ICM-20608-G [TDK]
IMU (惯性测量设备);
TDK ELECTRONICS 
ICM-20608-G
ICM-20608-G Datasheet
Revision 1.0
InvenSense Inc.
1745 Technology Drive, San Jose, CA 95110 U.S.A
+1(408) 988–7339
This document contains information on a pre-production
product. InvenSense Inc. reserves the right to change
specifications and information herein without notice.
Document Number: DS-000081
Revision: 1.0
Release Date: 06/15/2015
www.invensense.com
ICM-20608-G
TABLE OF CONTENTS
TABLE OF CONTENTS....................................................................................................................................................... 2
Table Of FIGURES ............................................................................................................................................................ 4
Table Of TABLES .............................................................................................................................................................. 4
1.
2.
3.
General Description ............................................................................................................................................. 5
1.2 Purpose and Scope....................................................................................................................................5
1.3 Product Overview......................................................................................................................................5
1.4 Applications...............................................................................................................................................5
Features ............................................................................................................................................................... 6
2.1 Gyroscope Features ..................................................................................................................................6
2.2 Accelerometer Features............................................................................................................................6
2.3 Additional features....................................................................................................................................6
Electrical Characteristics...................................................................................................................................... 7
3.1 Gyroscope Specifications ..........................................................................................................................7
3.2 Accelerometer Specifications....................................................................................................................8
3.3 Electrical Specifications.............................................................................................................................9
3.3.1 D.C. Electrical Characteristics.................................................................................................................... 9
3.3.2 Standard (Duty-Cycle) Mode Noise and Power Performance:................................................................ 10
3.3.3 A.C. Electrical Characteristics.................................................................................................................. 11
3.3.4 Other Electrical Specifications ................................................................................................................ 13
3.4 I2C Timing characterization.....................................................................................................................14
3.5 spi Timing characterization .....................................................................................................................15
3.6 Absolute Maximum Ratings ....................................................................................................................16
Applications Information ................................................................................................................................... 17
4.1 Pin Out Diagram and Signal Description .................................................................................................17
4.2 Typical Operating Circuit.........................................................................................................................18
4.3. bill of materials for external components...............................................................................................19
4.4. Block Diagram .........................................................................................................................................19
4.5. Overview .................................................................................................................................................20
4.6. Three-Axis MEMS Gyroscope with 16-bit ADCs and Signal Conditioning ...............................................20
4.7. Three-Axis MEMS Accelerometer with 16-bit ADCs and Signal Conditioning.........................................20
4.8. I2C and SPI Serial Communications Interfaces........................................................................................20
4.8.1 ICM-20608-G Solution Using I2C Interface ............................................................................................. 20
4.8.2 ICM-20608-G Solution Using SPI Interface.............................................................................................. 21
4.9 Self-Test...................................................................................................................................................22
4.
4.10
4.11
4.12
4.13
Clocking...............................................................................................................................................22
Sensor Data Registers .........................................................................................................................22
FIFO.....................................................................................................................................................22
Interrupts............................................................................................................................................22
Page 2 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
4.14
4.15
4.16
4.17
Digital-Output Temperature Sensor ...................................................................................................22
Bias and LDOs .....................................................................................................................................23
Charge Pump ......................................................................................................................................23
Power Modes......................................................................................................................................23
5
6
Programmable Interrupts .................................................................................................................................. 24
5.1 Wake-on-Motion Interrupt .....................................................................................................................24
Digital Interface ................................................................................................................................................. 25
6.1 I2C and SPI Serial Interfaces....................................................................................................................25
6.2 I2C Interface............................................................................................................................................25
6.3 I2C Communications Protocol.................................................................................................................25
6.4 I2C Terms .................................................................................................................................................27
6.5 SPI Interface ............................................................................................................................................28
Assembly............................................................................................................................................................ 29
Orientation of Axes............................................................................................................................................29
Package Dimensions ..........................................................................................................................................30
Part Number Package Marking.......................................................................................................................... 32
7
8
9.Reference................................................................................................................................................................... 33
Revision History .................................................................................................................................................34
Compliance Declaration Disclaimer ...................................................................................................................35
Page 3 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
TABLE OF FIGURES
Figure 1. I2C Bus Timing Diagram ............................................................................................................................................................14
Figure 2. SPI Bus Timing Diagram.............................................................................................................................................................15
Figure 3. Pin out Diagram for ICM-20608-G 3.0x3.0x0.75mm LGA .........................................................................................................17
Figure 4. ICM-20608-G I2C Operation Application Schematic.................................................................................................................18
Figure 5. ICM-20608-G SPI Operation Application Schematic .................................................................................................................18
Figure 6. ICM-20608-G Block Diagram.....................................................................................................................................................19
Figure 7. ICM-20608-G Solution Using I2C Interface ................................................................................................................................21
Figure 8. ICM-20608-G Solution Using SPI Interface................................................................................................................................21
Figure 9. START and STOP Conditions......................................................................................................................................................25
Figure 10. Acknowledge on the I2C Bus ...................................................................................................................................................26
Figure 11. Complete I2C Data Transfer.....................................................................................................................................................26
Figure 12. Typical SPI Master/Slave Configuration ..................................................................................................................................28
Figure 13. Orientation of Axes of Sensitivity and Polarity of Rotation ....................................................................................................29
TABLE OF TABLES
Table 1. Gyroscope Specifications .............................................................................................................................................................7
Table 2. Accelerometer Specifications.......................................................................................................................................................8
Table 3. D.C. Electrical Characteristics.......................................................................................................................................................9
Table 4. Gyroscope Noise and Current Consumption..............................................................................................................................10
Table 5. Accelerometer Noise and Current Consumption .......................................................................................................................10
Table 6. A.C. Electrical Characteristics .....................................................................................................................................................12
Table 7. Other Electrical Specifications....................................................................................................................................................13
Table 8. I2C Timing Characteristics...........................................................................................................................................................14
Table 9. SPI Timing Characteristics (8MHz Operation) ............................................................................................................................15
Table 10. Absolute Maximum Ratings .....................................................................................................................................................16
Table 12. Bill of Materials .......................................................................................................................................................................19
Table 13. Power Modes for ICM-20608-G ...............................................................................................................................................23
Table 14. Table of Interrupt Sources........................................................................................................................................................24
Table 15. Serial Interface .........................................................................................................................................................................25
Table 16. I2C Terms ..................................................................................................................................................................................27
Page 4 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
1. GENERAL DESCRIPTION
1.2 PURPOSE AND SCOPE
This document is a product specification, providing a description, specifications, and design related information on the ICM-20608-
G™ MotionTracking device. The device is housed in a small 3x3x0.75mm 16-pin LGA package.
1.3 PRODUCT OVERVIEW
The ICM-20608-G is a 6-axis MotionTracking device that combines a 3-axis gyroscope, and a 3-axis accelerometer in a small
3x3x0.75mm (16-pin LGA) package. It also features a 512-byte FIFO that can lower the traffic on the serial bus interface, and reduce
power consumption by allowing the system processor to burst read sensor data and then go into a low-power mode. ICM-20608-G,
with its 6-axis integration, enables manufacturers to eliminate the costly and complex selection, qualification, and system level
integration of discrete devices, guaranteeing optimal motion performance for consumers.
The gyroscope has a programmable full-scale range of ±250, ±500, ±1000, and ±2000 degrees/sec. The accelerometer has a user-
programmable accelerometer full-scale range of ±2g, ±4g, ±8g, and ±16g. Factory-calibrated initial sensitivity of both sensors
reduces production-line calibration requirements.
Other industry-leading features include on-chip 16-bit ADCs, programmable digital filters, an embedded temperature sensor, and
programmable interrupts. The device features I2C and SPI serial interfaces, a VDD operating range of 1.71 to 3.45V, and a separate
digital IO supply, VDDIO from 1.71V to 3.45V. Communication with all registers of the device is performed using either I2C at 400kHz
or SPI at 8MHz.
By leveraging its patented and volume-proven CMOS-MEMS fabrication platform, which integrates MEMS wafers with companion
CMOS electronics through wafer-level bonding, InvenSense has driven the package size down to a footprint and thickness of
3x3x0.75mm (16-pin LGA), to provide a very small yet high performance low cost package. The device provides high robustness by
supporting 10,000g shock reliability.
1.4 APPLICATIONS
Mobile phones and tablets
Handset and portable gaming
Motion-based game controllers
3D remote controls for Internet connected DTVs and set top boxes, 3D mice
Wearable sensors for health, fitness and sports
Page 5 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
2. FEATURES
2.1 GYROSCOPE FEATURES
The triple-axis MEMS gyroscope in the ICM-20608-G includes a wide range of features:
Digital-output X-, Y-, and Z-axis angular rate sensors (gyroscopes) with a user-programmable full-scale range of ±250, ±500,
±1000, and ±2000°/sec and integrated 16-bit ADCs
Digitally-programmable low-pass filter
Factory calibrated sensitivity scale factor
Self-test
2.2 ACCELEROMETER FEATURES
The triple-axis MEMS accelerometer in ICM-20608-G includes a wide range of features:
Digital-output X-, Y-, and Z-axis accelerometer with a programmable full scale range of ±2g, ±4g, ±8g and ±16g and
integrated 16-bit ADCs
User-programmable interrupts
Wake-on-motion interrupt for low power operation of applications processor
Self-test
2.3 ADDITIONAL FEATURES
The ICM-20608-G includes the following additional features:
Smallest and thinnest LGA package for portable devices: 3x3x0.75mm (16-pin LGA)
Minimal cross-axis sensitivity between the accelerometer and gyroscope axes
512 byte FIFO buffer enables the applications processor to read the data in bursts
Digital-output temperature sensor
User-programmable digital filters for gyroscope, accelerometer, and temp sensor
10,000 g shock tolerant
400kHz Fast Mode I2C for communicating with all registers
8MHz SPI serial interface for communicating with all registers
MEMS structure hermetically sealed and bonded at wafer level
RoHS and Green compliant
Page 6 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3. ELECTRICAL CHARACTERISTICS
3.1 GYROSCOPE SPECIFICATIONS
Typical Operating Circuit of section 0, VDD = 1.8 V, VDDIO = 1.8 V, TA = 25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
GYROSCOPE SENSITIVITY
FS_SEL=0
Full-Scale Range
±250
±500
±1000
±2000
16
3
3
3
3
3
3
3
3
3
2
1
1
1
/s
/s
FS_SEL=1
FS_SEL=2
FS_SEL=3
/s
/s
Gyroscope ADC Word Length
Sensitivity Scale Factor
bits
FS_SEL=0
131
LSB/(/s)
LSB/(/s)
LSB/(/s)
LSB/(/s)
%
FS_SEL=1
65.5
32.8
16.4
±2
FS_SEL=2
FS_SEL=3
Sensitivity Scale Factor Tolerance
Sensitivity Scale Factor Variation Over Temperature
Nonlinearity
25°C
-40°C to +85°C
Best fit straight line; 25°C
±3
%
±0.1
±2
%
Cross-Axis Sensitivity
%
ZERO-RATE OUTPUT (ZRO)
Initial ZRO Tolerance
25°C
±5
2
1
/s
ZRO Variation Over Temperature
-40°C to +85°C
±0.1
/s/°C
GYROSCOPE NOISE PERFORMANCE (FS_SEL=0)
Noise Spectral Density
0.008
27
1
2
/s/√Hz
Gyroscope Mechanical Frequencies
Low Pass Filter Response
Gyroscope Start-Up Time
25
29
KHz
Programmable Range
From Sleep mode
5
250
Hz
ms
Hz
Hz
3
1
1
1
35
Standard (duty-cycled) mode
Low-Noise (active) mode
3.91
4
500
8000
Output Data Rate
Table 1. Gyroscope Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
Page 7 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.2 ACCELEROMETER SPECIFICATIONS
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
ACCELEROMETER SENSITIVITY
AFS_SEL=0
AFS_SEL=1
±2
±4
g
g
3
3
Full-Scale Range
AFS_SEL=2
±8
g
3
AFS_SEL=3
±16
g
3
ADC Word Length
Output in two’s complement format
AFS_SEL=0
16
bits
3
3
3
16,384
8,192
LSB/g
LSB/g
AFS_SEL=1
Sensitivity Scale Factor
AFS_SEL=2
AFS_SEL=3
4,096
2,048
±2
LSB/g
LSB/g
%
3
3
2
Initial Tolerance
Component-level
-40°C to +85°C AFS_SEL=0
Component-level
Sensitivity Change vs. Temperature
±0.016
%/C
1
Nonlinearity
Best Fit Straight Line
±0.5
±2
%
%
1
1
Cross-Axis Sensitivity
ZERO-G OUTPUT
Component-level, all axes
Initial Tolerance
±60
mg
1
1
-40°C to +85°C,
Board-level
X and Y axes
Z axis
±0.5
mg/°C
Zero-G Level Change vs. Temperature
±1
mg/°C
1
NOISE PERFORMANCE
µg/√Hz
250
Noise Spectral Density
1
3
Low Pass Filter Response
Programmable Range
5
218
Hz
Intelligence Function Increment
4
20
30
mg/LSB
ms
ms
Hz
Hz
3
1
1
From Sleep mode
Accelerometer Startup Time
Output Data Rate
From Cold Start, 1ms VDD ramp
Standard (duty-cycled) mode
Low-Noise (active) mode
0.24
4
500
4000
1
Table 2. Accelerometer Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Tested in production.
3. Guaranteed by design.
Page 8 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.3 ELECTRICAL SPECIFICATIONS
3.3.1 D.C. Electrical Characteristics
Typical Operating Circuit of section 0, VDD = 1.8 V, VDDIO = 1.8 V, TA=25°C, unless otherwise noted.
PARAMETER
CONDITIONS
SUPPLY VOLTAGES
MIN
TYP
MAX
UNITS
NOTES
VDD
1.71
1.71
1.8
1.8
3.45
3.45
V
V
1
1
VDDIO
SUPPLY CURRENTS
Low-Noise Mode
6-axis Gyroscope + Accelerometer
3
mA
mA
1
1
2.6
3-axis Gyroscope
390
µA
1
3-axis Accelerometer, 4kHz ODR
Accelerometer Standard Mode
100Hz ODR, 1x averaging
57
µA
1
Gyroscope Standard Mode
Gyroscope Standard Mode
100Hz ODR, 1x averaging
10Hz ODR, 1x averaging
1.6
1.3
mA
mA
1
1
6-Axis Standard Mode (Gyroscope
Standard Mode; Accelerometer Low-
Noise Mode)
100Hz ODR, 1x averaging
1.9
6
mA
µA
1
1
Full-Chip Sleep Mode
TEMPERATURE RANGE
Performance parameters are not applicable
beyond Specified Temperature Range
Specified Temperature Range
-40
+85
°C
1
Table 3. D.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
Page 9 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.3.2 Standard (Duty-Cycle) Mode Noise and Power Performance:
The following tables contain Gyroscope and Accelerometer noise and current consumption values for standard (duty-cycle) mode,
for various ODRs and averaging filter settings. Please refer to the ICM-20608-G Register Map for further information about the
registers referenced in the tables below.
FCHOICE_B
G_AVGCFG
0
0
0
1
0
2
0
3
0
4
0
5
0
6
0
7
Averages
Ton (ms)
Noise BW (Hz)
Noise (dps) TYP based on
0.008º/s/Hz
1x
1.73
650.8
2x
2.23
407.1
4x
3.23
224.2
8x
5.23
117.4
16x
9.23
60.2
32x
17.23
30.6
64x
33.23
15.6
128x
65.23
8.0
0.20
0.16
0.12
0.09
0.06
0.04
0.03
0.02
ODR
SMPLRT_DIV
(Hz)
Current Consumption (mA) TYP
255
99
64
32
19
9
7
4
3
2
3.9
10.0
15.4
30.3
1.3
1.3
1.4
1.4
1.5
1.6
1.7
1.9
2.1
2.3
2.9
1.3
1.3
1.4
1.4
1.5
1.7
1.8
2.1
2.3
2.6
1.3
1.4
1.4
1.5
1.6
1.9
2.0
2.5
2.7
1.3
1.4
1.5
1.6
1.8
2.2
2.5
1.4
1.5
1.6
1.8
2.1
3.0
1.4
1.6
1.8
2.2
2.8
1.5
1.9
2.2
1.8
2.5
N/A
N/A
50.0
100.0
125.0
200.0
250.0
333.3
500.0
N/A
N/A
N/A
N/A
1
N/A
Table 4. Gyroscope Noise and Current Consumption
ACCEL_FCHOICE_B
1
x
x
0
7
0
0
7
1
0
7
2
0
7
3
A_DLPF_CFG
DEC2_CFG
Averages
Ton (ms)
Noise BW (Hz)
Noise (mg) TYP based on
250µg/Hz
1x
1.084
1100.0
4x
1.84
441.6
8x
2.84
235.4
16x
4.84
121.3
32x
8.84
61.5
8.3
5.3
3.8
2.8
2.0
ODR
SMPLRT_DIV
(Hz)
Current Consumption (µA) TYP
255
127
63
31
15
7
3.9
7.8
8.4
9.8
9.4
11.9
17.0
27.1
47.2
87.5
168.1
329.3
10.8
14.7
22.5
38.2
69.4
13.6
20.3
33.7
60.4
113.9
220.9
19.2
31.4
55.9
104.9
202.8
N/A
15.6
31.3
62.5
125.0
250.0
500.0
12.8
18.7
30.4
57.4
100.9
194.9
132.0
257.0
3
1
N/A
N/A
Table 5. Accelerometer Noise and Current Consumption
Page 10 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.3.3 A.C. Electrical Characteristics
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS NOTES
SUPPLIES
Supply Ramp Time (TRAMP
)
Monotonic ramp. Ramp rate is
10% to 90% of the final value
0.01
100
85
ms
1
TEMPERATURE SENSOR
Operating Range
Room Temperature Offset
Ambient
25°C
-40
°C
°C
1
1
1
0
Sensitivity
Untrimmed
326.8
LSB/°C
POWER-ON RESET
Valid power-on RESET
From power-up
From sleep
AD0 = 0
Supply Ramp Time (TRAMP
)
0.01
100
100
5
ms
ms
ms
1
1
1
11
Start-up time for register read/write
1101000
1101001
I2C ADDRESS
AD0 = 1
DIGITAL INPUTS (FSYNC, AD0, SCLK, SDI, CS)
0.7*VDDIO
VIH, High Level Input Voltage
VIL, Low Level Input Voltage
V
V
0.3*VDD
IO
1
1
CI, Input Capacitance
< 10
pF
DIGITAL OUTPUT (SDO, INT)
RLOAD=1MΩ;
VOH, High Level Output Voltage
VOL1, Low-Level Output Voltage
0.9*VDDIO
V
V
RLOAD=1MΩ;
0.1*VDD
IO
VOL.INT, INT Low-Level Output Voltage
OPEN=1, 0.3mA sink
Current
0.1
V
Output Leakage Current
tINT, INT Pulse Width
OPEN=1
100
50
nA
µs
LATCH_INT_EN=0
I2C I/O (SCL, SDA)
-0.5V
0.3*VDD
IO
V
V
VIL, Low-Level Input Voltage
VIH, High-Level Input Voltage
0.7*VDDIO
VDDIO +
0.5V
0.1*VDD
IO
Vhys, Hysteresis
V
V
1
VOL, Low-Level Output Voltage
IOL, Low-Level Output Current
3mA sink current
0
0.4
VOL=0.4V
VOL=0.6V
3
6
mA
mA
Output Leakage Current
100
nA
ns
tof, Output Fall Time from VIHmax to VILmax
Cb bus capacitance in pf
20+0.1Cb
300
Page 11 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
INTERNAL CLOCK SOURCE
FCHOICE_B=1,2,3
SMPLRT_DIV=0
FCHOICE_B=0;
DLPFCFG=0 or 7
SMPLRT_DIV=0
FCHOICE_B=0;
32
8
kHz
kHz
2
2
Sample Rate
DLPFCFG=1,2,3,4,5,6;
SMPLRT_DIV=0
CLK_SEL=0, 6 or gyro
inactive; 25°C
CLK_SEL=1,2,3,4,5 and
gyro active; 25°C
CLK_SEL=0,6 or gyro
inactive
1
kHz
2
-5
-1
+5
+1
%
%
%
%
1
1
1
1
Clock Frequency
Initial Tolerance
-10
-1
+10
+1
Frequency
Variation over
Temperature
CLK_SEL=1,2,3,4,5 and
gyro active
Table 6. A.C. Electrical Characteristics
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. Guaranteed by design.
Page 12 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.3.4 Other Electrical Specifications
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SERIAL INTERFACE
Low-Speed Characterization
High-Speed Characterization
100 ±10%
1
kHz
1
SPI Operating Frequency, All Registers
Read/Write
8
MHz
1, 2
Modes 0
and 3
SPI Modes
All registers, Fast-mode
400
100
kHz
kHz
1
1
I2C Operating Frequency
All registers, Standard-mode
Table 7. Other Electrical Specifications
Notes:
1. Derived from validation or characterization of parts, not guaranteed in production.
2. SPI clock duty cycle between 45% and 55% should be used for 8-MHz operation.
Page 13 of 35
Document Number: DS-000081
Revision: 1.0
ICM-20608-G
3.4 I2C TIMING CHARACTERIZATION
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
I2C TIMING
I2C FAST-MODE
fSCL, SCL Clock
Frequency
400
kHz
µs
1
1
tHD.STA, (Repeated)
START Condition Hold
Time
0.6
tLOW, SCL Low Period
tHIGH, SCL High Period
1.3
0.6
µs
µs
1
1
tSU.STA, Repeated START
Condition Setup Time
0.6
0
µs
µs
ns
ns
ns
µs
1
1
1
1
1
1
tHD.DAT, SDA Data Hold
Time
tSU.DAT, SDA Data Setup
Time
100
tr, SDA and SCL Rise
Time
Cb bus cap. from 10 to 400pF
Cb bus cap. from 10 to 400pF
20+0.1Cb
20+0.1Cb
0.6
300
300
tf, SDA and SCL Fall
Time
tSU.STO, STOP Condition
Setup Time
tBUF, Bus Free Time
Between STOP and
START Condition
1.3
µs
1
Cb, Capacitive Load for
each Bus Line
< 400
pF
µs
µs
1
1
1
tVD.DAT, Data Valid Time
0.9
0.9
tVD.ACK, Data Valid
Acknowledge Time
Table 8. I2C Timing Characteristics
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
tf
tSU.DAT
tr
SDA
SCL
70%
30%
70%
30%
continued below at
A
tf
tr
tVD.DAT
70%
30%
70%
30%
tHD.DAT
9th clock cycle
tHD.STA
1/fSCL
tLOW
1st clock cycle
S
tHIGH
tBUF
SDA
SCL
70%
30%
A
tSU.STO
tSU.STA
tHD.STA
tVD.ACK
70%
30%
9th clock cycle
S
P
Sr
Figure 1. I2C Bus Timing Diagram
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ICM-20608-G
3.5 SPI TIMING CHARACTERIZATION
Typical Operating Circuit of section 0, VDD = 1.8V, VDDIO = 1.8V, TA=25°C, unless otherwise noted.
PARAMETERS
CONDITIONS
MIN
TYP
MAX
UNITS
NOTES
SPI TIMING
fSCLK, SCLK Clock
Frequency
8
MHz
1
tLOW, SCLK Low Period
tHIGH, SCLK High Period
tSU.CS, CS Setup Time
tHD.CS, CS Hold Time
tSU.SDI, SDI Setup Time
tHD.SDI, SDI Hold Time
tVD.SDO, SDO Valid Time
56
56
2
ns
ns
ns
ns
ns
ns
ns
1
1
1
1
1
1
1
63
3
7
Cload = 20pF
40
20
tDIS.SDO, SDO Output
Disable Time
ns
1
tFall, SCLK Fall Time
tRise, SCLK Rise Time
6.5
6.5
ns
ns
2
2
tDIS.SDO, SDO Output
Disable Time
20
ns
1
Table 9. SPI Timing Characteristics (8MHz Operation)
Notes:
1. Based on characterization of 5 parts over temperature and voltage as mounted on evaluation board or in sockets
2. Based on calculation from other parameter values
CS
70%
30%
tFall
tRise
tHD;CS
tSU;CS
70%
tHIGH
1/fCLK
SCLK
30%
tSU;SDI
tHD;SDI
tLOW
70%
30%
SDI
LSB IN
MSB IN
tDIS;SDO
tVD;SDO
tHD;SDO
70%
30%
SDO
MSB OUT
LSB OUT
Figure 2. SPI Bus Timing Diagram
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ICM-20608-G
3.6 ABSOLUTE MAXIMUM RATINGS
Stress above those listed as “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only
and functional operation of the device at these conditions is not implied. Exposure to the absolute maximum ratings conditions for
extended periods may affect device reliability.
PARAMETER
RATING
-0.5V to +4V
Supply Voltage, VDD
Supply Voltage, VDDIO
-0.5V to +4V
REGOUT
-0.5V to 2V
Input Voltage Level (AD0, FSYNC, SCL, SDA)
Acceleration (Any Axis, unpowered)
Operating Temperature Range
Storage Temperature Range
-0.5V to VDD + 0.5V
10,000g for 0.2ms
-40°C to +85°C
-40°C to +125°C
2kV (HBM);
250V (MM)
Electrostatic Discharge (ESD) Protection
Latch-up
JEDEC Class II (2),125°C
±100mA
Table 10. Absolute Maximum Ratings
Page 16 of 35
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ICM-20608-G
4. APPLICATIONS INFORMATION
4.1 PIN OUT DIAGRAM AND SIGNAL DESCRIPTION
PIN NUMBER
PIN NAME
VDDIO
SCL/SCLK
SDA/SDI
AD0/SDO
CS
PIN DESCRIPTION
1
Digital I/O supply voltage
2
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
I2C slave address LSB (AD0); SPI serial data output (SDO)
Chip select (0 = SPI mode; 1 = I2C mode)
Interrupt digital output (totem pole or open-drain)
Reserved. Do not connect.
3
4
5
6
INT
7
RESV
8
FSYNC
RESV
Synchronization digital input (optional). Connect to GND if unused.
Reserved. Connect to GND.
9
10
11
12
13
14
15
RESV
Reserved. Connect to GND.
RESV
Reserved. Connect to GND.
RESV
Reserved. Connect to GND.
GND
Connect to GND
REGOUT
RESV
Regulator filter capacitor connection
Reserved. Connect to GND.
16
VDD
Power Supply
Table 11. Signal Descriptions
16 15 14
13
12
11
10
9
VDDIO
SCL/SCLK
SDA/SDI
AD0/SDO
CS
1
2
3
4
5
GND
+Z
RESV
RESV
RESV
RESV
ICM-20608-G
I
C
M
-
2
0
6
0
8
-
G
+Y
+X
6
7
8
LGA Package (Top View)
16-pin, 3mm x 3mm x 0.75mm
Typical Footprint and thickness
Orientation of Axes of Sensitivity and Polarity of Rotation
Figure 3. Pin out Diagram for ICM-20608-G 3.0x3.0x0.75mm LGA
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ICM-20608-G
4.2 TYPICAL OPERATING CIRCUIT
1.8 – 3.3VDC
C2, 0.1 mF
VDD
C4, 2.2 mF
REGOUT
16 15 14
C1, 0.47 mF
GND
VDDIO
1.8 – 3.3 VDC
13
12
11
10
9
1
2
3
4
5
RESV
C3, 10 nF
SCL/SCLK
SDA/SDI
SCL
SDA
AD0
RESV
RESV
ICM-20608-G
AD0/SDO
CS
VDDIO
RESV
6
7
8
Figure 4. ICM-20608-G I2C Operation Application Schematic
1.8 – 3.3VDC
VDD
C2, 0.1 mF
C4, 2.2 mF
REGOUT
16 15 14
C1, 0.47 mF
GND
VDDIO
1.8 – 3.3 VDC
C3, 10 nF
13
12
11
10
9
1
2
3
4
5
RESV
SCL/SCLK
SDA/SDI
SCLK
SDI
RESV
RESV
ICM-20608-G
AD0/SDO
CS
SDO
RESV
nCS
6
7
8
Figure 5. ICM-20608-G SPI Operation Application Schematic
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ICM-20608-G
4.3. BILL OF MATERIALS FOR EXTERNAL COMPONENTS
COMPONENT
REGOUT Capacitor
LABEL
C1
SPECIFICATION
Ceramic, X7R, 0.47µF ±10%, 2V
Ceramic, X7R, 0.1µF ±10%, 4V
Ceramic, X7R, 2.2µF ±10%, 4V
Ceramic, X7R, 10nF ±10%, 4V
QUANTITY
1
1
1
1
C2
C4
C3
VDD Bypass Capacitors
VDDIO Bypass Capacitor
Table 11. Bill of Materials
4.4. BLOCK DIAGRAM
ICM-20608-G
INT
Self
test
X Accel
Y Accel
ADC
ADC
Interrupt
Status
Register
CS
Self
test
Slave I2C and
SPI Serial
Interface
AD0 / SDO
SCL / SCLK
SDA / SDI
FIFO
Self
test
Z Accel
X Gyro
ADC
ADC
User & Config
Registers
FSYNC
Self
test
Sensor
Registers
Self
test
Y Gyro
Z Gyro
ADC
ADC
Self
test
Temp Sensor
ADC
Bias & LDOs
Charge
Pump
VDD
GND
REGOUT
Figure 6. ICM-20608-G Block Diagram
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ICM-20608-G
4.5. OVERVIEW
The ICM-20608-G is comprised of the following key blocks and functions:
Three-axis MEMS rate gyroscope sensor with 16-bit ADCs and signal conditioning
Three-axis MEMS accelerometer sensor with 16-bit ADCs and signal conditioning
Primary I2C and SPI serial communications interfaces
Self-Test
Clocking
Sensor Data Registers
FIFO
Interrupts
Digital-Output Temperature Sensor
Bias and LDOs
Charge Pump
Standard Power Modes
4.6.
THREE-AXIS MEMS GYROSCOPE WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The ICM-20608-G consists of three independent vibratory MEMS rate gyroscopes, which detect rotation about the X-, Y-, and Z-
Axes. When the gyros are rotated about any of the sense axes, the Coriolis Effect causes a vibration that is detected by a capacitive
pickoff. The resulting signal is amplified, demodulated, and filtered to produce a voltage that is proportional to the angular rate.
This voltage is digitized using individual on-chip 16-bit Analog-to-Digital Converters (ADCs) to sample each axis. The full-scale range
of the gyro sensors may be digitally programmed to ±250, ±500, ±1000, or ±2000 degrees per second (dps). The ADC sample rate is
programmable from 8,000 samples per second, down to 3.9 samples per second, and user-selectable low-pass filters enable a wide
range of cut-off frequencies.
4.7. THREE-AXIS MEMS ACCELEROMETER WITH 16-BIT ADCS AND SIGNAL CONDITIONING
The ICM-20608-G’s 3-Axis accelerometer uses separate proof masses for each axis. Acceleration along a particular axis induces
displacement on the corresponding proof mass, and capacitive sensors detect the displacement differentially. The ICM-20608-G’s
architecture reduces the accelerometers’ susceptibility to fabrication variations as well as to thermal drift. When the device is placed
on a flat surface, it will measure 0g on the X- and Y-axes and +1g on the Z-axis. The accelerometers’ scale factor is calibrated at the
factory and is nominally independent of supply voltage. Each sensor has a dedicated sigma-delta ADC for providing digital outputs.
The full scale range of the digital output can be adjusted to ±2g, ±4g, ±8g, or ±16g.
4.8. I2C AND SPI SERIAL COMMUNICATIONS INTERFACES
The ICM-20608-G communicates to a system processor using either a SPI or an I2C serial interface. The ICM-20608-G always acts as a
slave when communicating to the system processor. The LSB of the I2C slave address is set by pin 4 (AD0).
4.8.1 ICM-20608-G Solution Using I2C Interface
In the figure below, the system processor is an I2C master to the ICM-20608-G.
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ICM-20608-G
Interrupt
Status
Register
I2C Processor Bus: for reading all
sensor data from ICM-20608
INT
ICM-20608-G
AD0
SCL
VDDIO or GND
Slave I2C
or SPI
SCL
SDA
System
Processor
Serial
Interface
SDA
FIFO
User & Config
Registers
Sensor
Register
Factory
Calibration
Bias & LDOs
VDD
GND
REGOUT
Figure 7. ICM-20608-G Solution Using I2C Interface
4.8.2 ICM-20608-G Solution Using SPI Interface
In the figure below, the system processor is an SPI master to the ICM-20608-G. Pins 2, 3, 4, and 5 are used to support the SCLK, SDI,
SDO, and CS signals for SPI communications.
Processor SPI Bus: for reading all
data from ICM-20608 and for
configuring ICM-20608
Interrupt
Status
Register
INT
nCS
CS
ICM-20608-G
SDO
SDI
Slave I2C
or SPI
Serial
Interface
System
Processor
SCLK
SDI
SCLK
SDO
FIFO
Config
Register
Sensor
Register
Factory
Calibration
Bias & LDOs
VDD
GND
REGOUT
Figure 8. ICM-20608-G Solution Using SPI Interface
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ICM-20608-G
4.9 SELF-TEST
Self-test allows for the testing of the mechanical and electrical portions of the sensors. The self-test for each measurement axis can
be activated by means of the gyroscope and accelerometer self-test registers (registers 27 and 28).
When the self-test is activated, the electronics cause the sensors to be actuated and produce an output signal. The output signal is
used to observe the self-test response.
The self-test response is defined as follows:
Self-test response = Sensor output with self-test enabled – Sensor output with self-test disabled
The self-test response for each gyroscope axis is defined in the gyroscope specification table, while that for each accelerometer axis
is defined in the accelerometer specification table.
When the value of the self-test response is within the specified min/max limits of the product specification, the part has passed self-
test. When the self-test response exceeds the min/max values, the part is deemed to have failed self-test. It is recommended to use
InvenSense MotionApps software for executing self-test.
4.10 CLOCKING
The ICM-20608-G has a flexible clocking scheme, allowing a variety of internal clock sources to be used for the internal synchronous
circuitry. This synchronous circuitry includes the signal conditioning and ADCs, and various control circuits and registers. An on-chip
PLL provides flexibility in the allowable inputs for generating this clock.
Allowable internal sources for generating the internal clock are:
a) An internal relaxation oscillator
b) Auto-select between internal relaxation oscillator and gyroscope MEMS oscillator to use the best available source
The only setting supporting specified performance in all modes is option b). It is recommended that option b) be used.
4.11 SENSOR DATA REGISTERS
The sensor data registers contain the latest gyroscope, accelerometer, and temperature measurement data. They are read-only
registers, and are accessed via the serial interface. Data from these registers may be read anytime.
4.12 FIFO
The ICM-20608-G contains a 512-byte FIFO register that is accessible via the Serial Interface. The FIFO configuration register
determines which data is written into the FIFO. Possible choices include gyro data, accelerometer data, temperature readings, and
FSYNC input. A FIFO counter keeps track of how many bytes of valid data are contained in the FIFO. The FIFO register supports burst
reads. The interrupt function may be used to determine when new data is available.
The ICM-20608-G allows FIFO read in standard (duty cycle) accelerometer mode.
4.13 INTERRUPTS
Interrupt functionality is configured via the Interrupt Configuration register. Items that are configurable include the INT pin
configuration, the interrupt latching and clearing method, and triggers for the interrupt. Items that can trigger an interrupt are (1)
Clock generator locked to new reference oscillator (used when switching clock sources); (2) new data is available to be read (from
the FIFO and Data registers); (3) accelerometer event interrupts; (4) FIFO overflow. The interrupt status can be read from the
Interrupt Status register.
4.14 DIGITAL-OUTPUT TEMPERATURE SENSOR
An on-chip temperature sensor and ADC are used to measure the ICM-20608-G die temperature. The readings from the ADC can be
read from the FIFO or the Sensor Data registers.
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ICM-20608-G
4.15 BIAS AND LDOS
The bias and LDO section generates the internal supply and the reference voltages and currents required by the ICM-20608-G. Its
two inputs are an unregulated VDD and a VDDIO logic reference supply voltage. The LDO output is bypassed by a capacitor at
REGOUT. For further details on the capacitor, please refer to the Bill of Materials for External Components.
4.16 CHARGE PUMP
An on-chip charge pump generates the high voltage required for the MEMS oscillator.
4.17 POWER MODES
The following table lists the user-accessible power modes for ICM-20608-G.
MODE
NAME
GYRO
Off
Drive On
Off
Off
Duty-Cycled
On
ACCEL
Off
Off
Duty-Cycled
1
2
3
4
5
6
7
8
Sleep Mode
Standby Mode
Accelerometer Standard Mode
Accelerometer Low-Noise Mode
Gyroscope Standard Mode
Gyroscope Low-Noise Mode
6-Axis Low-Noise Mode
On
Off
Off
On
On
On
6-Axis Standard Mode
Duty-Cycled
Table 12. Power Modes for ICM-20608-G
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ICM-20608-G
5 PROGRAMMABLE INTERRUPTS
The ICM-20608-G has a programmable interrupt system which can generate an interrupt signal on the INT pin. Status flags indicate
the source of an interrupt. Interrupt sources may be enabled and disabled individually.
INTERRUPT NAME
Motion Detection
MODULE
Motion
FIFO Overflow
Data Ready
FIFO
Sensor Registers
Table 13. Table of Interrupt Sources
5.1 WAKE-ON-MOTION INTERRUPT
The ICM-20608-G provides motion detection capability. A qualifying motion sample is one where the high passed sample from any
axis has an absolute value exceeding a user-programmable threshold. The following steps explain how to configure the Wake-on-
Motion Interrupt.
Step 1: Ensure that Accelerometer is running
In PWR_MGMT_1 register (0x6B) set CYCLE = 0, SLEEP = 0, and GYRO_STANDBY = 0
In PWR_MGMT_2 register (0x6C) set STBY_XA = STBY_YA = STBY_ZA = 0, and STBY_XG = STBY_YG = STBY_ZG = 1
Step 2: Accelerometer Configuration
In ACCEL_CONFIG2 register (0x1D) set ACCEL_FCHOICE_B = 0 and A_DLPF_CFG[2:0] = 1 (b001)
Step 3: Enable Motion Interrupt
In INT_ENABLE register (0x38) set WOM_INT_EN = 111 to enable motion interrupt
Step 4: Set Motion Threshold
Set the motion threshold in ACCEL_WOM_THR register (0x1F)
Step 5: Enable Accelerometer Hardware Intelligence
In ACCEL_INTEL_CTRL register (0x69) set ACCEL_INTEL_EN = ACCEL_INTEL_MODE = 1; Ensure that bit 0 is set to 0.
Step 6: Set Frequency of Wake-Up
In Standard Mode Configuration register (0x1E) set LPOSC_CLKSEL[3:0] for a sample rate as indicated in the register map
Step 7: Enable Cycle Mode (Accelerometer Standard Mode)
In PWR_MGMT_1 register (0x6B) set CYCLE = 1
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ICM-20608-G
6 DIGITAL INTERFACE
6.1 I2C AND SPI SERIAL INTERFACES
The internal registers and memory of the ICM-20608-G can be accessed using either I2C at 400 kHz or SPI at 8MHz. SPI operates in
four-wire mode.
PIN NUMBER
PIN NAME
VDDIO
PIN DESCRIPTION
1
4
2
3
Digital I/O supply voltage.
AD0 / SDO
SCL / SCLK
SDA / SDI
I2C Slave Address LSB (AD0); SPI serial data output (SDO)
I2C serial clock (SCL); SPI serial clock (SCLK)
I2C serial data (SDA); SPI serial data input (SDI)
Table 14. Serial Interface
Note:
To prevent switching into I2C mode when using SPI, the I2C interface should be disabled by setting the I2C_IF_DIS configuration bit.
Setting this bit should be performed immediately after waiting for the time specified by the “Start-Up Time for Register Read/Write”
in Section 3.3.3.
6.2 I2C INTERFACE
I2C is a two-wire interface comprised of the signals serial data (SDA) and serial clock (SCL). In general, the lines are open-drain and bi-
directional. In a generalized I2C interface implementation, attached devices can be a master or a slave. The master device puts the
slave address on the bus, and the slave device with the matching address acknowledges the master.
The ICM-20608-G always operates as a slave device when communicating to the system processor, which thus acts as the master.
SDA and SCL lines typically need pull-up resistors to VDD. The maximum bus speed is 400 kHz.
The slave address of the ICM-20608-G is b110100X which is 7 bits long. The LSB bit of the 7 bit address is determined by the logic
level on pin AD0. This allows two ICM-20608-Gs to be connected to the same I2C bus. When used in this configuration, the address
of one of the devices should be b1101000 (pin AD0 is logic low) and the address of the other should be b1101001 (pin AD0 is logic
high).
6.3 I2C COMMUNICATIONS PROTOCOL
START (S) and STOP (P) Conditions
Communication on the I2C bus starts when the master puts the START condition (S) on the bus, which is defined as a HIGH-to-LOW
transition of the SDA line while SCL line is HIGH (see figure below). The bus is considered to be busy until the master puts a STOP
condition (P) on the bus, which is defined as a LOW to HIGH transition on the SDA line while SCL is HIGH (see figure below).
Additionally, the bus remains busy if a repeated START (Sr) is generated instead of a STOP condition.
SDA
SCL
S
P
START condition
STOP condition
Figure 9. START and STOP Conditions
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ICM-20608-G
Data Format / Acknowledge
I2C data bytes are defined to be 8-bits long. There is no restriction to the number of bytes transmitted per data transfer. Each byte
transferred must be followed by an acknowledge (ACK) signal. The clock for the acknowledge signal is generated by the master,
while the receiver generates the actual acknowledge signal by pulling down SDA and holding it low during the HIGH portion of the
acknowledge clock pulse.
If a slave is busy and cannot transmit or receive another byte of data until some other task has been performed, it can hold SCL
LOW, thus forcing the master into a wait state. Normal data transfer resumes when the slave is ready, and releases the clock line
(refer to the following figure).
DATA OUTPUT BY
TRANSMITTER (SDA)
not acknowledge
DATA OUTPUT BY
RECEIVER (SDA)
acknowledge
SCL FROM
MASTER
1
2
8
9
clock pulse for
acknowledgement
START
condition
Figure 10. Acknowledge on the I2C Bus
Communications
After beginning communications with the START condition (S), the master sends a 7-bit slave address followed by an 8th bit, the
read/write bit. The read/write bit indicates whether the master is receiving data from or is writing to the slave device. Then, the
master releases the SDA line and waits for the acknowledge signal (ACK) from the slave device. Each byte transferred must be
followed by an acknowledge bit. To acknowledge, the slave device pulls the SDA line LOW and keeps it LOW for the high period of
the SCL line. Data transmission is always terminated by the master with a STOP condition (P), thus freeing the communications line.
However, the master can generate a repeated START condition (Sr), and address another slave without first generating a STOP
condition (P). A LOW to HIGH transition on the SDA line while SCL is HIGH defines the stop condition. All SDA changes should take
place when SCL is low, with the exception of start and stop conditions.
SDA
SCL
1 – 7
8
9
1 – 7
8
9
1 – 7
8
9
S
P
START
STOP
ADDRESS
R/W
ACK
DATA
ACK
DATA
ACK
condition
condition
Figure 11. Complete I2C Data Transfer
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ICM-20608-G
To write the internal ICM-20608-G registers, the master transmits the start condition (S), followed by the I2C address and the write
bit (0). At the 9th clock cycle (when the clock is high), the ICM-20608-G acknowledges the transfer. Then the master puts the register
address (RA) on the bus. After the ICM-20608-G acknowledges the reception of the register address, the master puts the register
data onto the bus. This is followed by the ACK signal, and data transfer may be concluded by the stop condition (P). To write multiple
bytes after the last ACK signal, the master can continue outputting data rather than transmitting a stop signal. In this case, the ICM-
20608-G automatically increments the register address and loads the data to the appropriate register. The following figures show
single and two-byte write sequences.
Single-Byte Write Sequence
Master
Slave
S
AD+W
RA
DATA
DATA
P
ACK
ACK
ACK
ACK
Burst Write Sequence
Master
Slave
S
AD+W
RA
DATA
P
ACK
ACK
ACK
To read the internal ICM-20608-G registers, the master sends a start condition, followed by the I2C address and a write bit, and then
the register address that is going to be read. Upon receiving the ACK signal from the ICM-20608-G, the master transmits a start
signal followed by the slave address and read bit. As a result, the ICM-20608-G sends an ACK signal and the data. The
communication ends with a not acknowledge (NACK) signal and a stop bit from master. The NACK condition is defined such that the
SDA line remains high at the 9th clock cycle. The following figures show single and two-byte read sequences.
Single-Byte Read Sequence
Master
Slave
S
AD+W
RA
RA
S
AD+R
AD+R
NACK
P
ACK
ACK
ACK
ACK
ACK
DATA
Burst Read Sequence
Master
Slave
S
AD+W
S
ACK
NACK
P
ACK DATA
DATA
6.4 I2C TERMS
SIGNAL
DESCRIPTION
S
AD
W
Start Condition: SDA goes from high to low while SCL is high
Slave I2C address
Write bit (0)
R
Read bit (1)
ACK
Acknowledge: SDA line is low while the SCL line is high at the 9th clock
cycle
NACK
RA
Not-Acknowledge: SDA line stays high at the 9th clock cycle
ICM-20608-G internal register address
DATA
P
Transmit or received data
Stop condition: SDA going from low to high while SCL is high
Table 15. I2C Terms
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ICM-20608-G
6.5 SPI INTERFACE
SPI is a 4-wire synchronous serial interface that uses two control lines and two data lines. The ICM-20608-G always operates as a
Slave device during standard Master-Slave SPI operation.
With respect to the Master, the Serial Clock output (SCLK), the Serial Data Output (SDO) and the Serial Data Input (SDI) are shared
among the Slave devices. Each SPI slave device requires its own Chip Select (CS) line from the master.
CS goes low (active) at the start of transmission and goes back high (inactive) at the end. Only one CS line is active at a time, ensuring
that only one slave is selected at any given time. The CS lines of the non-selected slave devices are held high, causing their SDO lines
to remain in a high-impedance (high-z) state so that they do not interfere with any active devices.
SPI Operational Features
1. Data is delivered MSB first and LSB last
2. Data is latched on the rising edge of SCLK
3. Data should be transitioned on the falling edge of SCLK
4. The maximum frequency of SCLK is 8MHz
5. SPI read and write operations are completed in 16 or more clock cycles (two or more bytes). The first byte contains the
SPI Address, and the following byte(s) contain(s) the SPI data. The first bit of the first byte contains the Read/Write bit
and indicates the Read (1) or Write (0) operation. The following 7 bits contain the Register Address. In cases of
multiple-byte Read/Writes, data is two or more bytes:
SPI Address format
MSB
LSB
R/W A6 A5 A4 A3 A2 A1 A0
SPI Data format
MSB
LSB
D7
D6 D5 D4 D3 D2 D1 D0
6. Supports Single or Burst Read/Writes.
SPC
SDI
SPI Master
SPI Slave 1
SDO
CS
CS1
CS2
SPC
SDI
SDO
CS
SPI Slave 2
Figure 12. Typical SPI Master/Slave Configuration
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Document Number: DS-000081
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ICM-20608-G
7 ASSEMBLY
This section provides general guidelines for assembling InvenSense Micro Electro-Mechanical Systems (MEMS) gyros packaged in
LGA package.
ORIENTATION OF AXES
The diagram below shows the orientation of the axes of sensitivity and the polarity of rotation. Note the pin 1 identifier (•) in the
figure.
+Z
+Y
+Z
I
C
+Y
M
-
2
0
6
0
8
-
G
+X
+X
Figure 13. Orientation of Axes of Sensitivity and Polarity of Rotation
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ICM-20608-G
PACKAGE DIMENSIONS
16 Lead LGA (3x3x0.75) mm NiAu pad finish
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Document Number: DS-000081
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ICM-20608-G
DIMENSIONS IN MILLIMETERS
SYMBOLS
MIN
NOM
MAX
Total Thickness
Substrate Thickness
Mold Thickness
A
A1
A2
0.7
0.75
0.105
0.63
0.8
REF
REF
D
E
2.9
2.9
0.2
0.3
3
3
3.1
3.1
0.3
Body Size
Lead Width
Lead Length
W
0.25
L
e
n
0.35
0.5
16
2
0.4
BSC
Lead Pitch
Lead Count
D1
E1
SD
BSC
BSC
BSC
Edge Ball Center to Center
Body Center to Contact Ball
1
---
SE
b
---
---
---
---
---
---
BSC
---
Ball Width
Ball Diameter
Ball Opening
Ball Pitch
Ball Count
Pre-Solder
---
---
e1
n1
---
---
Package Edge Tolerance
aaa
bbb
ddd
eee
fff
0.1
0.2
0.08
---
Mold Flatness
Coplanarity
Ball Offset (Package)
Ball Offset (Ball)
---
Lead Edge to Package Edge
M
0.01
0.06
0.11
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Document Number: DS-000081
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ICM-20608-G
8 PART NUMBER PACKAGE MARKING
The part number package marking for ICM-20608-G devices is summarized below:
PART NUMBER
ICM-20608-G
PART NUMBER PACKAGE MARKING
IC268G
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Document Number: DS-000081
Revision: 1.0
ICM-20608-G
9.REFERENCE
Please refer to “InvenSense MEMS Handling Application Note (AN-IVS-0002A-00)” for the following information:
Manufacturing Recommendations
o
o
o
o
Assembly Guidelines and Recommendations
PCB Design Guidelines and Recommendations
MEMS Handling Instructions
ESD Considerations
o
Reflow Specification
o
Storage Specifications
o
o
o
Package Marking Specification
Tape & Reel Specification
Reel & Pizza Box Label
o
Packaging
o
Representative Shipping Carton Label
Compliance
o
o
o
Environmental Compliance
DRC Compliance
Compliance Declaration Disclaimer
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Document Number: DS-000081
Revision: 1.0
ICM-20608-G
REVISION HISTORY
REVISION
DATE
REVISION
NUMBER
DESCRIPTION
06/15/2015
1.0
Initial Release
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Document Number: DS-000081
Revision: 1.0
ICM-20608-G
COMPLIANCE DECLARATION DISCLAIMER
InvenSense believes the environmental and other compliance information given in this document to be correct but cannot
guarantee accuracy or completeness. Conformity documents substantiating the specifications and component characteristics are on
file. InvenSense subcontracts manufacturing and the information contained herein is based on data received from vendors and
suppliers, which has not been validated by InvenSense.
This information furnished by InvenSense is believed to be accurate and reliable. However, no responsibility is assumed by
InvenSense for its use, or for any infringements of patents or other rights of third parties that may result from its use. Specifications
are subject to change without notice. InvenSense reserves the right to make changes to this product, including its circuits and
software, in order to improve its design and/or performance, without prior notice. InvenSense makes no warranties, neither
expressed nor implied, regarding the information and specifications contained in this document. InvenSense assumes no
responsibility for any claims or damages arising from information contained in this document, or from the use of products and
services detailed therein. This includes, but is not limited to, claims or damages based on the infringement of patents, copyrights,
mask work and/or other intellectual property rights.
Certain intellectual property owned by InvenSense and described in this document is patent protected. No license is granted by
implication or otherwise under any patent or patent rights of InvenSense. This publication supersedes and replaces all information
previously supplied. Trademarks that are registered trademarks are the property of their respective companies. InvenSense sensors
should not be used or sold in the development, storage, production or utilization of any conventional or mass-destructive weapons
or for any other weapons or life threatening applications, as well as in any other life critical applications such as medical equipment,
transportation, aerospace and nuclear instruments, undersea equipment, power plant equipment, disaster prevention and crime
prevention equipment.
©2015 InvenSense, Inc. All rights reserved. InvenSense, MotionTracking, MotionProcessing, MotionProcessor, MotionFusion,
MotionApps, DMP, AAR, and the InvenSense logo are trademarks of InvenSense, Inc. Other company and product names may be
trademarks of the respective companies with which they are associated.
©2015 InvenSense, Inc. All rights reserved.
Page 35 of 35
Document Number: DS-000081
Revision: 1.0
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