 850  
Room #1219,  
Chinachem Golden Plaza  
77 Mody Road, Tsimhatsui East  
East Kowloon, Hong Kong  
Tel: +852 23 789 789  
Fax: +852 23 755 733  
Tel: +33 1 30 60 70 00  
Fax: +33 1 30 60 71 11  
United Kingdom  
Easthampstead Road  
Bracknell  
Berkshire RG12 1LX  
Tel: +44 1344 707 300  
Fax: +44 1344 427 371  
Germany  
Erfurter Strasse 31  
85386 Eching  
Tel: +49 89 319 70 0  
Fax: +49 89 319 46 21  
Korea  
25-4, Yoido-Dong, Suite 605,  
Singsong Bldg.  
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Tel: +822 785 1136  
Fax: +822 785 1137  
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Tel: +49 201 247 30 0  
Fax: +49 201 247 30 47  
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Tel: +1 408 441 0311  
Fax: +1 408 436 4200  
Rep. of Singapore  
Keppel Building #03-00  
25 Tampines Street 92,  
Singapore 528877  
Theresienstrasse 2  
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Tel: +1 908 848 5208  
Fax: +1 908 848 5232  
Tel: +65 260 8223  
Fax: +65 787 9819  
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Lin Kou Hsiang,  
244 Taipei Hsien  
Tel: +886 2 2609 5581  
Fax: +886 2 2600 2735  
Italy  
Via Grosio, 10/8  
20151 Milano  
Tel: +39 02 38 03 71  
Fax: +39 02 38 03 72 34  
Spain  
Japan  
Principe de Vergara, 112  
28002 Madrid  
Tonetsushinkawa Bldg.  
1-24-8 Shinkawa Chuo Ku  
Tokyo 104-0033  
Tel: +34 91 564 51 81  
Fax: +34 91 562 75 14  
Tel: +81 3 3523 3551  
Fax: +81 3 3523 7581  
Web Site  
http://www.atmel-wm.com  
© Atmel Germany GmbH 2001.  
Atmel Germany GmbH makes no warranty for the use of its products, other than those expressly contained in the Companys standard warranty  
which is detailed in Atmel Germany GmbHs Terms and Conditions. The Company assumes no responsibility for any errors which may appear in  
this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commit-  
ment to update the information contained herein. No licenses to patents or other intellectual property of Atmel Germany GmbH are granted by  
the Company in connection with the sale of Atmel Germany GmbH products, expressly or by implication. Atmel Germany GmbHs products are  
not authorized for use as critical components in life support devices or systems.  
Data sheets can also be retrieved from the Internet: http://www.atmel-wm.com  
Rev. A4, 11-Dec-01  

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