C3216X7R1V685M160AC_17 [TDK]
Multilayer Ceramic Chip Capacitors;
| 型号： | C3216X7R1V685M160AC_17 |
| 厂家： | 
TDK ELECTRONICS |
| 描述： | Multilayer Ceramic Chip Capacitors |
| 文件： | 总3页 (文件大小：232K) |
| 中文： | 中文翻译 | 下载： | 下载PDF数据表文档文件 |
1 of 3
Creation Date : May 23, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216JB1V335K160AB
TDK item description C3216JB1V335KT****
Applications
Commercial Grade
Feature
Series
Status
General General (Up to 50V)
C3216 [EIA 1206]
Production (Not Recommended for New Design)
Size
Length(L)
3.20mm ±0.20mm
Width(W)
1.60mm ±0.20mm
1.60mm ±0.20mm
0.20mm Min.
Thickness(T)
Terminal Width(B)
Terminal Spacing(G)
1.00mm Min.
2.10mm to 2.50mm(Flow Soldering)
2.00mm to 2.40mm(Reflow Soldering)
Recommended Land Pattern (PA)
Recommended Land Pattern (PB)
Recommended Land Pattern (PC)
1.10mm to 1.30mm(Flow Soldering)
1.00mm to 1.20mm(Reflow Soldering)
1.00mm to 1.30mm(Flow Soldering)
1.10mm to 1.60mm(Reflow Soldering)
Electrical Characteristics
Capacitance
3.3μF ±10%
35VDC
Rated Voltage
Temperature Characteristic
Dissipation Factor (Max.)
Insulation Resistance (Min.)
JB(±10%)
5%
151MΩ
Other
Wave (Flow)
Reflow
Soldering Method
AEC-Q200
No
Packing
Blister (Plastic)Taping [180mm Reel]
2000pcs
Package Quantity
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
2 of 3
Creation Date : May 23, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216JB1V335K160AB
Characteristic Graphs(This is reference data, and does not guarantee the products characteristics.)
Impedance
ESR
C3216JB1V335K160AB
C3216JB1V335K160AB
Capacitance
DC Bias Characteristic
C3216JB1V335K160AB
C3216JB1V335K160AB
Temperature Characteristic
Ripple Temperature Rising
C3216JB1V335K160AB(100kHz) C3216JB1V335K160AB(500kHz) C3216JB1V335K160AB(1MHz)
C3216JB1V335K160AB(DC Bias =
17.5V )
C3216JB1V335K160AB(No Bias)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
3 of 3
Creation Date : May 23, 2017 (GMT)
Multilayer Ceramic Chip Capacitors
C3216JB1V335K160AB
Associated Images
Land Pattern (Terminal Connection)
! Images are for reference only and show exemplary products.
! This PDF document was created based on the data listed on the TDK Corporation website.
! All specifications are subject to change without notice.
Copyright(c) TDK Corporation. All rights reserved.
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